PIXEL ARRAY SUBSTRATE AND ELECTROWETTING DISPLAY PANEL
20240061234 ยท 2024-02-22
Assignee
Inventors
Cpc classification
G09G3/348
PHYSICS
International classification
Abstract
A pixel array substrate including a substrate and multiple pixel units is provided. The pixel units are disposed on the substrate, and each include at least one active device, a pixel electrode and at least one storage capacitor. The pixel electrode is electrically connected to the at least one active device, and has multiple openings. The at least one storage capacitor is electrically connected to the pixel electrode and the at least one active device. The at least on storage capacitor completely overlaps a part of the openings of the pixel electrode. An electrowetting display panel adopting the pixel array substrate is also provided.
Claims
1. A pixel array substrate, comprising: a substrate; and a plurality of pixel units, disposed on the substrate and each comprising: at least one active device; a pixel electrode, electrically connected to the at least one active device and having a plurality of openings; and at least one storage capacitor, electrically connected to the pixel electrode and the at least one active device, wherein the at least one storage capacitor completely overlaps a part of the openings of the pixel electrode.
2. The pixel array substrate according to claim 1, wherein an orthographic projection area of each of the at least one storage capacitor on the substrate is smaller than or equal to an orthographic projection area of each of the openings on the substrate.
3. The pixel array substrate according to claim 1, wherein the at least one active device completely overlaps another part of the openings of the pixel electrode.
4. The pixel array substrate according to claim 3, wherein an orthographic projection area of each of the at least one active device on the substrate is smaller than or equal to an orthographic projection area of each of the openings on the substrate.
5. The pixel array substrate according to claim 1, wherein the openings comprise a first opening and a second opening arranged adjacent to each other, a first storage capacitor of the at least one storage capacitor completely overlaps the first opening, and a second storage capacitor of the at least one storage capacitor or a first active device of the at least one active device completely overlaps the second opening.
6. The pixel array substrate according to claim 5, wherein the openings further comprise a third opening, the third opening is arranged adjacent to the first opening, and the at least one storage capacitor and the at least one active device do not overlap the third opening.
7. The pixel array substrate according to claim 1, wherein each of the at least one active device comprises: a semiconductor pattern; a first gate electrode, disposed between the semiconductor pattern and the substrate; a second gate electrode, disposed on a side of the semiconductor pattern away from the first gate electrode; and a source electrode and a drain electrode, respectively electrically connected to two different places of the semiconductor pattern, the drain electrode electrically connected to the pixel electrode.
8. The pixel array substrate according to claim 7, wherein each of the at least one storage capacitor is a stacked structure of a first capacitor electrode, a second capacitor electrode, and a third capacitor electrode, the first capacitor electrode and the first gate electrode are in a same film layer, the second capacitor electrode, the source electrode, and the drain electrode are in a same film layer, and the third capacitor electrode and the second gate electrode are in a same film layer.
9. The pixel array substrate according to claim 1, wherein the at least one active device comprises a first active device and a second active device that are electrically connected to each other, the openings comprise a first opening and a second opening arranged adjacent to each other, and the first active device and the second active device overlap the first opening and the second opening respectively and are electrically connected to a same data line and a same scan line.
10. The pixel array substrate according to claim 1, further comprising a connection wire electrically connected to the at least one storage capacitor, wherein the part of the openings of the pixel electrode overlap the connection wire.
11. An electrowetting display panel, comprising: a pixel array substrate, comprising: a substrate; and a plurality of pixel units, disposed on the substrate and each comprising: at least one active device; a pixel electrode, electrically connected to the at least one active device and having a plurality of openings; and at least one storage capacitor, electrically connecting the pixel electrode and the at least one active device, wherein the at least one storage capacitor completely overlaps a part of the openings of the pixel electrode; a hydrophobic layer, disposed on the pixel array substrate; an opposite substrate, disposed overlapping the pixel array substrate and provided with a transparent conductive layer; a barrier wall structure layer, disposed between the pixel array substrate and the opposite substrate and defining a plurality of microchambers, the openings of the pixel electrode overlapping the microchambers respectively; an ink layer, disposed in the microchambers; and a polar fluid layer, disposed in the microchambers, wherein the ink layer is located between the polar fluid layer and the hydrophobic layer.
12. The electrowetting display panel according to claim 11, wherein the at least one active device completely overlaps another part of the openings of the pixel electrode.
13. The electrowetting display panel according to claim 12, wherein an orthographic projection area of each of the at least one storage capacitor or each of the at least one active device on the substrate is smaller than or equal to an orthographic projection area of each of the openings on the substrate.
14. The electrowetting display panel according to claim 11, wherein the openings comprise a first opening and a second opening arranged adjacent to each other, a first storage capacitor of the at least one storage capacitor completely overlaps the first opening, and a second storage capacitor of the at least one storage capacitor or a first active device of the at least one active device completely overlaps the second opening.
15. The electrowetting display panel according to claim 14, wherein the openings further comprise a third opening, the third opening is arranged adjacent to the first opening, and the at least one storage capacitor and the at least one active device do not overlap the third opening.
16. The electrowetting display panel according to claim 11, wherein each of the at least one active device comprises: a semiconductor pattern; a first gate, disposed between the semiconductor pattern and the substrate; a second gate, disposed on a side of the semiconductor pattern away from the first gate; and a source electrode and a drain electrode, respectively electrically connected to two different places of the semiconductor pattern, the drain electrode electrically connected to the pixel electrode.
17. The electrowetting display panel according to claim 16, wherein each of the at least one storage capacitor is a stacked structure of a first capacitor electrode, a second capacitor electrode, and a third capacitor electrode, the first capacitor electrode and the first gate electrode are in a same film layer, the second capacitor electrode, the source electrode, and the drain electrode are in a same film layer, and the third capacitor electrode and the second gate electrode are in a same film layer.
18. The electrowetting display panel according to claim 11, the at least one active device comprises a first active device and a second active device that are electrically connected to each other, the openings comprise a first opening and a second opening arranged adjacent to each other, and the first active device and the second active device overlap the first opening and the second opening respectively and are electrically connected to a same data line and a same scan line.
19. The electrowetting display panel according to claim 11, further comprising a connection wire electrically connected to the at least one storage capacitor, wherein the part of the openings of the pixel electrode overlap the connection wire.
20. The electrowetting display panel according to claim 11, wherein a gap is formed between the barrier wall structure layer and the hydrophobic layer, and the microchambers are communicated through the gap.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.
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DESCRIPTION OF THE EMBODIMENTS
[0022] Reference will now be made in detail to the exemplary embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
[0023] As used herein, about, approximately, or substantially includes a stated value and an average value within an acceptable deviation of the specific value as determined by one of ordinary skill in the art, taking into account the measurement and the specific amount of measurement-related error (i.e. the limitation of the measurement system). For example, about may mean within one or more standard deviations of the stated value, or within 30%, 20%, 15%, 10%, 5%. Moreover, with respect to the terms about, approximately, or substantially as used herein, a more acceptable range or standard deviation may be selected based on measurement properties, cutting properties, or other properties, instead of using one standard deviation for all properties.
[0024] In the drawings, the thickness of layers, films, panels, zones and the like are enlarged for the sake of clarity. It should be understood that when an element such as a layer, film, zone or substrate is referred to as being on or connected to another element, it may be directly on or connected to that other element, or there may be an intermediate element. In contrast, when an element is referred to as being directly on or directly connected to another element, there is no intermediate element. As used herein, connected may refer to a physical and/or electrical connection. Moreover, electrical connection may refer to the existence of other elements between two elements.
[0025] Furthermore, relative terms such as lower or bottom and upper or top may be used herein to describe the relationship of one element's relation to another element, as shown in the drawings. It should be understood that the relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the drawings. For example, if a device in a drawing is turned over, an element having been described as being on the lower side of another element would then be oriented at the upper side of that another element. Thus, the exemplary term lower may include an orientation of lower and an orientation of upper, depending on the particular orientation of the drawing. Similarly, if a device in a drawing is turned over, an element having been described as below or under another element would then be oriented as above the other element. Thus, the exemplary term above or below may encompass both the orientation of above and below.
[0026] Exemplary embodiments are described herein with reference to cross-sectional views that are schematic views of idealized embodiments. Thus, variations in the shape of a figure as a result of, for example, manufacturing techniques and/or tolerances may be expected. Accordingly, the embodiments described herein should not be construed as limited to a particular shape of a region as shown herein, but rather include shape deviations resulting from, for example, manufacturing tolerance. For example, a region shown or described as flat may generally have rough and/or non-linear features. Moreover, a shown acute angle may be round. Thus, a region shown in the figure is essentially schematic, and a shape thereof is not intended to show an accurate shape of the region and is not intended to limit the claims of the disclosure.
[0027] Reference will now be made in detail to exemplary embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.
[0028]
[0029] Referring to
[0030] The material of the hydrophobic layer 170 is, for example, fluoropolymer, Teflon, or other hydrophobic materials, and a film thickness thereof may be in the range of 1 m to 2 m. The material of the opposite substrate 200 is, for example, inorganic transparent materials (e.g. glass, quartz, or other suitable materials, or a combination of the above), organic transparent materials (e.g. polyimide, polymethyl methacrylate, plastic, polycarbonate, or other suitable materials, or derivatives of the above), or hard or soft light-transmitting materials such as the combination of the above. The disclosure takes glass as an example, but is not limited thereto.
[0031] In this embodiment, the ink layer 310 is suitable for absorbing light of a specific wavelength range, and its hydrophilicity may be changed by electrifying the polar fluid layer 320. For example, a driving circuit layer DCL and a pixel electrode PE that are electrically connected to each other may be disposed on the pixel array substrate 100. The opposite substrate 200 may be provided with a transparent conductive layer TCL. When the pixel electrode PE and the transparent conductive layer TCL are not electrified, the polar fluid layer 320 will be pushed by the ink layer 310 away from the hydrophobic layer 170, and the hydrophobic layer 170 will be covered by the ink layer 310 (as shown in
[0032] In contrast, when the pixel electrode PE and the transparent conductive layer TCL are electrified (e.g. electrically connected to a DC voltage source), with the charge distribution generated on the surface, the hydrophobic layer 170 will increase its affinity for the polar fluid layer 320, such that the polar fluid layer 320 may be driven to squeeze the ink layer 310 away and adsorb it to the hydrophobic layer 170 (as shown in
[0033] Further, the pixel array substrate 100 includes a substrate 101 and multiple pixel units PU disposed on the substrate 101. Although
[0034] Referring to
[0035] In this embodiment, the pixel electrode PE has multiple openings OP, and the openings OP overlap the multiple microchambers CA defined by the barrier wall structure layer BW. The overlapping relationship here means, for example, that two members overlap each other along a stacking direction (e.g. direction Z) of the substrate 101 and the opposite substrate 200 (as shown in
[0036] Specifically, these openings OP may define a concentrated zone where the ink layer 310 is squeezed by the polar fluid layer 320 and shrinks when the pixel electrode PE is electrified (as shown in
[0037] In order to avoid affecting an opening rate of the pixel unit PU in the bright state due to the setting of the storage capacitor SCP, the storage capacitor SCP may be disposed in a zone overlapping the opening OP of the pixel electrode PE. As shown in
[0038] More specifically, in this embodiment, the twelve storage capacitors SCP completely overlap the twelve openings OP of the pixel electrode PE, respectively, and the two active devices T completely overlap the other two openings OP of the pixel electrode PE, respectively. For example, an orthographic projection area of each of the storage capacitor SCP and the active device T on the substrate 101 may be smaller than or equal to an orthographic projection area of the opening OP on the substrate 101.
[0039] It should be noted that, for an opening OP overlapping the active device T or the storage capacitor SCP, at least one opening OP among the adjacent multiple (e.g. six in this embodiment) openings OP also overlaps the active device T or the storage capacitor SCP. This allows for a more continuous arrangement and distribution of the twelve storage capacitors SCP and the two active devices T, simplifying the design of the wires for electrically connecting these storage capacitors SCP and the active devices T (e.g. a connection wire CL1, a connection wire CL2, and a connection wire CL3 as shown in
[0040] On the other hand, for an opening OP overlapping the active device T or the storage capacitor SCP, at least one opening OP among the adjacent multiple (e.g. six in this embodiment) openings OP does not overlap the active device T or the storage capacitor SCP. Thus, even if the arrangement of these storage capacitors SCP and the two active devices T is continuous, a closed loop will not be formed. Accordingly, in the manufacturing process of the electrowetting display panel 10, the fluidity of the ink layer 310 and the polar fluid layer 320 can be increased when they are coated on the hydrophobic layer 170, which facilitates uniform distribution of the ink layer 310 and the polar fluid layer 320 in the multiple microchambers CA of the barrier wall structure layer BW.
[0041] For example, as shown in the pixel unit PU2 of
[0042] Referring to
[0043] Further, referring to
[0044] In this embodiment, the active device T is, for example, an amorphous Silicon TFT (a-Si TFT), but not limited thereto. In other embodiments, the active device T may also be a low temperature polysilicon thin film transistor (LIPS TFT), a microcrystalline silicon thin film transistor (micro-Si TFT) or a metal oxide transistor. The active device T is covered with a flat layer 130. The pixel electrode PE is disposed on the flat layer 130 and is electrically connected to the drain electrode DE of the active device T. A thickness of the flat layer 130 may be in the range of 2.5 micrometers to 3 micrometers.
[0045] On the other hand, the storage capacitor SCP is, for example, a laminated structure of a first capacitor electrode CPE1, a second capacitor electrode CPE2, and a third capacitor electrode CPE3, but not limited thereto. The insulating layer 110 is provided between the first capacitor electrode CPE1 and the second capacitor electrode CPE2, and the insulating layer 120 is provided between the second capacitor electrode CPE2 and the third capacitor electrode CPE3.
[0046] Referring to
[0047] Moreover, a first scan line GL1 is formed in the first metal layer, wherein the first gate electrode GE1 of the first active device T1 and the first gate electrode GE1 of the second active device T2 are both electrically connected to the first scan line GL1. It should be noted that, in this embodiment, part of a line segment of the first scan line GL1 may be conformal to and overlapping part of an edge contour of the pixel electrode PE. More specifically, part of the line segment of the first scan line GL1 may be disposed completely overlapping the barrier wall structure layer BW (as shown in
[0048] Referring to
[0049] Moreover, a data line DL is also formed in the second metal layer, wherein the source electrode SE of the first active device T1 and the source electrode SE of the second active device T2 are both electrically connected to the data line DL. It should be noted that, in this embodiment, the data line DL may be conformal to part of the edge contour of the pixel electrode PE and be spaced apart from the pixel electrode PE, but the disclosure is not limited thereto. In other embodiments not shown, part of the edge contour of the pixel electrode PE may also overlap the data line DL. More specifically, in this embodiment, the data line DL may be disposed completely overlapping the barrier wall structure layer BW (as shown in
[0050] In this embodiment, the second metal layer may further be formed with a conductive pattern CP1. The conductive pattern CP1 is electrically connected to the connection wire CL2 and is structurally separated from the second capacitor electrode CPE2.
[0051] Referring to
[0052] Moreover, a second scan line GL2 is formed in the third metal layer, wherein the second gate electrode GE2 of the first active device T1 and the second gate electrode GE2 of the second active device T2 are both electrically connected to the second scan line GL2. It should be noted that, in this embodiment, part of a line segment of the second scan line GL2 may be conformal to and overlapping part of the edge contour of the pixel electrode PE. More specifically, part of the line segment of the second scan line GL2 may be disposed completely overlapping the barrier wall structure layer BW (as shown in
[0053] In this embodiment, the third metal layer may further be formed with a conductive pattern CP2. The conductive pattern CP2 is structurally independent from the second capacitor electrode CPE2 and the connection wire CL3. For example, the insulating layer 120 between the second metal layer and the third metal layer may have a contact hole 120a. The conductive pattern CP2 of the third metal layer may be disposed in the contact hole 120a of the insulating layer 120 and directly contact the conductive pattern CP1 of the second metal layer. In this embodiment, the flat layer 130 may have an opening 130a, and the pixel electrode PE disposed on the flat layer 130 may extend into the opening 130a to contact the conductive pattern CP2. In other words, the conductive pattern CP1 of the second metal layer and the conductive pattern CP2 of the third metal layer may serve as an electrical bridge structure between the pixel electrode PE and the drain electrode DE (or the connection wire CL2) of the active device T, but the disclosure is not limited thereto.
[0054] Referring to
[0055] Referring to
[0056] Hereinafter, other embodiments will be given to illustrate the disclosure in detail, wherein the same components will be described in same reference numerals, and the description of the same technical content will be omitted. Please refer to the above embodiments for the omitted parts, and details will not be repeated below.
[0057]
[0058] Correspondingly, a connection wire CL1-A of the first metal layer (as shown in
[0059] On the other hand, in this embodiment, a first scan line GL1-A of the first metal layer (as shown in
[0060]
[0061] In this embodiment, the data line DL-A of the pixel array substrate 100B may not need to have a line segment conformal to part of the edge contour of the pixel electrode PE (e.g. the zigzag line segment of the data line DL in
[0062] Since the connection wire CL1, the connection wire CL2, the connection wire CL3, the storage capacitors SCP and the active devices T of this embodiment are all similar to the pixel array substrate 100 of
[0063] In summary, in the electrowetting display panel according to an embodiment of the disclosure, the storage capacitors are disposed overlappingly a part of the openings of the pixel electrode of the pixel array substrate. When a display pixel of the electrowetting display panel is operated to appear in a bright state, the ink layer is concentrated in a zone of the multiple openings overlapping the pixel electrode. At this time, the storage capacitor will still be shielded by the ink layer and will not be exposed in a light-transmitting zone. Therefore, the opening rate of the electrowetting display panel in the bright state can be effectively increased, thereby improving the display brightness during operation.
[0064] It will be apparent to those skilled in the art that various modifications and variations may be made to the structure of the disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the disclosure cover modifications and variations of this disclosure provided they fall within the scope of the following claims and their equivalents.