SELF-ALIGNING TIP
20230223289 · 2023-07-13
Assignee
Inventors
Cpc classification
H01L2224/83203
ELECTRICITY
H01L2924/00012
ELECTRICITY
H01L2224/131
ELECTRICITY
H01L2224/81203
ELECTRICITY
H01L2224/291
ELECTRICITY
H01L2224/131
ELECTRICITY
H01L2224/2919
ELECTRICITY
H01L2224/32225
ELECTRICITY
H01L2224/2919
ELECTRICITY
B23Q3/15513
PERFORMING OPERATIONS; TRANSPORTING
H01L2224/83191
ELECTRICITY
H01L2224/04026
ELECTRICITY
H01L2224/16227
ELECTRICITY
H01L2224/75745
ELECTRICITY
H01L2224/05638
ELECTRICITY
H01L21/6838
ELECTRICITY
H01L2924/00014
ELECTRICITY
H01L24/75
ELECTRICITY
H01L2224/81191
ELECTRICITY
H01L2924/00014
ELECTRICITY
H01L2224/83192
ELECTRICITY
H01L2924/00012
ELECTRICITY
H01L2224/32227
ELECTRICITY
H01L2224/05638
ELECTRICITY
H01L2224/83203
ELECTRICITY
H01L2224/291
ELECTRICITY
H01L2224/81203
ELECTRICITY
International classification
B23Q3/155
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.
Claims
1. A self-aligning tip system comprising: a tip holder comprising, a threaded section disposed on a distal end thereof, and a hollow inner cavity; a lockable swivel collar disposed in the hollow inner cavity of the tip holder, the lockable swivel collar comprising a central aperture configured to retain a tip; and a locking cap comprising a central aperture configured to allow a tip to pass therethrough, wherein the locking cap is configured to be threaded onto the threaded section of the tip holder and to retain the lockable swivel collar inside of the inner cavity of the tip holder, wherein, when the locking cap is installed loosely, a tip retained in the lockable swivel collar is allowed to swivel in roll, pitch and yaw while maintaining accurate theta registration, and wherein, when the locking cap is installed tightly, a tip retained in the lockable swivel collar is locked in terms of roll, pitch and yaw.
2. The self-aligning tip system of claim 1 wherein the tip holder comprises an upper section configured to be retained in a die bonding system.
3. The self-aligning tip system of claim 1 wherein the lockable swivel collar comprises swivel ball profiles on top and bottom sides thereof and wherein the tip holder and locking cap comprise corresponding swivel ball profiles on a bottom portion and a top portion thereof, respectively.
4. The self-aligning tip system of claim 1 further comprising a spring disposed between the lockable swivel collar and locking cap.
5. The self-aligning tip system of claim 4 wherein the locking cap and lockable swivel collar comprise spring seats configured to locate the spring.
6. The self-aligning tip system of claim 4 wherein the spring is configured to bias a tip held retained in the lockable swivel collar to a neutral position.
7. The self-aligning tip system of claim 4 further comprising a magnet disposed in the tip holder.
8. The self-aligning tip system of claim 7 wherein the magnet is configured to bias a tip held retained in the lockable swivel collar to a neutral position.
9. The self-aligning tip system of claim 1 further comprising a magnet disposed in the tip holder.
10. The self-aligning tip system of claim 9 wherein the magnet is configured to bias a tip held retained in the lockable swivel collar to a neutral position.
11. The self-aligning tip system of claim 1 wherein the self-aligning tip system is configured such that tip alignment occurs with the center of rotation located at the bottom of a die held by a tip retained by the lockable swivel collar.
12. The self-aligning tip system of claim 1 further comprising at least one air-port disposed in the tip holder.
13. The self-aligning tip system of claim 12 wherein the self-aligning tip system is configured to utilize vacuum to lock the tip into position.
14. The self-aligning tip system of claim 1 further comprising a tip retained in the lockable swivel collar wherein the tip comprises at least one air port configured to allow the transmission of positive pressure and/or vacuum from a backside of the tip to a distal end thereof, the distal end being configured to mount a die to a substrate.
15. The self-aligning tip system of claim 14 wherein with the tip in an unlocked position, the tip is configured to utilize a burst or steady stream of air through the at least one air-port disposed therein to reduce the friction associated with tip alignment.
16. The self-aligning tip system of claim 1 wherein the lockable swivel collar utilizes a clamp-collar retention system to retain a tip.
17. The self-aligning tip system of claim 1 wherein the locking cap further comprises preloaded locking tabs configured to prevent rotation of the lockable swivel collar relative to the self-aligning tip system, once tightened.
18. A method of planarizing a tip to a substrate, the method comprising: using a self-aligning tip system in accordance with claim 1: retaining a tip within the lockable swivel collar; loosening the locking cap, thereby allowing the tip to swivel in roll, pitch and yaw while maintaining accurate theta registration; bringing the tip into contact with the substrate; and tightening the locking cap, thereby locking the tip in roll, pitch and yaw.
19. A die bonding system comprising: a turret comprising a rotation measuring device and a plurality of self-aligning tip system holding portions positioned substantially adjacent a periphery thereof wherein each self-aligning tip system holding portion comprises two concentric apertures, a first aperture and a second aperture, said first aperture extending fully through said turret and said second aperture positioned on the side of the turret opposite said first aperture and concentric therewith, wherein said second aperture extends only partially into said turret and wherein, upon rotation, each of said plurality of self-aligning tip system holding apertures can be brought into alignment with a tool; and a motor configured to rotate said turret upon activation, wherein at least one of the plurality of self-aligning tip system holding portions comprises a self-aligning tip system.
20. A self-aligning tip system comprising: a tip holder comprising at least one air-port, a threaded section disposed on a distal end thereof, and a hollow inner cavity; a lockable swivel collar comprising a central aperture configured to retain a tip; a locking cap disposed in the hollow inner cavity of the tip holder, the lockable swivel collar comprising a central aperture configured to allow a tip to pass therethrough, wherein the locking cap is configured to be threaded onto the threaded section of the tip holder and to retain the lockable swivel collar inside of the inner cavity of the tip holder; and a spring disposed between the lockable swivel collar and locking cap, wherein, when the locking cap is installed loosely, a tip retained in the lockable swivel collar is allowed to swivel in roll, pitch and yaw while maintaining accurate theta registration, wherein, when the locking cap is installed tightly, a tip retained in the lockable swivel collar is locked in terms of roll, pitch and yaw, wherein the tip holder comprises an upper section configured to be retained in a die bonding system, wherein the spring is configured to bias a tip held retained in the lockable swivel collar to a neutral position, wherein the lockable swivel collar comprises swivel ball profiles on top and bottom sides thereof and wherein the tip holder and locking cap comprise corresponding swivel ball profiles on a bottom portion and a top portion thereof, respectively.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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[0055] These and other features of the present embodiments will be understood better by reading the following detailed description, taken together with the figures herein described. The accompanying drawings are not intended to be drawn to scale. For purposes of clarity, not every component may be labeled in every drawing.
DETAILED DESCRIPTION
[0056] As a preliminary matter, for the purposes of this disclosure, the X, Y, and Z axis should be understood to refer to the three orthogonal linear axes while “T”, which may also be referred to as Theta or Θ, refers to a revolute axis.
[0057] Thermo-compression bonding is one method used to bond a die, also known as a chip, to a substrate. It is sometimes also referred to as diffusion bonding, pressure joining, thermo-compression welding or solid state welding. This process takes advantage of surface diffusion, grain boundary diffusion and bulk diffusion to physically and electrically connect a die to a substrate.
[0058] Planarity errors are always present in both pick and place machinery and customer dies/substrates. These errors make robust attachments of dies to substrates a constant challenge, especially when there is no solder or preform used (e.g. certain types of eutectic bonding). Embodiments of the present disclosure solve this problem by employing both a global planarity correction for the pick and place gantry/deck tools along with the option to use a fully compliant tip 104 to help with varying planarity errors in a customer's dies and substrates.
[0059] The die placement system described herein, in embodiments, utilizes a novel self-aligning tip system 100 to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. More specifically, embodiments utilize a tip 104 held by a tip holder 102 adjustably, but lockably, retained by the self-aligning tip system 100 to aid in die placement/attachment. This self-aligning tip system 100 provides for the global correction of planarity errors that may exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment. This is accomplished, in embodiments, by the tip 104 self-aligning to a die having non-parallel top and bottom surfaces.
[0060] Now referring to
[0061] In embodiments, the tip holder 102 comprises at least one, in embodiments multiple, air-port(s) 108, which is/are configured to allow the communication of vacuum and/or positive pressure through the tip holder 102 and to a tip 104 held therein allowing for, inter alia, the tip 104 to be locked or floated programmatically.
[0062] In embodiments, the air-port(s) 108 further allows the communication of vacuum and/or positive pressure through a tip 104 installed therein, allowing for, inter alia, dies to be held to the tip 104 via vacuum. By using positive pressure, the air acts against the spring-seated swivel ball profiles to help float the tip 104 into mating with the surface of a die. In such embodiments, vacuum can also be used to lock the tip 104 into place.
[0063] In embodiments, such as those depicted in
[0064] In other embodiments, such as those depicted in
[0065] The aforementioned ability of the tip 104 to fully swivel in roll, pitch and yaw while maintaining accurate theta registration is depicted in
[0066] In embodiments, the tip holder 102 is sized to accommodate standard tips 104, allowing it to be used with off-the-shelf parts.
[0067] In embodiments, the self-aligning tip system 100 has the ability to run in a self-aligning mode for each individual pick or can be aligned and locked in a “locked mode” for global placement on non-level surfaces. In embodiments, this tip locking feature is enabled by tightening a locking cap 106, which, in embodiments, is a knurled cap 106, configured to be threaded onto the tip holder 102 and configured to clamp all swivel joint surfaces (i.e. an inside surface of the lockable swivel collar 114 to the swivel ball profile disposed in a backside of the locking cap 106, and an outside surface of the lockable swivel collar 114 to a swivel ball profile disposed in the tip holder 102) locking them together. This feature is best illustrated in
[0068] In embodiments, with the tip 104 in an unlocked position, the tip 104 is configured to utilize a burst or steady stream of air through an air-port 108 in the tip 104 to create a frictionless tip 104 alignment, reducing downward forces normally required to seat the tip 104 against the top of a die. Alternatively, vacuum can then be used to temporarily lock the tip 104 into position.
[0069] In embodiments, tip 104 alignment occurs with the center of rotation located at the bottom of a die to help mitigate die scrubbing (i.e. relative motion in the X and/or Y directions while the die and tip 104 are in contact). Other locations for the center of rotation are available through customization when dealing with different thickness dies. In embodiments, customization of the center of rotation is accomplished by changing the shape of the lockable swivel collar 114, the tip holder 102, and/or or swivel ball profile disposed in a backside of the locking cap 106.
[0070] In embodiments, an internal spring 116 biases the self-aligning tip system 100 to return back to a neutral position after die placement. The spring can also be configured to help freeze the tip orientation after each die pick/alignment by increasing friction in the swivel ball system or ball joint formed by the locking cap 106 and the lockable swivel collar 114, thereby allowing the swivel ball system to retain the angle used in a prior die bonding operation during a subsequent die bonding operation.
[0071] In embodiments, such as that depicted in
[0072] In embodiments, the tip 104 uses a clamp collar type of tip retention, with the lockable swivel collar 114 serving as the clamp, allowing a multitude of off-the-shelf standard tips 104 to be used. In embodiments, the locking cap 106 includes preloaded locking tabs, the preloaded locking tabs being configured to prevent rotation of the lockable swivel collar 114 relative to the self-aligning tip system 100, when tightened.
[0073] This design allows for less than perfect planarity of the pick and place, or die bonding system, machine gantry and deck tools. This can be achieved by simply planarizing the tip 104 to a surface requiring compensation to ensure planarity and tightening the locking cap 106 to capture that position.
[0074] The design also allows for customers to manufacture dies/substrates that have greater planarity errors than would normally be allowed simply by loosening the locking cap 106 and allowing the tip 104 to go into a full angular compliance mode where it automatically planarizes a die held by a tip 104 to a substrate at each die bond operation, within the limits of compliance of the lockable swivel collar 114.
[0075] Views of the individual components making up the aforementioned assemblies are provided in
[0076] More specifically,
[0077] Now referring to
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[0079] Now referring to
[0080] Now referring to
[0081] The foregoing description of the embodiments of the present disclosure has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the present disclosure to the precise form disclosed. Many modifications and variations are possible in light of this disclosure. It is intended that the scope of the present disclosure be limited not by this detailed description, but rather by the claims appended hereto.
[0082] A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the scope of the disclosure. Although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results.