MICROMECHANICAL COMPONENT

Abstract

A micromechanical component comprising a bracket and an adjustable portion arranged in an adjustable manner on the bracket. The micromechanical component includes a first bender actuator and a first support structure for the first bender actuator. The first bender actuator is arranged in or on the first support structure and is configured to bend the first support structure at least in the area of the first bender actuator arranged in or on the first support structure, such that the adjustable portion is displaceable relative to the bracket about a first rotational axis. The first support structure is directly connected to the adjustable portion. The micromechanical component additionally includes a first spring configured to suspend the first support structure for the first bender actuator and the adjustable portion from the bracket.

Claims

1. A micromechanical component, comprising: a bracket; an adjustable portion arranged in an adjustable manner on the bracket; a first bender actuator; and a first support structure for the first bender actuator, wherein the first bender actuator is arranged in or on the first support structure; wherein the first bender actuator is configured to bend the first support structure at least in an area of the first bender actuator arranged in or on the first support structure, such that the adjustable portion is displaceable relative to the bracket around a first rotational axis; and wherein the first support structure is directly connected to the adjustable portion, and wherein the micromechanical component includes a first spring, wherein the first spring is configured to suspend the first support structure for the first bender actuator and the adjustable portion from the bracket.

2. The micromechanical component according to claim 1, further comprising: a second spring configured to suspend the first support structure for the first bender actuator and the adjustable portion from the bracket.

3. The micromechanical component according to claim 2, wherein a first point of application of the first spring on the first support structure and a second point of application of the second spring on the first support structure are arranged at an offset from the first rotational axis.

4. The micromechanical component according to claim 2, further comprising: a second bender actuator and a second support structure for the second bender actuator, wherein the second bender actuator is arranged in or on the second support structure, wherein the second bender actuator is configured to bend the second support structure at least in an area of the second bender actuator arranged in or on the second support structure, such that the adjustable portion is displaceable relative to the bracket around the first rotational axis, wherein the second support structure is directly connected to the adjustable portion; and a third spring configured to suspend the second support structure for the second bender actuator and the adjustable portion from the bracket.

5. The micromechanical component according to claim 4, wherein the first support structure and the second support structure engage the adjustable portion at opposite ends of the adjustable portion.

6. The micromechanical component according to claim 4, wherein a third point of application of the first spring on the first support structure and a fourth point of application of the third spring on the second support structure are arranged on the first rotational axis.

7. The micromechanical component according to claim 5, wherein the first spring is directed connected to the first support structure and/or the second spring is directly connected to the second support structure and/or the third spring is directly connected to the third support structure.

8. The micromechanical component according to claim 4, wherein the first bender actuator and/or the second bender actuator, is configured as piezoelectric actuator.

9. The micromechanical component according to claim 4, wherein the first bender actuator is arranged on an opposite end of the first support structure to the adjustable portion and/or the second bender actuator is arranged on an opposite end of the second support structure to the adjustable portion.

10. The micromechanical component according to claim 4, wherein the first support structure and/or the second support structure in a semi-circular wing shape.

11. The micromechanical component according to claim 4, further comprising: a control device configured to control the first bender actuator and/or the second bender actuator, using electrical signals such that the adjustable portion is moved into a resonant oscillating movement around the first rotational axis relative to the bracket.

12. The micromechanical component according to claim 1, wherein the adjustable portion is a micromirror.

13. The micromechanical component according to claim 4, wherein the first support structure and/or the second support structure, is configured as a spring element.

14. The micromechanical component according to claim 13, wherein the first spring and/or the second spring and/or the third spring, has a lower spring stiffness than the first support structure and/or the second support structure.

15. A microscanning device, comprising: a micromechanical component including: a bracket, an adjustable portion arranged in an adjustable manner on the bracket, a first bender actuator, and a first support structure for the first bender actuator, wherein the first bender actuator is arranged in or on the first support structure, wherein the first bender actuator is configured to bend the first support structure at least in an area of the first bender actuator arranged in or on the first support structure, such that the adjustable portion is displaceable relative to the bracket around a first rotational axis, and wherein the first support structure is directly connected to the adjustable portion, and wherein the micromechanical component includes a first spring, wherein the first spring is configured to suspend the first support structure for the first bender actuator and the adjustable portion from the bracket.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG. 1 schematically shows a first embodiment of a micromirror device as a micromechanical component, according to the present invention.

[0016] FIG. 2 schematically shows a second embodiment of a micromirror device as a micromechanical component, according to the present invention.

[0017] FIG. 3 schematically shows a scanning device with the micromechanical component, according to an example embodiment of the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0018] FIG. 1 schematically shows a top view of a first embodiment of a micromirror device as a micromechanical component 1a. The micromechanical component 1a comprises a bracket 5 and a micromirror, as adjustable portion 15a, which is arranged in an adjustable manner on the bracket 5. Additionally, the micromechanical component 1a comprises a first piezoelectric actuator as first bender actuator 20a and a first support structure 30a for the first bender actuator 20a. The first bender actuator 20a is arranged on the outer surface of the first support structure 30a. In this exemplary embodiment, the first support structure 30a is wing-shaped, in particular in a semi-circular wing shape. The first bender actuator 20a is configured to bend the first support structure 30a at least in the area of the first bender actuator 20a arranged on the first support structure 30a, such that the micromirror, as adjustable portion 15a, is displaceable relative to the bracket 5 around a first rotational axis 10a. The first support structure 30a is directly connected to the adjustable portion 15a. The micromechanical component 1a additionally comprises a first spring 25a, which is configured to suspend the first support structure 30a for the first bender actuator 20a and the adjustable portion 15a from the bracket 5. The first spring 25a does not impede the described twisting motion mechanism.

[0019] Additionally, the micromechanical component 1a has a second piezoelectric actuator as second bender actuator 20b and a second support structure 30b for the second bender actuator 20b. The second bender actuator 20b is arranged on an outer surface of the second support structure 30b. The second support structure 30b is also wing-shaped, in particular in a semi-circular wing shape. The second bender actuator 20b is configured to bend the second support structure 30b at least in the area of the second bender actuator 20b arranged on the second support structure 30b, such that the adjustable portion 15a is displaceable relative to the bracket 5 around the first rotational axis 10a. The second support structure 20b is also directly connected to the adjustable portion 15a. In this exemplary embodiment, the micromechanical component 1a comprises a third spring 25b, which is configured to suspend the second support structure 30b for the second bender actuator 20b and the adjustable portion 15a from the bracket 5.

[0020] The first 30a and the second support structure 30b are configured as spring elements in this exemplary embodiment. The two support structures 30a and 30b are formed from silicon. The first spring 25a and the third spring 25b are configured as meander-shaped springs in this exemplary embodiment and have a lower, in particular a significantly lower, spring stiffness than the first support structure 30a and the second support structure 30b.

[0021] The first bender actuator 20a and the second bender actuator 20b are arranged on an opposite end 60a and 60b of the respective support structure 30a and 30b to the adjustable portion 15a.

[0022] The first support structure 30a and the second support structure 30b engage with the adjustable portion 15a at opposite ends 50a and 50b of the adjustable portion 15a. A third point of application 45a of the first spring 25a on the first support structure 30a, as well as a fourth point of application 45b of the third spring 25b on the second support structure 30b are substantially arranged on the first rotational axis 10a. The first spring 25a and the second spring 25b are directly connected to the respective support structure 30a and 30b.

[0023] The micromechanical component 1a additionally comprises a control device (not shown here), which is configured to control the first 20a and the second bender actuator 20b by means of electrical signals such that the adjustable portion 15a can be moved into a resonant oscillating movement around the first rotational axis 10a relative to the bracket 5.

[0024] FIG. 2 schematically shows a second embodiment of a micromechanical component 1b. In contrast to the first embodiment, the micromechanical component 1b only comprises a single first support structure 30c for a first piezoelectric actuator as the first bender actuator 20c. Again, the first bender actuator 20c is configured to bend the first support structure 30c in the area of the first bender actuator 20c arranged on the first support structure 30c, such that the micromirror, as adjustable portion 15b, is displaceable relative to the bracket 5 around the first rotational axis 10b. The first support structure 20c is directly connected to the adjustable portion 15b. The first bender actuator 20c is arranged on an opposite end 60c of the first support structure 30c to the adjustable portion 15b. The micromechanical component 1b comprises a first spring 25c and a second spring 25d which are configured to suspend the first support structure 30c and the adjustable portion 15b from the bracket 5. In contrast to the first embodiment, a first point of application 45c of the first spring 25c on the first support structure 30c and a second point of application 45d of the second spring 25d on the first support structure 30c are arranged at an offset from the first rotational axis 10b. The first spring 25c and the second spring 25d are directly connected to the first support structure 30c. The first spring 25c and the second spring 25d are configured as meander-shaped springs and have a lower, in particular a significantly lower, spring stiffness than the first support structure 30c.

[0025] FIG. 3 schematically shows a microscanning device as scanning device 100. The scanning device 100 comprises a light unit 70 for generating light beams, in particular laser beams. Additionally, the scanning device 100 comprises a micromechanical component 80, as shown, by way of example, in FIGS. 1 and 2. The micromechanical component 100 is in particular configured as a micromirror device and serves to deflect the light beams. In particular, the scanning device 100 is configured as a lidar sensor. Alternatively, the scanning device 100 is configured as a microscanning device for data goggles. Further possible applications are scanning the environment with a depth measurement of the laser emitters, e.g. in smartphones, for which the micromirror is suitable due to its miniaturization. With the spectral analysis of an optical beam, the environment can also be analyzed for certain substances. In this context, a further optical component 90 for redirecting, in particular for guiding, the light beams into the retina of the data goggles user is optionally provided. The optical component 90 is in particular configured as a holographic optical element or as a waveguide.