TRIODE WITH WIREBONDED STRUCTURE AND METHOD OF MAKING

Abstract

A wire bonded triode for amplification of electromagnetic signals that includes an electron emitter (cathode), control grid, and an electron collector (anode) and having one or more wire bonded structures. A method of making a triode for amplification of electromagnetic signals that includes wirebonding one or more wires to form a wire bonded structure corresponding with one or more of an anode, grid and/or cathode element.

Claims

1. A triode, comprising a package defining a cavity, a grid, an emitter and a collector disposed inside the cavity, wherein at least one of the grid, the emitter and the collector is a wirebonded structure inside the cavity or at least partially exposed to the cavity.

2. The triode of claim 1, wherein the wirebonded structure includes one or more wires having a plurality of wirebonded connections.

3. The triode of claim 2, wherein the wirebonded connections of the wirebonded structure are disposed within the cavity of the triode.

4. The triode of claim 3, wherein the wirebonded structure comprises a plurality of wirebonded connections defining a plane that is disposed inside the cavity and wherein the plurality of wirebonded connections are electrically connected.

5. The triode of claim 1, wherein the package comprises a cover portion and a base portion, wherein each of the grid, the emitter and the collector are connected to the base portion, wherein the base portion has an interior surface defining a boundary of the cavity and an outside surface opposite the inside surface and that is outside the cavity.

6. The triode of claim 1, further comprising one or more getter materials inside the cavity.

7. The triode of claim 5, wherein the collector is a wirebonded structure having a plurality of wirebonded connections defining a plane that is disposed inside the cavity and elevated from the base portion.

8. The triode of claim 1, wherein the wirebonded structure is formed from a single wire that is wirebonded to itself to form a wirebonded structure disposed within the cavity.

9. The triode of claim 1, wherein the wirebonded structure is at least partially formed on the base portion of the triode such that a plane defined by a plurality of wirebonded connections is parallel and in direct contact with the interior surface of the base portion.

10. The triode of claim 1, wherein the grid is disposed between the emitter and the collector and at least two of the grid, the emitter and the collector have a wirebonded structure.

11. The triode of claim 1, wherein the grid, the emitter and/or the collector having the wirebonded structure includes a first pad, a second pad and a plurality of wires, wherein each of the plurality of wires has a first end and a second end, wherein the first end of each wire is wire bonded to the first pad and the second end of each wire is wire bonded to the second pad.

12. The triode of claim 11, wherein at least one of the first pad and the second pad is disposed on the interior surface of the base portion and one or more of the wires projects from the base portion to bridge the first pad and the second pad without direct contact to the base portion.

13. The triode of claim 1, wherein each of the grid, the emitter and the collector is in direct contact with the base portion and each are connected to an electrical lead passing through the base portion to a pin or connector on the exterior surface of the base portion.

14. The triode of claim 1, wherein the emitter, the grid and the collector are physically separated from one another inside the cavity.

15. The triode of claim 1, wherein at least one of the grid and the collector includes a wirebonded structure with a tensioned wire.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0049] A more complete appreciation of the disclosure and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:

[0050] FIG. 1 shows a set of 5 wirebonds creating a set of parallel conductors above a substrate.

[0051] FIG. 2A-D show different portions of a wirebond with approximate shapes including a ball bond (FIG. 2B), wedge bond (FIG. 2C), wedge on a ball bond (FIG. 2D), wire bridge structure (FIG. 2A) representing the connection between different portions of a wire, different wires and/or other elements of a microelectronic device.

[0052] FIG. 3 shows wirebonds that overlap as planes to create a triode grid.

[0053] FIG. 4A shows a top down view of a wirebond grid made of a single layer of wirebonds oriented parallel to one another.

[0054] FIG. 4B shows a top down view of a wirebond grid made of two layers of oriented wirebonds crossing one another.

[0055] FIG. 5A shows individual wirebonds of a wirebond element having the same voltage.

[0056] FIG. 5B shows individual wirebonds of a wirebond element having independent voltages.

[0057] FIG. 5C shows individual wirebonds of a multi-layer wirebond element having the same voltage.

[0058] FIG. 5D shows individual wirebonds of a multi-layer wirebond element independent voltages.

[0059] FIG. 6A shows a wirebond attached to a substrate.

[0060] FIG. 6B shows a set of multiple wirebonds attached to a substrate.

[0061] FIG. 7A shows a perspective view of an example of the entire triode formed with wirebonds with the electron flow oriented parallel to the substrate.

[0062] FIG. 7B shows a grid side view of an example of the triode formed with wirebonds.

[0063] FIG. 7C shows a collector side view of an example of the triode formed with wirebonds.

[0064] FIG. 7D shows a grid front view of an example of the triode formed with wirebonds.

[0065] FIG. 7E shows a collector front view of an example of the triode formed with wirebonds.

[0066] FIG. 8 shows an example triode formed with wirebonds and the electron flow oriented vertically to the substrate.

[0067] FIGS. 9A-C show cross-sections for the wires used in wirebond formation.

[0068] FIG. 10A shows a top view of an example of where the conductivity pads can be oriented on the substrate.

[0069] FIG. 10B shows a bottom view of an example of where the conductivity pads can be oriented on the substrate.

[0070] FIG. 11 shows an example substrate with a cathode (filament wire) wirebonded in place by wirebonding the wire to a pad in or on a substrate.

[0071] FIG. 12 shows an example with the wires for the cathode and grid wirebonded in place by wirebonding the wire to a pad in or on a substrate.

[0072] FIG. 13 shows a triode showing the wirebonded anode, grid and cathode by wirebonding the wire to a pad in or on a substrate.

[0073] FIG. 14 shows an example triode with a getter material placed on the substrate.

[0074] FIG. 14A shows a triode side view.

[0075] FIG. 14B shows a triode view looking at the collector.

[0076] FIG. 15 shows an example triode enclosed with a lid to create the vacuum enclosure.

[0077] FIGS. 16A-B shows a top view (16A) and bottom view (16B) of a substrate example for a vertical triode arrangement.

[0078] FIG. 17 shows grid wirebonds above the substrate collector pad.

[0079] FIG. 18 shows a vertical triode arrangement with the cathode (filament), grid and getter shown.

[0080] FIG. 19A shows a box shape inside which the wirebonded triode structure exists.

[0081] FIG. 19B shows a cut-away image showing the location of emitter, grid and collector.

[0082] FIG. 19C shows a cut-away image showing the possibility for having, for example, the grid attached to a surface other than the surface for the emitter and collector.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0083] As used herein, the words “a” and “an” and the like carry the meaning of “one or more”. Additionally, within the description of this disclosure, where a numerical limit or range is stated, the endpoints are included unless stated otherwise. Also, all values and subranges within a numerical limit or range are specifically included as if explicitly written out.

[0084] As used herein, the terms “optional”, “optionally” or “preferably” means that the described step or event can or cannot occur or the subsequently described component(s) may or may not be present.

[0085] The term “comprising” is considered an open-ended term synonymous with terms such as including, containing or having and is used herein to describe aspects of the invention which may include additional components, functionality and/or structure. Terms such as “consisting essentially of” are used to identify aspects of the invention which exclude particular components that are not explicitly recited in the claim but would otherwise have a material effect on the basic and novel properties of the drilling fluid composition. The term “consisting of” describes aspects of the invention in which only those features explicitly recited in the claims are included and thus other components not explicitly or inherently included in the claim are excluded.

[0086] The present disclosure describes using wirebonding technology to form triode elements such as the grid, emitter and/or collector for vacuum tube devices, VFD devices and other solid state amplification devices. Triode devices that have one or more wirebonded structures are described. In the context of the present disclosure a wirebonded structure is formed during a wirebond process and has the shapes and purpose necessary for a triode element such as a triode anode, a triode cathode or a triode grid. In the context of the present disclosure a wirebond connection represents at least one mechanical and electrical connection formed by a wirebond process (e.g., a ball bond, a wedge bond, stitch bond, bond on ball) that is connected, preferably in direct connection, with a wire or filament wire, at least at one point preferably a plurality of points.

[0087] Conventionally, fixed elements (e.g., triode anode, triode cathode and/or triode grid) are created for each triode component using conventional joining techniques such as soldering, spot welding and mechanical methods. These elements are then joined as needed to provide the desired electrical connectivity. Wirebonding is not however used to form the isolated triode elements (e.g., fixed elements when present inside a VFD device). Conventionally, triode components in the form of fixed elements are formed before assembly and retain their original shape once inside a device.

[0088] In the present disclosure, the elements of a triode, e.g., grid, emitter and/or collector, can be formed by a wirebond process, e.g., by using wirebonding techniques, to form elements having one or more wirebonded connections, e.g., a wirebonded structure. The formation of the wirebonded structures/elements can be a part of the assembly process for making an isolated structure (e.g., an individual triode element) and/or during assembly of a VFD. Using multiple wirebonds and/or multiple wirebonded connections allows the creation of unique shapes for the triode elements thereby adding extra functionality to the triode elements individually or to a device containing the assembled elements. In addition, the wirebonded structures disclosed herein may serve the same electrical function as conventional assemblies. An example of an electrical function is the amplification of an electromagnetic signal (radio signal).

[0089] Examples of wirebonded structures and corresponding triode elements that are part of the present disclosure are shown in the figures. In FIG. 1, the grid (100) is preferably made by wirebonding filaments or wires to a substrate. Multiple wires or electrically conductive structures (310) may be created in a pattern (300). Each wirebond (310) preferably having at least two points, e.g., ends or electrical connectors, preferably wirebonded and/or mechanically attached and electrically connected to a substrate (200) at surface points (210 and 220). Surface points (210 and 220) may be on different substrate planes.

[0090] Typically ball bonds (320), FIG. 2B, and wedge bonds (330), FIG. 2C, may be used during the wirebond process to create the wirebonded connection between the grid wires and the substrate, FIG. 2A. A wedge bond on a ball bond is also possible (340), FIG. 2D. An example wire entirety includes the ball (320) and wedge bonds (330) and wire loop (370) running between the surface points is the wirebond (310), FIG. 2A.

[0091] The wirebonded structures shown in FIG. 1 are abbreviated for clarity. In the context of the present disclosure the wire that bridges contact points of a substrate will have at least one, and preferably a plurality, of wirebonded connections that form a three dimensional structure which functions as the triode element and is the wirebonded structure. In another aspect of the invention one or more triode elements is formed by wirebonding at least two wires to a substrate, preferably each wire separately bonded to the substrate at two points but optionally sharing one or more optionally co-terminus wirebonded connections to a substrate or other wirebond structure.

[0092] Examples of wirebonds include the wirebonds described in Microelectronics Packaging Handbook, pp. II-186-II-217. Typically the wire (wire filament) diameter may range from 5 to 100 micron, preferably 10-75 micron, 15-50 micron, 20-40 micron, or 25-30 micron. Ball bond diameters can range from 20-150 micron, preferably 30-125 micron, 40-100 micron, 50-90 micron, 60-80 micron or about 75 micron. Creation of the ball and wedge bonds from the wire during bonding causes the wire to be reshaped locally. The ball and wedge bonds (wirebonded connections) preferably scale with the wire diameter. For example, a ball or wedge bond preferably has a diameter that is 1-10 times the wire diameter, preferably 2-9 times the wire diameter, 3-8 times the wire diameter, 4-7 times the wire diameter or 5-6 times the wire diameter.

[0093] The horizontal plane spacing between wirebonds (340, 342, 344, and 346) is not required to be uniform at the points at which the wirebonds are connected to a substrate or other element (210 and 220) nor along the length of a wirebonded element (310), FIG. 1. Vertically the wirebonds (310) may have different heights (360, 362, 364, 366, and 368) to the substrate (200). The heights of wirebonds as a distance from a plane defined by the substrate or connection points on a substrate are not required to be uniform at the ball and wedge wirebonded connection (320, 330) nor along the filament wire, e.g., wire loop, that represents a portion of the wirebond (310) of a wirebonded structure (300).

[0094] A signal applied to the grid (100) changes the ability of electrons to pass through the horizontal (340, 342, 344, and 346) and vertical (360, 362, 364, 366, and 368) spacings from the emitter (not shown) to the collector (not shown). An example signal is an electromagnetic oscillation (radio signal) from recorded music.

[0095] Multiple wirebonds are created in a pattern (400) that has groups 310 and 410 in a layered scheme grid (110), see FIG. 3. The horizontal spacing between wirebonds in group 310 (340, 342, 344, and 346) and in group 410 (440, 442, 444, and 446) is not required to be uniform. The vertical spacing between the wirebonds in group 310 and group 410 is not required to be uniform (not shown).

[0096] When looking down on to wirebond grids (310) and (410) the result may represent a slotted grid (150), FIG. 4A, and/or a cross-hatch grid (160), FIG. 4B, in which crosswires may optionally be electrically connected, e.g., may be connected by wirebonded connections at points where wires cross.

[0097] In embodiments (100), FIGS. 5A-D, the voltage for each wirebond can be the same or different. In FIG. 5A the wirebond grid is shown to have the same voltage (V310) to each wirebonded element. FIG. 5B shows that each wirebonded element has its own independent voltage (V310-1-V310-5).

[0098] In embodiments with two or more grid levels, each wirebond can be at the same or different voltage. FIG. 5C shows V310 and V410 for the two layers of wirebonds. These voltages may be the same. FIG. 5D shows the two layers of wirebonds with each a unique voltage (V310-1, -2, -3, -4, -5, V410-1, -2, -3, -4, -5).

[0099] In embodiments (150-1 (FIG. 5A), 150-2 (FIG. 5B)) and (160-1 (FIG. 5C), 160-2 (FIG. 5D)) an anode surface (390) exists at the substrate surface. The anode surface is typically created separately and is not part of the grid of wirebonds that forms the wirebonded structure of a triode.

[0100] Voltages chosen for the embodiments can be used to maximize electron collection at the anode (390). These voltages are not the same as the voltages used to pass electrons from the emitter (cathode) to the collector (anode). Example voltages include those described in, for example, U.S. Pat. No. 9,583,300 (see FIG. 13 description—U.S. Pat. No. 9,583,300 is incorporated herein by reference in its entirety) with 4 V at the anode and 3 V at the grid.

[0101] In embodiments for the emitter (cathode) and collector (anode) a wirebonded structure having only a single wirebond (620), FIG. 6A, a wirebonded structure having multiple wirebonds (720), FIG. 6B, or a wirebonded structure having wire filaments or wire loops one or more of which has a wire-to-wire wirebonded connections (not shown) can be implemented. Most commonly emitters have a single wire filament that is wirebonded to the substrate (610) and/or has one or more wire-to-wire wirebonded connections.

[0102] The metal alloy used for the emitter wirebonds can be selected for improved electron emission. This metal alloy may have coatings to improve electron emission.

[0103] Collectors preferably have multiple wirebonds and/or wirebonded structures, FIG. 6B, thereby enhancing the ability of the collector to collect electrons. The embodiment strives for a large collecting metal surface area.

[0104] Techniques for tensioning of the emitter wire are known and include those described in, for example, U.S. Pat. No. 9,583,300 (see for example FIG. 8). Tensioning is intended to help maintain the alignment of emitter wires to the grid and anode, even while hot. Conventionally, tensioning is viewed as necessary in order to minimize the effects of shape distortion, e.g. wire sag, caused as current passes through a wire to generate heat for electron emission. Preferred shapes are springs that pull the, e.g., emitter wire, into alignment. Wirebonds can implement spring like tensioning by appropriate modification of their structure and composition and/or by tensioning the wire filament while wirebonded connections are formed during a wirebonding process.

[0105] An example embodiment including emitter, grid and collector constructed of wirebonds is shown in FIG. 7A, (800). The emitter (810) is represented by a single wirebond. The grid (820) is a wirebonded structure that is represented by several wirebonds that provide a surface similar to a conventional grid. The collector (830) is a wirebonded structure including multiple wirebonds stacked vertically. The multiple wirebonds create a large electron collection surface area approaching a single plate surface area.

[0106] In the example embodiment (800) electrons are emitted at the emitter (810). If the grid voltage is set to pass electrons then the electrons pass through or by the grid (820) and are collected at the collector (830).

[0107] In the example embodiment (800) the substrate (200) surface is approximately parallel to the electron flow.

[0108] The grid (820) and collector (830) of FIG. 7A provide simple examples of three dimensional wirebonded structures. FIGS. 7B and 7D are respectively a side and front view for the wirebond grid structure. FIGS. 7C and 7E are the side and front view for the wirebond collector structure respectively. More complicated structures are possible and can be used to control the emission, flow and collection of electrons.

[0109] In FIG. 8, the embodiment has a vertically arranged emitter (910), grid (920) and collector (930). In this case, instead of a wirebonded structure for the electron collector, a substrate metallization area (930) is present. The collector metallization area could be coated with a fluorescing material, not shown.

[0110] Example spacings between the emitter, grid and collector for FIG. 7 and FIG. 8 can be found in for example 9,583,300 (see in particular the description of FIG. 13). For example, spacings between the emitter and grid are from 0.05 to 1.0 mm, preferably 0.1 to 0.8 mm, 0.2 to 0.6 mm or around 0.4 mm and those between the grid and collector are from 0.05 to 1.0 mm, preferably 0.1 to 0.8 mm, 0.2 to 0.6 mm or around 0.3 mm.

[0111] FIG. 9 provides cross-sections for the wire used in the wirebond. The wire or wire filament of a wirebond is typically circular or near circular in cross-section, FIG. 9A. To better gather electrons at the anode it is possible to use wire that is flattened, FIG. 9B. The flattened surface provides a more efficient electron collection surface if oriented to the electron flow. Preferred orientation would be the flattened surface facing to the electron flow. Changing the emitter wire from circular to a tear drop or pointed shape emits electrons preferentially at the thin edge, FIG. 9C. This can be used to reduce the current needed for heating. The tear drop or pointed shape also is beneficial for field emission since a lower field strength is needed for pulling electrons free from the point.

[0112] It is possible to have two or more triodes inside a single package. For space usage efficiency, the different triodes may use the same collector. Alternatively the different triodes may use the same emitter. Multiple triodes in a single package using the same collector and emitter are conceptually possible.

[0113] Preferably, a lid is used to properly enclose the triode. The lid provides a barrier separating the space inside the cavity from the outside atmosphere. The atmosphere outside the lid may contaminate the triode in two basic ways. First, the triode works best in a vacuum, e.g., the triode components disposed in the cavity are in a vacuum. The lid defines the closed volume of the cavity that is under vacuum. Second the lid provides a physical barrier through which damaging chemicals cannot pass. It is of particular concern to isolate the triode components from chemicals and/or damaging electromagnetic energy that may oxidize the emitter surfaces.

[0114] In addition to providing a physical barrier the lid can function to provide other benefits. The lid can be designed to have one or more electrical functions. For example, the lid may provide an electrical ground potential for stray electrons present in the triode cavity. By being at a ground or slightly positive potential, charge buildup on surfaces can be reduced.

[0115] In other aspects the lid can function as a carrier, mounting surface or substrate for one or more triode elements and also other electronic components. As an example, the lid may be the surface on which the grid is created and/or a surface on which the grid is mounted. The wirebonding method described herein can be used for fabricating a triode having, e.g., a grid mounted on or integrated with an interior surface of the lid. In this embodiment the lid, once placed and sealed (joined) to the substrate, has the grid in the proper place for the triode to function.

[0116] In FIG. 19A the closed triode assembly is shown (1920) which includes the substrate (1900) and lid (1910). The substrate for this figure is a cavity configuration while the lid is a flat plate, FIGS. 19B and 19C. For FIG. 19B and FIG. 19C the dashed line (1930) of FIG. 19A shows where the opened view look into the triode assembly volume occurs.

[0117] FIG. 19B shows an opened view (sideview in the plane of the substrate on which the components are mounted) including the emitter (810), grid (820) and collector (830), all with electrical connections to the substrate (1900). FIG. 19C shows the grid (820) electrically connected to the lid (1910). The emitter (810) and collector (830) remain electrically connected to the substrate. Other combinations are possible such that one or more of the emitter, grid and collector are mounted on the lid, substrate and/or a surface of the lid that is not parallel to the substrate.

[0118] Other surfaces may be used for making electrical connections between components of the triode and/or between the triode and other components of a device that includes the triode. A simple substrate and lid configuration can include two or more distinct surfaces joined (e.g., in electrical communication) together to form a triode assembly.

[0119] During the sealing operation, an electrical connection can be made to provide an electrical path from the substrate and/or one or more components mounted on the substrate to the lid and/or one or more components mounted on the lid. One common method for sealing the lid to the substrate is with solder. The solder provides the electrical connectivity for providing an electrical communication to components of the triode mounted on or in contact with the lid, e.g., the grid.

[0120] The lid as described above is preferably of a shaped singular metallic construction and/or made from an electrically insulating material such as a metal oxide such as glass that is impermeable or resistant to passage of gases. For adding electrical properties to the triode, the metallic lid may be a sandwich or alloy of multiple materials. For instance the inside surface of the lid can be a conductor and/or may have conductive pathways comprising a metal coating or film whereas an outside surface can function as an insulator. An insulator on the outside provides protection to possible component users from electrical shocks.

[0121] Other configurations of conductor- and/or insulator-functionalized lids are further beneficial. For instance a metal-insulator metal sandwich provides electrical function on the lid inside surface, an insulator barrier to the outside surface and the outside metal surface provides, for example, protection from spurious outside electro-magnetic fields.

[0122] The inside metal surface of the lid can be patterned for multiple electrical purposes. In one aspect patterning can function to provide contact pads to which wirebonds are made. The pads have electrical connectivity and thus electrical routing can be patterned on or in the metal to thereby supply a voltage.

[0123] Other areas of the inside metallic surface of the lid can be patterned to create voltage fields to better direct electrons to the intended targets. For example, in conventional triodes the current flow from the emitter to the collector is not a perfect beam with some electrons diverging from the grid. A patterned lid (and likewise a similarly complementary patterned substrate) directs more electrons through the grid thereby increasing amplification for the triode.

Examples

[0124] The device of FIG. 7A is formed using the process described in FIGS. 10-15. FIGS. 10-15 illustrate one method for creating a triode using the wirebonding method of the present disclosure. The electron flow from the cathode through and by the grid and then to the anode is approximately parallel to the substrate surface.

[0125] A ceramic substrate 1200 is provided in the first step as shown in FIGS. 10A and 10B. The substrate, 1200, provides a support for a wirebond process that forms a triode. The substrate has electrically conductive surfaces (e.g., pads), (1210, 1220, 1230, and 1240) for an illustration of appropriate size, number and patterning to function as electrical connectivity points and/or wirebond pads, on two or more surfaces. Pads are on at least one surface and preferably on both top and bottom surfaces. The top surface pads are used for the wirebond construction (1210, 1220, and 1230), FIG. 10A. The bottom surface pads (1240), FIG. 10B, are used for making electrical and mechanical connections to, for example, a printed circuit board.

[0126] The substrate has electrically conductive surfaces of size equal to or greater than the ball and wedge wirebond contact areas, number sufficient for the count of ball and wedge bonds and in a pattern to provide the layout for the device being fabricated.

[0127] In the second step, the substrate, 1200, is brought to the sample holder in a wirebonding machine (e.g., K&S (Kulicke & Soffa Industries, Inc.) Rapid Pro Ball Bonder). The wirebonder thermosonically bonds each wirebond, preferably individually, to form wirebonded connections. After alignment of the wire to a substrate connectivity point, a single wire is bonded to the substrate top surfaces designated for the emitter circuit. Preferably each wire (310) uses two pads to make connectivity with the substrate (FIG. 11). The first connection will preferably be a ball bond (320) and the second connection will preferably be a wedge bond (330).

[0128] The emitter wire alloy and/or coating is different from the wire alloy used for the grid and collector, thus the substrate may optionally be moved to a different wirebonder for further bonding or the first wirebonding machine may exchange wire alloys.

[0129] For the third step, the wirebonder or the substrate moves to allow the wirebonder to align and create the wirebonds for the grid (FIG. 12). Each wirebond is created according to a preprogrammed pattern using preferably ball bonds (320) and wedge bonds (330). After completion of the grid pattern the collector is created in a fourth step (FIG. 13).

[0130] Although the wire alloy for the grid and collector is preferably the same, the shape including diameter may be different. The difference in wires is achieved when the wirebonder exchanges the wire being used or the substrate moves to another wirebonder.

[0131] Step five, generally optional, incorporates a getter material to prolong the vacuum life for the triode. The getter material (1410) is preferably placed on the substrate (1200) (FIG. 14) or is part of the cavity lid. FIGS. 14A and 14B represent the finished wirebonded structures in side and front view respectively.

[0132] A lid (1510) is then placed over the triode (FIG. 15) while in vacuum. This lid makes contact along the substrate (1200) perimeter. The lid and substrate form and define a box, e.g., vacuum cavity, in which the triode is disposed. A bond (1520) between the lid and the substrate can be created thermosonically, thermally, chemically (e.g., with an adhesive), mechanically or by other means. Since the lid is placed and sealed while under vacuum, the triode in the cavity is under vacuum.

[0133] The lid of FIG. 15 is a represented by a five sided box. The lid of FIG. 19 is a single planar structure. The lid style is not immediately important and not limited to five sided nor single sided. Rather the lid function of sealing the cavity from the outside environment is important.

[0134] The preferred electron path is parallel to the substrate top surface. The electrons are emitted at the emitter, pass through and by the grid and are received at the collector.

[0135] The device of FIG. 8 is made using the steps described in FIGS. 16-18 and 15 illustrate a second method for creating a triode using the described wirebonding method. The electron flow is vertical to the substrate surface and as described the electron flow uses the substrate surface as a collector.

[0136] FIGS. 16A and 16B have a ceramic substrate 1300 in the form of a rectangular sheet. The substrate, 1300, provides a substrate for a device containing triode elements made using a wirebond process. The substrate has electrically conductive surfaces of appropriate size, number and patterning (1310, 1320, 1330, and 1340) to function as electrical connectivity points and/or wirebond pads, on two or more surfaces. Pads are on at least one surface and preferably on both top and bottom surfaces. The top surface pads, FIG. 16A, are used for the wirebond construction (1310, 1320). The bottom surface pads (1340), FIG. 16B, are used for making electrical and mechanical connections to, for example, a printed circuit board.

[0137] Pad 1330 is the collector for the triode and is preferably integral and preferably flush with the surface of the substrate, 1300. This pad may be coated with a fluorescing material, not shown.

[0138] The substrate is moved to a sample holder in a wirebonding machine. After alignment of the wire to the substrate one or preferably more wirebonds with wirebonded connections are made to form the grid (FIG. 17). Each wirebond preferably has a ball bond (320) and a wedge bond (330) that join the wire (310) to an electrically conductive substrate surface or pad thereon.

[0139] After forming the grid, the substrate can remain in the wirebonding machine or be transferred to a separate wirebonding machine to form the emitter. The substrate and wire are aligned and preferably one wirebond formed from one ball bond (320) and one wedge bond (330) are made to the proper electrically conductive substrate surfaces (FIG. 18).

[0140] After forming the grid and emitter the substrate optionally has getter material added (FIG. 18). The getter material is preferably attached to the substrate in areas away from the wirebonds (1350).

[0141] A lid (1510) is then joined to the substrate while in a vacuum (FIG. 15). The lid in the example is of a box shape with 5 main outside surfaces: 4 sides and 1 top. The lid is sealed (1520) to the substrate (1200) to ensure a vacuum is maintained inside the now sealed assembly.

[0142] The preferred electron path has the electrons emitted by the emitter above the grid, flowing through and by the grid and then reaching the collector. The electron path is nominally vertical to and aimed at the substrate surface in particular the substrate surface collector region.

[0143] Typically wirebonds are encapsulated with a thermoset or thermoplastic organic material like a curable epoxy or a molding compound. For the present disclosure it is preferred that complete encapsulation (i.e., complete submersion or contact at all surfaces with the organic material) is avoided. Complete encapsulation with a material may defeat the individual triode elements function for example by interfering with electron flow between the triode components. Nonetheless, those skilled in the art will realize that portions of the wirebond may be encapsulated with a material and allow the triode to function.

[0144] Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein.