SENSOR PACKAGE AND METHOD OF PRODUCING THE SENSOR PACKAGE

Abstract

The sensor package comprises a carrier (1) including electric conductors (13), an ASIC device (6) and a sensor element (7), which is integrated in the ASIC device (6). A dummy die or interposer (4) is arranged between the carrier (1) and the ASIC device (6). The dummy die or interposer (4) is fastened to the carrier (1), and the ASIC device (6) is fastened to the dummy die or interposer (4).

Claims

1. A sensor package, comprising: a carrier including electric conductors; an ASIC device; a sensor element integrated in the ASIC device; a dummy die or interposer arranged between the carrier and the ASIC device, the dummy die or interposer being fastened to the carrier; and the ASIC device being fastened to the dummy die or interposer.

2. The sensor package according to claim 1, wherein the dummy die or interposer includes an electrically inactive semiconductor substrate.

3. The sensor package according to claim 1, wherein the dummy die or interposer comprises an insulator or glass.

4. The sensor package according to claim lone of claims 1 to 3, further comprising: an adhesive layer between the dummy die or interposer and the ASIC device, the adhesive layer comprising silicone.

5. The sensor package according to claim 4, wherein the adhesive layer is at least 80 m thick.

6. The sensor package according to claim 1, further comprising: a cover with an opening, the dummy die or interposer and the ASIC device being arranged between the carrier and the cover.

7. The sensor package according to claim 1, wherein the sensor element is a pressure sensor.

8. The sensor package according to claim 1, wherein the sensor element is sensitive to stress.

9. The sensor package according to claim 1, wherein the dummy die or interposer has smaller lateral dimensions than the ASIC device.

10. The sensor package according to claim 1, wherein the ASIC device laterally overhangs the dummy die or interposer by at least 100 m.

11. The sensor package according to claim 1, further comprising: a bond layer between the carrier and the dummy die or interposer, the bond layer comprising a die attach foil.

12. A method of producing a sensor package, comprising: providing a carrier including electric conductors; fastening a dummy die or interposer on the carrier; providing an ASIC device comprising an integrated sensor element, and fastening the ASIC device to the dummy die or interposer.

13. The method according to claim 12, further comprising: fastening the ASIC device to the dummy die or interposer by an adhesive layer.

14. The method according to claim 13, wherein the adhesive layer comprises silicone.

15. The method according to claim 13, wherein the adhesive layer is formed at least 80 m thick.

16. The method according to claim 12, further comprising: fastening the dummy die or interposer to the carrier by a bond layer comprising a die attach foil.

17. A sensor package, comprising: a carrier including electric conductors; an ASIC device; a sensor element integrated in the ASIC device; a dummy die or interposer arranged between the carrier and the ASIC device; the dummy die or interposer being fastened to the carrier; the ASIC device being fastened to the dummy die or interposer; and the ASIC device laterally overhanging the dummy die or interposer by at least 100 m.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG. 1 is a cross section of a sensor package comprising a dummy die or interposer.

[0017] FIG. 2 is a cross section of a further sensor package comprising a dummy die or interposer and an overhanging ASIC device.

[0018] FIG. 3 is a cross section of a further sensor package comprising a dummy die or interposer and an ASIC device with larger overhang.

[0019] FIG. 4 is a top view corresponding to the indication in FIG. 2.

[0020] FIG. 5 is a top view corresponding to the indication in FIG. 3.

DETAILED DESCRIPTION

[0021] FIG. 1 is a cross section of a sensor package comprising a carrier 1 with integrated electric conductors 13, a bottom pad 2 on or above a top surface 10 of the carrier 1, a bond layer 3 on the bottom pad 2, a dummy die or interposer 4 on the bond layer 3, an adhesive layer 5 on the dummy die or interposer 4, an ASIC device 6 with integrated sensor elements 7 on the adhesive layer 5, electric interconnections 8 between the ASIC device 6 and contact pads 14 on the top surface 10 of the carrier 1, a cover 9 on the top surface 10, and terminal contacts 12 on the rear surface 11 of the carrier 1, opposite the top surface 10. The dummy die or interposer 4 provides a mechanical decoupling of the ASIC device 6 from the carrier 1. Deformations that may be caused by external forces acting on the sensor package may thus be prevented from adversely affecting the sensor element 7 integrated in the ASIC device 6.

[0022] The carrier 1 may be a printed circuit board, for instance, in particular a laminate. The terminal contacts 12 on the rear surface 11 of the carrier 1 may be formed in the shape of a land grid array, for instance. The integrated electric conductors 13 may provide a wiring or redistribution. The dummy die or interposer 4 may comprise semiconductor material, which may in particular be silicon, and may especially include an electrically inactive semiconductor substrate. The dummy die or interposer 4 may instead comprise an insulator or glass, for instance. The coefficient of thermal expansion of the insulator or glass may in particular be adapted to the coefficient of thermal expansion of the ASIC device 6.

[0023] The bottom pad 2 is optional. The bond layer 3 may be a die attach foil, for instance.

[0024] The adhesive layer 5 may especially comprise silicone, i. e. a compound obtained by polymerizing siloxane. The silicone may be applied like a glue to fasten the ASIC device 6 to the dummy die or interposer 4. The thickness t of the adhesive layer 5 is larger than 60 m, typically at least 80 m for an effective mechanical decoupling between the ASIC device 6 and the dummy die or interposer 4.

[0025] The ASIC device 6 may be a CMOS device, for instance. The sensor element 7 may be any conventional sensor, especially a pressure sensor or array of pressure sensors, which may be realized as a microelectromechanical system, for instance. The sensor element 7 may also comprise a sensor sensitive to stress. The mechanical decoupling of the ASIC device 6 from the carrier 1 is improved if the dummy die or interposer 4 has smaller lateral dimensions than the ASIC device 6, so that a lateral overhang 15 is formed at least on one lateral side or edge of the ASIC device 6. The overhang 15 may be considerably larger than the overhang 15 shown in FIG. 1.

[0026] The electric interconnections 8 between the ASIC device 6 and contact pads 14 on the top surface 10 of the carrier 1 may be bond wires, for instance, as shown in FIG. 1. The stack of the dummy die or interposer 4 and the ASIC device 6 is accommodated in a cavity 17, which is formed by the carrier 1 and the cover 9. The electric interconnections 8 and the contact pads 14 are also inside the cavity 17. The cover 9 may comprise a metal lid. If the sensor element 7 is a pressure sensor requiring access to the environment, an opening 16 is provided in the cover 9.

[0027] Typically the thickness of the carrier 1 may be in the range from 130 m to 170 m, the thickness of the bond layer 3 about 20 m, the thickness of the dummy die or interposer 4 in the range from 50 m to 200 m, the thickness of the adhesive layer 5 in the range from 60 m to more than 100 m, the height h of the ASIC device 6 in the range from 140 m to 400 m, and the overall height H of the sensor package, including the cover 9, in the range from 600 m to 1100 m.

[0028] FIG. 2 is a cross section of a further sensor package comprising a dummy die or interposer 4. Elements of the sensor package according to FIG. 2 that are similar to corresponding elements of the sensor package according to FIG. 1 are designated with the same reference numerals. In the sensor package according to FIG. 2, the lateral overhang 15 of the ASIC device 6 over the dummy die or interposer 4 is larger than in the sensor package according to FIG. 1, in order to improve the mechanical decoupling. In particular, the overhang 15 may be larger on two or three adjoining lateral sides or edges of the ASIC device 6, the shape of such an arrangement resembling the mushroom called turkey tail (trametes versicolor). The indicated dimension d of the overhang 15 may be typically larger than 50 m or even larger than 100 m.

[0029] FIG. 3 is a cross section of a further sensor package comprising a dummy die or interposer 4. Elements of the sensor package according to FIG. 3 that are similar to corresponding elements of the sensor package according to FIG. 1 are designated with the same reference numerals. In the sensor package according to FIG. 3, the lateral overhang 15 of the ASIC device 6 over the dummy die or interposer 4 is even larger than in the sensor package according to FIG. 2. The overhang 15 may be present on one lateral side or edge or on two or three adjoining lateral sides or edges. The larger overhang 15 allows the sensor element 7 to be shifted from the region of the ASIC device 6 that is supported by the dummy die or interposer 4 towards the region of the overhang 15, in order to enhance the mechanical decoupling of the sensor element 7. The dimension d of the overhang 15 indicated in FIG. 3 may be typically larger than 100 m.

[0030] FIG. 4 is a top view onto the stack of the dummy die or interposer 4 and the ASIC device 6 of the sensor package according to FIG. 2, corresponding to the indication IV with arrows pointing down in FIG. 2. The hidden contours of the dummy die or interposer 4, which is covered by the ASIC device 6, are represented in FIG. 4 with broken lines. Contact areas 18 of the ASIC device 6, which may be contact pads or uncovered surface areas of an uppermost metallization level of a wiring, for instance, are electrically connected to the contact pads 14 by interconnections 8, which are bond wires in this example. The number and the arrangement of the contact pads 14 and contact areas 18 can be varied according to individual requirements. The sensor element 7 may be arranged at or near the center of the ASIC device 6, as shown in FIG. 4 by way of example, or near the periphery of the ASIC device 6. FIG. 4 shows a typical turkey tail configuration with the large overhang 15 extending on three adjoining lateral sides or edges of the ASIC device 6. Instead, the large overhang 15 may only be present on two adjoining lateral sides or edges of the ASIC device 6.

[0031] FIG. 5 is a top view onto the stack of the dummy die or interposer 4 and the ASIC device 6 of the sensor package according to FIG. 3, corresponding to the indication V with arrows pointing down in FIG. 3. The hidden contours of the dummy die or interposer 4, which is covered by the ASIC device 6, are represented in FIG. 5 with broken lines. Contact areas 18 of the ASIC device 6, which may be contact pads or uncovered surface areas of an uppermost metallization level of a wiring, for instance, are electrically connected to the contact pads 14 by interconnections 8, which are bond wires in this example. The number and the arrangement of the contact pads 14 and contact areas 18 can be varied according to individual requirements. The sensor element 7 is arranged in the area of the overhang 15. FIG. 5 shows a diving board configuration with a large overhang 15 only on one lateral side or edge of the ASIC device 6. Instead, the large overhang 15 may be present on two or three adjoining lateral sides or edges of the ASIC device 6, as in the example shown in FIG. 4.

[0032] The sensor package is especially favorable for stress sensitive sensors. The sensor element and the circuitry are integrated on a single die, which allows to reduce the overall height of the sensor package substantially. At the same time stress decoupling is enhanced by the electrically inactive dummy die or interposer. Stress caused by thermal expansion is prevented if the coefficient of thermal expansion of the dummy die or interposer is adapted to the coefficient of thermal expansion of the ASIC device, in particular if the dummy die or interposer comprises the same semiconductor material and hence the same coefficient of thermal expansion as the ASIC device.