Method and apparatus for 3D fabrication
10500830 ยท 2019-12-10
Assignee
Inventors
- Kenneth H. Church (Orlando, FL, US)
- Josh Goldfarb (Orlando, FL, US)
- Michael W. Owens (Orlando, FL, US)
- Xudong Chen (Orlando, FL, US)
- Paul Deffenbaugh (Orlando, FL, US)
- Daniel Silva (Orlando, FL, US)
- Charles Michael Newton (Orlando, FL, US)
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B29C48/2886
PERFORMING OPERATIONS; TRANSPORTING
B29C64/106
PERFORMING OPERATIONS; TRANSPORTING
B29C64/118
PERFORMING OPERATIONS; TRANSPORTING
B29C64/112
PERFORMING OPERATIONS; TRANSPORTING
B29K2105/251
PERFORMING OPERATIONS; TRANSPORTING
B29C48/872
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C48/285
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/20
PERFORMING OPERATIONS; TRANSPORTING
B29C64/112
PERFORMING OPERATIONS; TRANSPORTING
B29C64/106
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An apparatus for use in 3D fabrication includes a heat sink, a melt tube extending through the heat sink, the melt tube having a first end and an opposite second end and adapted for melting filament or other material as the material is conveyed from the first end to the second end, a pen tip having an opening therein for ejecting melted material, the pen tip at the second end of the melt tube, and a pen tip holder for securely holding the pen tip during printing, the pen tip holder having a heater element associated therewith.
Claims
1. An apparatus for use in 3-D fabrication, the apparatus comprising: a heat sink configured to dissipate heat; a melt tube having a first end and an opposite second end and adapted for heating a material as the material is conveyed between the first end and the second end; a pen tip having an opening therein for ejecting melted material; and a pen tip holder configured to securely hold the pen tip, the pen tip holder disposed apart from the heat sink, the pen tip holder having a heater element; wherein the melt tube comprises a thin walled section such that only the melt tube of the apparatus extends between the heat sink and the pen tip holder for a distance thereby forming a heat break; wherein the pen tip is inserted into the pen tip holder and over the second end of the melt tube and wherein the pen tip holder is threadably secured to the melt tube to thereby hold the pen tip in position.
2. The apparatus of claim 1 wherein the pen tip, the pen tip holder, and the heater element form an integrated part with the heater element conformally printed on the pen tip or pen tip holder.
3. The apparatus of claim 1 further comprising a cooling unit for cooling the first end of the melt tube.
4. The apparatus of claim 3 wherein the cooling unit comprises a fan to provide forced air cooling of the first end of the melt tube.
5. The apparatus of claim 1 wherein the melt tube is comprised of metal.
6. The apparatus of claim 5 wherein the melt tube comprises a stainless steel tube.
7. The apparatus of claim 1 wherein the pen tip has a cone-shaped profile.
8. The apparatus of claim 1 further comprising a body wherein portions of the apparatus are disposed within the body and wherein wiring is printed on a side of the body.
9. The apparatus of claim 1 wherein the pen tip comprises a ceramic material.
10. The apparatus of claim 1 wherein the heater element comprises a heater stick positioned within the pen tip holder.
11. The apparatus of claim 1 wherein the heater element comprises a heater coil positioned within the pen tip holder.
12. The apparatus of claim 1 further comprising a cooling unit to selectively cool a portion of the apparatus.
13. The apparatus of claim 1 further comprising a heating system configured to selectively heat a portion of a build unit.
14. The apparatus of claim 13 wherein the heating system comprises a laser, an infrared heat source, or an ultrasonic wave generator.
15. The apparatus of claim 1 wherein the material comprises filaments.
16. The apparatus of claim 15 wherein the filaments comprise plastic.
17. The apparatus of claim 1 wherein the material comprises metal.
18. The apparatus of claim 1 wherein the material comprises powder.
19. An apparatus for use in 3-D fabrication, the apparatus comprising: a heat sink configured to dissipate heat; a melt tube having a first end and an opposite second end and adapted for heating a material as the material is conveyed between the first end and the second end; a pen tip having an opening therein for ejecting melted material; a pen tip holder configured to securely hold the pen tip, the pen tip holder disposed apart from the heat sink, the pen tip holder having a heater element associated therewith; and a heat break consisting of a thin walled section of the melt tube in between the heat sink and the pen tip holder, the heat break acting as a thermal choke to reduce heat transferred to the heat sink; wherein the pen tip is inserted into the pen tip holder and over the second end of the melt tube and wherein the pen tip holder is threadably secured to the melt tube to thereby hold the pen tip in position.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
(12) The present invention provides for safely melting high temperature plastic filaments by the use of a thin walled stainless steel tube between the hot and cold ends of the melt tube. This acts as a thermal choke that prevents heat transfer into the undesired areas, but does so in a much smaller space than other solutions thus effectively reducing the amount of gummy material. Furthermore, because this thin wall section and all materials below it are either constructed from stainless steel or ceramic, it is able to reach the extreme temperatures needed to melt high temperature thermoplastic filaments. Existing designs incorporating plastics in their melt tubes are not able to reach these temperatures. The heated section is comprised of a heater printed onto a screw-on nozzle holder that simultaneously heats up the ceramic pen tip while securing it to the end of the liquefier tube. Printing the heater coil directly onto the holder rather than using a conventional heater cartridge reduces the thermal mass and allows the nozzle to have an overall cone-shaped profile thus minimizing the amount of heat imparted into the part that is being printed and reducing warping of the part being printed.
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(14) Another extension of this design is the integration of the tip, tip holder and heater as one monolithic tip/nozzle.
(15) In addition to the heater and heat extrusion is the dispensing patterns on each pass of the extruded print. Typically, the nozzle of element 16 is a circular shape and is heated to allow a small uniform strip to be printed. This new design changes from a circular nozzle duct for extrusion to an oval or a slot shaped duct for extrusion. This allows for larger surface coverage per pass thus reducing the number of passes and increasing the build speeds.
(16) In addition to the benefits of an oval or a slot shaped duct for extrusion, the printed part or the nozzle of element 16 or the pump device can be rotated to maintain a specific angle against the path of printing. For example, the slot can be normal to the path of printing or the print part. If a different angle is desired of the slot relative to the path of printing or the print part, rotational and angle adjustments, such as adjustments made under computer control, can be made to the printed part or the nozzle of element 16 or the pump device.
(17) In addition to the nozzles with slotted ducts for increased speed, parallel nozzles can print simultaneously. This new design has multiple nozzles on a single pump but allows each nozzle to operate independently for rastering and filling unique, digital patterns. A number of heated printers or tools have done multiple nozzles, but not parallel printing utilizing a raster scan for larger area print coverage in one pass.
(18) In addition, a hopper design coupled with an auger screw may be used to pull material and push it through the nozzle of element 16. There are mixing and extruding equipment, but these are not pumps. The hopper and auger combination replace the filament fed approach.
(19) In addition, a swappable dovetail mount and a swappable tool changer interface may be used.
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(24) Also note that the heating/cooling isolation is provided. Although fan 28 is shown, alternative means may be used for cooling such as a water jacket or a piezoelectric cooler or other cooling means. The heating and cooling are localized, distributed, and/or focused. In other words, instead of heating the entire enclosure, only specific areas are heated and cooled.
(25) This localized heating also relates to the build unit. In typical FDM, for large builds by example, ones needs to heat the entire builder chamber, in other words, one is effectively printing inside an oven. The reason for such an approach is to address the thermal gradient that occurs during the build process. The material coming out of the pen tip is hot, as it cools, the build can warp a bit. To reduce warping, the material is printed on a heated bed. So layer after layer stays warm and the hot material is resting on warm material. They fuse together and stay warm. Once the print is done, the entire structure is allowed to cool down with a constant temperature throughout the printed structure. This reduces warping. If the structure is large, then the heated bed keeps the bottom section warm, the upper section will be cool which means hot plastic is being printed on cool plastic, and even though it can still fuse, the build will likely warp.
(26) To remedy this, the present invention allows for providing localized or directed heat at sections of the part to allow sections to stay warm and not warm and sections to cool down together and the sections will be stronger as a fused whole than single layers. Thus, localized or directed heat of sections allows for reductions in warping. This may be performed in various ways including with lasers heating up sections, IR lamps heating up sections, or ultrasonic waves heating up sections, or performed in any number of other ways that permit localized or directed heating or cooling.
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(29) Thus, according to one aspect is that the temperature isolation that may be needed to shield excess heat from radiating into other tools or pumps in proximity to the nFD pump. This type of shield provides protection for materials in proximity that are sensitive to heat and may cure in the pump device. Directed and localized temperature heating and cooling provide for more control over the entire printing process when multiple materials are utilized.
(30) According to another aspect, the distributed and localized heating that allow a reduction in delamination of layered materials that are the natural results of layer by layer manufacturing. Typical large builds will have a large thermal mismatch and this mismatch causes the structure to warp as different parts of the structure cool and heat at different rates. These changes can cause warping and delamination. To stop this some have heated the entire build chamber. To avoid heating the entire build chamber, localized or directed heat is used to control the heat differential in gradients. As a section of the structure becomes larger, it becomes more rigid and the delamination and warping is controlled. This approach maintains heat in sections to reduce or eliminate warping and delamination. There are a variety of heating sources to include laser, light emitting diodes, RF, microwave, acoustic, inductive, heated air, convection and IR to name a few.
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(32) Although various specific embodiments are shown and described herein, it is to be appreciated that any number of additional options, variations, and alternative embodiments are contemplated. The present invention is not to be limited to the specific embodiments shown herein.