OPTICAL SENSING MODULE
20190368923 ยท 2019-12-05
Assignee
Inventors
Cpc classification
G01J1/4228
PHYSICS
G01J1/0266
PHYSICS
G01J1/0295
PHYSICS
International classification
Abstract
An optical sensing module has a light source and an optical sensing integrated circuit device. The optical sensing integrated circuit device has an optical sensor and a grating. The optical sensor and the light source are arranged along a first direction. The grating is formed over the optical sensor and has multiple parallel wires. The multiple wires are perpendicular to the first direction.
Claims
1. An optical sensing module, comprising: a light source; and an optical sensing integrated circuit device comprising: a first optical sensor, wherein the first optical sensor and the light source are arranged along a first direction; and a grating formed over the first optical sensor and having multiple parallel wires, wherein the multiple wires are perpendicular to the first direction.
2. The optical sensing module as claimed in claim 1, wherein the optical sensing integrated circuit device comprises multiple conductive layers over the first optical sensor, and the multiple wires are formed by one of the conductive layers.
3. The optical sensing module as claimed in claim 1, wherein the first optical sensor is a proximity sensor to sense proximity of an object.
4. The optical sensing module as claimed in claim 2, wherein the first optical sensor is a proximity sensor to sense proximity of an object.
5. The optical sensing module as claimed in claim 1, wherein the first optical sensor is an infrared sensor.
6. The optical sensing module as claimed in claim 2, wherein the first optical sensor is an infrared sensor.
7. The optical sensing module as claimed in claim 1, wherein the optical sensing integrated circuit device further comprises a second optical sensor and the second optical sensor is an ambient light sensor to sense ambient light.
8. The optical sensing module as claimed in claim 2, wherein the optical sensing integrated circuit device further comprises a second optical sensor and the second optical sensor is an ambient light sensor to sense ambient light.
9. The optical sensing module as claimed in claim 1, wherein the light source is an infrared light emitting diode.
10. The optical sensing module as claimed in claim 2, wherein the light source is an infrared light emitting diode.
11. The optical sensing module as claimed in claim 1, further comprising: a circuit board for mounting the light source and the optical sensing integrated circuit device.
12. The optical sensing module as claimed in claim 2, further comprising: a circuit board for mounting the light source and the optical sensing integrated circuit device.
13. The optical sensing module as claimed in claim 11, further comprising: a housing mounted on the circuit board to cover the light source and the optical sensing integrated circuit device, wherein the housing comprises: a first opening aligning with the light source; and a second opening aligning with the first optical sensor of the optical sensing integrated circuit device.
14. The optical sensing module as claimed in claim 12, further comprising: a housing mounted on the circuit board to cover the light source and the optical sensing integrated circuit device, wherein the housing comprises: a first opening aligning with the light source; and a second opening aligning with the first optical sensor of the optical sensing integrated circuit device.
15. The optical sensing module as claimed in claim 13, wherein the housing further comprises a wall and the wall is formed between the light source and the optical sensing integrated circuit device.
16. The optical sensing module as claimed in claim 14, wherein the housing further comprises a wall and the wall is formed between the light source and the optical sensing integrated circuit device.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0015]
[0016]
[0017]
[0018]
[0019]
[0020]
[0021]
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0022]
[0023] The light sensing module 10 may comprise (but not limited to) a light source 20 and an optical sensing integrated circuit device 30. The light source 20 and the optical sensing integrated circuit device 30 are mounted on a circuit board 11. The light source 20 may be an infrared light emitting diode to emit infrared light. The optical sensing integrated circuit device 30 comprises a first optical sensor 31 and a second optical sensor 33. In one embodiment, the first optical sensor 31 is a proximity sensor (PS) for sensing proximity of an object and the second optical proximity sensor 33 is an ambient light sensor (ALS) for detecting ambient lights. The proximity sensor may be (but not limited to) an infrared sensor.
[0024]
[0025]
[0026] With further reference to
[0027] A glass 14 on the housing 12 is a part of the electronic device. A part of the light signal LS upwardly emitted from the light source 20 passes through the glass 14 and reflected by an object 40 (such as a finger) outside of the electronic device to generate a first reflected light RS1 directed to the first optical sensor 31. Another part of the light signal LS upwardly emitted from the light source 20 is reflected inside the glass 14 for many times to generate a second reflected light RS2 directed to the first optical sensor 31. For the first optical sensor 31, the first reflected light RS1 is for sensing proximity of the object but the second reflected light is unwanted noise.
[0028] With further reference to
[0029] The grating 32 formed above the first optical sensor 31functions as a polarizer. The grating 32 can reflects the S-polarization light S.sub.p in the second reflected light RS2 to greatly decrease energy of the S-polarization light S.sub.p, thus the noise is decreased and the signal-to-noise ratio of the first optical sensor 31 is improved.
[0030] On the other hand, from the field of view (FOV)shown in
[0031] Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with the details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.