METHOD OF MANUFACTURING DIAMOND SUBSTRATE

Abstract

A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond; and a step of forming a modified layer 20, which includes a processing mark 21b of graphite and a crack 22b extending along a surface (111) around the processing mark 21b, along the surface (111) of the single crystal diamond at a predetermined depth from an upper surface of the block by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally.

Claims

1. A method of manufacturing a diamond substrate comprising: a step of placing a laser condensing unit configured to condense laser light so as to face an upper surface of a block of single crystal diamond; and a step of forming a modified layer, which includes a processing mark of graphite and a crack extending along a surface (111) around the processing mark, along the surface (111) of the single crystal diamond, at a predetermined depth from the upper surface of the block by radiating the laser light on the upper surface of the block from the laser condensing unit and condensing the laser light inside the block, and moving the laser condensing unit and the block in a relative manner two-dimensionally.

2. The method of manufacturing a diamond substrate according to claim 1, wherein the block has a plate-like shape having an upper surface as the (111) surface of the single crystal diamond.

3. The method of manufacturing a diamond substrate according to claim 1, wherein the step of forming the modified layer includes: a step of moving the laser condensing unit and the block in a relative manner in a predetermined scanning direction; and a step of moving the laser condensing unit and the block in a relative manner in a direction orthogonal to the scanning direction at a predetermined interval.

4. The method of manufacturing a diamond substrate according to claim 3, wherein the laser light is pulsed laser light, and the graphite of the processing mark is formed by laser light reflected by a crack extending from another adjacent processing mark in at least one of the scanning direction and the direction orthogonal to the scanning direction.

5. The method of manufacturing a diamond substrate according to claim 1, wherein the step of forming the modified layer includes forming the modified layer at a predetermined depth over an entire surface of the upper surface.

6. The method of manufacturing a diamond substrate according to claim 1, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

7. The method of manufacturing a diamond substrate according to claim 1, wherein the laser light has a pulse width in a range of several ns to several hundred ns.

8. The method of manufacturing a diamond substrate according to claim 2, wherein the step of forming the modified layer includes: a step of moving the laser condensing unit and the block in a relative manner in a predetermined scanning direction; and a step of moving the laser condensing unit and the block in a relative manner in a direction orthogonal to the scanning direction at a predetermined interval.

9. The method of manufacturing a diamond substrate according to claim 2, wherein the step of forming the modified layer includes forming the modified layer at a predetermined depth over an entire surface of the upper surface.

10. The method of manufacturing a diamond substrate according to claim 3, wherein the step of forming the modified layer includes forming the modified layer at a predetermined depth over an entire surface of the upper surface.

11. The method of manufacturing a diamond substrate according to claim 4, wherein the step of forming the modified layer includes forming the modified layer at a predetermined depth over an entire surface of the upper surface.

12. The method of manufacturing a diamond substrate according to claim 8, wherein the step of forming the modified layer includes forming the modified layer at a predetermined depth over an entire surface of the upper surface.

13. The method of manufacturing a diamond substrate according to claim 2, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

14. The method of manufacturing a diamond substrate according to claim 3, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

15. The method of manufacturing a diamond substrate according to claim 4, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

16. The method of manufacturing a diamond substrate according to claim 5, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

17. The method of manufacturing a diamond substrate according to claim 8, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

18. The method of manufacturing a diamond substrate according to claim 9, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

19. The method of manufacturing a diamond substrate according to claim 10, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

20. The method of manufacturing a diamond substrate according to claim 11, further comprising a step of causing the block to spontaneously delaminate into a portion up to a depth from the upper surface to the modified layer, and a portion deeper than the modified layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG. 1 is a perspective view illustrating a schematic configuration of a processing device.

[0016] FIGS. 2A and 2B are perspective views illustrating a crystal structure of diamond.

[0017] FIG. 3 is a plan view of a block of single crystal diamond illustrating scanning of laser light.

[0018] FIGS. 4A to 4D are plan views illustrating the formation of a modified layer in the block of single crystal diamond.

[0019] FIGS. 5A to 5D are cross-sectional views illustrating the formation of the modified layer in the block of single crystal diamond.

[0020] FIGS. 6A and 6B are photographs illustrating a delaminated surface of the block of single crystal diamond which has delaminated at the modified layer.

[0021] FIGS. 7A and 7B are micrographs of a lower surface of a first portion of the block of single crystal diamond which has delaminated at the modified layer.

[0022] FIGS. 8A and 8B are micrographs of an upper surface of a second portion of the block of single crystal diamond which has delaminated at the modified layer.

[0023] FIG. 9 is a micrograph of an adhesive tape pressure-bonded to and then peeled away from a delaminated surface of the block of single crystal diamond which has delaminated at the modified layer.

DETAILED DESCRIPTION

[0024] Next, an embodiment of the present invention will be described with reference to the drawings. In the following drawings, the same or similar portions are denoted by the same or similar numerals. However, it should be noted that the drawings are schematic, and the relationship between the thickness and the plane dimensions, the ratios of the thickness of each layer, and the like are different from those in reality. Therefore, the specific thickness and dimensions should be determined in consideration of the following description. Also, it is needless to say that portions having different dimensional relationships and ratios among the drawings are included.

[0025] Further, the following embodiments exemplify devices and methods for embodying the technical idea of the present invention, and the embodiments of the present invention do not specify the materials, shapes, structures, arrangements, etc. of the components as follows. Various modifications may be made to the embodiments of the present invention in the claims.

[0026] FIG. 1 is a perspective view illustrating a schematic configuration of a processing device 100. The processing device 100 includes a stage 110 for placing a block 10 of single crystal diamond thereon, a stage support unit 120 for supporting the stage 110 so as to be movable in the XY direction in a horizontal plane, and a fixture 130 for fixing the block 10 of single crystal diamond. An adhesive layer, a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like may be applied for the fixture 130.

[0027] The plate-like block 10 having a rectangular outer periphery, which is formed by cutting an ingot of single crystal diamond to a predetermined length as an object to be processed, is fixed on the stage 110 with a (111) surface as an upper surface 10a. The (111) surface serving as a main surface has an off-angle of 0 degrees. An object to be processed is not limited to this shape, and as long as the upper surface 10a serves as the (111) surface, an ingot of single crystal diamond, a disk-shaped wafer, or a bulk crystal of single crystal diamond may be employed.

[0028] The processing device 100 includes a laser light source 160 for generating pulsed laser light, and a laser condensing unit 190 including an objective lens 170 and an aberration adjusting unit 180, and radiates laser light B, which is emitted from the laser light source 160, toward the (111) surface of the upper surface of the block 10 of single crystal diamond via the laser condensing unit 190.

[0029] FIGS. 2A and 2B are perspective views illustrating a crystal structure of diamond. As illustrated in FIG. 2A, in a diamond crystal, carbon atoms indicated by white circles are covalently bonded to adjacent carbon elements by the arms of sp.sup.3 hybrid orbitals extending in the direction of the four respective vertices of the tetrahedron centered on the carbon atoms. The covalent bonds are illustrated as solid lines. The carbon atoms, which are covalently bonded to each of the four adjacent carbon atoms, form a body-centered cubic lattice called a diamond structure.

[0030] FIG. 2B illustrates the (111) surface in the diamond structure. It is conventionally known that single crystal diamond is very hard because carbon atoms form covalent bonds with four respective adjacent carbon atoms in a diamond structure. However, a carbon atom is covalently bonded to an adjacent carbon atom in the <111> direction by only a single arm of the sp.sup.3 hybrid orbital. Accordingly, when the covalent bond of the single arm is cut off, it is relatively easy to separate the carbon atom from the adjacent carbon atom in the direction of the (111) surface orthogonal to the <111> direction. As a result, the (111) surface becomes a cleavage surface.

[0031] FIG. 3 is a plan view of the block 10 of single crystal diamond illustrating scanning of the laser light B. The block 10 of single crystal diamond placed on the stage 110 of the processing device 100 illustrated in FIG. 1 moves two-dimensionally in the XY direction in a horizontal plane relative to the laser condensing unit 190 such that the laser light B radiated from the laser light condensing unit 190 is radiated toward a predetermined position on the upper surface 10a of the block 10 of single crystal diamond. Here, the block 10 has the (111) surface, which serves as a main surface with an off-angle of 0 degrees, as the upper surface 10a.

[0032] A scanning line 31 of the laser light B is first scanned in the [112] direction at a dot pitch dp, and shifted by a line pitch d in the [110]0 direction orthogonal to the [112] direction, and the laser light B is scanned in the [112] direction at a dot pitch dp to form a new scanning line 31. By repeating the formation of the scanning line 31 in this way, a modified layer 20 is continuously formed along the (111) surface inside the block 10 of single crystal diamond.

[0033] Inside the block 10 of single crystal diamond, the laser light B is condensed from the upper surface 10a at a predetermined depth, and a processing mark of graphite and a crack extending along the (111) surface around the processing mark are formed. The laser light B of a nanosecond pulse laser, which is emitted from the laser light source 160, is reflected by the crack formed along the (111) surface as the cleavage surface, and the diamond is pyrolyzed, and thus the processing mark of graphite is formed. Here, the nanosecond pulse laser refers to a laser having a pulse width, that is, a pulse duration in the range of several ns to several hundred ns, more specifically, in the range of 1 ns or more to less than 1 μs.

[0034] FIGS. 4A to 4D are plan views illustrating the formation of the modified layer 20 in the block 10 of single crystal diamond. FIGS. 5A to 5B are cross-sectional views illustrating the formation of the modified layer 20 in the block 10 of single crystal diamond. FIG. 5A to 5D respectively correspond to cross sections formed by the cutting lines in FIGS. 4A to 4D.

[0035] Referring to FIGS. 4A and 5A, a first scan line 31 is directed in the [112] direction, and a processing mark 21a is directed toward the lower surface 10b facing the upper surface 10a in the block 10 of single crystal diamond. In addition, a crack 22a extending in the [110] direction, and a crack 22bi extending in the [110] direction are formed along the (111) surface due to cleavage from the processing mark 21a, and the modified layer 20 including the processing mark 21a, the crack 22a, and the crack 22bi is formed around the first scan line 31. The processing mark 21a has a conical shape which has the bottom surface near the cracks 22a and 22bi and the vertex in the direction of the lower surface 10b. In the processing mark 21a, the diamond is pyrolyzed into graphite by the condensed laser light B. Here, the length 22biL of the crack 22bi extending in the [110] direction is adjusted by the energy of the laser light B at the condensing point, the irradiated dot pitch dp, and the expansion of the processing mark 21a controlled by the focal depth.

[0036] Referring to FIGS. 4B and 5B, a second scan line 31 is performed after the laser condensing unit 190 moves in a relative manner two-dimensionally by the line pitch d from the first scan line 31 in the [110] direction orthogonal to the scanning direction of the first scan line 31. At this time, the line pitch d is se such that the focal point of the laser light B is on the crack 22bi. That is, the relationship between the line pitch d and the length 22biL of the crack 22bi is the length 22biL>the line pitch d.

[0037] A second scan line 31 is directed in the [112] direction, and a processing mark 21b is directed toward the upper surface 10a. In addition, a crack 22b extending in the [110] direction along the (111) surface is formed due to cleavage from the processing mark 21b, and the modified layer 20 including the processing mark 21b, the cracks 22b and 22bi is formed around the second scan line 31. The processing mark 21b has a conical shape which has the bottom surface near the cracks 22b and 22bi and the vertex in the direction of the upper surface 10a. In the processing mark 21b, the diamond is pyrolyzed into graphite by the condensed laser light B.

[0038] Here, cleavage of a length of 22bL occurs in the crack 22b along the (111) surface in the [110] direction due to expansion of the processing mark 21b, and thus the modified layer 20 expands. At this time, cleavage also develops in the cracks 22bi and 22a due to the expansion of the processing mark 21b, and as a result, a continuous cleavage surface is formed in the cracks 22a, 22bi and 22b.

[0039] The scanning direction of the laser light B in the first scanning line 31 is not particularly limited to the [112] direction, and the scanning direction of the laser light B in the second scanning line 31 is not particularly limited to the [112] direction. The first scanning line 31 and the second scanning line 31 may be scanned in the [112] direction and in the [112] direction, respectively, or may be scanned in only one direction. In this regard, however, a scanning direction in which a reciprocal operation is performed is preferable in consideration of the efficiency of moving the laser condensing unit 190 and the block 10 of single crystal diamond in a relative manner.

[0040] Referring to FIGS. 4C and 5C, a third scan line 31 is performed after the laser condensing unit 190 moves in a relative manner two-dimensionally by the line pitch d from the second scan line 31 in the [110] direction orthogonal to the scanning direction of the second scan line 31. At this time, the line pitch d is set such that the focal point of the laser light B is on the crack 22b where the cleavage has occurred. That is, the relationship between the line pitch d and the length 22bL of the crack 22b is the length 22bL>the line pitch d.

[0041] The third scan line 31 is directed in the [112] direction, and the processing mark 21b is directed toward the upper surface 10a. In addition, the crack 22b extending in the [110] direction along the (111) surface is formed due to cleavage from the processing mark 21b, and the modified layer 20 including the processing mark 21b and the crack 22b is formed around the third scan line 31. The processing mark 21b has a conical shape which has the bottom surface near the crack 22bi and the vertex in the direction of the upper surface 10a. In the processing mark 21b, the diamond is pyrolyzed into graphite by the condensed laser light B. Here, cleavage of the length 22bL occurs in the crack 22b along the (111) surface in the [110] direction due to expansion of the processing mark 21b, and thus the modified layer 20 expands.

[0042] Referring to FIGS. 4D and 5D, the same operation is repeated after the fourth scan line 31 up to the n.sup.th scan line 31 toward the end face of the block 10. As a result, the modified layer 20 cleaved in the (111) surface along the crack 22b is formed in the entire surface inside the block 10. A large amount of internal stress is accumulated in the modified layer 20 due to a rapid temperature change when forming the processing marks 21 and the change in the crystal structure from diamond to graphite. In order to release such internal stress, the modified layer 20 spontaneously breaks along the (111) surface as the cleavage surface. Accordingly, at the modified layer 20, the block 10 of single crystal diamond spontaneously delaminates into a first portion 11 from the upper surface 10a to the modified layer 20, and a second portion 12 from the modified layer 20 to the lower surface 10b. At least one of the delaminated first portion 11 and the delaminated second portion 12 may be used as a substrate of single crystal diamond. This substrate may include a wafer.

[0043] In the block 10 of single crystal diamond delaminated into the first portion 11 and the second portion 12, the modified layer 20 corresponds to a “cutting margin” to be lost by processing. The thickness of the modified layer 20 is equivalent to the height of the processing mark 21b of graphite having a substantially conical shape, and can be set within a range of several μm or less. Accordingly, it is possible to reduce the amount of single crystal diamond to be lost in manufacturing a diamond substrate by processing the block 10 of single crystal diamond, thereby making it possible to improve the yield in manufacturing the diamond substrate by processing the block 10 of single crystal diamond.

EXAMPLE

[0044] In the processing device 100 illustrated in FIG. 1, a nanosecond laser having the specification shown in TABLE 1 was used as the laser light source 160. Further, as shown in TABLE 2, the block 10 of single crystal diamond was moved in a relative manner two-dimensionally with respect to the laser condensing unit 190, and the laser light B was radiated toward the upper surface 10a, which is the (111) surface, to form the modified layer 20 at a predetermined depth from the upper surface 10a. In this Example, Ib-type diamond obtained by means of the HPHT method was employed.

TABLE-US-00001 TABLE 1 SPECIFICATION OF LASER LIGHT SOURCE Hippo532-11 (MADE BY LASER OSCILLATOR MODEL SPECTRA PHYSICS) WAVELENGTH 532 nm PULSE WIDTH 10 ns REPETITION FREQUENCY 20 kHz OUTPUT 1 W

TABLE-US-00002 TABLE 2 LASER LIGHT RADIATION SETTINGS SCANNING VELOCITY 10 mm/s DOT PITCH dp 0.5 μm LINE PITCH d 60 μm

[0045] The conditions of the laser light source 160 and the laser light radiation as above were set in consideration of the length of the crack 22b and the size of the processing mark 21b. Since graphitization proceeds for the length of the crack 22b due to the accumulation of heat by the laser light B condensing unit, it becomes more difficult to control the length of the crack 22b as the graphitized processing mark 21b is increased in size and the spacing of the dot pitch dp and the line pitch d is reduced in size. As a result, it is not possible to control the development of the cleavage of the (111) surface by expansion of the processing mark 21b. Accordingly, the above conditions were set such that the cleavage of the (111) surface could be controlled in order to obtain a stable processing and a delamination state.

[0046] As for the size of the processing mark 21b, it is necessary to control the processing mark 21b, that is, the growth of the graphitized portion, in order to reduce the loss after delamination. The conditions were set considering that the depth (growth height) of the processing mark 21a formed in the block 10 of single crystal diamond had to be set to 30 μm or less at the maximum.

[0047] As described above, the conditions obtained in consideration of the length of the crack 22b and the size of the processing mark 21b were that under a laser output of 1 W and an oscillation frequency of 20 kHz, a suitable range of the dot pitch dp was 0.5 μm to 1.0 μm, and the range of the line pitch d at this time was 50 μm to 100 μm. Since it is difficult to measure the length of the crack 22b, it is considered to be 100 μm to 150 μm in the range estimated from the above line pitch d. TABLEs 1 and 2 were set based on these considerations.

[0048] The entire upper surface 10a of the block 10 of single crystal diamond was scanned under the above conditions to form the modified layer 20 at a predetermined depth from the upper surface 10a. As a result, the block 10 of single crystal diamond spontaneously delaminated at the modified layer 20 to obtain the first portion 11 from the upper surface 10a to the modified layer 20, and the second portion 12 deeper than the modified layer 20.

[0049] FIGS. 6A and 6B are photographs illustrating a delaminated surface of the block 10 of single crystal diamond which has delaminated at the modified layer 20. FIG. 6A is a photograph of the lower surface of the first portion 11, and FIG. 6B is a photograph of the upper surface of the second portion 12, each of which illustrates the delaminated surface of the modified layer 20.

[0050] FIGS. 7A and 7B are micrographs, using a scanning electron microscope (SEM), of the lower surface of the first portion 11 of the block 10 of single crystal diamond which has delaminated at the modified layer 20. FIG. 7A illustrates the entire lower surface of the first portion 11, and FIG. 7B illustrates an enlarged partial portion of FIG. 7A. Both figures illustrate the delaminated surface of the modified layer 20 in the lower surface of the first portion 11. In FIG. 7B, it was observed that the processing marks 21 expanded or were recessed in the delaminated surface of the modified layer 20.

[0051] FIGS. 8A and 8B are micrographs, using a scanning electron microscope (SEM), of the upper surface of the second portion 12 of the block 10 of single crystal diamond which has delaminated at the modified layer 20. FIG. 8A illustrates the entire upper surface of the second portion 12, and FIG. 8B illustrates an enlarged partial portion of FIG. 8A. Both figures illustrate the delaminated surface of the modified layer 20 in the upper surface of the second portion 12. In FIG. 8B, it was observed that the processing marks 21 of the modified layer 20 were stuck together.

[0052] FIG. 9 is a micrograph of an adhesive tape pressure-bonded to and then peeled away from a delaminated surface of the block 10 of single crystal diamond which has delaminated at the modified layer 20. It was observed that graphite was transferred from the delaminated surface to the adhesive surface of the adhesive tape. Accordingly, it has become obvious that the graphite, which is derived from the processing marks 21 formed in the modified layer 20, exists on the delaminated surface in such a state that it can easily be peeled away by pressing and adhering adhesive tape thereto.

[0053] The present invention can be utilized for manufacturing a power device or a magnetic sensor using a diamond substrate.