Method of fitting fastener to object
11698097 ยท 2023-07-11
Assignee
Inventors
Cpc classification
F16B37/061
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K1/0008
PERFORMING OPERATIONS; TRANSPORTING
F16B39/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16B1/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
B23K1/00
PERFORMING OPERATIONS; TRANSPORTING
B23K31/02
PERFORMING OPERATIONS; TRANSPORTING
F16B1/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16B37/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A method of fitting a fastener to an object is introduced. The fastener has a weldable surface and an engaging portion or a hole portion. One end of the hole portion or one end of the engaging portion has a holding portion. During a welding heating process, solder flows into or enters the holding portion and then cools down and solidifies therein so as to be held therein. Therefore, the weldable surface and the holding portion together enable the fastener to be firmly coupled to an object. The engaging portion and the hole portion together enable an object to be coupled to or removed from another object, so as to couple together and separate at least two objects repeatedly and quickly.
Claims
1. A method of fitting a fastener to an object, the fastener having a solderable surface and an engaging portion or a hole portion, the method comprising the steps of: providing a tool for gripping the fastener; moving the fastener to a fitting position of the object with the tool; and causing the tool to press the fastener downward against the object and then release or loosen its grip on the fastener, thereby positioning the fastener at the fitting position of the object; wherein an end of the hole portion or an end of the engaging portion has a holding portion, such that liquid-state solder flows into or enters the holding portion during a solder heating process, thereby allowing the liquid-state solder in the holding portion to cool and solidify; and wherein the fastener is adapted to be soldered to a first object, and the first object has a corresponding solderable surface, wherein solder between the solderable surface and the corresponding solderable surface turns into liquid state when heated up, such that the liquid-state solder flows into the holding portion, thereby allowing the liquid-state solder in the holding portion to cool and solidify, a solder layer, intended to be heated and then cooled to solidify, is disposed between the solderable surface of the fastener and the corresponding solderable surface of the first object.
2. The method of claim 1, wherein causing the tool to press resiliently the fastener downward against the object and then release or loosen its grip on the fastener, thereby positioning the fastener at the fitting position of the object.
3. The method of claim 1, wherein causing the tool to press the fastener downward against the object and then causing the tool to sense a feedback message indicative of the fastener having come into contact with the object and then release or loosen its grip on the fastener, thereby positioning the fastener at the fitting position of the object.
4. A method of fitting a fastener to an object, the fastener having a solderable surface and an engaging portion or a hole portion, the method comprising the steps of: providing a tool for gripping the fastener; moving the fastener to a fitting position of the object with the tool; and causing the tool to press the fastener downward against the object and then release or loosen its grip on the fastener, thereby positioning the fastener at the fitting position of the object; wherein an end of the hole portion or an end of the engaging portion has a holding portion, such that liquid-state solder flows into or enters the holding portion during a solder heating process, thereby allowing the liquid-state solder in the holding portion to cool and solidify; and wherein the holding portion, where the liquid-state solder flows into, solidifies and thus is held, prevents the solder which turns into liquid state when heated up from flowing into the hole portion or the engaging portion and then cooling and solidifying, such that the solidified solder will not fall off, because interference or impacts are prevented from happening when a second object engages with or enters the hole portion or the engaging portion.
5. The method of claim 1, wherein the fastener has a joining portion with a solderable surface, and the joining portion is adapted to be soldered to a first object, the joining portion is adapted to be soldered to a penetrating hole of the first object from inside, to a penetrating hole of the first object from outside, or to a flat surface at an end of the first object.
6. The method of claim 1, wherein the fastener has a joining portion, and the joining portion has a stopping element which stops liquid-state solder from entering or flowing into the engaging portion or the hole portion, after the solder has cooled down to fit the fastener to the object firmly, the stopping element is removed to restore a joining function of the engaging portion or the hole portion, or the stopping element is not removed to stay on the joining portion.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
(28) To facilitate understanding of the object, characteristics and effects of this present disclosure, embodiments together with the attached drawings for the detailed description of the present disclosure are provided.
(29) Referring to
(30) The fitting process begins by welding the fastener 1 to a first object 2. The first object 2 has a corresponding weldable surface 21. During the heating process, the solder between the weldable surface 11 and the corresponding weldable surface 21 turns into liquid state, such that the liquid-state solder flows into the holding portion 14. Then, the liquid-state solder in the holding portion 14 cools and thus turns into the solid-state solder 7 so as to be held in the holding portion 14. After that, the engaging portion 12 or the hole portion 13 engages with a second object 3, or the engaging portion 12 and the hole portion 13 are engaged to the second object 3. Thus, with the holding portion 14 being adapted to receive the liquid-state solder and then hold the solid-state solder 7, the liquid-state solder does not flow into the hole portion 13 or the engaging portion 12, cool and solidify. Thus, the solidified solder is unlikely to fall off, because it is impossible for interference or impacts to happen when the second object 3 engages with or enters the hole portion 13 or the engaging portion 12. Therefore, the weldable surface 11 and the holding portion 14 together enable the fastener 1 to be firmly coupled to the first object 2, whereas the engaging portion 12 and the hole portion 13 together enable the first object 2 to be coupled to or removed from the second object 3, so as to couple together and separate at least two objects repeatedly and quickly.
(31) In a preferred embodiment of the present disclosure, the fastener 1 has a joining portion 15. The joining portion 15 has a weldable surface 11. The joining portion 15 and the weldable surface 11 together enable the fastener 1 to be welded to the first object 2. Both the holding portion 14 and the joining portion 15 have a weldable surface, or the fastener 1 is fully enclosed by a weldable surface (not shown), thereby allowing the present disclosure to meet different usage needs.
(32) In a preferred embodiment of the present disclosure, the joining portion 15 is adapted to be welded to a penetrating hole 22 of the first object 2 from inside or from outside, so as to be welded to a flat surface at one end of the first object 2. According to the present disclosure, the joining portion 15 is adapted to be welded to the penetrating hole 22 of the first object 2, such that the fastener 1 is firmly coupled to the first object 2.
(33) In a preferred embodiment of the present disclosure, the engaging portion 12 is a thread (for example, internal thread or external thread, preferably internal thread in this embodiment). The engaging portion 12 may also be a hole member or slot member (not shown). The hole portion 13 is a penetrating hole. The holding portion 14 and the joining portion 15 are step portions. Therefore, the fastener 1 engages with the second object 3 through the engaging portion 12 and the hole portion 13.
(34) In a preferred embodiment of the present disclosure, the fastener 1 is adapted to be welded to the first object 2, and the first object 2 is a printed circuit board (PCB), metal board or plastic board. Therefore, according to the present disclosure, the fastener 1 is applicable to various first object 2, thereby allowing the present disclosure to meet practical fitting-related needs.
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(45) Alternatively, the holding portion 14 is an arcuate surface, curved surface, slot, dent or hole, whereas the joining portion 15 is a raised portion, dented portion, arcuate surface portion or curved surface portion (not shown). Therefore, the present disclosure meets different usage needs.
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(47) In a preferred embodiment of the present disclosure, the carrier 4 has a lid 41. The lid 41 hides the fastener 1 in the carrier 4.
(48) In a preferred embodiment of the present disclosure, the tool 5 is a clamping component, evacuating device or magnetic attracting device. Therefore, the tool 5 is appropriately selected in accordance with usage needs, thereby allowing the present disclosure to meet practical fitting-related needs.
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(50) In a preferred embodiment of the present disclosure, the comparison device 6 is an image comparison device, vision comparison device, distance comparison device or space comparison device. Therefore, the comparison device 6 is selected as needed to meet practical usage needs.
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(52) In a preferred embodiment of the present disclosure, a solder layer 23 (or weldable layer), intended to be heated and then cooled to solidify, is disposed between the weldable surface 11 of the fastener 1 and the corresponding weldable surface 21 of the first object 2, such that the weldable surface 11 of the fastener 1 and the corresponding weldable surface 21 of the first object 2 can be welded together by the solder layer 23.
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(58) Thus, the fastener 1 is fixed to the first object 2 to enhance the efficiency of subsequent processes.
(59) In an embodiment of the present disclosure, the fastener 1 is disposed in a carrier 4. The fastener 1 is taken out of the carrier 4 with a tool 5, and then a comparison device 6 compares the fastener 1 with the corresponding weldable surface 21 at the fitting position 20 of the first object 2 in terms of position or distance. Thus, the tool 5 moves the fastener 1 to a predetermined height a (from 0.000001 mm to 10 mm) above the corresponding weldable surface 21 of the first object 2 according to the comparison message of the comparison device 6 and then releases or loosens its grip on the fastener 1, such that the fastener 1 descends and lands on the corresponding weldable surface 21 at the fitting position 20 of the first object 2. After that, the weldable surface 11 of the fastener 1 and the corresponding weldable surface 21 of the first object 2 are heated up and welded together, allowing the fastener 1 to be welded to the first object 2. The first object 2 is a PCB, and a penetrating hole 22 is disposed at the fitting position of the first object 2. The fastener 1 is disposed in the penetrating hole 22.
(60) In an embodiment of the present disclosure, the method comprises the steps of: providing a comparison device 6 for comparing the fastener 1 with the first object 2 in terms of its fitting position or fitting distance after the tool 5 has gripped the fastener 1; moving the fastener 1 to the predetermined height a above the fitting position of the object with the tool 5 according to a comparison message of the comparison device 6; and causing the tool 5 to release or loosen its grip on the fastener 1, such that the fastener 1 descends and lands on the fitting position of the first object 2.
(61) In an embodiment of the present disclosure, the method comprises the steps of: providing, after the tool 5 has gripped the fastener 1, a comparison device 6 for comparing the fastener 1 with a corresponding weldable surface 21 at the fitting position of the first object 2 in terms of position or distance; moving the fastener 1 to the predetermined height a above the corresponding weldable surface 21 of the first object 2 with the tool 5 according to a comparison message of the comparison device 6; and causing the tool 5 to release or loosen its grip on the fastener 1, such that the fastener 1 descends and lands on the corresponding weldable surface 21 of the first object 2.
(62) In an embodiment of the present disclosure, the tool 5 is a clamping component, engaging component, evacuating device, magnetic attracting device or resilient motion component, thereby allowing the present disclosure to meet practical fitting-related needs.
(63) In an embodiment of the present disclosure, the comparison device 6 is a vision comparison device, distance comparison device, image comparison device, AI comparison device or photograph comparison device, thereby allowing the present disclosure to meet practical fitting-related needs.
(64) Referring to
(65) The tool 5 has a sensing member 51 (for example, a resilient sensing member). After the tool 5 has moved the fastener 1 to the fitting position of the first object 2 and the sensing member 51 of the tool 5 has sensed a feedback message indicative of the fastener 1 having come into contact with the first object 2, the tool 5 releases or loosens its grip on the fastener 1, such that the fastener 1 is positioned at the fitting position of the first object 2, thereby allowing the present disclosure to meet practical fitting-related needs.
(66) In an embodiment of the present disclosure, after the fastener 1 has come into contact with the first object 2, electrical conduction therebetween comes into play. The sensing member 51 senses the electrical conduction and thus generates a feedback message. The feedback message causes the tool 5 to release or loosen its grip on the fastener 1.
(67) In an embodiment of the present disclosure, when the fastener 1 is fitted to the first object 2 as described above, the joining portion 15 has a stopping element 8. The stopping element 8 stops the liquid-state solder on the weldable surface 21 from entering or flowing into the engaging portion 12 (or the hole portion 13). After the solder has cooled down to thereby fit the fastener 1 to the first object 2 firmly, the stopping element 8 is removed from the joining portion 15 with a tool 9 to thereby restore the joining function of the engaging portion 12 (or the hole portion 13).
(68) Regarding the method of fitting the fastener 1 to an object according to the present disclosure, the tool 5 grips the fastener 1, such that the tool 5 moves the fastener 1 to the fitting position of the first object 2, and the tool 5 presses the fastener 1 downward against the first object 2, thereby allowing the tool 5 to release or loosen its grip on the fastener 1. Thus, the fastener 1 is positioned at the fitting position of the first object 2, thereby allowing the present disclosure to meet practical fitting-related needs.
(69) Regarding the method of fitting the fastener 1 to an object according to the present disclosure, the tool 5 grips the fastener 1, such that the tool 5 moves the fastener 1 to a fitting position of the first object 2 and presses resiliently the fastener 1 downward against the first object 2, thereby causing the tool 5 to release or loosen its grip on the fastener 1. Thus, the fastener 1 is positioned at the fitting position of the first object 2, thereby allowing the present disclosure to meet practical fitting-related needs.
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(73) While the present disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the present disclosure set forth in the claims.