LASERS OR LEDS BASED ON NANOWIRES GROWN ON GRAPHENE TYPE SUBSTRATES

Abstract

A device, such as a light-emitting device, e.g. a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a first distributed Bragg reflector or metal mirror positioned substantially parallel to said graphitic substrate and positioned on the opposite side of said graphitic substrate to said NWs; optionally a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and wherein said NWs comprise aim-type doped region and a p-type doped region and optionally an intrinsic region there between.

Claims

1. A device, such as a light-emitting device, e.g. a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a first distributed Bragg reflector or metal mirror positioned substantially parallel to said graphitic substrate and positioned on the opposite side of said graphitic substrate to said NWs; optionally a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and wherein said NWs comprise an n-type doped region and a p-type doped region and optionally an intrinsic region there between.

2. A device, such as a light-emitting device, e.g. a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a first distributed Bragg reflector or metal mirror positioned substantially parallel to said graphitic substrate and positioned on the opposite side of said graphitic substrate to said NWs; optionally a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and wherein said NWs comprise an n-type doped region and a p-type doped region and optionally an intrinsic region there between; wherein at least one of said regions comprises at least one heterostructure; and optionally at least one of said regions comprises an electron or hole blocking layer.

3. A device as claimed in claims 1 to 2 wherein said first distributed Bragg reflector or metal mirror in contact with the opposite side of said graphitic substrate.

4. A device as claimed in claims 1 to 3 wherein said n-type doped region or p-type doped region comprises at least one heterostructure; and optionally at least one of said regions comprises an electron or hole blocking layer.

5. A device as claimed in claims 1 to 3 wherein said intrinsic region is present and comprises at least one heterostructure; preferably at least one quantum heterostructure; and optionally at least one of said regions comprises an electron or hole blocking layer.

6. A device, such as a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a transparent spacer layer substantially parallel to and in contact with the opposite side of said graphitic substrate; a first distributed Bragg reflector or metal mirror substantially parallel to and in contact with the transparent spacer layer; optionally a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and wherein said NWs comprise an n-type doped region and a p-type doped region and optionally an intrinsic region there between.

7. A device as claimed in claim 6 wherein at least one of said regions comprises at least one heterostructure, preferably said intrinsic region comprises at least one heterostructure; and optionally at least one of said regions comprises an electron or hole blocking layer.

8. A device as claimed in claim 6 or 7 wherein graphene glass forms said graphitic layer and transparent spacer layer.

9. A device as claimed in claims 2 to 5 or 7 to 8 wherein said heterostructure is a quantum heterostructure.

10. A device as claimed in claims 2 to 5 or 7 to 9 wherein said heterostructure is selected from a quantum well, a quantum dot, or a superlattice.

11. A device as claimed in any one of claims 1 to 8 wherein said NWs comprise a p-type GaN/intrinsic InGaN/n-type GaN NW structure.

12. A device as claimed in any one of claims 1 to 8 wherein said NWs comprise a p-type Al(Ga)N/intrinsic (Al)(In)GaN/n-type Al(Ga)N NW structure.

13. A device, such as a light-emitting device, e.g. a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a first distributed Bragg reflector or metal mirror positioned substantially parallel to said graphitic substrate and positioned on the opposite side of said graphitic substrate to said NWs; optionally a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and wherein said NWs comprise at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said NWs comprises an electron or hole blocking layer.

14. A device, such as a light-emitting device, e.g. a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a transparent spacer layer substantially parallel to and in contact with the opposite side of said graphitic substrate; a first distributed Bragg reflector or metal mirror positioned substantially parallel to said graphitic substrate and positioned on the opposite side of said graphitic substrate to said NWs; optionally a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and wherein said NWs comprise at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said NWs comprises an electron or hole blocking layer.

15. A device as claimed in claim 14 wherein graphene glass forms said graphitic layer and transparent spacer layer.

16. A device, such as a light-emitting device, e.g. a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a first distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; optionally a second distributed Bragg reflector or metal mirror positioned substantially parallel to said graphitic substrate and positioned on the opposite side of said graphitic substrate to said NWs; and wherein said NWs comprise an n-type doped region and a p-type doped region and optionally an intrinsic region there between.

17. A device, such as a light-emitting device, e.g. a laser device, comprising: a plurality of group III-V semiconductor NWs grown on one side of a graphitic substrate, preferably through the holes of an optional hole-patterned mask on said graphitic substrate; a first distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; optionally a second distributed Bragg reflector or metal mirror positioned substantially parallel to said graphitic substrate and positioned on the opposite side of said graphitic substrate to said NWs; and wherein said NWs comprise at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said NWs comprises an electron or hole blocking layer.

18. A device as claimed in claim 16 or 17 wherein said second distributed Bragg reflector or metal mirror is not present; and wherein said graphitic substrate is in the form of graphene glass.

19. A device as claimed in any preceding claim wherein light is emitted (lased) in a direction substantially parallel to and in the same direction as the growth direction of the NWs or wherein light is emitted (lased) in a direction substantially parallel to and in the opposite direction as the growth direction of the NW.

20. A device as claimed in any preceding claim wherein the distributed Bragg reflector comprises alternating layers of different group III-V semiconductors.

21. A device as claimed in any preceding claim wherein the distributed Bragg reflector comprises alternating layers of dielectric material(s).

22. A device as claimed in any preceding claim wherein said NWs comprise Ga, In or Al.

23. A device as claimed in any preceding claim wherein said NWs comprise As, Sb, P or N.

24. A device as claimed in any preceding claim wherein said NWs comprise Ga and/or In and/or Al together with As and/or Sb and/or P.

25. A device as claimed in any preceding claim wherein said NWs comprise Ga and/or In and/or Al together with N.

26. A device as claimed in any preceding claim being a laser.

27. A device as claimed in any preceding claim being a resonant cavity light emitting diode (RCLED).

28. A device as claimed in any one of claims 13 to 15 and 17-27 wherein said at least one heterostructure is selected from a quantum well, a quantum dot, or a superlattice.

29. A device as claimed in any preceding claim wherein said intrinsic region comprises a heterostructure consisting of ions of Al and/or Ga and/or In with Sb and/or As, and/or N.

30. A device as claimed in any preceding claim wherein said NWs comprise an electron or hole blocking layer.

31. A process for the preparation of a device comprising providing a graphitic substrate having a first distributed Bragg reflector or metal mirror substantially parallel to and on one side of said graphitic substrate; growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate opposite to said DBR or metal mirror, preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising an n-type doped region and a p-type doped region optionally separated by an intrinsic region (active region); and optionally providing a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs.

32. A process as claimed in claim 31 wherein said intrinsic region is present.

33. A process as claimed in claim 31 or 32 wherein at least one of said regions, such as the intrinsic region comprises at least one heterostructure preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said three NW regions comprising an electron or hole blocking layer;

34. A process for the preparation of a device comprising providing a graphitic substrate having a first distributed Bragg reflector or metal mirror substantially parallel to and on one side of said graphitic substrate; growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate opposite to said DBR or metal mirror, preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said NWs comprising an electron or hole blocking layer; and optionally providing a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs.

35. A process for the preparation of a device as claimed in any one of claims 31 to 34 wherein said first distributed Bragg reflector or metal mirror is substantially parallel to and in contact with said graphitic substrate.

36. A process for the preparation of a device as claimed in claim 6 comprising providing a first distributed Bragg reflector or metal mirror in contact with a transparent spacer layer, said spacer layer being in contact with a graphitic substrate; growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate opposite to said spacer layer, preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising an n-type doped region and a p-type doped region optionally separated by an intrinsic region (active region); and optionally providing a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs.

37. A process as claimed in claim 36 wherein said intrinsic region comprises at least one heterostructure preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said three NW regions comprising an electron or hole blocking layer;

38. A process for the preparation of a device as claimed in claim 14 comprising providing a first distributed Bragg reflector or metal mirror in contact with a transparent spacer layer, said spacer layer being in contact with a graphitic substrate; growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate opposite to said spacer layer, preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said NWs comprising an electron or hole blocking layer; and optionally providing a second distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs.

39. A process as claimed in any one of claims 36 to 38 wherein said graphitic substrate and transparent spacer layer are formed by graphene glass.

40. A process for the preparation of a device as claimed in claim 16 or 18 comprising providing a graphitic substrate or graphene glass, respectively; growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising an n-type doped region and a p-type doped region optionally separated by an intrinsic region (active region); and providing a distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs.

41. A process for the preparation of a device as claimed in claim 17 or 18 comprising providing a graphitic substrate or graphene glass, respectively; growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said NWs comprising an electron or hole blocking layer; and providing a distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs.

42. A process for the preparation of a device as claimed in any one of claims 1 to 12 and 16 to 30 comprising growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate, preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising an n-type doped region and a p-type doped region optionally separated by an intrinsic region (active region) and optionally at least one of said three NW regions comprising an electron or hole blocking layer; and optionally providing a distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and transferring said graphitic substrate onto a DBR or metal mirror or onto a transparent spacer layer on a DBR or onto a transparent spacer layer on a metal mirror.

43. A process for the preparation of a device as claimed in claim 42 wherein said NWs comprising at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice.

44. A process for the preparation of a device as claimed in claim 13 or 14 comprising growing a plurality of group III-V semiconductor NWs epitaxially on said graphitic substrate, preferably through the holes of a hole-patterned mask on said graphitic substrate, said NWs comprising at least one heterostructure, preferably selected from a quantum well, a quantum dot, or a superlattice; and optionally at least one of said NWs comprising an electron or hole blocking layer; and optionally providing a distributed Bragg reflector or metal mirror in contact with the top of at least a portion of said NWs; and transferring said graphitic substrate onto a DBR or metal mirror or onto a transparent spacer layer on a DBR or onto a transparent spacer layer on a metal mirror.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0273] FIG. 1 summarizes the fabrication process of an integrated NW/graphene/DBR laser or RCLED device. Due to the coherent coupling among DBR, NWs, and high reflectivity NW top-mirror, a NW-based vertical-cavity surface-emitting laser (VCSEL) will be demonstrated with the ultimate goal of achieving low threshold current and high light emission efficiency. Surface-emitting PC properties can also be developed by tuning the NW diameter and the pitch size between the NWs. The DBR can be made of multilayers of thin films grown by MBE (e.g. GaAs/AlAs), where crystal orientation is in general (100). Another type of DBR can be fabricated with insulating layers. However, such thin films with crystal orientation of (100) or insulating layers cannot be used for vertical NW growth. This issue can be solved by using graphene as a buffer layer. In addition, the graphene can be used as a carrier injection layer due to its high conductivity and transparency.

[0274] In FIG. 1(a) a DBR is provided onto which is placed a graphene layer (figure b). Subsequently mask layer can be applied and etched to form holes for positioned NW growth (figure c).

[0275] NWs are grown in the holes such that an n-type doped region is made first followed by the i-region and p-type doped region (figure d). A top reflective layer can then be applied such as an Al metal layer (i.e. a metal mirror). The intrinsic region may comprise a series of quantum heterostructures (e.g. quantum wells/quantum dots or a superlattice).

[0276] Optionally, the graphene layer and Bragg reflector can be etched to create individual NW lasers (f).

[0277] Both electrically and optically pumped NW lasers are designed with axial (FIG. 2 (a,b)) or radial heterostructures (FIG. 2(c)) of lower and higher bandgap materials to enhance the gain for lasing. A self-catalyzed vapor-liquid-solid method will be used to grow GaAs-based NW lasers on graphene, for example GaAs with InGaAs inserts/wells or GaAsSb inserts/wells, and the catalyst-free method will be used for the growth of III-N-based NW lasers on graphene, for example AlGaN NWs with GaN inserts/wells or InGaN inserts/wells. Furthermore, a high-quality DBR, for example with AlAs/GaAs or AlN/GaN Bragg pairs, will be grown by MBE or MOCVD, onto which graphene (e.g. single-layer or double-layer) will be transferred for subsequent growth of the NW laser or RCLED.

[0278] FIG. 3 describes a structure and laser spectra of a single GaAsSb/GaAs heterostructured NW laser. The NW laser consists of periodic segments of GaAsSb and GaAs. By optical pumping, the NW lases in the near-IR and causes an interference pattern as shown in FIG. 3(b). By tuning the composition and structure, the GaAsSb/GaAs heterostructured NW laser can lase covering a wide range of wavelengths as shown in FIG. 3(c).

[0279] In FIG. 4(a), a bottom DBR or metal mirror is provided with a transparent intermediate layer such as a silica layer on top of which is located the graphene layer. This arrangement allows for tuning of reflectivity and/or protection (capping) of e.g. GaAs/Al(Ga)As DBR during further epitaxial growth (at high temperature) of NWs on the graphene.

[0280] In FIG. 4(b), the DBR is located at the top of the NWs with a transparent silica, e.g. fused silica, support or other transparent support being used to carry the graphene layer. Optionally graphene glass may be used as combined substrate and support.

[0281] FIG. 4(c) shows an alternative option to the structure displayed in FIG. 4(a), where the graphene and the transparent intermediate layer are replaced by graphene glass which can also provide support during NW growth. Bottom DBR or metal mirror can be provided after NW growth.

[0282] In FIG. 4(d), the glass supports the DBR.

[0283] FIG. 5(a) presents the schematic of a grown NW/graphene/DBR structure. Before the NW growth, exfoliated graphene flakes were placed on top of the DBR reflector, as depicted in the optical image of FIG. 5(b). FIG. 5(c) shows a 30 tilted SEM image of a 7 m long GaAsSb-based superlattice NW epitaxially grown perpendicular on the tiny graphene flake circled in red and marked as C in FIG. 5(b). The measured normalized reflectivity of the GaAs/AlAs DBR structure is shown as the blue curve in FIG. 5(d), which contains a high reflectivity plateau around 890 to 990 nm and reflectance fringes outside the plateau. By exerting optical excitation, photoluminescence is observed from the GaAsSb-based superlattice NW with Fabry-Prot modes, which is marked by vertical red dashed lines. The spacing among the Fabry-Prot modes is around 11.6 nm, which corresponds to an energy spacing of E=16 meV around 950 nm. This correlates well to the theoretical value of 16.7 meV found for the expected TE01 mode using n.sub.group=5.35 found from calculations based on FDTD simulations.

[0284] The NW is grown in the [111] crystal direction, and perpendicular to the graphitic surface, whereas the GaAs/AlAs DBR (thin film) is grown in the [001] crystal direction on an n-type GaAs(001) wafer.

EXAMPLE 1

Electrically Pumped AlN/AlGaN/GaN Axial Heterostructured NW Lasers (RCLEDs) on Graphene/DBR:

[0285] GaN-based NWs with AlN/AlGaN axial quantum heterostructured active gain medium are grown on a dielectric DBR (e.g. a DBR with SiO.sub.2 (n=1.5) and TiO.sub.2 (n=2.5) Bragg pairs) with graphene buffer. The heavily n-doped GaN NW segment is epitaxially grown directly on the graphene/DBR structure, which is followed by the growth of a heavily n-doped AlN segment, 5 periods of intrinsic AlN/AlGaN quantum heterostructured active gain medium, and a p-doped MN segment. After that, a p-doped GaN top segment is grown for top contact.

EXAMPLE 2

Optically Pumped GaAsSb/GaAs Axial Heterostructured NW Lasers on Graphene/DBR:

[0286] Intrinsic GaAs with GaAsSb/GaAs axial quantum heterostructured active gain medium are grown on a GaAs/AlAs DBR using a graphene buffer. After nucleation by using AlAsSb buffer as nucleation stem, GaAs NWs are directly epitaxially grown on the graphene/DBR structure, which is followed by the growth of 60 periods of intrinsic GaAsSb/GaAs quantum heterostructured active gain medium with a thickness of 100 nm for each segment. After the growth of the active gain medium, an AlGaAs shell with thickness of 15 nm is grown to passivate the surface for enhanced light performance.

EXAMPLE 3

NW/Graphene/DBR RCLED.

[0287] Before the NW growth, exfoliated graphene flakes were placed on top of a GaAs/AlAs DBR reflector. The GaAs/AlAs DBR (thin film) is grown in the [001] crystal direction on an n-type GaAs(001) wafer. The measured normalized reflectivity of the GaAs/AlAs DBR structure is shown in FIG. 5(d). It contains a high reflectivity plateau around 890 to 990 nm and reflectance fringes outside the plateau.

[0288] 7 m long GaAsSb-based superlattice NWs were epitaxially grown perpendicular on the graphene/DBR structure in the [111] crystal direction.

[0289] By exerting optical excitation, photoluminescence is observed from the GaAsSb-based superlattice NW with Fabry-Prot modes, which is marked by vertical red dashed lines. The spacing among the Fabry-Prot modes is around 11.6 nm, which corresponds to an energy spacing of 6E=16 meV around 950 nm. This correlates well to the theoretical value of 16.7 meV found for the expected TE01 mode using n.sub.group=5.35 found from calculations based on FDTD simulations.