Depositing Station And Device For Generating Contact Metallizations

Abstract

The invention relates to a depositing station comprising a basin arrangement (11) having a basin (13) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin, the basin having a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber. Furthermore, the invention relates to a device for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station.

Claims

1. A depositing station (10, 71, 78, 98, 99) comprising a basin arrangement (11, 77, 80) having a basin (13, 81) forming a processing chamber (12) and serving to receive a solution of a metal, in particular nickel, zinc, palladium, gold or the like, dissolved in a liquid, for a, preferably electroless, deposition on an object receivable in the processing chamber, in particular on a terminal face of a wafer (15, 85, 96) receivable in the processing chamber, the basin having at least one inlet (17) for introducing the solution into the basin, characterized in that the basin has a perforation (18) which forms at least part of the inlet of the basin and which is configured to homogeneously introduce the solution into the processing chamber.

2. The depositing station according to claim 1, characterized in that the inlet (17) of the basin (13, 81) is disposed on the bottom of the basin, a bottom wall (19) of the basin having the perforation (18).

3. The depositing station according to claim 2, characterized in that the basin (13, 81) has a substructure (20) which forms part of the inlet (17) of the basin and which is disposed below the bottom wall (19) of the basin, said substructure (20) forming a cavity (21) through which the solution can flow and which is limited at least by the bottom wall of the basin and a bottom wall (23) of the substructure, the basin having an inlet socket (27) which forms part of the inlet of the basin and is inserted in a passage opening (26) penetrating at least the bottom wall of the substructure, said inlet socket (27) having a perforation (29) on at least the circumference of a portion (28) of the inlet socket protruding into the cavity, said perforation (29) being configured to introduce the solution into the cavity.

4. The depositing station according to any one of the preceding claims, characterized in that the basin (13, 81) has an outlet (30), preferably disposed on the side of the basin, for draining the solution from the basin.

5. The depositing station according to claim 4, characterized in that each side wall (31) of the basin (13, 81) has a perforation (33) which is preferably formed in an area of an edge (32) of the side walls and which forms the outlet (30) of the basin.

6. The depositing station according to any one of the preceding claims, characterized in that the basin arrangement (11, 80) comprises an additional basin (34, 82), the basin (13, 81) being inserted into the additional basin.

7. The depositing station according to claim 6, characterized in that the additional basin (34, 82) has an outlet (35, 36), which is preferably disposed on the bottom of the additional basin, for draining the solution from the additional basin.

8. The depositing station according to at least claims 4 and 7, characterized in that the inlet (17) of the basin (13, 81) is provided for introducing the solution from an area (25) outside of the basin arrangement (11, 77, 80) into the basin, the outlet (30) of the basin is provided for draining the solution from the basin into the additional basin (34, 82) and the outlet (35, 36) of the additional basin is provided for draining the solution from the additional basin to the area outside of the basin arrangement.

9. The depositing station according to at least claims 4 and 6, characterized in that the basin (13, 81) is inserted into the additional basin (34, 82), preferably so as to be centered, such that the solution is introduced from the basin into an area (40) of the additional basin limited at least by side walls (31) of the basin and side walls (39) of the additional basin, through the outlet (30) of the basin disposed on the side of the basin, each side wall of the basin having a rim (41) in an area of an edge (32) of the side walls of the basin which preferably protrudes perpendicular from the side walls of the basin to a direction of the side walls of the additional basin and which abuts against the side walls of the additional basin in such a manner that an opening (43) of the additional basin is covered.

10. The depositing station according to any one of claims 6 to 9, characterized in that the additional basin (34, 82) has at least one inlet (37, 38), preferably disposed on the side of the additional basin, for introducing the solution from an area (25) outside of the basin arrangement (11, 77, 80) into the additional basin.

11. The depositing station according to any one of the preceding claims, characterized in that the basin (13, 81) is configured such that a transport receptacle (14, 84, 95) having a plurality of objects, in particular wafers (15, 85, 96), received therein is insertable into the basin from above.

12. The depositing station according to claim 11, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a manipulator (16, 102) which is configured to insert the transport receptacle (14, 84, 95) into the basin (13, 81) and remove said transport receptacle (14, 84, 95) from the basin.

13. The depositing station according to any one of the preceding claims, characterized in that the basin arrangement (11, 77, 80) has a filling level measuring device (45) which is configured to measure a filling level.

14. The depositing station according to any one of the preceding claims, characterized in that the basin arrangement (11, 77, 80) and/or the depositing station (10, 71, 78, 98, 99) has a heating device (46) which is configured to heat the solution.

15. The depositing station according to any one of the preceding claims, characterized in that the basin arrangement (11, 77, 80) has a lid (49, 83) which covers an opening (50) of the basin (13, 81) in a closed position of the lid.

16. The depositing station according to claim 15, characterized in that the lid (49, 83) is pivotable, the lid forming a guiding portion (52) in an area of a pivot axis (51) of the lid, said guiding portion (52) being configured to guide condensate, which may have formed on an inner surface (53) of the lid, into the basin when the lid is moved to an open position of the lid.

17. The depositing station according to any one of the preceding claims, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a tube assembly (54) which integrates the depositing station into a fluid circuit (55).

18. The depositing station according to claim 17, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a pumping device (56) which is configured to circulate the solution in the fluid circuit (55).

19. The depositing station according to claim 17 or 18, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a filter device (57, 72) which preferably has a preliminary filter (73) and a main filter (74) and which is configured to clean the solution flowing in the fluid circuit (55).

20. The depositing station according to any one of claims 17 to 19, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a volume flow device (58) which is configured to measure and/or adjust a volumetric flow rate of the solution in the fluid circuit (55).

21. The depositing station according to any one of the preceding claims, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a valve arrangement (59) which is configured to empty the basin arrangement (11, 77, 80).

22. The depositing station according to any one of the preceding claims, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a sample-analysis device (60, 75) which is configured to take a sample of the solution, preferably from the basin arrangement (11, 77, 80), and to analyze said sample, in particular regarding a pH value of the sample.

23. The depositing station according to any one of the preceding claims, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a cooling device (47, 76).

24. The depositing station according to any one of the preceding claims, characterized in that the depositing station (10, 71, 78, 98, 99) comprises a dosing arrangement (61) having at least one container (62) for receiving a component contained in the solution and having at least one dosing pump (63) which is assigned to the container, the dosing arrangement being configured to dose the component in the solution.

25. The depositing station according to any one of the preceding claims, characterized in that the basin arrangement (11, 77, 80) has a moving device (86) which is configured to preferably vertically move the object in the processing chamber (12).

26. A device (69, 94) for producing contact metallizations on terminal faces of wafers, comprising at least one depositing station (10, 71, 78, 98, 99) according to any one of the preceding claims, a processing chamber (12) of the depositing station being configured to receive a transport receptacle (14, 84, 95) having a plurality of wafers (15, 85, 96) received therein, the device having a manipulator (16, 102) for handling the transport receptacle.

27. The device according to claim 26, characterized in that the device (69, 94) comprises a plurality of workstations which are preferably disposed in a line, each workstation having a processing chamber (12) for receiving the transport receptacle (14, 84, 95) having the wafers (15, 85, 96) received therein, the plurality of workstations comprising the depositing station (10, 71, 78, 98, 99) as a workstation, the device having a conveyor (103) on which the manipulator (16, 102) is disposed, the manipulator, in interaction with the conveyor, allowing the transport receptacle to be disposed in a selectable order of the processing chambers in a conveying direction.

28. The device according to claim 27, characterized in that the manipulator (16, 102) has a horizontally movable carrier (106) which is connected to a conveyor belt (105) of the conveyor (103) and which has at least one gripping arm (107) which is vertically moveable with respect to the carrier.

29. The device according to claim 27 or 28, characterized in that the device (69, 94) comprises an input/output station (97) which preferably has drawers (111), said drawers (111) preferably being automatically retractable and extendable, and serves to equip the device with at least one transport receptacle (14, 84, 95), and/or the plurality of workstations comprise at least one cleaning station, at least one rinsing station for removing any residue from wafer surfaces and/or a drying station.

Description

[0044] FIG. 1 shows a perspective side view of a depositing station at an angle from above, having partly exploded components;

[0045] FIG. 2 shows a perspective view of the rear of the depositing station at an angle from above, having partly exploded components;

[0046] FIG. 3 shows a perspective view of another side of the depositing station at an angle from above, having partly exploded components;

[0047] FIG. 4 shows a perspective view of the front of the depositing station at an angle from above, having partly exploded components;

[0048] FIG. 5 shows a top view of the depositing station having partly exploded components;

[0049] FIG. 6 shows an exploded side view of a basin arrangement of the depositing station at an angle from above;

[0050] FIG. 7 shows an exploded side view of the basin arrangement at an angle from below;

[0051] FIG. 8 shows an exploded front view of the basin arrangement at an angle from above;

[0052] FIG. 9 shows an exploded view of another side of the basin arrangement at an angle from above;

[0053] FIG. 10 shows a perspective view of the rear of the basin arrangement at an angle from above;

[0054] FIG. 11 shows a perspective view of the front of the basin arrangement at an angle from below;

[0055] FIG. 12 shows a sectional view of the rear of the basin arrangement;

[0056] FIG. 13 shows a sectional side view of the basin arrangement;

[0057] FIG. 14 shows a perspective partial side view of a device for producing contact metallizations with the transport receptacle being positioned outside of a processing chamber;

[0058] FIG. 15 shows a perspective partial side view of the device with the transport receptacle being positioned inside the processing chamber;

[0059] FIG. 16 shows a partial sectional side view of the device with the transport receptacle being positioned inside the processing chamber;

[0060] FIG. 17 shows another partial sectional side view of the device with the transport receptacle being positioned inside the processing chamber;

[0061] FIG. 18 shows a perspective side view, in particular of a dosing arrangement of the depositing station, at an angle from above;

[0062] FIG. 19 shows a perspective side view of an additional embodiment of a depositing station;

[0063] FIG. 20 shows a perspective side view of an additional embodiment of a depositing station;

[0064] FIG. 21 shows a perspective view of the rear of an additional embodiment of a basin arrangement at an angle from above, with the lid of the basin arrangement being closed in the embodiment;

[0065] FIG. 22 shows a perspective view of the rear of the additional embodiment of the basin arrangement at an angle from above, with the lid of the basin arrangement being closed in the additional embodiment;

[0066] FIG. 23 shows a perspective side view of the additional embodiment of the basin arrangement at an angle from below, with the lid of the basin arrangement being open in the additional embodiment;

[0067] FIG. 24 shows a perspective side view of a conveyor of an additional embodiment of a device for producing contact metallizations, with a manipulator of the additional embodiment of the device being disposed thereon;

[0068] FIG. 25 shows a perspective side view of the manipulator;

[0069] FIG. 26 shows a perspective view of a drawer of an input/output station of the additional embodiment of the device;

[0070] FIG. 27 shows a side view of the drawer;

[0071] FIG. 28 shows a perspective view of the additional embodiment of the device.

[0072] A combined view of FIGS. 1 to 18 shows a depositing station 10 comprising a basin arrangement 11 having a basin 13 forming a processing chamber 12 and serving to receive a solution (not shown) of a metal dissolved in a liquid, for a deposition on a terminal face of a plurality of wafers 15 received in a transport receptacle 14 receivable in processing chamber 12, said plurality of wafers 15 being insertable into basin 13 from above for carrying out a deposition process, and/or being removable from basin 13 afterwards and being manageable by means of a manipulator 16.

[0073] Basin 13 has an inlet 17 for introducing the solution into basin 13, basin 13 having a perforation 18 which forms at least part of inlet 17 of basin 13 and which is configured to homogeneously introduce the solution into processing chamber 12. Inlet 17 of basin 13 is disposed on the bottom of basin 13, such that a bottom wall 19 of basin 13 has perforation 18.

[0074] Furthermore, basin 13 has a substructure 20 which forms part of inlet 17 of basin 13 and which is disposed below bottom wall 19 of basin 13, said substructure 20 forming a cavity 21 through which the solution can flow and which is limited by bottom wall 19 of basin 13, side walls 22 of substructure 20 and a bottom wall 23 of substructure 20, basin 13 having an inlet socket 27 which forms part of inlet 17 of basin 13 and is inserted in a passage opening 26 penetrating at least bottom wall 23 of substructure 20 and a bottom wall 24 of an additional basin 34 of basin arrangement 11, said inlet socket 27 having a perforation 29 on a circumference of a portion 28 of inlet socket 27 protruding into cavity 21, said perforation 29 being configured to introduce the solution into cavity 21. In this case, inlet socket 27 is disposed centrally below bottom wall 19 of basin 13.

[0075] Furthermore, basin 13 has an outlet 30 disposed on the side of basin 13 for draining the solution from basin 13, each side wall 31 of basin 13 having a perforation 33 which is preferably formed in an area of an edge 32 of side walls 31 and which forms outlet 30 of basin 13.

[0076] Furthermore, basin arrangement 11 comprises an additional basin 34, basin 13 being inserted into additional basin 34.

[0077] Additional basin 34 has outlets 35, 36 disposed on the bottom of additional basin 34 for draining the solution from additional basin 34, said outlets 35, 36 being preferably disposed at the end of bottom wall 24 of additional basin 34 and transversely at an offset.

[0078] In case at hand, inlet 17 of basin 13 is provided for introducing the solution from an area 25 outside of basin arrangement 11 into basin 13, outlet 30 of basin 13 is provided for draining the solution from basin 13 into additional basin 34 and outlets 35, 36 of additional basin 34 are provided for draining the solution from additional basin 34 to area 25 outside of basin arrangement 11.

[0079] Furthermore, additional basin 34 has two inlets 37, 38 disposed on the side of additional basin 34 for introducing the solution from an area 25 outside of basin arrangement 11 into additional basin 34.

[0080] Basin 13 is inserted into additional basin 34 so as to be centered, such that the solution can be introduced from basin 13 into an area 40 of additional basin 34 limited in particular by side walls 31 of basin 13 and side walls 39 of additional basin 34 through outlet 30 of basin 13, each side wall 31 of basin 13 having a rim 41 in an area of edge 32 of side walls 31 of basin 13 which protrudes perpendicular from side walls 31 of basin 13 to a direction of side walls 39 of additional basin 34 and which abuts against a correspondingly formed rim 42 of side walls 39 of additional basin 34 in such a manner that an opening 43 of additional basin 34 is covered. Basin 13 is detachably connected to additional basin 34 by means of screw means 44 of basin arrangement 11.

[0081] Furthermore, basin arrangement 11 has a filling level measuring device 45 disposed in additional basin 34 which is configured to measure a filling level in additional basin 34.

[0082] Furthermore, basin arrangement 11 has a heating device 46 which is disposed in additional basin 34 and which is configured to heat the solution. Heating device 46 is disposed in a lower part 48 of area 40 so as to surround the circumference of basin 13.

[0083] Furthermore, basin arrangement 11 has a pivotable lid 49 which covers an opening 50 of basin 13 in a closed position of lid 49, lid 49 forming a guiding portion 52 in an area of a pivot axis 51 of lid 49, said guiding portion 52 being configured to guide condensate, which may have formed on an inner surface 53 of lid 49, into basin 13 when lid 49 is moved to an open position of lid 49.

[0084] Depositing station 10 comprises a tube assembly 54 which integrates depositing station 10 into a fluid circuit 55.

[0085] Furthermore, depositing station 10 comprises a pumping device 56 which is configured to circulate the solution in fluid circuit 55.

[0086] Furthermore, depositing station 10 comprises a filter device 57 which is configured to clean the solution flowing in fluid circuit 55.

[0087] Additionally, depositing station 10 comprises a volume flow device 58, which is configured to measure and/or adjust a volumetric flow rate of the solution in fluid circuit 55, a valve arrangement 59, which is configured to empty basin arrangement 11, a sample-analysis device 60, which is configured to take and analyze a sample of the solution, in particular regarding the pH value of the sample, a cooling device 47, and a dosing arrangement 61 having three containers 62 for receiving a component (not shown) contained in the solution, each container 62 being assigned one dosing pump 63 of dosing arrangement 61, dosing arrangement 61 being configured to dose the component in the solution.

[0088] Cooling device 47, sample-analysis device 60 and dosing arrangement 61 are shown exploded off basin arrangement 11 and can be correspondingly disposed on or connected to basin arrangement 11 in particular.

[0089] Tube assembly 54 comprises a plurality of tube sections, the tube sections consisting of several connected tube elements in some instances, which are generally evident in the Figures, but will not be described individually hereinafter.

[0090] A tube section 64 connects outlets 35, 36 of additional basin 34 to pumping device 56. An additional tube section 65 connects pumping device 56 to filter device 57, an additional tube section 66 connecting filter device 57 to inlet 17 of basin 13. Furthermore, an additional tube section 67 is provided which connects filter device 57 to inlets 37, 38 of additional basin 34. Additionally, a bypass tube section 68 connects tube section 64 to additional tube section 66.

[0091] Volume flow device 58 is integrated in additional tube section 66. Furthermore, valve arrangement 59 is connected to tube section 64 and also to additional tube section 66 via bypass tube section 68 in order to make it possible to empty basin 13 and additional basin 34.

[0092] By means of manipulator 16, which is a component of a device for producing contact metallizations 69, to which depositing station 10 also belongs, transport receptacle 14 having wafers 15 vertically positioned therein can be inserted in and/or removed from processing chamber 12, transport receptacle 14, which has been inserted into processing chamber 12, being supported by four supporting elements 70, which are disposed on bottom wall 19 of basin 13, of basin arrangement 11.

[0093] FIG. 19 shows a depositing station 71. A filter device 72 of the depositing station comprises a preliminary filter 73 and a main filter 74 in this case. Additionally, a sample-analysis device 75 of depositing station 71 and a cooling device 76 of depositing station 71 are disposed on a basin arrangement 77 of depositing station 71. Furthermore, a filling tube section 79 is provided which serves to refill basin arrangement 77. In addition, the essential components of depositing station 71 correspond to depositing station 10.

[0094] FIG. 20 shows a depositing station 78, which essentially corresponds to depositing station 71.

[0095] A combined view of FIGS. 21 to 23 shows a basin arrangement 80 having a basin 81, an additional basin 82 and a pivotable lid 83, a transport receptacle 83 having a plurality of wafers 85 received therein being inserted into basin 81. Furthermore, basin arrangement 80 has a moving device 86, which is configured to vertically move transport receptacle 84 in basin 81. Moving device 86 comprises a vertically moveable frame-like moving element 87, which is guided by a guiding portion 88 of moving elements 87 in a guiding system 89 of moving device 86, said guiding system 89 being disposed on the side of additional basin 82. By means of a programmable actuator system 90, which is also disposed on the side of additional basin 82, of moving device 86, moving element 87 can be moved vertically, transport receptacle 84 being held by a retaining portion 91 of moving element 87, said retaining portion 91 protruding into basin 81. Lid 83 has cavities 92 which are protruded by moving element 87 when lid 83 is closed. This configuration of lid 83 allows a vertical movement to be carried out when lid 83 is closed, moving element 87 alternately moving out of lid 83 and into lid 84 during the vertical movement. Furthermore, the inside of lid 83 has a coating 93 to prevent condensates. Moreover, the essential components of basin arrangement 80 correspond to basin arrangement 11.

[0096] A combined view of FIGS. 24 to 28 shows a device 94 for producing contact metallizations on terminal face of wafers 96 received in a transport receptacle 95, said device 94 comprising an input/output station 97 for equipping device 94 with transport receptacles 95 and a plurality of workstations, of which only two depositing stations 98, 99 can be seen in this case. Input/output station 97 and the workstations and depositing stations 98, 99 are disposed in a line. In each of the two free areas 100, 101 of device 94, one additional workstation can be disposed. Each workstation and depositing station 98, 99 has a processing chamber (not shown) for receiving transport receptacle 95. Furthermore, device 94 has a manipulator 102 for handling transport receptacle 95, device 94 having a conveyor 103, on which manipulator 102 is disposed, manipulator 102 in interaction with conveyor 103 allowing an arrangement of transport receptacle 95 in a selectable order of the processing chambers in a conveying direction (not shown). Additionally, device 94 is provided with an operator interface 104. Furthermore, manipulator 102 has a horizontally moveable carrier 106 which is connected to a conveyor belt 105 of conveyor 103 and which has a gripping arm 107 which is vertically moveable with respect to carrier 106. Conveyor belt 105 is driven by a drive motor 108 of conveyor 103. Carrier 106 has a conveyor belt 110 driven by a drive motor 109 of carrier 106 by means of which gripping arm 107 is moveable with respect to carrier 106. Input/output station 97 has drawers 111 which can each be automatically retracted and extended by means of a drive motor 112 of drawer 111. Additionally, a respective handle 113 of drawer 111 allows an operator to manually retract and extend drawer 111. Furthermore, each drawer 111 has a bottom 114 with positioning elements 115 disposed on bottom 114 for positioning transport receptacle 95. Furthermore, receptacle elements 116 of transport receptacle 95 can be seen which serve to grip transport receptacle 95 by means of gripping arm 107.

[0097] The objects shown in FIGS. 1 to 28 can be combined in any useful manner.