Photo cell devices for phase-sensitive detection of light signals
10483426 ยท 2019-11-19
Assignee
Inventors
Cpc classification
H01L31/112
ELECTRICITY
H01L31/103
ELECTRICITY
Y02E10/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
G01S7/4861
PHYSICS
H01L31/03529
ELECTRICITY
H01L31/02024
ELECTRICITY
International classification
H01L31/18
ELECTRICITY
H01L31/0352
ELECTRICITY
H01L31/112
ELECTRICITY
Abstract
Embodiments relate to photo cell devices. In one embodiment, a trench-based photo cells provides very fast capture of photo-generated charge carriers, particularly when compared with conventional approaches, as the trenches of the photo cells create depleted regions deep within the bulk of the substrate that avoid the time-consuming diffusion of carriers.
Claims
1. A method comprising: providing a first vertical trench in a substrate; and providing a second vertical trench in the substrate laterally disposed from the first vertical trench, wherein a horizontal extent of the first and second vertical trenches extend in a first direction such that the first and second vertical trenches run in the first direction parallel to one another; providing a third vertical trench in the substrate; providing a fourth vertical trench in the substrate laterally disposed from the third vertical trench, wherein a horizontal extent of the third and fourth vertical trenches extend in a second direction generally perpendicular to the first direction, such that the third and fourth vertical trenches run in the second direction parallel to one another, wherein the first vertical trench, the second vertical trench, the third vertical trench and the fourth vertical trench collectively substantially enclose and thus define a square region of the substrate therebetween; alternately depleting a first region of the substrate surrounding the first vertical trench and a second region of the substrate surrounding the second vertical trench by alternately applying a voltage to a first vertical trench gate contact and a second vertical trench gate contact, and alternately depleting a third region of the substrate surrounding the third vertical trench and a fourth region of the substrate surrounding the fourth vertical trench by alternately applying a voltage to a third vertical trench gate contact and a fourth vertical trench gate contact, wherein the alternate depleting of the first, second, third and fourth regions comprising an interleaved biasing resulting in biasing of the various trenches serially in a circular fashion, wherein a lateral distance separating the first vertical trench and the second vertical trench is related to a doping level of the substrate such that upon operation a biasing of one of the first vertical trench, the second vertical trench, the third vertical trench and the fourth vertical trench results in formation of a fully depleted gap in a region centrally located between the first vertical trench, the second vertical trench, the third vertical trench, and the fourth vertical trench.
2. The method of claim 1, wherein the voltage is a positive voltage, and the substrate is p-doped.
3. The method of claim 1, wherein the voltage is a negative voltage, and the substrate is n-doped.
4. The method of claim 1, further comprising comparing a charge at the first vertical trench gate contact and the second vertical trench gate contact.
5. The method of claim 1, wherein first and second vertical trenches each extends at least about 5 microns into the substrate.
6. The method of claim 1, wherein first and second vertical trenches each extends at least about 30 microns into the substrate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The invention may be more completely understood in consideration of the following detailed description of various embodiments of the invention in connection with the accompanying drawings, in which:
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(8) While the invention is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
DETAILED DESCRIPTION
(9) Embodiments relate to photo cell devices. In one embodiment, a trench-based photo cells provides very fast capture of photo-generated charge carriers, particularly when compared with conventional approaches, as the trenches of the photo cells create depleted regions deep within the bulk of the substrate that avoid the time-consuming diffusion of carriers.
(10) Referring to
(11) Each trench 102 and 104 extends, for example, at least about 5 microns, such as about 30 microns or deeper, into device 100 in embodiments, though the particular depth of trenches 102 and 104 can be selected according to a wavelength of the light that will be the signal source. As depicted, trenches 102 and 104 extend to the same or similar depths, though this can vary in other embodiments. Trenches 102 and 104 thereby form vertical trench gates, reducing or eliminating the aforementioned vertical depletion limit because space charge region 106 is spread horizontally, i.e., in parallel with the surface of device 100. Other dimensions of trenches 102 and 104 can be, for example, about 0.1 microns to about 5 microns wide and about 0.1 microns to about 100 microns long (referring to the dimensions shown in the top views of
(12) The separation between trenches 102 and 104, horizontally as depicted on the page of
(13) In use, such as when device 100 operates as a phase sensitive detector, electrodes 110 and 112 of adjacent trenches 102 and 104, respectively, are biased alternately with a positive voltage, i.e., a fast sweep, as depicted in
(14) Various embodiments of systems, devices and methods have been described herein. These embodiments are given only by way of example and are not intended to limit the scope of the invention. It should be appreciated, moreover, that the various features of the embodiments that have been described may be combined in various ways to produce numerous additional embodiments. Moreover, while various materials, dimensions, shapes, configurations and locations, etc. have been described for use with disclosed embodiments, others besides those disclosed may be utilized without exceeding the scope of the invention.
(15) Persons of ordinary skill in the relevant arts will recognize that the invention may comprise fewer features than illustrated in any individual embodiment described above. The embodiments described herein are not meant to be an exhaustive presentation of the ways in which the various features of the invention may be combined. Accordingly, the embodiments are not mutually exclusive combinations of features; rather, the invention may comprise a combination of different individual features selected from different individual embodiments, as understood by persons of ordinary skill in the art.
(16) Any incorporation by reference of documents above is limited such that no subject matter is incorporated that is contrary to the explicit disclosure herein. Any incorporation by reference of documents above is further limited such that no claims included in the documents are incorporated by reference herein. Any incorporation by reference of documents above is yet further limited such that any definitions provided in the documents are not incorporated by reference herein unless expressly included herein.
(17) For purposes of interpreting the claims for the present invention, it is expressly intended that the provisions of Section 112, sixth paragraph of 35 U.S.C. are not to be invoked unless the specific terms means for or step for are recited in a claim.