Method and Structure for Conductive Elastomeric Pin Arrays Using Conductive Elastomeric Interconnects and/or metal Caps through a Hole or An Opening in a Non-Conductive Medium

Abstract

An improved method and structure is provided for constructing elastomeric pin arrays using a non-conductive medium and compression limiters. Pin to pin of the same elastomeric material, pin to pin of similar elastomeric material, or pin to metal cap structure interconnects are constructed using an elastomeric connection through a non-conductive medium. Compression limiting structures are mated to the non-conductive medium. This structure eliminates the need for PCB structures as the medium reducing manufacturing cost.

Claims

1. An electrical interconnect, comprising: elastomeric pin arrays formed of elastomeric material joined together using a conductive elastomer through a hole or opening in a non-conductive medium; and compression limiting structures mated to said non-conductive medium, said compression limiting structures being used to limit conductive elastomeric strokes to within target ranges thereby forming an electrical interconnect and negating a need for a PCB based through via/pad structure and reducing manufacturing costs.

2. The electrical interconnect of claim 1 wherein said elastomers are the same elastomeric material.

3. The electrical interconnect of claim 1 wherein said elastomers are the similar elastomeric material.

4. The electrical interconnect according to claim 1 wherein said target ranges are 10%-40% of the non-compressed height of the elastomers.

5. The electrical interconnect of claim 1 wherein said compression limiting structures, such as but not limited to Kapton or FRW, are used to limit conductive elastomeric interconnect compression strokes to within target ranges of 10%-40% of the non-compressed height of the elastomers.

6. An electrical interconnect, comprising: pin arrays formed of elastomeric pin to metal cap structure interconnects using a conductive elastomer and metal cap through a hole or opening in a non-conductive medium; and compression limiting structures mated to said non-conductive medium, said compression limiting structures being used to limit conductive elastomeric strokes to within target ranges thereby forming an electrical interconnect and negating a need for a PCB based through via/pad structure and reducing manufacturing costs.

7. An electrical interconnect, comprising: a PCB or IC ball grid array interconnect using a mating pad, a compression limiter, a conductive elastomer, a non-conductive medium and ball.

8. A method for forming an electrical interconnect, the steps comprising: forming elastomeric pin arrays elastomeric material joined together using a conductive elastomer through a hole or opening in a non-conductive medium; and compression limiting structures mated to said non-conductive medium, said compression limiting structures limiting conductive elastomeric strokes to within a target range thereby forming an electrical interconnect and negating a need for a PB based through via/pad structure and reducing manufacturing costs.

9. The method of claim 8 wherein said elastomers are the same elastomeric material.

10. The method of claim 8 wherein said elastomers are the similar elastomeric material.

11. A method of forming an electrical interconnect, the steps comprising: forming arrays formed of elastomeric pin to metal cap structure interconnects using a conductive elastomer and metal cap through a hole or opening in a non-conductive medium; and compression limiting structures mated to said non-conductive medium, said compression limiting structures limiting conductive elastomeric strokes to within target ranges thereby forming an electrical interconnect and negating a need for a PCB based through via/pad structure and reducing manufacturing costs.

12. A method of forming an electrical interconnect, the steps comprising: forming a PCB to IC ball grid array interconnect by joining and connecting mating pads, a compression limiter, a conductive elastomer, a non-conductive medium and a ball.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 is a first embodiment showing a PCB to PCB interconnect in accordance with the teachings of the present invention;

[0006] FIG. 2 is a sectional view of a second embodiment of the present invention showing the elastomeric pin connections using the same elastomeric material with a compression limiter and non-conductive medium;

[0007] FIG. 3 is a third embodiment of the present invention showing pin to pin connection using similar elastomeric material with a compression limiter, non conductive medium;

[0008] FIG. 4 is a fourth embodiment of the present invention showing pin to metal cap connection using a compression limiter, a non-conductive medium and a metal cap; and

[0009] FIG. 5 is a fifth embodiment of the present invention showing a PCB to IC ball grid array interconnect using a mating pad, a compression limiter, a conductive elastomer, a non-conductive medium and a ball.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

[0010] Referring to the drawings of FIGS. 1-5, FIG. 1 is a first embodiment of the present invention showing a PCB to PCB interconnect. In FIG. 1, a first PCB structure 5a is connected to a second PCB structure 5b by a mating pad 1 attached to the portion of the bottom surface of the PCB 5a connecting to a top surface of a conductive elastomer 3.

[0011] The conductive elastomer 3 is connected with compression limiters 2 on both sides of the conductive elastomer 3 and a non-conductive medium 4 by a non-conductive medium having a hole or opening with elastomeric material and/or metal caps feeding through the hole or opening. A mating pad is provided on a portion of a top surface of the second PCB substrate 5b to connectedly be attached, preferably with adhesive material, to the bottom surface of the conductive elastomer 3. FIG. 1 provides an interconnect with no need for solderable metallic disk, e.g. a flange. Thus reducing manufacturing costs.

[0012] FIG. 2 describes a second embodiment of the present invention in which elastomeric pin connections using the same elastomeric material with a compression limiter and non-conductive medium. Conductive elastomeric interconnects of the same elastomeric material 3 are joined together using conductive structures through a hole in the non-conductive medium 4. Compression limiting structures 2 are used to limit conductive elastomeric interconnect compression strokes to within target ranges. This eliminates the need for a PCB structure and greatly reduces manufacturing cost.

[0013] FIG. 3 describes a third embodiment of the present invention in which elastomeric pin connections using the similar elastomeric material 3, 5 with a compression limiter 2 and non-conductive medium 4. Conductive elastomeric interconnects of the similar elastomeric material 3, 5 are joined together using conductive structures through a hole in the non-conductive medium 4. Compression limiting structures 2 are used to limit conductive elastomeric interconnect compression strokes to within target ranges. This eliminates the need for a PCB structure and greatly reduces manufacturing cost.

[0014] FIG. 4 is a fourth embodiment of the present invention showing elastomeric pin 3 to metal cap 6 connection using a compression limiter 2, a non-conductive medium 4 and a metal cap 6. Conductive elastomeric interconnects 3 and metal caps 6 are joined together using conductive structures through a hole in the non-conductive medium 4. Compression limiting structures 2 use the metal 6 to non-conductive medium 4.

[0015] FIG. 5 is a fifth embodiment of the present invention showing a PCB 5 connected to an IC ball grid array interconnect 67 using a mating pad 1, a compression limiter 2, a conductive elastomer 3 and a non-conductive medium 4 and a ball 7. The ball grid array 6 is connected to the structure formed with compression limiter structures 2 connected by feeding through a hole or an opening in a non-conductive medium 4 with a conductive elastomer and/or metal caps. A bottom portion of the elastomer 3 is mated, preferably by adhesive material, to a mating pad 1 attached to a top portion of the PCB structure 5. This is a less costly process to manufacture as solderable metallic material is not needed to form this interconnect structure.

[0016] While certain embodiments have been shown and described, it is distinctly understood that the invention is not limited thereto but may be otherwise embodied within the scope of the appended claims.