Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack

Abstract

A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.

Claims

1. A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising: a plurality of rings arranged one next to the other and vertically one above the other, each of said rings having an inner circumference and being equipped with a plurality of holding chucks extending inward from said inner circumference, said holding chucks being configured to receive and hold the substrate stack; and a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer.

2. The device according to claim 1, wherein each of the nozzles has a diameter of 0.01 to 10 mm.

3. The device according to claim 1, wherein each of the rings is equipped with a solvent line that is connected to the nozzles of the ring.

4. The device according to claim 1, wherein the nozzles of each ring are spaced from one another over an entire periphery of the ring.

5. The device according to claim 4, wherein the nozzles of each ring are evenly spaced from one another over the entire periphery of the ring.

6. The device according to claim 1, wherein each of said rings has at least 60 of said nozzles.

7. The device according to claim 1, wherein the holding chucks pivot.

8. The device according to claim 1, wherein each of the holding chucks have at least one attaching pin for fastening the substrate stack thereto.

9. The device according to claim 1, wherein the rings are installed in a closed chamber.

10. The device according to claim 1, wherein the device has 2 to 30 of said rings arranged one above the other.

11. The device according to claim 1, wherein the nozzles of each ring pivot with a degree of pivoting movement of 1 to 20.

12. The device according to claim 11, wherein the nozzles of each ring pivot in a horizontal plane.

13. The device according to claim 1, further comprising: a receiving system configured to transport the substrate stack to and/or away from each of said rings, said receiving system being further configured to move in a vertical direction.

14. A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising: a plurality of rings arranged one next to the other and vertically one above the other, an inside of each of said rings being dimensioned to receive the substrate stack; and a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer; a receiving system configured to transport the substrate stack to and/or away from each of said rings, said receiving system being further configured to move in a vertical direction; and one or more additional nozzles configured to clean a bottom of the substrate stack, said additional nozzles being located below the receiving system and/or in a lowermost ring, said additional nozzles pointing toward a direction of a center of the substrate stack.

15. The device according to claim 14, wherein the device has 1 to 60 of said additional nozzles.

16. The device according to claim 14, further comprising: a plurality of attaching pins configured to secure the substrate stack during cleaning of the substrate stack.

17. The device according to claim 16, wherein the device has 15 or less attaching pins.

18. A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising: a plurality of rings arranged one next to the other and vertically one above the other, an inside of each of said rings being dimensioned to receive the substrate stack; a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer; and a pivoting arm with at least one nozzle for cleaning the substrate stack.

19. A method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, said substrate stack comprised of at least two substrates temporarily bonded to each other with the connecting layer, the method comprising: placing the substrate stack inside a ring of a device comprised of a plurality of rings arranged one next to the other, each ring having a plurality of nozzles that are arranged at least over a portion of a periphery of the ring, wherein each of said nozzles receives a solvent; directing the nozzles toward the connecting layer; and spraying the solvent onto an edge area of the connecting layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1a: a diagrammatic top view of a device according to the invention in accordance with a first embodiment with a line of intersection A-A,

(2) FIG. 1b: a diagrammatic cross-sectional view of a partial section of the device of FIG. 1a along the line of intersection A-A,

(3) FIG. 1c: a diagrammatic cross-sectional view of a device according to the invention in accordance with a second embodiment,

(4) FIG. 2a: a cross-sectional view of a device according to the invention in accordance with a third embodiment,

(5) FIG. 2b: a top view of a receiving system according to a preferred embodiment,

(6) FIG. 3: a cross-sectional view of a device according to the invention in accordance with a fourth embodiment,

(7) FIG. 4a: a cross-sectional view of a receiving system according to another embodiment,

(8) FIG. 4b: a top view of the receiving system of FIG. 4a,

(9) FIG. 5a: a diagrammatic top view of an exemplary embodiment of a nozzle body, and

(10) FIG. 5b: a cross-sectional view of another exemplary nozzle body.

(11) In the figures, the same components and components with the same function are identified with the same reference numbers and are therefore also only named once in each case.

DETAILED DESCRIPTION OF THE INVENTION

(12) FIG. 1a diagrammatically shows a top view of a device 22 according to the invention in accordance with a first embodiment with a line of intersection A-A. FIG. 1b shows a diagrammatic half of a cross-sectional view of the device 22 along the line of intersection A-A. The other half is designed in mirror image.

(13) As shown in the embodiment according to FIGS. 1a and 1b, the device 22 has a ring 1. The ring 1 is equipped with pivoting holding devices 3 with attaching pins 7 in order to hold a substrate stack 2 in a partial-dissolving position. The attaching pins 7 are advantageously cylindrical or have slightly conical tips, but they can also have other suitable shapes and/or sizes. The substrate stack 2 is comprised of a carrier substrate 5 and a product substrate 6, which are temporarily bonded with one another via a connecting layer e.g., an adhesive layer.

(14) The ring 1 is mounted preferably 0.1 to 15 mm, more preferably 0.1 to 10 mm, most preferably 0.1 to 8 mm, and with utmost preference 0.1 to 5 mm away from the substrate stack 2.

(15) The ring 1 is equipped with a solvent line 9 (also called a Common Rail 9 below), in which holes, preferably nozzles 1a, run. The holes, preferably nozzles 1a, have a diameter of preferably 0.01 to 10 mm, more preferably 0.01 to 7 mm, most preferably 0.01 to 5 mm, and with utmost preference 0.1 to 2 mm. The nozzles 1a are arranged on the entire periphery of the ring 1. The distance of the nozzles 1a to one another depends on the material and the edge zone that is to be detached (also called edge area or edge zone below) and lies in a range of 1 to 50 mm, preferably in a range of 3 to 20 mm. The nozzle 1a sprays solvent on the edge area of the connecting layer 4 (indicated with a solvent jet 8).

(16) The diameter of the product substrate 6 is preferably essentially identical to the diameter of the carrier substrate 5. The thickness of the product substrate 6 is in particular smaller than the thickness of the carrier substrate 5.

(17) The solvent lines 9 are filled with solvent, and the solvent exits at high pressure from the nozzles 1a. The pressure in this case is greater than or equal to 1 bar, preferably greater than 5 bar, even more preferably greater than 10 bar, and most preferably greater than 20 bar. If the unit is operated under vacuum and the ambient pressure is less than 1 bar, the pressure of the solvent if necessary can also be less than 1 bar. The pressure of the solvent, however, must in any case be greater than the ambient pressure. The solvent is pumped in the circuit (not shown) and roughly filtered in order to prevent the nozzles 1a from clogging. For an embodiment according to the invention, in which the solvent is separated by distillation and recycled, the solvent is already heated.

(18) The process time, e.g., during the partial-dissolving process (Edge Zone Release (EZR) process) depends on the material, i.e., on adhesive, and on the width of the (adhesive) edge zone. The edge zone can be configured as narrow as possible in order to reduce the process time or the partial-dissolving time.

(19) In an alternative embodiment to FIG. 1b, the ring 1 and/or the holding device 3 is/are designed to rotate. As a holding device 3, i.e., receiving system, in particular a specimen holder (chuck) is suitable. In order to make possible a complete and/or faster loosening or partial dissolving, a relative rotation between the nozzles 1a and the substrate stack 2 is carried out. The substrate stack holding device 3 is preferably located on a shaft that can be put in rotation around its axis. In this embodiment, the holding device 3 is not pivoting but rather runs centrically with a shaft (not shown). Advantageously, the receiving system 10 is installed (see FIG. 2a). The receiving system 10 first moves, in particular is driven over a shaft 12, upward in the z-direction and brings the substrate stack 2 into the operating position. This shaft can then also be put in rotation around its axis (not shown). Instead of rotation, an oscillation of the holding device 3 around the shaft is also possible. In this case, rotation or oscillation can be set in such a way that at least the angle that lies between two nozzles 1a is covered by the oscillation. As a result, the entire connecting layer periphery is covered, and fewer nozzles 1a can be installed.

(20) FIG. 1c shows one half of a diagrammatic cross-sectional view of a device 22 according to the invention in accordance with a second embodiment. The other half is designed in mirror image. In FIG. 1c, three rings 1 that are in particular designed identically as well as corresponding holding devices 3 are arranged vertically stacked one above the other. All rings 1 are installed in a closed chamber (not shown). The stacked rings 1 are connected to one another and are supplied by means of connecting lines or supply lines 9 with solvent by means of a high-power circulating pump.

(21) Multiple rings 1 can be arranged one above the other in any number, preferably 2 to 30, more preferably 2 to 15, most preferably 2 to 10, and with utmost preference 2 to 5 rings 1, so that multiple substrate stacks 2 can be treated at the same time.

(22) FIG. 2a diagrammatically shows a cross-sectional view of a device 22 according to the invention in accordance with a third embodiment. The device 22 can be designed as described in FIG. 1c, whereby the device 22 in addition has a receiving system 10. The upper ring 1 is already loaded with a substrate stack 2 in this depiction. A second substrate stack is located on the receiving system 10.

(23) The substrate stack 2 may have been previously loaded by a robot (not shown) onto the receiving system (in particular a chuck) 10. The receiving system 10 is designed in such a way that the robot can remove the substrate stack 2 again after the loosening or partial dissolving. The substrate stack 2 is advantageously attached to the receiving system 10 that can move parallel to the z-direction (vertical direction). The receiving system 10 moves, in particular is driven over a shaft 12, upward in the z-direction and brings the substrate stack 2 into the vicinity of the middle holding device 3. After that, movable loading pins 11 load the substrate stack 2 onto the middle holding device 3.

(24) In an advantageous embodiment of the invention, it is provided that the holding devices 3 can be pivoted, and the loading pins 11 can place the substrate stack 2 thereon. The attaching pins 7 prevent the substrate stack 2 from slipping on the holding device 3. In another exemplary embodiment, a vacuum system is arranged alternatively or optionally on the in particular pivoting holding devices 3.

(25) This process is repeated until all substrate stacks 2 are loaded or all rings 1 are loaded. After that, the spraying of the solvent from the nozzles 1a is started.

(26) FIG. 2b shows a top view of a receiving system 10 of a preferred embodiment. To receive a substrate stack 2 from the holding device 3 or to place it on the holding device 3, the receiving system 10 has a lifting mechanism, not shown, with loading pins 11. The lifting mechanism can be integrated into, e.g., the receiving system 10 and can be operated by means of a control network. The receiving system 10 as shown in FIG. 2b has three recesses 13 for loading pins 11. In addition, according to an exemplary embodiment, the support surface of the receiving system 10 has circular recesses that are arranged concentric to the center. These recesses are advantageous in order to be able to perform a cleaning of the substrate stack 2 from below. The recesses can also have other suitable shapes, e.g., can be designed in the shape of a honeycomb or circle and/or have other types of area coverage.

(27) After the spraying process, the lowermost substrate stack 2 is raised by the loading pins 11. After that, the holding devices 3 are pivoted out, and the loading pins 11 place the substrate stack 2 on the receiving system 10. The receiving system 10 moves into a defined lower position in order to make possible or to perform the cleaning of the substrate stack 2.

(28) FIG. 3 diagrammatically shows a cross-sectional view of a device 22 according to the invention in accordance with a fourth embodiment. FIG. 3 shows an embodiment in which the substrate stack 2 is cleaned with solvent, e.g., pure solvent or a solvent mixture, and is dried with fast-drying solvents. The receiving system 10 runs in a defined lower position in order to make possible or to perform the cleaning of the substrate stack 2. The rings 1 that are stacked one above the other as well as the receiving system 10 are arranged in a closed chamber 16.

(29) Above this lower position, there is located a pivoting arm 14 with a nozzle 141 for the cleaning of the substrate stack by solvent. The use of a pivoting shield (not shown) in the device 22 is especially preferred so that when the loosening or partial dissolving is completed, and the lowermost substrate stack 2 is removed for cleaning, the shield prevents the contamination of the lowermost substrate stack 2 by drops from above. If the shield pivots, the substrate stack 2 can be cleaned and then dried. For receiving the next substrate stack 2, the shield comes up again.

(30) Advantageously, it is provided to extract the lowermost substrate stack 2 in each case downward from the ring stack with the receiving system 10 that is movable in the z-direction and to cover it with the pivoting shield to the extent that cleaning and drying with solvent are possible. The pivoting arm 14 with the nozzle 141 is used for the cleaning of the upper side of the substrate stack 2. Under the receiving system 10, there is located another nozzle 15 that points in the direction toward the center of the substrate stack 2, so that even the lower side of the substrate stack 2 can be cleaned. In this exemplary embodiment, the substrate stack 2 is secured only on the periphery of three attaching pins 10a during the cleaning step.

(31) The substrate stack 2 is unloaded from the receiving system 10 with a robot and runs, e.g., onto a film-frame mounter or to the next module (e.g., for Edge Zone Debonding EZD). As an alternative, e.g., a buffer station is used for intermediate storage of the substrate stack 2, before the latter is further processed in the process, i.e., e.g., until there are again spaces for further processing in the in particular automatic unit.

(32) FIG. 4a diagrammatically shows another exemplary embodiment of the receiving system 10 in a side view. FIG. 4b shows a top view of the receiving system 10, movable in the z-direction, from FIG. 4a. The substrate stack 2 (not shown) is secured only on the periphery with three attaching pins 10a. The receiving system 10 has three longitudinal arms 101, which extend radially outward from the center of the receiving system 10 and are evenly spaced at intervals of 120. The ends of the arms 101 lie on a circle K. The arms 101 are made the same length. The arms 101 are designed to be rod-shaped with uniform cross-sections. A horizontally-arranged support surface for the substrate stack 2 is arranged on the radially outward-lying ends of the arms 101. The attaching pin 10a is located on this support surface. This embodiment makes possible an especially efficient cleaning of the substrate stack 2. The contour of the support surface and the shape of the receiving system 10 are not, moreover, limited to the embodiments according to FIG. 2b and FIG. 4b.

(33) FIGS. 5a and 5b show nozzle bodies 17, 19 according to two further developments of the device 22 according to the invention. The nozzle bodies 17, 19 can be arranged above the product substrate 6 with the substrate surface 6o. As a result, the product substrate 6 can be especially efficiently cleaned, in particular from above, in particular after the substrate stack 2 has been completely separated.

(34) According to a first embodiment, FIG. 5a shows a nozzle body 17 (with a so-called cleaning triangle), whose nozzles 18 are arranged only on a partial area of the nozzle body 17 or the surface of the nozzle body 17. This partial area comprises in particular a circular surface segment that extends from the center over an angle of approximately 900. The nozzle body 17 and/or the product substrate 6 can be rotated in particular in order to achieve an especially thorough cleaning of the surface 6o0.

(35) FIG. 5b shows a nozzle body 19 according to a second embodiment, whose nozzles 18 are arranged distributed not only over a partial area but over the entire surface of the nozzle body 19. The nozzle body 19 is equipped with the nozzles 18 on the entire surface.

(36) The solvent or solvent mixture is pumped into the circuit in particular for the rough cleaning in the Common Rail 9. The solvent is pumped through supply lines 20 into the nozzle body 17 or 19.

(37) The device 22 has the nozzle body 17 or 19 in particular for cleaning the product substrate 6 after the detaching (Edge Zone Debonding EZD). The product substrate 6 is in particular stretched on an adhesive film 21 with a film frame and is cleaned in particular in a separate cleaning module.

LIST OF REFERENCE SYMBOLS

(38) 1 Ring 1a Nozzle 2 Substrate stack 3, 3 Holding device 4 Connecting layer 5 Carrier substrate 6 Product substrate 6o Substrate surface 7 Attaching pin 8 Solvent jet 9 Solvent line 10 Receiving system 10a Attaching pin 101 Arm 11 Loading pin 12 Shaft 13 Recess 14 Arm 141 Nozzle 15 Nozzle 16 Chamber 17 Nozzle body 18 Nozzle 19 Nozzle body 20 Supply line 21 Film K Circle