CONTINUOUS DEPOSITION INSTALLATION AND ASSEMBLY FOR SAME

Abstract

A continuous separation installation for the galvanic deposition of a substance on objects includes contacting devices having at least one electrically conductive contact arm. The contacting devices are arranged in areas of the continuous separation installation which are free from an electrolyte used for the galvanic deposition of the substance. There is also described an assembly for a continuous separation installation.

Claims

1-15. (canceled)

16. A continuous deposition installation for the electrolyte deposition of a substance on objects, the continuous deposition installation comprising: contacting devices having at least one electrically conductive contact arm; said contacting devices being arranged in regions of the continuous deposition installation that are free of an electrolyte used for the electrolyte deposition of the substance.

17. The continuous deposition installation according to claim 16, wherein: the electrolyte is arranged in a tank; said tank having at least one outflow device configured to enable a level of the electrolyte in said tank to be lowered locally in outflow regions; said contacting devices have contact surfaces for contacting the objects; said contact surfaces of said contacting devices are disposed in said outflow regions.

18. The continuous deposition installation according to claim 17, wherein at least one said outflow device comprises a hollow body, which is arranged at least in sections below said contact surfaces of at least one contacting device and through which the electrolyte is able to flow at least in sections.

19. The continuous deposition installation according to claim 18, wherein said hollow body is a pipe having an upper opening below said contact surfaces of at least one said contacting device.

20. The continuous deposition installation according to claim 18, wherein a plurality of contacting devices are electrically conductively connected to a voltage source and a load resistance is connected upstream of at least one portion of said plurality of contacting devices, and wherein the respective said load resistance is dimensioned such that, upon contact being made, an electric current of substantially identical magnitude is applied to each of said plurality of contacting devices.

21. The continuous deposition installation according to claim 20, wherein all of said contacting devices are electrically conductively connected to the voltage source.

22. The continuous deposition installation according to claim 16, which comprises a dedicated rectifier connected to each said contacting device.

23. The continuous deposition installation according to claim 16, comprising: at least one assembly including: a plurality of contacting devices; a control device connectable to a voltage supply; wherein each contacting device of said plurality of contacting devices is connected to said control device via separate electrical lines and electric current is able to be applied separately to each contacting device of said plurality of contacting devices; wherein said control device is configured to the effect that electric current applied to the individual contacting devices of said plurality of contacting devices is controlled by open-loop control or closed-loop control, separately for each of said individual contacting devices; wherein said control device is configured as constant-current closed-loop control for each of said individual contacting devices, such that electric current of constant magnitude is able to be applied separately to each of said individual contacting devices; wherein said control device is configured to run through separate, predefinable current profiles for each of said individual contacting devices; and wherein said control device has a communication interface for bidirectional data exchange.

24. The continuous deposition installation according to claim 16, wherein said communication interface is a bus interface.

25. The continuous deposition installation according to claim 16, wherein the electric current applied to the individual contacting devices of said plurality of contacting devices is controlled by closed-loop control.

26. An assembly for a continuous deposition installation for depositing a substance on objects, the assembly comprising: a plurality of contacting devices; and a control device connectable to a voltage supply; wherein each of said contacting devices is connected to said control device via separate electrical lines, such that electric current may be applied separately to each of said contacting devices.

27. The assembly according to claim 26, wherein said contacting devices are at least four contacting devices.

28. The assembly according to claim 26, wherein said control device is configured to cause electric current to be applied to the individual said contacting devices to be controlled by open-loop control and/or closed-loop control separately for each of said individual contacting devices.

29. The assembly according to claim 28, wherein said control device is a constant-current closed-loop controller for each individual said contacting device of said contacting devices such that electric current of constant magnitude is applied separately to each individual said contacting device.

30. The assembly according to claim 28, wherein said control device is configured to run through separate, predefinable current profiles for each individual said contacting device.

31. The assembly according to claim 26, wherein said control device includes a communication interface configured to bidirectionally exchange data with a data processing device.

32. The assembly according to claim 26, wherein said communication interface is a bus interface.

33. A method for galvanically depositing metals or metal alloys, the method comprising: providing an installation according to claim 16; and depositing the metal or the metal alloy on a substrate.

34. The method according to claim 33, which comprises depositing on a solar cell.

Description

[0031] The invention is explained in greater detail below with reference to figures. In so far as expedient, identically acting elements are provided with identical reference signs herein. The invention is not restricted to the exemplary embodiments illustrated in the figuresnot even with regard to functional features. The description above and also the description of the figures below contain numerous features which are rendered in part as a plurality in combination in the dependent subclaims. These features and also all the other features disclosed above and in the description of the figures below will, however, also be considered individually and combined to form expedient further combinations by the person skilled in the art. In particular, all features mentioned are combinable in each case individually and in any suitable combination with the continuous deposition installation and the assembly as claimed in the independent claims.

[0032] In the figures:

[0033] FIG. 1 shows a first exemplary embodiment of the continuous deposition installation according to the invention in a schematic sectional illustration,

[0034] FIG. 2 shows a second exemplary embodiment of the continuous deposition installation according to the invention in a schematic sectional illustration,

[0035] FIG. 3 shows a partial illustration of a third exemplary embodiment of the continuous deposition installation according to the invention,

[0036] FIG. 4 shows a schematic partial illustration of a fourth exemplary embodiment of the continuous deposition installation according to the invention containing an assembly according to the invention.

[0037] FIG. 1 shows a first exemplary embodiment of the continuous deposition installation according to the invention in a schematic sectional illustration. The continuous deposition installation 10 illustrated comprises a tank 5, in which a liquid electrolyte 7 is arranged. In the continuous deposition installation 10, solar cells 1 are transported in a transport direction 3 by means of transport rollers 4. In this case, an underside of the solar cells 1 makes contact with the electrolyte 7. The tank 5 can be embodied as an overflow tank in a manner known per se, such that a level 8 of the electrolyte 7 is higher than an upper edge of the tank 5 and the electrolyte overflows into a surrounding tank (not illustrated).

[0038] The continuous deposition installation 10 comprises contacting devices 12. The latter are illustrated with only one electrically conductive contact arm 13 in FIG. 1, for the sake of simplicity, but a plurality of contact arms can readily be provided. Pipes 16 as outflow devices are provided in the tank 5. Upper openings 17 of said pipes 16 are arranged below the level 8 of the electrolyte 7. Consequently, the electrolyte 15 flows from the surroundings of the pipes 16 into the openings 17 of the pipes 16 and flows through the pipes 16 downward. Consequently, the level 8 of the electrolyte is lowered locally in outflow regions 18.

[0039] The contacting devices 12 have contact surfaces 14 at their lower end. These are those surfaces of the contacting devices 12 which make contact with the surface of the solar cells 1 as the solar cells 1 pass through the continuous deposition installation 10. Said contact surfaces 14 of the contacting devices 12 are arranged in the outflow regions 18. Consequently, the contact surfaces 14, and thus the contacting devices 12 in their entirety, even when they are currently not bearing on one of the solar cells 1, do not make contact with the electrolyte 7. Consequently, the contact surfaces 14 and likewise the contacting devices 12 in their entirety never make contact with the electrolyte 7 and the disadvantageous deposition of metal on the contacting devices 12 as described above is avoided. At those moments when the solar cells 1 are being transported through below the contacting devices 12 and being contacted by the contact surfaces 14, it may indeed happen, depending on the dimensioning of the pipes 16, that the contact surfaces 14 bearing on the surface of the solar cells 1 are situated outside the outflow regions 18. Nevertheless, since the contact surfaces 14 lie above the level 8 of the electrolyte 7 at these moments, no contact arises between the contact surfaces 14 or other parts of the contacting devices 12, on the one hand, and the electrolyte 7, on the other hand.

[0040] In the exemplary embodiment in FIG. 1, the contact surfaces 14 of the contacting devices 12 within the meaning of the present application are arranged in the outflow regions 18. Furthermore, the pipes 16 are arranged below the contact surfaces 14 of the contacting devices 12. Correspondingly, in the exemplary embodiment illustrated in FIG. 2, the contact surfaces 14 of contacting devices 22a, 22b are arranged in outflow regions 28 and pipes 26 are arranged below the contact surfaces 14 of the contacting devices 22a, 22b.

[0041] The second exemplary embodiment illustrated in a schematic sectional illustration in FIG. 2 shows a continuous deposition installation 20, which differs from the continuous deposition installation 10 from FIG. 1 essentially in that two contacting devices 22a, 22b are provided in the outflow regions 28, said contacting devices being arranged in a manner offset with respect to one another in the transport direction 3 of the solar cells 1. This configuration variant has proved to be advantageous in individual applications. For the rest, the same conditions as in the exemplary embodiment in FIG. 1 are present. The contact surfaces 14 of the contacting devices 22a, 22b are arranged in the outflow regions 28 and never make contact with the electrolyte 7. Openings 27 of the pipes 26 are once again arranged below the level 8 of the electrolyte 7.

[0042] FIG. 3 shows a perspective partial illustration of a further exemplary embodiment. In the case of the continuous deposition installation 30 illustrated, contacting devices 32a, 32b are provided, each comprising four contact arms 33a, 33b, 33c, 33d. In a manner similar to the contacting devices 22a, 22b in the exemplary embodiment in FIG. 2, two contacting devices 32a, 32b arranged adjacent in the transport direction 3 of the solar cells 1 are arranged above the same outflow device, which is formed by a pipe as in the case of the continuous deposition installation 20. Other outflow devices can be provided instead. The pipes serving as outflow devices are not visible in FIG. 3. The contacting devices 32b, too, are discernible only in places and in small parts. In most cases, the contacting devices 32b are concealed by a contacting device carrier 34. These contacting device carriers 34 serve to support contacting device modules 36 accommodating the contacting devices 32a, 32b.

[0043] In the case of the continuous deposition installation 30, all contacting devices 32a, 32b are electrically conductively connected to a voltage source 40. For the purpose of compensating for differences in the electrical resistance as described in greater detail above, load resistances 38 are connected upstream of all contacting devices 32a, 32b. In the exemplary embodiment in FIG. 3, said load resistances are arranged in the contacting device modules 36. In principle, they can also be arranged at other locations. The electrical leads to the voltage source 40 are not illustrated in the illustration in FIG. 3, for the sake of better clarity.

[0044] As in the other exemplary embodiments illustrated in the figures, the solar cells 1 are transported in the transport direction 3 by means of the transport rollers 4 and are guided past the contacting devices 32a, 32b in the process. In this case, the contacting devices 32a, 32b, formed from a high-grade steel sheet in the exemplary embodiment in FIG. 3, are slightly bent and contact the solar cells 1 on the top side thereof. The movement of the solar cells 1 is not slowed down or even stopped by the contact with the contacting devices 32a, 32b. In all exemplary embodiments illustrated in FIGS. 1 to 4, the contacting devices transfer electric current or charge carriers to the solar cell at least during part of the time while they contact the solar cells. This electric circuit is closed via the electrolyte 7 and an anode (not illustrated in the figures) in a manner known per se.

[0045] FIG. 4 illustrates one exemplary embodiment of the assembly according to the invention in a schematic illustration. This assembly 60 is identified by a dashed boundary. At the same time, FIG. 4 illustrates a further exemplary embodiment of a continuous deposition installation on the basis of a schematic partial illustration. This continuous deposition installation 50 in turn comprises a tank, an electrolyte, outflow devices and transport rollers. However, these component parts are not illustrated in FIG. 4, for the sake of better clarity. By contrast, solar cells 1 are shown, which are transported in the transport direction 3 by means of the transport rollers (not illustrated). Analogously to the case of the exemplary embodiments in FIGS. 1 and 2, provision is made of outflow devices, in particular pipes, which form outflow regions, in which contact surfaces of the contacting devices 52 are arranged.

[0046] The continuous deposition installation 50 comprises four assemblies 60. The number of assemblies can be increased or decreased as necessary. Each of said assemblies comprises three contacting devices 52 in the exemplary embodiment in FIG. 4. The assembly is thus designed for a three-track installation. The number of contacting devices can be increased, for example in order, as in the exemplary embodiment in FIG. 3, to provide two contacting devices per track in an assembly 60 or in order to extend the continuous deposition installation 50 by additional tracks. Each contacting device 52 comprises three contact arms 53a, 53b, 53c. The number of contact arms can be adapted to the respective application. The contacting devices 52 are supported on a contacting device carrier 54.

[0047] Besides the contacting devices 52, the assembly 60 comprises a control device 64 connectable to a voltage supply. Said control device is already connected to the voltage supply 70 owing to the use of the assembly 60 in the continuous deposition installation 50 in the illustration in FIG. 4. Furthermore, each of the contacting devices 52 is connected to the control device 64 via separate electrical lines 62. This is done in such a way that electric current is able to be applied separately to each of the contacting devices 52.

[0048] Furthermore, the assembly 60 comprises a data processing unit 68 configured to carry out measurement processes within the assembly, for example current or resistance measurements at individual contacting devices 52 or contact arms 53a, 53b, 53c, and to detect measurement values and to process them further as necessary. The control device is configured as constant-current closed-loop control for each contacting device. Furthermore, the control device is configured to run through separate, predefinable current profiles for each contacting device 52. The stated functions of the control device can be realized by means of discrete electrical or electronic circuits or components. Preferably, the data processing unit 68 is configured to provide these functionalities, if appropriate with recourse to further components of the control device 64. This enables a high flexibility in the process management. This flexibility is additionally intensified by the bus interface 66 provided in the assembly 60, said bus interface enabling bidirectional data exchange with a data processing device 72. Using said bus interface, measurement data determined by the control device 66 can be evaluated in the central data processing device and the assemblies 60 arranged downstream in the transport direction 3, or the contacting devices of said assemblies, can be driven in a targeted manner for each individual solar cell. This makes it possible to compensate for or at least reduce ascertained shortcomings by adapting the process parameters in subsequently traversed parts of the continuous deposition installation 50 or to adapt the process parameters to individual properties of the respective solar cell 1. Moreover, for the purpose of process archiving, measurement and process data for each treated solar cell can be communicated to the data processing device 72 and archived.

[0049] Complex current profiles can be realized by means of the data processing unit 68. By way of example, it is possible firstly to use low current values in order that possible electrolyte splashes present on the solar cells can dry and sparking is avoided. At a later point in time in the course of the process, higher currents can then be provided in order to realize required deposition rates.

[0050] In all exemplary embodiments shown in the figures, components worthy of protection can be protected against corrosion, if necessary, by means of a protective lacquer or potting in epoxy resin.

[0051] Although the invention has been illustrated and described more specifically in detail by means of preferred exemplary embodiments, the invention is not restricted by the exemplary embodiments disclosed and other variants of the invention can be derived by the person skilled in the art, without departing from the basic concept of the invention.

LIST OF REFERENCE SIGNS

[0052] 1 Solar cell [0053] 3 Transport direction [0054] 4 Transport roller [0055] 5 Tank [0056] 7 Electrolyte [0057] 8 Level [0058] 10 Continuous deposition installation [0059] 12 Contacting device [0060] 13 Contact arm [0061] 14 Contact surface [0062] 15 Electrolyte [0063] 16 Pipe [0064] 17 Opening [0065] 18 Outflow region [0066] 20 Continuous deposition installation [0067] 22a Contacting device [0068] 22b Contacting device [0069] 26 Pipe [0070] 27 Opening [0071] 28 Outflow region [0072] 30 Continuous deposition installation [0073] 32a Contacting device [0074] 32b Contacting device [0075] 33a Contact arm [0076] 33b Contact arm [0077] 33c Contact arm [0078] 33d Contact arm [0079] 34 Contacting device carrier [0080] 36 Contacting device module [0081] 38 Load resistance [0082] 40 Voltage source [0083] 50 Continuous deposition installation [0084] 52 Contacting device [0085] 53a Contact arm [0086] 53b Contact arm [0087] 53c Contact arm [0088] 54 Contacting device carrier [0089] 60 Assembly [0090] 62 Electrical line [0091] 64 Control device [0092] 66 Bus interface [0093] 68 Data processing unit [0094] 70 Voltage supply [0095] 72 Data processing device