SPUTTERING APPARATUS FOR COATING OF 3D-OBJECTS

Abstract

An apparatus to coat at least one three-dimensional (3D) object. The apparatus includes: a coating chamber; a vacuum pump system; a chamber port; and a rotatable object holder. The holder has a rotational axis Z. At least two rotary cathodes are positioned in the chamber. Each cathode includes a hollow cylindrical rotary target having a rotary axis Y. A magnetic system is swivel or rotary mounted round axis Y and positioned neighboring to an inner diameter surface of the target. At least one power supply is provided for the target. The targets of the at least two rotary cathodes are positioned round the holder, with their axes Y1, Y2 transverse to axis Z, both being offset to the holder in a z-direction, and being offset to each other in a direction along axis Z on opposite sides of an object plane O which is vertical to axis Z.

Claims

1. An apparatus to coat at least one three-dimensional(3D-) object (8,8) by physical vapor deposition, the apparatus comprising: a coating chamber (2,2); a vacuum pump (13) system (13) connected to the chamber by a vacuum port (28); a chamber port (12); a rotatable object holder (9), the holder having a rotational axis Z; at least two rotary cathodes positioned in the chamber, the cathodes each comprising a hollow cylindrical rotary target (3,4) having a rotary axis Y; a magnetic system (6, 6) which is swivel or rotary mounted round axis Y and positioned neighboring to an inner diameter surface of the target; at least one power supply (7,7) for the target; whereat the targets (3,4) of the at least two rotary cathodes are positioned round the holder (9,9,9), with their axes Y.sub.1, Y.sub.2 transverse to axis Z, both being offset to the holder in a z-direction, and being offset to each other in a direction along axis Z on opposite sides of an object plane O which is vertical to axis Z, and the holder is movable along axis Z to position the object plane O in or near the center of a circumferential edge, protrusion, or recess of the 3D-object to be coated.

2. The apparatus according to claim 1, wherein axes Y.sub.1, Y.sub.2 of the targets are in a right angle to axis Z.

3. The apparatus according to claim 1, wherein axes Y.sub.1, Y.sub.2 of the targets are both horizontal.

4. The apparatus according to claim 1, wherein the holder is mounted on the closure of the chamber port.

5. The apparatus according to claim 1, wherein the chamber port is mounted in a bottom area of the chamber.

6. The apparatus according to claim 1, comprising at least one further rotary cathode, positioned above or below the at least two rotary cathodes.

7. The apparatus according to claim 1, comprising at least one planar magnetron, positioned above or below the at least two rotary cathodes.

8. The apparatus according to claim 1, wherein targets (3, 4) are positioned on the same side of the holder.

9. The apparatus according to claim 1, wherein targets (3, 4) are positioned on opposite sides of the holder.

10. The apparatus according to claim 1, comprising 2n targets (3, 4) whereat n is an integer.

11. The apparatus according to claim 1, wherein the at last one target (3) on one side of plane O and the at last one target (4) on the other side of plane O each have a separate power supply.

12. The apparatus according to claim 1, wherein at last one target (3) on one side of plane O and at last one target (4) positioned next on the other side of plane O is connected to a bipolar power supply in dual magnetron configuration.

13. The apparatus according to claim 1, comprising a control system (14) with a power modulator adapted to set and control the power of the at least one power supply and a magnet controller adapted to set and control movement and position of the magnetic system.

14. The apparatus according to claim 1, wherein an object axis of the at least one 3D-object corresponds to the holder axis Z.

15. A process to deposit a coating on a surface (S.sub.c,S.sub.h,S.sub.v) of at least one 3D-object using an apparatus according to claim 14 and comprising the following steps: mounting the at least one 3D-object on the holder; Transferring the holder with the 3D-object into the coating chamber; applying vacuum to the chamber by opening the vacuum port; setting a gas flow of inert gas and setting optionally a gas flow of a reactive gas; optionally applying a substrate bias to the 3D-object; connecting the targets to a power supply to sputter material from the targets towards the surface.

16. The process according to claim 15, wherein the target power P of at least one of the targets (3, 4) is synchronized by the power modulator with at least one of the following process features: a rotation angle ? of the holder round axis Z, a position angle ? of the magnetic system, a swivel frequency f of the magnetic system, an angular velocity ? of the magnetic system.

17. The process according to claim 15, wherein the magnetic systems of the targets (3,4) are swivel mounted, and the magnet controller controls the position angle ? or/and a swivel frequency f of each of the magnetic systems (6, 6) in dependency of a number m of holder turns round axis Z, where m is an integer.

18. The process according to claim 15, wherein the magnetic systems of the targets (3,4) are swivel mounted, and the magnet controller controls the position angle ? or/and a swivel frequency f of each of the magnetic systems (6, 6) in dependency of a rotation angle ? of the holder round axis Z.

19. The process according to claim 15, wherein the position angle ? of the magnetic system is set in a range from ?0? towards plane O to ?90? towards axis Z.

20. The process according to claim 15, wherein the magnetic systems are rotary mounted, and the magnet controller controls an angular velocity ? of the magnetic system in dependency of a number m of turns of the holder, where m is an integer, or in dependency of a rotation angle ? of the holder round axis Z.

21. The process according to claim 15, wherein an object to be coated has a long Z-Axis and is of a cylindric, or prismatic, or cuboid shape.

22. The process according to claim 15, wherein the object to be coated is a flat body having two horizontal axes A, B of essentially different length in a relation of 10/12 to 10/40, and a thickness in a relation of 1 to 150 to one of horizontal axes A,B.

23. A process to deposit a coating on a surface (S.sub.c,S.sub.h,S.sub.v) of at least one 3D-object comprising the following steps: Providing an apparatus comprising: a coating chamber (2,2); a vacuum pump (13) system (13) connected to the chamber by a vacuum port (28); a chamber port (12); a rotatable object holder (9), the holder having a rotational axis Z; at least one rotary cathode positioned in the chamber, the cathode comprising a hollow cylindrical rotary target (3,4) having a rotary axis Y; a magnetic system (6, 6) which is swivel or rotary mounted round axis Y and positioned neighboring to an inner diameter surface of the target; at least one power supply (7,7) for the target; the target of the rotary cathode being positioned with axis Y.sub.1, Y.sub.2 in a target plane T, T, the target plane being perpendicular to axis Z, and the rotary cathode(s) being positioned in a distance D from rotary axis Z; mounting the at least one 3D-object on the rotatable holder; Transferring the holder with the 3D-object into the coating chamber; and position at least one object plane O, O, O comprising an essentially circumferential edge, protrusion or recess in a distance to a target plane T, T to allow sputtering in an angle ?.sub.E to the edge, protrusion or recess; applying vacuum to the chamber by opening the vacuum port; setting a gas flow of an inert gas and setting optionally a gas flow of a reactive gas; optionally applying a substrate bias to the 3D-object; rotate the 3D-object; connecting the targets to a power supply to sputter material from the targets towards the surface swivel or rotate the magnetic system to sweep or position a center of a sputter cone in an angle ?.sub.x from 0? to 90? or smaller.

Description

FIGURES

[0077] The invention shall now be further exemplified with the help of figures. It should be mentioned that figures are not reproduced to scale and give a schematically view only of important aspects of the invention. Same reference numbers or signs refer to the same matter. Inverted commas and subscript numbers or signs refer to subspecies or subfeatures of the respective feature without such superscript or subscript indications. The figures show:

[0078] FIG. 1: An apparatus of the state of the art;

[0079] FIG. 2: A further apparatus of the state of the art;

[0080] FIG. 3: A further apparatus of the state of the art;

[0081] FIG. 4: A vertical section of an inventive apparatus;

[0082] FIG. 5: A horizontal section of an inventive apparatus;

[0083] FIG. 6: A horizontal section of an inventive apparatus;

[0084] FIG. 7: A further vertical section of the apparatus of FIG. 4;

[0085] FIG. 8A, B: Movement scheme of the magnetic system, vertical section;

[0086] FIG. 9A, B: Scheme of power modulation, vertical section;

[0087] FIG. 10A, B, C: Scheme of magnetic movement and power modulation, horizontal section;

[0088] FIG. 11: Graph of power modulation;

[0089] FIG. 12: Graph of position/angle modulation of the magnetic system;

[0090] FIG. 13-15B: Further embodiment of inventive apparatuses;

[0091] FIG. 16: Detail of an inventive arrangement.

[0092] With reference to FIG. 1 to 4 it is referred to the section technical background above.

[0093] In FIG. 4 a vertical section of a first embodiment of an inventive apparatus is shown. The coating apparatus 1 comprises a vacuum coating chamber 2 with vacuum pump 13 and control system 14 attached. The object 8 can be a solid object surrounded by closed surfaces in continuous lines or alternatively can be a hollow object, e.g. a type of tube or a polygonal frame and fixed with a holder 9 in an inner circumference of the object as shown in dashed lines. The frame can be a covered one-piece frame, may have a separate cover or is open on both ends.

[0094] The targets 3,4 of two rotary cathodes are placed on two opposite sides of the object holder 9 in respective distance to the surfaces of object 8 to be coated. Targets 3,4 are supplied by separate target supplies 7, which can be DC, pulsed DC, RF, high plasma ionization magnetron sputtering (HIPIMS), or mixed supplies, e.g. when DC and RF frequencies, or two RF frequencies of different frequency are superimposed. When RF, HIPIMS, or mixed supplies are used, synchronizing means will be applied to avoid harmful frequency interferences. Supply lines 7 deliver the power from the target supplies to an inner surface of the targets via dynamic pick ups. A substrate bias supply 19 can be optionally foreseen to bias the object with DC, DC-pulse or RF-frequencies which may be synchronized with the respective frequencies of the target supplies.

[0095] With the embodiment as shown, the holder is mounted on a closure 12 of the chamber port 12 in the bottom of the chamber 2. On the outer side of the chamber port an object drive 11 is mounted to rotate the object holder 9 with the object(s) during the deposition process and optionally for positioning. The vertical object axis Zo is aligned with rotation axis Z of the holder.

[0096] Within the hollow target tubes 3, 4, which are rotated during sputtering, a magnetic system 6 comprising at least two rows of permanent magnets of opposite polarity (black and white) is swivel mounted, so that during sputtering the so called racetrack which is formed between the two rows of magnets on the outer surface of the target can be varied from an angle ?.sub.x=0? in direction of horizontal plane O to an angle ?.sub.x=90? in direction of the rotation axis Z. Smaller angles from 20? to 70? may be applied for different object geometries up to the respective needs. Further details of the rotary cathodes like cooling cylinders for the inner surface of the target, details of the swivel system and drive, target drive, dark room shields and the like should be in place, but are not shown as being known state of the art and not relevant for the present invention. The same refers to gas inlets for inert sputter gas and/or reactive gas, process monitoring devices or means to enhance ionization of the sputtered particles, which may help to enhance respective thickness distribution too, however, are not a subject of the present invention. Targets 3 and 4 are arranged offset in relation to each other with reference to a Z-direction, defined by rotation axis Z of the holder 9 whereby objects 8 can be positioned by holder 9 with reference to plane O, which defines a middle, here horizontal plane between lower and upper target axes Y.sub.1, Y.sub.2 respectively between target position U and U. Where U is the uppermost outer diameter position of the lower target 3 and U is the lowest outer diameter position of the upper target 4. The holder 9 can be rotated for deposition by holder drive 10 and be moved along axis Z by holder lifter 20 which acts on telescopic post 10 to move the holder respectively.

[0097] Furthermore, devices to promote ionization of the sputtered atoms, or heating and/or cooling devices, or etching devices (not shown) can be foreseen within the chamber, e.g. if the sputter deposition process should comprise also conditioning steps like degassing, etching, heating, and/or cooling, in front or behind the sputter deposition step within the same chamber. However, as a bottom loading sputter chamber as shown can be mounted, e.g. above an object handling level of a multi-chamber processing system, which comprises further processing modules, features relevant to sputtering and uniformity of the deposited coatings are in the focus of the further explanations.

[0098] FIG. 5 shows a scheme of a horizontal section of an inventive apparatus as shown in FIG. 4, with the upper target 4 having a stripped pattern and the object has a cylindrical shape.

[0099] Similarly, FIG. 6 shows a horizontal section, however this section comprises four rotating targets arranged in the chamber 2 regularly arranged round a hollow object 8 which has the shape of a regular equilateral hexagon. Two targets are positioned above and two targets are positioned below object plane O, on different sides but in equal distance to S. Therewith a faster deposition rate can be attained than with the two cathode arrangement in FIG. 4 an 5. Similar target arrangements with 6 or any further 2n target arrangement, with n being an integer 1, can be build for 3D-objects with respective big diameters in coating chambers of respective big dimensions, whereby upper and lower targets can be arranged alternatively round the holder, respectively object perimeter. Furthermore FIG. 6 shows a central cylinder of diameter D in tangential touch with the outer target diameters. In this case diameter D encompasses perimeter and inner diameter of hexagonal prisme 8 in a distance, which is a good option to attain a very uniform coating also on the sidewall surfaces for elongated 3D-objects.

[0100] With a configuration as shown in FIGS. 4 to 6 angel ?.sub.x of the magnetic system can be varied between 0? and 90? or in a smaller opening angle to sweep over all surfaces of the 3D-object to be coated. The surface of the 3D-object comprises side surfaces S.sub.v, in parallel to axis Z, surfaces S.sub.h in an angle to axis Z, here in parallel and in planes O or O, and convex surfaces S.sub.c in a transition area between surface S.sub.v and S.sub.h. Angular velocity of the swiveling magnetic system can be varied to optimize respective deposition variance to a minimum for all object surfaces as mentioned above.

[0101] Alternatively, instead of sweeping through the complete angle sector between 0 and 90?, the magnetic system may be stepwise positioned in different angular positions which may be in the case of FIG. 4 30?, 45?, 70? and 85? degree. At each position sputtering is performed during at least one or a multitude of 360? rotations of the 3D-object, while sputterpower can be varied according to the geometric diameter of the respective substrate plane Oz to which the center of the sputter cone is directed.

[0102] As an example, for coating of short cylindric, or prismatic objects having a relatively short dimension z and surface S.sub.v compared to a relatively big dimension d and surface S.sub.h of a diameter of the cylinder (as shown in FIGS. 4 and 5), or of an inscribed diameter of a regular equilateral prism (as shown in FIG. 6 with a hexagon base), dwell time of the magnetic system within an angle area for ?.sub.x between 0? and about 45? can be chosen to be shorter than dwell time in an angle area for ?.sub.x between about 45? and 90? depending on the positioning of the target axes Y.sub.1, Y.sub.2 towards the respective edge of the 3D object, see also following paragraphs. On the other hand, in case of elongated 3D objects having a relatively long dimension z and respectively long or high surface S.sub.v and a relatively small dimension d and surface S.sub.h f respective dwell times can be inversed. In other words coating times, here dwell times t.sub.v, t.sub.h and power intensities P.sub.v, P.sub.h of the target supplies can be chosen proportional to the respective geometric surface proportions S.sub.v, S.sub.h of the 3D object(s), e.g.

(t.sub.v?P.sub.v)/(t.sub.h?P.sub.h)=k??(S.sub.v)/Z(S.sub.h)

where k is a constant which would be 2 in case of a cubic object or in case of a cylinder of equal height and diameter. As above, sputter dwell time can be the time a certain surface area is exposed to the sweeping sputter cone or the number of object rotations the respective surface is exposed to a sputter cone of a temporarily stationary sputter cone.

[0103] Therewith angular velocity ? of the magnetic system, which is in inverse ratio to the dwell time and defines respective angle ?.sub.x of the position of the racetrack and resulting sputter cone, as well as step by step positioning can be used to define and optimize the coating thickness as well as other coating parameters separately for respective surfaces S.sub.h, S.sub.v. With reference to surface S.sub.c, in case of FIG. 4 to 6, a convex surface at the edge of the 3D object, special measurements can be taken and angular velocity can be set to a value ?.sub.n, which can be e.g. between the higher angular velocity ?.sub.2 used for the coating of the smaller object sides in an average distance from the target which is closer to the active target surface (the race track), here sidewalls with dimensions z, and a lower angular velocity col set for the object dimension d in an average distance from the target which is further away from the active target surface, here the surfaces in plane O or S, or upper and lower surfaces.

[0104] As mentioned above the same effect can be produced by stopping the magnetic system in defined angular positions to perform sputtering for at least one 360? turn of the object holder. Varying distances between the racetrack on the target surface and the object surface in the respective object plane O.sub.x which arise due to deviations from a cylindric shape at or near the respective object plane can then be compensated by power modulations, e.g. applying a lower power for surfaces passing the race track in a closer distance and applying a higher power for surfaces passing the racetrack in distance further away, see also FIG. 10A to B.

[0105] As an example for cylindric objects, targets can be aligned with an alignment mechanism 21 symbolized by a pair of x/z double arrows (only shown with axis Y.sub.2) so that the magnetic systems can be positioned, e.g. in such a way, that ?.sub.x is in line with the angle bisector line BL, which divides surface edge section S.sub.c in two subsectors I, II, when the sputter cone of targets 3, respectively 4 is directed towards the respective circumferential edge of the 3D object. In case of the cylinder in FIGS. 4 and 5 as shown, as well as with the hexagonal prism in FIG. 6, or any prism or cuboid of similar basis dimensions a and b the angle bisector line is 45? and so is ?.sub.x when opposed to the center of the convex edge. Similar hereby means with the example of a rectangular base with sides a, b (in an x,y-plane): a/b<1.5 and b a. The angular velocity con can be set to a constant value between ?.sub.1 and cot for the time when it sweeps across the convex area or be shifted, e.g. continuously between ?.sub.1 and ?.sub.2. In case of a continuously shifting con a slightly higher target power might be applied for the sector where average angular velocity {tilde over (?)} is higher to achieve the same thickness in both sectors so that {tilde over (?)}.sub.I/P.sub.I={tilde over (?)}.sub.II/P.sub.II.

[0106] In case of similar surface and geometric relations, as with cubes, or cuboids of similar side dimension, cylinders of similar height and diameter or regular prisms of similar height and lateral dimensions a constant power P can be used to sweep continuously or stepwise over the vertical respectively horizontal surfaces of the 3D object during the coating process.

[0107] FIG. 7 shows a further vertical section of an apparatus according to FIG. 4, having mounted a flat cuboid substrate of dimensions a, b in the x,y-plane and c in z-direction, whereby a/b?1.5, to demonstrate the benefit of the inventive apparatus with reference to coating processes for 3D-objects having very different geometric dimensions, here c<<b<a, e.g. in a relation 1/10/20.

[0108] In a further embodiment of the invention a flat 3D-object 8 can be positioned and rotated in a central object plane O overlapping with the targets in a Z-projection as shown in in FIG. 7. This means that the longer horizontal object side of dimension a is longer than the horizontal distance t.sub.hd between inner diameter positions U.sub.v and U.sub.v of the offset (lower and upper) targets 3, 4. However at the same time targets 3, 4 should be aligned symmetrically in target planes T, T by alignment mechanism 21, such that the mounted 3D-object does not overlap in Z-projection with target axes Y.sub.1, Y.sub.2, even when it is rotated by the holder so that its maximum dimension are positioned between the axes, e.g in a diagonal position as shown in the horizontal section of FIG. 10c. To allow an optimal thickness distribution on side surfaces S.sub.v even in edge areas neighbouring the racetrack in such a so called maximum positions of the 3D-object (e.g. with diagonal edges in front of the targets as in FIG. 10C), a projected distance of at least 25 to 100 mm between axes Y.sub.1, Y.sub.2 and the outermost edge of the object should be maintained. That is for a diagonal dimension d1 as present d1=(a.sup.2+b.sup.2).sup.1/2 and (t.sub.ha?d1)/2?5 or 5?30 mm. The actual minimum distance depends on the size of the target diameter d.sub.t and the dimension z of the body 8 to be coated, as it should be avoided that side surfaces S.sub.v, which can be in parallel to axis Z or at least in part convex as shown, can be coated only by a grazing particle beam of the sputter cone 16, in parallel to surface S.sub.v to be coated. It should be mentioned that even a sputter cone of a magnetic system 6 in ?=0? position, that is in parallel to Z-direction and a respective planar surface S.sub.v can coat a respective surface by sputtered particles flying in an angle to ?. Such effects can be enforced by already known processes using additional ionization of the sputtered particles, e.g. HIPIMS-processes, and the application of a substrate bias.

[0109] To introduce and position the 3D-object into the coating chamber 2 it is first put on the object holder with its long horizontal side a in parallel to target axes Y.sub.1, Y.sub.2 and the chamber port 12 closed in the following, double arrows here showing movement directions of the closure 12. In this position object 8 and substrate holder 9 are shown in dashed double dotted lines at the bottom of the chamber. Thereafter the holder lifts the object along axis Z into a respective parallel position in the object plane O as shown with reference numbers 8 for the object and 9 for the holder. The vertical object axis Zo is aligned with rotation axis Z of the holder. Only than rotation can be initiated to bring the object into different coating positions whereat ?=0 in a parallel position as shown in dash-dotted lines, whereas reference number 8 here shows the substrate in solid lines in an ?=90? position, see also FIG. 10A-C.

[0110] To align the sputter cathodes and thereby targets 3, 4 also in a vertical direction to 3D-objects of different dimension z at least the upper electrode 4 can be moved also in a Z-direction as symbolized by the vertical double arrows of the alignment mechanism 21 for target axis Y.sub.2.

[0111] In FIG. 7 the power supply is a bipolar pulsed power supply 7 being configured as a dual magnetron supply, thereby connecting electrically outputs of different polarity with the inputs of targets 3 and 4, which during sputtering act alternatingly as cathode and anode. Despite of the fact that separate power supplies could be used also with the configuration in FIG. 7, a bipolar configuration has benefits when reactive gases are used which otherwise might tend to poison certain target surfaces. Poisoning here means to make the target surface electrically isolating by chemical reaction with the reactive gas. Therefore, respective dual magnetron configurations using a bipolar pulsed power supply 7 might be used for any embodiment when respective reactive gases like oxygen or nitrogen should be used. Such reactive gases can be supplied by a separate reactive gas inlet 27 or together with the sputter gas via obligatory inert gas inlet 26.

[0112] FIGS. 8A and 8B show a vertical section of a movement and positioning scheme of the magnetic system during a deposition process, showing in FIG. 8A a ?-position of the magnetic systems 6 and the respective sputter cone 16 whereby side surfaces S.sub.v of the short object side b, which is in parallel to the target axes Y.sub.1, Y.sub.2, can be coated while the object is in an ?=90? position according to horizontal section scheme in FIG. 10B. Depending on the actual substrate dimensions ?-values from 30? to 85?, or 45? to 80? might be applied. Higher ?-values from 85? to 90? may be used for a maximum position where a maximal, e.g. a horizontal dimension in an object plane O.sub.x is positioned between the projection of target axes Y.sub.1, Y.sub.2, on plane O or O.sub.x. In case of a cuboid with a rectangular basis a, b the maximum dimension is a diagonal with dimension d1 as shown above and in horizontal section FIG. 10C.

[0113] With FIG. 8B a ?-position is shown which allows to coat surface areas S.sub.h in planes O an O, here upper and lower surface areas, while the object is in an ?=0? position with the long side a in parallel to the target axes Y.sub.1, Y.sub.2, in accordance with horizontal section in FIG. 10A. Depending on the actual substrate dimensions ?-values from 40? to 90?, or 45? to 80? might be applied.

[0114] For simple rotational geometries as discussed above and moderate substrate rotation speeds swiveling of the magnetic system may be synchronized with the rotation of the substrate holder and the respective circumferential geometry of the object(s) on the holder, so that the sputter cone follow at least approximately the respective surface area to be coated. Such a swivel curve showing the dependency of position angle ? from object rotation angle ? is shown in FIG. 12. In this case however for medium and near distance positions of the substrate side surfaces S.sub.v, see FIGS. 10B and 10C, the same position is used to avoid to many reverse turns of the magnetic system.

[0115] In case of higher substrate rotation, e.g. equal or higher 0.2 or 0.5 rounds per second however, due to the inertia of the magnetic system another principle should be applied to avoid mechanical overload of the system. Therefore, as mentioned above, the magnet is swiveled to a defined ?-position and stationary hold at the position for a certain number of substrate rotations and then moved to at least one, but usually to further, e.g. 3 to 6 different ?-positions to produce a good coating distribution on the 3D-object. It has to be noted that different ?-positions may be applied with the same of different coating time, i.e. same or different number of rotations, depending on the geometric details of the object.

[0116] FIGS. 9A and 9B show similar vertical schemes as in FIGS. 8A and 8B, however directed to the power modulation during substrate rotation of a cuboid object. In contrast to FIGS. 8A and 8B a magnetic system comprising three lines of alternatively opposite magnetic orientation, thereby two parallel racetracks and a respective broader overlapping sputter cone can be produced allowing to use a smaller over all position angle, but at the same time loosing adjustment precision of the cone.

[0117] With FIG. 9A again an ?=90? position of the 3D-object is shown according to horizontal scheme in FIG. 10B. As the object, here with its smaller side b, is in a medium position compared to the far distance position in FIG. 10A and the near distance position in FIG. 10C, a medium target power can be applied.

[0118] With FIG. 9B again an ?=0? position of the 3D-object is shown according to horizontal scheme in FIG. 10A, which is a far position. Therefore, a high power is applied to the targets. In FIG. 10C a respective near distance position is shown with a low target power applied.

[0119] A complete power curve which can be used to synchronize the power of targets 3, 4 with the rotation angle ? of a cuboid 3D-object is shown in FIG. 11, showing different target power in dependency of the, in this case symmetric object geometry having near distance or diagonal edge positions at 64?, 116?, 244?, 296, whereas there are only two medium and two far distance positions referring to the respective parallel edge positions as shown in FIGS. 10A and 10B. Alternative curves, e.g. in sinus or cosinus type modulation could be applied obviously too.

[0120] As could be shown hereby power synchronization can be more easily applied and more finely tuned to any object geometry, compare also curves of FIG. 11 and FIG. 12, or alternatives with fixed ?-position for one or several object rotations as discussed above.

[0121] The coating chamber in FIG. 13 has the same geometry and target arrangement as coating chambers shown in FIGS. 4 and 7, however a 3D-object 8 of different, more complex geometry, which is asymmetric with reference to the object plane O, is mounted to the pedestal type holder 9. The object comprising a cuboid middle body 8B, a higher but smaller upper cuboid part 8A, and a flat and smaller lower cuboid part 8C. A horizontal scheme of the body mounted in parallel 8 (dash double dotted lines) and in a 90? rotated position 8 (solid lines) to the targets 3, 4 can be seen in FIG. 14. In such a constellation, magnetic systems 6 can be pivoted with different angular velocity and/or can be set to different ? angels during the deposition process to provide a uniform coating distribution. Alternatively, or in addition targets 3, 4 can be driven with different power modulation curves from their dedicated power supplies 7. Furthermore FIG. 13 displays an angel ?.sub.E directed directly to the edge of the 3D-object. Thereby it can be seen that there will be a second, different ?.sub.E for the upper magnetic mechanism 6 when it swivels to the upper edge of the present 3D-object 8 which leeds to the terminal surface of sector 8A. With targets 3, 4 in dotted lines a coating chamber is shown comprising two pairs of targets 3, 4 if a higher coating speed should be envisaged. Such target pairs with targets 3, 4 positioned on the same side of the holder, i.e. on the same side of the holder axis Z, can be used for any configuration, for instance with FIG. 4 or 13 with targets 3, 4 on the same side of the holder only, instead of the opposed target position as shown, to have the coating chamber and vacuum volume as small as possible. Or as a further example analog to FIG. 4 but with respective superposed target pairs 3, 4 in the position of the single targets 3, 4 as shown, when a high-rate deposition and/or higher coating thicknesses should be sought. Respective target pairs with targets 3, 4 positioned on the same side of the holder can be also foreseen with FIG. 8 to 10 and FIG. 15A, 15B.

[0122] FIGS. 15A and B show further embodiments of the present invention which can be applied for elongated 3D objects 8 which may be cylindric, prismatic or of any other shape. The object 8 in FIG. 15A comprises one pronounced circumferential protrusion 8 in a central object plane O, whereas the object 8, respectively the objects, as symbolized by dashed reference and separation line between the objects 8, in FIG. 15B has respectively have two protrusions 8 in planes O.sub.x in lateral regions. Symmetrically to the respective protrusions 8 rotary targets 3 and 4 are mounted according to one of the embodiments as discussed above. Additionally, further rotary targets 5 are mounted as shown in FIG. 15A above respectively below the edge region to provide a uniform coating there and on the terminal surfaces S.sub.h traverse to axis Z. In FIG. 15B a further planar sputter target 5 is mounted to provide a uniform coating on the long shaft between the two object protrusions 8. In both figures the vertical object axis Zo again is aligned with rotation axis Z of the holder.

[0123] FIG. 16 shows a target arrangement which could be used for all inventive embodiments, using instead of one swivel mounted magnetic system 6 per target, four rotating magnetic systems 6 each offset by 90? from the next system with reference to the inner target diameter. All magnetic systems 6 rotate clockwise at the same rotational speed against the rotation of the rotating target 3, 4, 5, round target axis Y. The respective four magnetic system configuration ensures that plasma never extinguishes in the active quarter of the rotating cathode where the target surface lies open, whereas the rest of the surface is covered with a dark room shield 23, which can be set on ground potential to provide the anode of the rotary cathode, or alternatively is electrically isolated and on floating potential.

[0124] When using a wider angle of the dark room shield aperture 24 a system with three or two equidistantly positioned magnetic systems would suffice, e.g. for an aperture of 120? respectively 180?. Otherwise for less productive systems even one rotating system 6 may suffice and plasma is reignited each time the magnetic system starts to pass under the open target surface in the aperture area.

[0125] At the same time when the magnetic system 6 passes under the aperture 24 power may be modulated according to power graph 25 as shown in the dash dotted curve above the respective target surface. Therewith power can be set low when the magnetic system passes or stands in a ?.sub.x position of about 45?, opposite to the near surface area S.sub.c of a circumferential edge, protrusion or similar of the rotated 3D-object 8. Therewith the particle flow as symbolized by short arrow 15 will be smaller than inside surface areas S.sub.h, S.sub.v further away from the target surface when the racetrack passes an angle of about 30? or 60?, which is symbolized by longer particle flow arrows 15. Therewith a more uniform coating distribution between edge or protrusion areas and side areas of the 3D-object can be reached and even small differences or asymmetries in edge convexity as exemplarily shown in dash double dotted lines can be taken into account.

[0126] Respective power curves as shown and discussed at the hand of FIG. 16 can be also applied and adapted to swivel mounted targets of the same or different swivel range. So can darkroom shields be used with all types of rotary cathodes to better define the counter electrode.

[0127] Finally, it should be mentioned that a combination of features mentioned with one embodiment, examples or types of the present invention can be combined with any other embodiment, example, or type of the invention unless being obviously in contradiction.

[0128] Several tests and experiments have been performed with a Solaris S115 multi-chamber system from Evatec AG, one process chamber having been adapted with two cathodes using targets of the same target material for one deposition process. Chamber volume was about 60 liters, targets of 300 mm length and an outer diameter from 105 to 110 mm have been used. The targets could be aligned in a horizontal plane towards axis Z according to the respective substrate dimensions, the upper target could be aligned also in a z-direction. Preprocessing steps (degassing, etching, adhesion layer) have been performed in separate chambers when necessary. 3D-objects of cylindric or cuboid shape of the following dimensions have been coated: [0129] Cylindric shape: Diameter from 50 to 200 mm, height from 5 to 20 mm each having one circumferential protrusion from 5 to 20 mm projecting from the sidewall(s) of the 3D-object, or at least one circumferential convex edge between vertical sidewall(s) and horizontal terminal surfaces have been foreseen. Edge radius for the convex edge was 3, 8, and 15 mm. Protrusions had a square or a convex semi-circular shape. [0130] Cuboid shape: base dimensions a/b from 1 to 3, with side a varying from 50 to 200 mm, height from 5 to 20 mm; protrusions respectively edges as mentioned with cylinder. [0131] As target material aluminum, chromium, titanium has been used in inert and reactive gas atmosphere. Respective process parameters are shown in table 1 below. [0132] Coating uniformities between 5 to 15 percent could be achieved for all surfaces of the 3D-body. Even better uniformities could be reached for sidewall and convex edge, respectively protrusion surfaces alone.

TABLE-US-00001 TABLE 1 Process parameters: Example Unit Range 1 Range 2 Range 3 Argon gas flow: 8 sccm 0-60 0-140 0-12 Nitrogen gas flow: 16 sccm 10-120 0-100 0-25 Chuck gas flow: 3 sccm 0-20 no 2-6 Chuck gas pressure: 4 mbar 0-20 no 3-8 Process gas 3.00E?03 mbar 5e?2-5e?4 5e?2-5e?4 1e?3-5e?3 pressure: pulsed DC power 1000 W 100-10000 100-10000 400-1600 Al, Cr, Ti Target object 45 mm 10-80 40-50 distance:

REFERENCE NUMBERS

[0133] 1,1 sputtering apparatus [0134] 2,2 coating chamber [0135] 3 lower rotary target [0136] 4 upper rotary target [0137] 5 target [0138] 5 further rotary target [0139] 6 swivel mounted magnetic system [0140] 6 rotatable mounted magnetic system [0141] 7 power supply [0142] 7 bipolar pulsed power supply [0143] 8 3D object [0144] 8 3D object in load position [0145] 8 protrusion [0146] 8 recess [0147] 9,9,9 object holder (pedestal type, internal, screwed, . . . ) [0148] 10 holder post [0149] 11 holder drive [0150] 12 chamber port [0151] 12 closure of the chamber port [0152] 13 pumping system [0153] 14 control system [0154] 15 particle flow (symbolized) [0155] 16 plasma cone (symbolized) [0156] 17 carrousel [0157] 18 inner circumference of a hollow object [0158] 19 bias supply (DC, RF) [0159] 20 holder lifter for holder movement in Z-direction [0160] 21 alignment mechanism for target axis [0161] 22 inscribed diameter [0162] 23 darkroom shield [0163] 24 aperture [0164] 25 power graph [0165] 26 inlet inert gas [0166] 27 inlet reactive gas [0167] 28 vacuum or pumping port [0168] ? angel of the holder/object rotation (0? and 180?=parallel to targets); [0169] ?, ?.sub.x position angel of the magnetic system ?.sub.x=0? when in parallel to axis Z; ?.sub.x=90? when vertical to axis Z); [0170] ?.sub.E ?.sub.x when directed directly to the edge protrusion, recess [0171] ? angular velocity of angle ? [0172] BL angle bisector line of object edge [0173] O.sub.x object plane [0174] O object plane (see definition); [0175] O first terminal (lower) object plane [0176] O second terminal (upper) object plane [0177] P sputter power [0178] S.sub.c convex surface comprising sub sectors I and II [0179] S.sub.h surface in parallel ?45?, preferably ?30? deviation to object plane, e.g. in O, O; [0180] S.sub.v surface in a right angle ?45? to O, preferably ?30? deviation from right angle to object plane; [0181] Y.sub.1,2 target axis [0182] Z holder axis=object axis [0183] Z carrousel axis [0184] Z satellite axis [0185] .Math. movement arrows, magnetic system, target axis, substrate holder.