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SUPPORT GLASS SUBSTRATE AND LAMINATED SUBSTRATE USING SAME

20230212061 · 2023-07-06

    Inventors

    Cpc classification

    International classification

    Abstract

    A support glass substrate of the present invention is a support glass substrate for supporting a substrate to be processed, the support glass substrate including lithium aluminosilicate-based glass, having a content of Li.sub.2O of from 0.02 mol % to 25 mol % in a glass composition, and having an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 160×10.sup.−7/° C. or less.

    Claims

    1. A support glass substrate for supporting a substrate to be processed, the support glass substrate comprising lithium aluminosilicate-based glass, having a content of Li.sub.2O of from 0.02 mol % to 25 mol % in a glass composition, and having an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 160×10.sup.−7/° C. or less.

    2. The support glass substrate for supporting a substrate to be processed according to claim 1, wherein the support glass substrate comprises as the glass composition, in terms of mol %, 50% to 80% of SiO.sub.2, 4% to 25% of Al.sub.2O.sub.3, 0% to 16% of B.sub.2O.sub.3, 0.9% to 15% of Li.sub.2O, more than 0% to 21% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 10% of MgO, 0% to 10% of ZnO, and 0% to 15% of P.sub.2O.sub.5.

    3. The support glass substrate according to claim 1, wherein the support glass substrate satisfies the following relationship: a molar ratio ([Na.sub.2O]—[Li.sub.2O])/([Al.sub.2O.sub.3]+[B.sub.2O.sub.3]+[P.sub.2O.sub.5])≤1.50.

    4. The support glass substrate according to claim 1, wherein the support glass substrate satisfies the following relationship: a molar ratio ([B.sub.2O.sub.3]+[Na.sub.2O]—[P.sub.2O.sub.5])/([Al.sub.2O.sub.3]+[Li.sub.2O])≥0.001.

    5. The support glass substrate according to claim 1, wherein the support glass substrate comprises 12 mol % or more of ([Li.sub.2O]+[Na.sub.2O]+[K.sub.2O]), and satisfies the following relationship: [SiO.sub.2]+1.2×[P.sub.2O.sub.5]-3×[Al.sub.2O.sub.3]-2×[Li.sub.2O]-1.5×[Na.sub.2O]—[K.sub.2O]—[B.sub.2O.sub.3]≥−40%.

    6. The support glass substrate according to claim 1, wherein the support glass substrate has a temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s of less than 1,660° C.

    7. The support glass substrate according to claim 1, wherein the support glass substrate comprises overflow-merged surfaces in a middle portion thereof in a sheet thickness direction.

    8. The support glass substrate according to claim 1, wherein the support glass substrate has a mass loss of 100.0 mg/cm.sup.2 or less per unit surface area when immersed in a 5 mass % HCl aqueous solution warmed to 80° C. for 24 hours.

    9. The support glass substrate according to claim 1, wherein the support glass substrate has a mass loss of 5.0 mg/cm.sup.2 or less per unit surface area when immersed in a 5 mass % NaOH aqueous solution warmed to 80° C. for 6 hours.

    10. The support glass substrate according to claim 1, wherein the support glass substrate comprises a compressive stress layer in a glass surface thereof.

    11. A support glass substrate, comprising a compressive stress layer in a glass surface thereof and comprising as a glass composition, in terms of mol %, 50% to 80% of SiO.sub.2, 4% to 25% of Al.sub.2O.sub.3, 0% to 16% of B.sub.2O.sub.3, 0.9% to 15% of Li.sub.2O, more than 0% to 21% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 10% of MgO, 0% to 10% of ZnO, and 0% to 15% of P.sub.2O.sub.5.

    12. The support glass substrate according to claim 10, wherein the compressive stress layer has a compressive stress value of from 165 MPa to 1,000 MPa on an outermost surface.

    13. The support glass substrate according to claim 10, wherein the compressive stress layer has a depth of layer of from 50 μm to 200 μm.

    14. The support glass substrate according to claim 1, wherein the support glass substrate comprises a compressive stress layer in a glass surface thereof, comprises, as the glass composition, 17 mol % or more of Al.sub.2O.sub.3, 1 mol % or more of P.sub.2O.sub.5, and 12 mol % or more of ([Li.sub.2O]+[Na.sub.2O]+[K.sub.2O]), and satisfies the following relationship: [SiO.sub.2]+1.2 [P.sub.2O.sub.5]-3×[Al.sub.2O.sub.3]-2×[Li.sub.2O]-1.5×[Na.sub.2O]—[K.sub.2O]—[B.sub.2O.sub.3]≥−20 mol %.

    15. The support glass substrate according to claim 10, wherein the support glass substrate has a stress profile having at least a first peak, a second peak, a first bottom, and a second bottom in a thickness direction.

    16. The support glass substrate according to claim 1, wherein the support glass substrate has a wafer shape or a substantially disc shape having a diameter of from 100 mm to 500 mm, has a sheet thickness of less than 2.0 mm, has a total thickness variation (TTV) of 5 μm or less, and has a warpage level of 60 μm or less.

    17. The support glass substrate according to claim 1, wherein the support glass substrate has a substantially rectangular shape of □200 mm or more, has a sheet thickness of 1.0 mm or more, and has a total thickness variation (TTV) of 30 μm or less.

    18. The support glass substrate according to claim 17, wherein the support glass substrate has a corner angle of from 89.0° to 91.0° when seen from above.

    19. The support glass substrate according to claim 1, wherein the support glass substrate comprises a positioning portion in an outer peripheral portion thereof.

    20. The support glass substrate according to claim 19, wherein the positioning portion has any one of a notch structure, a chamfer structure, and a cutout structure.

    21. A laminate, comprising at least a substrate to be processed and a support glass substrate for supporting the substrate to be processed, wherein the support glass substrate is the support glass substrate according to claim 1.

    22. The laminate according to claim 21, wherein the substrate to be processed comprises at least a semiconductor chip molded with a sealing material.

    23. A method of manufacturing a semiconductor package, comprising the steps of: preparing a laminate comprising at least a substrate to be processed and a support glass substrate for supporting the substrate to be processed; and subjecting the substrate to be processed to processing treatment, wherein the support glass substrate is the support glass substrate according to claim 1.

    24. The method of manufacturing a semiconductor package according to claim 23, wherein the step of subjecting the substrate to be processed to processing treatment comprises arranging wiring on one surface of the substrate to be processed.

    25. The method of manufacturing a semiconductor package according to claim 23, wherein the step of subjecting the substrate to be processed to processing treatment comprises forming a solder bump on one surface of the substrate to be processed.

    26. A glass substrate, comprising as a glass composition, in terms of mol %, 50% to 65% of SiO.sub.2, 8% to 25% of Al.sub.2O.sub.3, 0% to 10% of B.sub.2O.sub.3, 5.1% to 20% of Li.sub.2O, more than 10% to 16.1% of Na.sub.2O, 0% to 15% of K.sub.2O, 0.01% to 3% of MgO, 0% to 10% of CaO, and 0.01% to 10% of ZrO.sub.2, and having a Young's modulus of 80 GPa or more.

    27. A glass substrate, comprising as a glass composition, in terms of mol %, 50% to 65% of SiO.sub.2, 8% to 18% of Al.sub.2O.sub.3, 0% to 10% of B.sub.2O.sub.3, 20% to 25% of Li.sub.2O, 0.01% to 10% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 10% of MgO, 0.01% to 10% of CaO, and 0% to 10% of ZrO.sub.2, having a Young's modulus of 85 GPa or more, and having a fracture toughness K.sub.1C of 0.80 MPa.Math.m.sup.0.5 or more.

    28. A glass substrate, comprising as a glass composition, in terms of mol %, 64% to 76% of SiO.sub.2, 4% to 15% of Al.sub.2O.sub.3, 4% to 16% of B.sub.2O.sub.3, 0.1% to 14% of Li.sub.2O, 0.01% to 14% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 7% of MgO, 0% to 7% of CaO, 0% to 7% of SrO, 0% to 7% of BaO, and 0% to 10% of ZrO.sub.2, having a Young's modulus of 60 GPa or more, and having an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 85×10.sup.−7/° C. or less.

    29. The glass substrate according to claim 28, wherein the glass substrate comprises as the glass composition, in terms of mol %, 0.01% to 7% of MgO and 0.01% to 7% of CaO.

    30. The glass substrate according to claim 28, wherein the glass substrate comprises as the glass composition, in terms of mol %, 0.01% to 7% of SrO.

    31. The glass substrate according to claim 28, wherein the glass substrate comprises as the glass composition, in terms of mol %, 0.01% to 7% of MgO, 0.01% to 7% of CaO, and 0.01% to 7% of SrO.

    32. The glass substrate according to claim 28, wherein the glass substrate comprises as the glass composition, in terms of mol %, 1.5% to 8.5% of Li.sub.2O, 0.01% to 7% of MgO, 0.01% to 7% of CaO, and 0.01% to 7% of SrO.

    Description

    BRIEF DESCRIPTION OF DRAWINGS

    [0043] FIG. 1 is a conceptual perspective view for illustrating an example of a laminated substrate of the present invention.

    [0044] FIG. 2 are conceptual sectional views for illustrating a manufacturing process for a fan-out type WLP.

    [0045] FIG. 3 are conceptual sectional views for illustrating a step of thinning a substrate to be processed through use of a support glass substrate as a backgrind substrate.

    [0046] FIG. 4 is an explanatory view for illustrating an example of a stress profile having a first peak, a second peak, a first bottom, and a second bottom.

    [0047] FIG. 5 is another explanatory view for illustrating an example of a stress profile having a first peak, a second peak, a first bottom, and a second bottom.

    DESCRIPTION OF EMBODIMENTS

    [0048] A support glass substrate of the present invention comprises lithium aluminosilicate-based glass and has a content of Li.sub.2O of from 0.02 mol % to 25 mol % in a glass composition. Li.sub.2O is a component that reduces a viscosity at high temperature to improve meltability and formability, and is also a component that increases a Young's modulus and a fracture toughness K.sub.10. In addition, Li.sub.2O is a component required for increasing a thermal expansion coefficient. Further, Li.sub.2O is an ion exchange component, and is particularly an essential component for obtaining a large depth of layer through ion exchange between a Li ion in the glass and a Na ion in a molten salt. Meanwhile, when the content of Li.sub.2O is too large, the devitrification property of the glass is increased, with the result that it becomes difficult to obtain transparent glass. In addition, a manufacturing cost also rises. Accordingly, a suitable lower limit of the content range of Li.sub.2O is 0.02 mol % or more, 0.03 mol % or more, 0.04 mol % or more, 0.05 mol % or more, 0.1 mol % or more, 0.2 mol % or more, 0.3 mol % or more, 0.4 mol % or more, 0.5 mol % or more, 0.9 mol % or more, 1 mol % or more, 1.5 mol % or more, 2 mol % or more, 3 mol % or more, 4 mol % or more, 4.5 mol % or more, 4.9 mol % or more, 5 mol % or more, 5.1 mol % or more, 5.2 mol % or more, 5.5 mol % or more, 6.5 mol % or more, 7 mol % or more, 7.3 mol % or more, 7.5 mol % or more, or 7.8 mol % or more, particularly 8 mol % or more. When the Young's modulus or the fracture toughness K.sub.1C is preferentially increased, the content of Li.sub.2O is 15% or more, particularly 20% or more. Accordingly, a suitable upper limit of the content range of Li.sub.2O is 25 mol % or less, 24 mol % or less, 23 mol % or less, 22 mol % or less, 21 mol % or less, 20.5 mol % or less, 20.1 mol % or less, 20 mol % or less, 19.9 mol % or less, 19.8 mol % or less, 19 mol % or less, 18 mol % or less, 17 mol % or less, 16 mol % or less, 15 mol % or less, 13 mol % or less, 12 mol % or less, 11.5 mol % or less, 11 mol % or less, 10.5 mol % or less, less than 10 mol %, 9.9 mol % or less, 9 mol % or less, or 8.9 mol % or less, particularly 8.5% or less.

    [0049] It is preferred to restrict the thermal expansion coefficient of the support glass substrate so as to match with the thermal expansion coefficient of a substrate to be processed. Specifically, when the ratio of a semiconductor chip is low and the ratio of a sealing material is high in the substrate to be processed, it is preferred to increase the thermal expansion coefficient of the support glass substrate. In contrast, when the ratio of the semiconductor chip is high and the ratio of the sealing material is low in the substrate to be processed, it is preferred to reduce the thermal expansion coefficient of the support glass substrate. Accordingly, the average linear thermal expansion coefficient of the support glass substrate within the temperature range of from 30° C. to 380° C. is preferably 38×10.sup.−7/° C. or more and 160×10.sup.−7/° C. or less, more preferably 45×10.sup.−7/° C. or more and 155×10.sup.−7/° C. or less, 50×10.sup.−7/° C. or more and 150×10.sup.−7/° C. or less, 55×10.sup.−7/° C. or more and 140×10.sup.−7/° C. or less, 60×10.sup.−7/° C. or more and 130×10.sup.−7/° C. or less, 65×10.sup.−7/° C. or more and 120×10.sup.−7/° C. or less, 65×10.sup.−7/° C. or more and 110×10.sup.−7/° C. or less, 70×10.sup.−7/° C. or more and 105×10.sup.−7/° C. or less, 75×10.sup.−7/° C. or more and 100×10.sup.−7/° C. or less, 80×10.sup.−7/° C. or more and 99×10.sup.−7/° C. or less, or 85×10.sup.−7/° C. or more and 98×10.sup.−7/° C. or less, particularly preferably 87×10.sup.−7/° C. or more and 96×10.sup.−7/° C. or less. The “thermal expansion coefficient within the temperature range of from 30° C. to 380° C.” refers to a value measured for an average thermal expansion coefficient with a dilatometer.

    [0050] It is preferred that the support glass substrate of the present invention comprise as the glass composition, in terms of mol %, 50% to 80% of SiO.sub.2, 4% to 25% of Al.sub.2O.sub.3, 0% to 16% of B.sub.2O.sub.3, 0.9% to 15% of Li.sub.2O, more than 0% to 21% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 10% of MgO, 0% to 10% of ZnO, and 0% to 15% of P.sub.2O.sub.5. In the following description of the content range of each component, the expression “%” means “mol %”.

    [0051] SiO.sub.2 is a component that forms a glass network. When the content of SiO.sub.2 is too small, vitrification does not occur easily, and the thermal expansion coefficient becomes too high, with the result that thermal shock resistance is liable to be reduced. Accordingly, a suitable lower limit of the content range of SiO.sub.2 is 50% or more, 55% or more, 57% or more, or 59% or more, particularly 61% or more. Meanwhile, when the content of SiO.sub.2 is too large, the meltability and the formability are liable to be reduced, and the thermal expansion coefficient is excessively reduced, with the result that it becomes difficult to match the thermal expansion coefficient with those of peripheral materials. Accordingly, a suitable upper limit of the content range of SiO.sub.2 is 80% or less, 70% or less, 68% or less, 66% or less, or 65% or less, particularly 64.5% or less.

    [0052] Al.sub.2O.sub.3 is a component that increases a strain point, the Young's modulus, the fracture toughness, and a Vickers hardness, and is also a component that improves ion exchange performance. Accordingly, a suitable lower limit of the content range of Al.sub.2O.sub.3 is 4% or more, 8% or more, 10% or more, 12% or more, 13% or more, 14% or more, 14.4% or more, 15% or more, 15.3% or more, 15.6% or more, 16% or more, 16.5% or more, 17% or more, 17.5% or more, 18% or more, or more than 18%, particularly 18.5% or more. Meanwhile, when the content of Al.sub.2O.sub.3 is too large, the viscosity at high temperature is increased, with the result that the meltability and the formability are liable to be reduced. In addition, a devitrified crystal is liable to precipitate in the glass, and it becomes difficult to form the glass into a sheet shape by an overflow down-draw method or the like. Particularly when the glass substrate is formed by an overflow down-draw method involving using alumina-based refractory as forming body refractory, a devitrified crystal of spinel is liable to precipitate at an interface with the alumina-based refractory. Further, acid resistance is reduced, with the result that it becomes difficult to apply the glass to an acid treatment step. Accordingly, a suitable upper limit of the content range of Al.sub.2O.sub.3 is 25% or less, 21% or less, 20.5% or less, 20% or less, 19.9% or less, 19.5% or less, or 19.0% or less, particularly 18.9% or less. When the content of Al.sub.2O.sub.3, which has a large influence on the ion exchange performance, is set to fall with the suitable ranges, a profile having a first peak, a second peak, a first bottom, and a second bottom becomes easily formable.

    [0053] B.sub.2O.sub.3 is a component that reduces the viscosity at high temperature and a density, and stabilizes the glass to cause less precipitation of a crystal, to thereby reduce a liquidus temperature. When the content of B.sub.2O.sub.3 is too small, there is a risk in that the glass may be unstable, and devitrification resistance may be reduced. Accordingly, a suitable lower limit of the content range of B.sub.2O.sub.3 is 0% or more, 0.1% or more, 0.2% or more, 0.5% or more, 0.6% or more, 0.7% or more, 0.8% or more, or 0.9% or more, particularly 1% or more. Meanwhile, when the content of B.sub.2O.sub.3 is too large, there is a risk in that the depth of layer may be reduced. In particular, the efficiency of ion exchange between a Na ion in the glass and a K ion in a molten salt is liable to be reduced, and the depth of layer (DOL_ZERO.sub.K) of a compressive stress layer is liable to be reduced. Accordingly, a suitable upper limit of the content range of B.sub.2O.sub.3 is 16% or less, 14% or less, 12% or less, 10% or less, 5% or less, 4% or less, 3.8% or less, 3.5% or less, 3.3% or less, 3.2% or less, 3.1% or less, or 3% or less, particularly 2.9% or less. When the content of B.sub.2O.sub.3 is set to fall within the suitable ranges, the profile having a first peak, a second peak, a first bottom, and a second bottom becomes easily formable.

    [0054] The content and effects of Li.sub.2O are as described above.

    [0055] Na.sub.2O is an ion exchange component, and is also a component that reduces the viscosity at high temperature to improve the meltability and the formability. In addition, Na.sub.2O is a component that improves the devitrification resistance, and is particularly a component that suppresses devitrification caused by a reaction with alumina-based refractory. Further, Na.sub.2O is also a component that increases the thermal expansion coefficient. Accordingly, a suitable lower limit of the content range of Na.sub.2O is more than 0%, 3% or more, 4% or more, 5% or more, 6% or more, 7% or more, 7.5% or more, 8% or more, 8.5% or more, 8.8% or more, or 9% or more, particularly more than 10%. Meanwhile, when the content of Na.sub.2O is too large, the thermal expansion coefficient is excessively increased, and the thermal shock resistance is liable to be reduced. In addition, the glass composition loses its component balance, and the devitrification resistance may be reduced contrarily. Accordingly, a suitable upper limit of the content range of Na.sub.2O is 21% or less, 20% or less, or 19% or less, particularly 18% or less, 16.1% or less, 14% or less, 15% or less, or 13% or less, particularly 11% or less.

    [0056] K.sub.2O is a component that reduces the viscosity at high temperature to improve the meltability and the formability. However, when the content of K.sub.2O is too large, the thermal expansion coefficient is excessively increased, and the thermal shock resistance is liable to be reduced. In addition, the compressive stress value of the compressive stress layer on the outermost surface is liable to be reduced. Further, K.sub.2O is also a component that increases the thermal expansion coefficient. Accordingly, a suitable upper limit of the content range of K.sub.2O is 15% or less, 10% or less, 7% or less, 6% or less, 5% or less, 4% or less, 3% or less, 2% or less, 1.5% or less, 1% or less, less than 1%, or 0.5% or less, particularly less than 0.1%. When the viewpoint of increasing the depth of layer is emphasized, a suitable lower limit of the content range of K.sub.2O is 0% or more, 0.1% or more, or 0.3% or more, particularly 0.5% or more.

    [0057] The molar ratio [Li.sub.2O]/([Na.sub.2O]+[K.sub.2O]) is preferably from 0.0 to 15.4, from 0.1 to 10.0, from 0.2 to 5.0, from 0.3 to 3.0, from 0.4 to 1.0, or from 0.5 to 0.9, particularly preferably from 0.6 to 0.8. When the molar ratio [Li.sub.2O]/([Na.sub.2O]+[K.sub.2O]) is too low, there is a risk in that the ion exchange performance cannot be sufficiently exhibited. In particular, the efficiency of ion exchange between a Li ion in the glass and a Na ion in the molten salt is liable to be reduced. Meanwhile, when the molar ratio [Li.sub.2O]/([Na.sub.2O]+[K.sub.2O]) is too high, a devitrified crystal is liable to precipitate in the glass, and it becomes difficult to form the glass into a sheet shape by an overflow down-draw method or the like. The “[Li.sub.2O]/([Na.sub.2O]+[K.sub.2O])” refers to a value obtained by dividing the content of Li.sub.2O by the total content of Na.sub.2O and K.sub.2O.

    [0058] MgO is a component that reduces the viscosity at high temperature to improve the meltability and the formability, and increases the strain point and the Vickers hardness. Among alkaline earth metal oxides, MgO is a component that has a high effect of improving the ion exchange performance. However, when the content of MgO is too large, the devitrification resistance is liable to be reduced, and in particular, it becomes difficult to suppress devitrification caused by a reaction with alumina-based refractory. Accordingly, a suitable content of MgO is from 0% to 10%, from 0.01% to 7%, from 0.05% to 5%, from 0.1% to 4%, or from 0.2% to 3.5%, particularly from 0.5% to less than 3%.

    [0059] ZnO is a component that improves the ion exchange performance, and is particularly a component that has a high effect of increasing the compressive stress value of the compressive stress layer on the outermost surface. In addition, ZnO is also a component that reduces the viscosity at high temperature without reducing a viscosity at low temperature. A suitable lower limit of the content range of ZnO is 0% or more, 0.1% or more, 0.3% or more, 0.5% or more, or 0.7% or more, particularly 1% or more. Meanwhile, when the content of ZnO is too large, there is a tendency that the glass undergoes phase separation, the devitrification resistance is reduced, the density is increased, or the depth of layer is reduced. Accordingly, a suitable upper limit of the content range of ZnO is 10% or less, 6% or less, 5% or less, 4% or less, 3% or less, 2% or less, 1.5% or less, 1.3% or less, or 1.2% or less, particularly 1.1% or less.

    [0060] P.sub.2O.sub.5 is a component that improves the ion exchange performance, and is particularly a component that increases the depth of layer. Further, P.sub.2O.sub.5 is a component that also improves the acid resistance. When the content of P.sub.2O.sub.5 is too small, there is a risk in that the ion exchange performance cannot be sufficiently exhibited. In particular, the efficiency of ion exchange between a Na ion in the glass and a K ion in the molten salt is liable to be reduced, and the depth of layer (DOL_ZERO.sub.K) of the compressive stress layer is liable to be reduced. In addition, there is a risk in that the glass may be unstable, and the devitrification resistance may be reduced. Accordingly, a suitable lower limit of the content range of P.sub.2O.sub.5 is 0% or more, 0.1% or more, 0.4% or more, 0.7% or more, 1% or more, 1.2% or more, 1.4% or more, 1.6% or more, 2% or more, 2.3% or more, or 2.5% or more, particularly 3% or more. Meanwhile, when the content of P.sub.2O.sub.5 is too large, the glass is liable to undergo phase separation, or water resistance is liable to be reduced. In addition, the depth of layer obtained through ion exchange between a Li ion in the glass and a Na ion in the molten salt is excessively increased, with the result that the compressive stress value (CS.sub.Na) of the compressive stress layer is liable to be reduced. Accordingly, a suitable upper limit of the content range of P.sub.2O.sub.5 is 15% or less, 10% or less, 5% or less, or 4.5% or less, particularly 4% or less. When the content of P.sub.2O.sub.5 is set to fall within the suitable ranges, a non-monotonic profile becomes easily formable.

    [0061] An alkali metal oxide is a component that reduces the viscosity at high temperature to improve the meltability and the formability, and is also an ion exchange component. Accordingly, a suitable lower limit of the content range of the alkali metal oxide ([Li.sub.2O]+[Na.sub.2O]+[K.sub.2O]) is 5% or more, 6% or more, 7% or more, 8% or more, 9% or more, 10% or more, 11% or more, 12% or more, 13% or more, or 14% or more, particularly 15% or more. However, when the content of the alkali metal oxide ([Li.sub.2O]+[Na.sub.2O]+[K.sub.2O]) is too large, there is a risk in that the thermal expansion coefficient may be increased. In addition, there is a risk in that the acid resistance may be reduced. Accordingly, a suitable upper limit of the content range of the alkali metal oxide ([Li.sub.2O]+[Na.sub.2O]+[K.sub.2O]) is 28% or less, 25% or less, 23% or less, 20% or less, or 19% or less, particularly 18% or less.

    [0062] The molar ratio [Li.sub.2O]/[P.sub.2O.sub.5] is preferably 0 or more, from 0.1 to 30, from 0.5 to 29, from 0.9 to 28, from 3.8 to 27, from 4 to 26, or from 10 to 25, particularly preferably from 15 to 20. When the molar ratio [Li.sub.2O]/[P.sub.2O.sub.5] is too low, the efficiency of ion exchange between a Li ion in the glass and a Na ion in the molten salt is liable to be reduced. Meanwhile, when the molar ratio [Li.sub.2O]/[P.sub.2O.sub.5] is too high, a devitrified crystal is liable to precipitate in the glass, and it becomes difficult to form the glass into a sheet shape by an overflow down-draw method or the like. The “[Li.sub.2O]/[P.sub.2O.sub.5]” refers to a value obtained by dividing the content of Li.sub.2O by the content of P.sub.2O.sub.5.

    [0063] The molar ratio ([Na.sub.2O]?[Li.sub.2O])/([Al.sub.2O.sub.3]+[B.sub.2O.sub.3]+[P.sub.2O.sub.5]) is preferably 1.50 or less, 0.70 or less, 0.50 or less, 0.30 or less, 0.29 or less, 0.27 or less, 0.26 or less, 0.25 or less, 0.23 or less, or 0.20 or less, particularly preferably 0.15 or less. When the molar ratio ([Na.sub.2O]?[Li.sub.2O])/([Al.sub.2O.sub.3]+[B.sub.2O.sub.3]+[P.sub.2O.sub.5]) is too high, there is a risk in that the ion exchange performance cannot be sufficiently exhibited. In particular, the efficiency of ion exchange between a Li ion in the glass and a Na ion in the molten salt is liable to be reduced.

    [0064] The molar ratio ([B.sub.2O.sub.3]+[Na.sub.2O]?[P.sub.2O.sub.5])/([Al.sub.2O.sub.3]+[Li.sub.2O]) is preferably 0.001 or more, 0.05 or more, 0.15 or more, 0.25 or more, 0.30 or more, 0.35 or more, 0.40 or more, 0.42 or more, or 0.43 or more, particularly preferably 0.45 or more. When the molar ratio ([B.sub.2O.sub.3]+[Na.sub.2O]?[P.sub.2O.sub.5])/([Al.sub.2O.sub.3]+[Li.sub.2O]) is too low, a devitrified crystal is liable to precipitate in the glass, and it becomes difficult to form the glass into a sheet shape by an overflow down-draw method or the like.

    [0065] The ([SiO.sub.2]+1.2×[P.sub.2O.sub.5]-3×[Al.sub.2O.sub.3]-2×[Li.sub.2O]-1.5×[Na.sub.2O]—[K.sub.2O]—[B.sub.2O.sub.3]) is preferably −40% or more, −30% or more, −25% or more, or −22% or more, particularly preferably −20% or more. When the ([SiO.sub.2]+1.2×[P.sub.2O.sub.5]-3×[Al.sub.2O.sub.3]-2×[Li.sub.2O]-1.5×[Na.sub.2O]—[K.sub.2O]—[B.sub.2O.sub.3]) is too low, the acid resistance is liable to be reduced. Meanwhile, when the ([SiO.sub.2]+1.2×[P.sub.2O.sub.5]-3×[Al.sub.2O.sub.3]-2×[Li.sub.2O]-1.5×[Na.sub.2O]—[K.sub.2O]—[B.sub.2O.sub.3]) is too high, there is a risk in that the ion exchange performance cannot be sufficiently exhibited.

    [0066] Accordingly, the ([SiO.sub.2]+1.2×[P.sub.2O.sub.5]-3×[Al.sub.2O.sub.3]-2×[Li.sub.2O]-1.5×[Na.sub.2O]—[K.sub.2O]—[B.sub.2O.sub.3]) is preferably 50% or less, 40% or less, 30% or less, 20% or less, 15% or less, 10% or less, or 5% or less, particularly preferably 0% or less.

    [0067] For example, the following components other than the above-mentioned components may be added.

    [0068] CaO is a component that reduces the viscosity at high temperature to improve the meltability and the formability without reducing the devitrification resistance as compared to other components, and increases the strain point and the Vickers hardness. However, when the content of CaO is too large, there is a risk in that the ion exchange performance may be reduced, or an ion exchange solution may be degraded at the time of ion exchange treatment. Accordingly, a suitable upper limit of the content range of CaO is 10% or less, 8% or less, 7% or less, 6% or less, 5% or less, 4% or less, 3.5% or less, 3% or less, 2% or less, 1% or less, less than 1%, or 0.5% or less, particularly from 0.01% to less than 0.1%.

    [0069] SrO and BaO are each a component that reduces the viscosity at high temperature to improve the meltability and the formability, and increases the strain point and the Young's modulus. However, when the contents of SrO and BaO are too large, an ion exchange reaction is liable to be inhibited. Besides, the density or the thermal expansion coefficient is increased inappropriately, or the glass is liable to devitrify. Accordingly, suitable contents of SrO and BaO are each from 0% to 7%, from 0% to 5%, from 0% to 3%, from 0% to 2%, from 0% to 1.5%, from 0% to 1%, from 0% to 0.5%, or from 0% to 0.1%, particularly from 0.01% to less than 0.1%.

    [0070] ZrO.sub.2 is a component that increases the Vickers hardness, and is also a component that increases viscosity around the liquidus viscosity and the strain point. However, when the content of ZrO.sub.2 is too large, there is a risk in that the devitrification resistance is remarkably reduced. Accordingly, a suitable content of ZrO.sub.2 is from 0% to 5%, from 0% to 4%, from 0% to 3%, from 0% to 1.5%, or from 0% to 1%, particularly from 0.01% to 0.1%.

    [0071] TiO.sub.2 is a component that improves the ion exchange performance, and is also a component that reduces the viscosity at high temperature. However, when the content of TiO.sub.2 is too large, transparency and the devitrification resistance are liable to be reduced. Accordingly, a suitable content of TiO.sub.2 is from 0% to 3%, from 0% to 1.5%, from 0% to 1%, or from 0% to 0.1%, particularly from 0.001 mol % to 0.1 mol %.

    [0072] SnO.sub.2 is a component that improves the ion exchange performance. However, when the content of SnO.sub.2 is too large, the devitrification resistance is liable to be reduced. Accordingly, a suitable lower limit of the content range of SnO.sub.2 is 0.005% or more, or 0.01% or more, particularly 0.1% or more, and a suitable upper limit thereof is 3% or less, or 2% or less, particularly 1% or less.

    [0073] Cl is a fining agent, but is a component that adversely affects an environment or a facility when the content thereof is too large. Accordingly, a suitable lower limit of the content range of Cl is 0.001% or more, particularly 0.01% or more, and a suitable upper limit thereof is 0.3% or less, or 0.2% or less, particularly 0.1% or less.

    [0074] As a fining agent, one kind or two or more kinds selected from the group consisting of SO.sub.3 and CeO.sub.2 (preferably the group consisting of SO.sub.3) may be added at from 0.001% to 1%.

    [0075] Fe.sub.2O.sub.3 is an impurity that is inevitably mixed in from raw materials. A suitable upper limit of the content range of Fe.sub.2O.sub.3 is 2,000 ppm or less (0.2% or less), 1,500 ppm or less (0.15% or less), less than 1,000 ppm (less than 0.1%), less than 800 ppm, less than 600 ppm, or less than 400 ppm, particularly less than 300 ppm. When the content of Fe.sub.2O.sub.3 is too large, the transmittance of a cover glass is liable to be reduced. Meanwhile, a suitable lower limit of the content range of Fe.sub.2O.sub.3 is 10 ppm or more, 20 ppm or more, 30 ppm or more, 50 ppm or more, 80 ppm or more, or 100 ppm or more. When the content of Fe.sub.2O.sub.3 is too small, a raw material cost rises owing to the use of high-purity raw materials, and a product cannot be manufactured inexpensively.

    [0076] A rare earth oxide, such as Nd.sub.2O.sub.3, La.sub.2O.sub.3, Y.sub.2O.sub.3, Nb.sub.2O.sub.5, Ta.sub.2O.sub.5, or Hf.sub.2O.sub.3, is a component that increases the Young's modulus. However, the costs of raw materials therefor are high. In addition, when the rare earth oxide is added in a large amount, the devitrification resistance is liable to be reduced. Accordingly, a suitable content of the rare earth oxide is 5% or less, 3% or less, 2% or less, 1% or less, or 0.5% or less, particularly 0.1% or less.

    [0077] It is preferred that the support glass substrate of the present invention be substantially free of each of As.sub.2O.sub.3, Sb.sub.2O.sub.3, PbO, and F as a glass composition from the standpoint of environmental considerations. In addition, it is also preferred that the support glass substrate be substantially free of Bi.sub.2O.sub.3 from the standpoint of environmental considerations. The “substantially free of” has a concept in which the explicit component is not positively added as a glass component, but its addition at an impurity level is permitted, and specifically refers to the case in which the content of the explicit component is less than 0.05%.

    [0078] The support glass substrate of the present invention preferably has the following characteristics.

    [0079] The temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s of the support glass substrate of the present invention is preferably less than 1,800° C., more preferably less than 1,660° C., 1,640° C. or less, less than 1,620° C., or 1,600° C. or less, particularly preferably from 1,400° C. to 1,590° C. When the temperature at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s is too high, the meltability and the formability are reduced, with the result that it becomes difficult to form molten glass into a sheet shape.

    [0080] A density is preferably 2.80 g/cm.sup.3 or less, 2.70 g/cm.sup.3 or less, 2.60 g/cm.sup.3 or less, 2.58 g/cm.sup.3 or less, 2.56 g/cm.sup.3 or less, 2.55 g/cm.sup.3 or less, 2.53 g/cm.sup.3 or less, 2.50 g/cm.sup.3 or less, 2.49 g/cm.sup.3 or less, or 2.45 g/cm.sup.3 or less, particularly preferably from 2.35 g/cm.sup.3 to 2.44 g/cm.sup.3. As the density becomes lower, the weight of a tempered glass substrate can be reduced more.

    [0081] A softening point is preferably 985° C. or less, 970° C. or less, 950° C. or less, 930° C. or less, 900° C. or less, 880° C. or less, or 860° C. or less, particularly preferably from 850° C. to 700° C. The “softening point” refers to a value measured based on a method of ASTM C338.

    [0082] A liquidus viscosity is preferably 10.sup.3.0 or more, 10.sup.3.2 or more, 10.sup.3.4 or more, 10.sup.3.6 or more, 10.sup.3.24 dPa.Math.s or more, 10.sup.4.5 dPa.Math.s or more, 10.sup.4.8 dPa.Math.s or more, 10.sup.4.9 dPa.Math.s or more, 10.sup.5.0 dPa.Math.s or more, 10.sup.5.1 dPa.Math.s or more, 10.sup.5.2 dPa.Math.s or more, 10.sup.5.3 dPa.Math.s or more, or 10.sup.5.4 dPa.Math.s or more, particularly preferably 10.sup.5.5 dPa.Math.s or more. As the liquidus viscosity becomes higher, devitrification resistance is improved more, and devitrified stones are less liable to be generated at the time of forming. The “liquidus viscosity” as used herein refers to a value measured for a viscosity at a liquidus temperature by a platinum sphere pull up method. The “liquidus temperature” refers to a temperature obtained as described below. Glass powder which has passed through a standard 30-mesh sieve (500 μm) and remained on a 50-mesh sieve (300 μm) is loaded into a platinum boat, and the platinum boat is kept for 24 hours in a temperature gradient furnace and is then taken out of the furnace. At this time, a highest temperature at which devitrification (devitrified stones) is observed with a microscope in glass is measured.

    [0083] A Young's modulus is preferably 63 GPa or more, 65 GPa or more, 68 GPa or more, 70 GPa or more, 74 GPa or more, from 75 GPa to 100 GPa, or from 80 GPa to 95 GPa, particularly preferably from 85 GPa to 90 GPa. When the Young's modulus is low, the support glass substrate is liable to be broken. In addition, the support glass substrate is liable to be deflected in the case of having a small sheet thickness.

    [0084] A fracture toughness K.sub.1C is preferably 0.80 MPa.Math.m.sup.0.5 or more, 0.81 MPa.Math.m.sup.0.5 or more, 0.82 MPa.Math.m.sup.0.5 or more, 0.83 MPa.Math.m.sup.0.5 or more, or 0.84 MPa.Math.m.sup.0.5 or more, particularly preferably 0.85 MPa.Math.m.sup.0.5 or more. When the fracture toughness K.sub.1C is low, the support glass substrate is liable to be broken.

    [0085] The mass loss of the support glass substrate of the present invention per unit surface area when the support glass substrate is immersed in a 5 mass % HCl aqueous solution warmed to 80° C. for 24 hours is preferably 100.0 mg/cm.sup.2 or less, 90 mg/cm.sup.2 or less, 80 mg/cm.sup.2 or less, 70 mg/cm.sup.2 or less, 60 mg/cm.sup.2 or less, 50 mg/cm.sup.2 or less, 40 mg/cm.sup.2 or less, or 30 mg/cm.sup.2 or less, particularly preferably 20 mg/cm.sup.2 or less. The support glass substrate may be brought into contact with an acid chemical in a manufacturing process for a semiconductor package, and preferably has high acid resistance from the viewpoint of preventing a process failure.

    [0086] The mass loss per unit surface area when the support glass substrate is immersed in a 5 mass % NaOH aqueous solution warmed to 80° C. for 6 hours is preferably 5.0 mg/cm.sup.2 or less, 4.9 mg/cm.sup.2 or less, 4.8 mg/cm.sup.2 or less, 4.7 mg/cm.sup.2 or less, 4.6 mg/cm.sup.2 or less, 4.5 mg/cm.sup.2 or less, 4.0 mg/cm.sup.2 or less, or 3.0 mg/cm.sup.2 or less, particularly preferably 2.0 mg/cm.sup.2 or less. The support glass substrate is often washed and recycled in a manufacturing process for a semiconductor package. In this case, the support glass substrate may be brought into contact with an alkaline chemical or detergent, and is required to have high alkali resistance.

    [0087] The support glass substrate of the present invention preferably has the following shape.

    [0088] The support glass substrate of the present invention preferably has a wafer shape or a substantially disc shape, and the diameter thereof is preferably 100 mm or more and 500 mm or less, particularly preferably 150 mm or more and 450 mm or less. With this configuration, the support glass substrate is easily applied to a manufacturing process for a fan-out type WLP. As required, the support glass substrate may be processed into any other shape, for example, a rectangular shape.

    [0089] The support glass substrate of the present invention also preferably has a substantially rectangular shape, and the dimensions thereof are preferably −200 mm or more or from □220 mm to −750 mm, particularly preferably from □250 mm to −500 mm. With this configuration, the support glass substrate is easily applied to a manufacturing process for a fan-out type panel level package (PLP). As required, the support glass substrate may be processed into any other shape, for example, a triangular shape or a trapezoidal shape.

    [0090] A sheet thickness is preferably less than 2.0 mm, 1.5 mm or less, 1.2 mm or less, 1.1 mm or less, or 1.0 mm or less, particularly preferably 0.9 mm or less. As the sheet thickness becomes smaller, the mass of a laminated substrate is reduced, and hence a handling property is improved. Meanwhile, when the sheet thickness is excessively small, the strength of the support glass substrate itself decreases, and hence the support glass substrate does not easily function as a supporting substrate. Accordingly, the sheet thickness is preferably 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, 0.4 mm or more, 0.5 mm or more, or 0.6 mm or more, particularly preferably more than 0.7 mm.

    [0091] A total thickness variation (TTV) is preferably 5 μm or less, 4 μm or less, 3 μm or less, 2 μm or less, or 1 μm or less, particularly preferably from 0.1 μm to less than 1 μm. In addition, an arithmetic average roughness Ra is preferably 20 nm or less, 10 nm or less, 5 nm or less, 2 nm or less, or 1 nm or less, particularly preferably 0.5 nm or less. As surface accuracy becomes higher, the accuracy of processing treatment is increased more easily. In particular, wiring accuracy can be increased, and hence high-density wiring can be performed. In addition, the strength of the support glass substrate is increased, with the result that the support glass substrate and a laminated substrate are less liable to be broken. Further, the number of times of reuse of the support glass substrate can be increased. The “arithmetic average roughness Ra” may be measured with a stylus-type surface roughness meter or an atomic force microscope (AFM).

    [0092] A warpage level is preferably 60 μm or less, 55 μm or less, 50 μm or less, or from 1 μm to 45 μm, particularly preferably from 5 μm to 40 μm. As the warpage level becomes smaller, the accuracy of processing treatment is increased more easily. In particular, wiring accuracy can be increased, and hence high-density wiring can be performed.

    [0093] When the support glass substrate has a wafer shape or a substantially disc shape, the circularity thereof is preferably 1 mm or less, 0.1 mm or less, or 0.05 mm or less, particularly preferably 0.03 mm or less. As the circularity becomes smaller, the support glass substrate is applied to a manufacturing process for a fan-out type WLP more easily. The “circularity” refers to a value obtained by subtracting a minimum contour value from a maximum contour value except for a notch structure.

    [0094] The support glass substrate of the present invention preferably comprises a positioning portion. The positioning portion preferably has any one of a notch structure, a chamfer structure, and a cutout structure, and particularly preferably has a notch structure. The notch structure more preferably has, in a deep portion thereof, a substantially circular shape or a substantially V-groove shape in plan view. This facilitates the position fixation of the support glass substrate by bringing a positioning member such as a positioning pin into abutment with the notch structure of the support glass substrate. As a result, this facilitates position alignment between the support glass substrate and the substrate to be processed. Particularly when a notch structure is also formed in the substrate to be processed, and the positioning member is brought into abutment with the notch structure, the position alignment is facilitated in the entire laminated substrate. Cracks are liable to occur in the notch structure owing to abutment with the positioning member, but the support glass substrate of the present invention, which has high strength, is particularly effective in the case of having a notch structure.

    [0095] When the positioning member is brought into abutment with the notch structure of the support glass substrate, a stress is liable to be concentrated in the notch structure, and the support glass substrate is liable to be broken from the notch structure. In particular, the tendency becomes remarkable when the support glass substrate is curved by external force. Accordingly, in the support glass substrate of the present invention, an end edge region in which a surface and an end surface of the notch structure intersect with each other is preferably entirely or partially chamfered. With this configuration, the breakage from the notch structure can be effectively avoided.

    [0096] In the support glass substrate of the present invention having a wafer shape or a substantially disc shape, the end edge region in which a surface and an end surface of the notch structure intersect with each other is entirely or partially chamfered. It is preferred that 50% or more of the end edge region in which a surface and an end surface of the notch structure intersect with each other be chamfered. It is more preferred that 90% or more of the end edge region in which a surface and an end surface of the notch structure intersect with each other be chamfered. It is still more preferred that the entirety of the end edge region in which a surface and an end surface of the notch structure intersect with each other be chamfered. As a larger region of the notch structure is chamfered, the breakage probability of the support glass substrate from the notch structure can be reduced.

    [0097] The chamfer width of the notch structure in a surface direction is preferably from 50 μm to 900 μm, from 200 μm to 800 μm, from 300 μm to 700 μm, or from 400 μm to 650 μm, particularly preferably from 500 μm to 600 μm. When the chamfer width of the notch structure in the surface direction is too small, the support glass substrate is liable to be broken from the notch structure. Meanwhile, when the chamfer width of the notch structure in the surface direction is too large, chamfering efficiency is reduced, and the manufacturing cost of the support glass substrate is liable to rise.

    [0098] The chamfer width of the notch structure in a sheet thickness direction is preferably from 5% to 80%, from 20% to 75%, from 30% to 70%, or from 35% to 65%, particularly preferably from 40% to 60% of the sheet thickness. When the chamfer width of the notch structure in the sheet thickness direction is too small, the support glass substrate is liable to be broken from the notch structure. Meanwhile, when the chamfer width of the notch structure in the sheet thickness direction is too large, external force is liable to be concentrated in the end surface of the notch structure, with the result that the support glass substrate is liable to be broken from the end surface of the notch structure.

    [0099] When the support glass substrate has a substantially rectangular shape, the support glass substrate has a corner angle of preferably from 89.0° to 91.0°, from 89.1° to 90.9°, from 89.2° to 90.8°, from 89.3° to 90.7°, or from 89.4° to 90.6°, particularly preferably from 89.5° to 90.5° when seen from above, that is, in plan view. As the corner angle is closer to 90°, the positioning of the support glass substrate can be performed more accurately at the time of conveyance.

    [0100] The support glass substrate of the present invention preferably comprises, on the surface thereof, an information identification part comprising dots as a constituent unit. The information identification part comprises one or more kinds of elements selected from a letter, a symbol, a two-dimensional code, and a figure, and the element is formed of a plurality of dots. The information identification part preferably comprises at least one piece of information selected from the dimensions, linear thermal expansion coefficient, lot, total thickness variation (TTV), manufacturer, distributor, and material code of the support glass substrate. The “dimensions” include the thickness dimension and outer diameter dimension of the support glass substrate, the dimensions of the notch structure, and the like.

    [0101] The outer diameter dimension of the dot is preferably from 0.05 mm to 0.20 mm or from 0.07 mm to 0.13 mm or less, particularly preferably from 0.09 mm to 0.11 mm. When the outer diameter dimension of the dot is too small, the viewability of the information identification part is liable to be reduced. Meanwhile, when the outer diameter dimension of the dot is too large, the strength of the support glass substrate is easily ensured.

    [0102] The dots adjacent to each other have a distance between centers of preferably from 0.06 mm to 0.25 mm. When the dots adjacent to each other have an excessively small distance between centers, the strength of the support glass substrate is easily ensured. Meanwhile, when the dots adjacent to each other have an excessively large distance between centers, the viewability of the information identification part is liable to be reduced.

    [0103] It is preferred that the information identification part comprise dots as a constituent unit, and the dots each have an annular groove shape. When the dots each have an annular groove shape, a region enclosed by the annular groove (an inside region with respect to the groove) remains without being removed by a laser, and hence a reduction in strength of a region in which the information identification part is formed can be prevented to the extent possible. In addition, in the case of the annular groove, the viewability is not significantly reduced even when the width dimension of the groove is reduced as long as the outer diameter dimension thereof is not changed. Thus, when the width dimension of the groove is reduced without changing the outer diameter dimension thereof, the inside region with respect to the groove can be enlarged accordingly, with the result that, while the viewability is ensured, required strength can be maintained.

    [0104] The depth dimension of the groove forming the dot is preferably from 2 μm to 30 μm. When the depth dimension of the groove is too small, the viewability of the information identification part is liable to be reduced. Meanwhile, when the depth dimension of the groove is too large, the strength of the support glass substrate is easily ensured.

    [0105] The information identification part may be formed by various methods, but the information identification part is preferably formed by radiating a pulse laser to abrade glass in the irradiated region, that is, the information identification part is preferably formed by laser abrasion. With this configuration, abrasion can be performed without accumulating excessive heat in the glass in the irradiated region. As a result, not only the length of a crack in a thickness direction but also the length of a crack extending from the dot in a surface direction can be reduced.

    [0106] The support glass substrate of the present invention is preferably manufactured by blending and mixing glass raw materials to produce a glass batch, and loading the glass batch into a glass melting furnace, followed by fining and stirring the resultant molten glass, and supplying the molten glass to a forming device to form the glass into a sheet shape.

    [0107] The support glass substrate of the present invention preferably has overflow-merged surfaces in a middle portion thereof in a sheet thickness direction. In the overflow down-draw method, surfaces that are to serve as the surfaces of the support glass substrate are formed in a state of free surfaces without being brought into contact with trough-shaped refractory. Accordingly, with slight polishing, the total thickness variation can be reduced to less than 2.0 μm, particularly to less than 1.0 μm. As a result, the manufacturing cost of the support glass substrate can be reduced.

    [0108] It is preferred that the surface of the support glass substrate of the present invention be polished after its formation by the overflow down-draw method. With this configuration, the total thickness variation can be easily controlled to less than 2.0 μm, 1.5 μm or less, or 1.0 μm or less, particularly from 0.1 μm to less than 1.0 μm.

    [0109] The support glass substrate of the present invention preferably has a compressive stress layer in a glass surface thereof, and more preferably has a compressive stress layer through ion exchange. When the compressive stress layer is formed in the glass surface, the breakage probability of the support glass substrate can be reduced at the time of dropping of a laminated substrate onto the ground.

    [0110] In the support glass substrate of the present invention, the compressive stress layer has a compressive stress value on the outermost surface of preferably from 165 MPa to 1,000 MPa, 200 MPa or more, 220 MPa or more, 250 MPa or more, 280 MPa or more, 300 MPa or more, or 310 MPa or more, particularly preferably 320 MPa or more. When the compressive stress value of the compressive stress layer on the outermost surface becomes higher, the Vickers hardness is increased more. Meanwhile, when an excessively large compressive stress is formed in the surface, an internal tensile stress of the support glass substrate is increased excessively, and there is a risk in that a dimensional change before and after ion exchange treatment may be increased. Accordingly, the compressive stress value of the compressive stress layer on the outermost surface is preferably 1,000 MPa or less, 900 MPa or less, 700 MPa or less, 680 MPa or less, or 650 MPa or less, particularly preferably 600 MPa or less. There is a tendency that the compressive stress value of the compressive stress layer on the outermost surface is increased when an ion exchange time period is shortened, or the temperature of an ion exchange solution is reduced.

    [0111] The compressive stress layer has a depth of layer of preferably from 50 μm to 200 μm, 50 μm or more, 60 μm or more, 80 μm or more, or 100 μm or more, particularly preferably 120 μm or more. As the depth of layer becomes larger, protrusions on the ground are less liable to reach the tensile stress layer of the support glass substrate at the time of dropping of the laminated substrate, and thus the breakage probability of the support glass substrate can be reduced more. Meanwhile, when the depth of layer is too large, there is a risk in that a dimensional change before and after the ion exchange treatment may be increased. Further, there is a tendency that the compressive stress value of the compressive stress layer on the outermost surface is reduced. Accordingly, the depth of layer is preferably 200 μm or less, 180 μm or less, or 150 μm or less, particularly preferably 140 μm or less. There is a tendency that the depth of layer is increased when the ion exchange time period is prolonged, or the temperature of the ion exchange solution is increased.

    [0112] The ion exchange treatment is preferably performed a plurality of times. As the ion exchange treatment performed a plurality of times, it is preferred to perform ion exchange treatment in which the support glass substrate is immersed in a molten salt containing a KNO.sub.3 molten salt, and then perform ion exchange treatment in which the support glass substrate is immersed in a molten salt containing a NaNO.sub.3 molten salt. With this configuration, while a large depth of layer is ensured, the compressive stress value of the compressive stress layer on the outermost surface can be increased.

    [0113] In particular, it is preferred to perform ion exchange treatment (first ion exchange step) in which the support glass substrate is immersed in a NaNO.sub.3 molten salt or a mixed molten salt of NaNO.sub.3 and KNO.sub.3, and then perform ion exchange treatment (second ion exchange step) in which the support glass substrate is immersed in a mixed molten salt of KNO.sub.3 and LiNO.sub.3. With this configuration, a non-monotonic stress profile illustrated in each of FIG. 4 and FIG. 5, that is, a stress profile having at least a first peak, a second peak, a first bottom, and a second bottom can be formed. As a result, the breakage probability of the support glass substrate can be significantly reduced at the time of dropping of the laminated substrate.

    [0114] In the first ion exchange step, a Li ion in the glass and a Na ion in the molten salt are ion-exchanged with each other, and in the case of using the mixed molten salt of NaNO.sub.3 and KNO.sub.3, a Na ion in the glass and a K ion in the molten salt are further ion-exchanged with each other. Herein, the ion exchange between a Li ion in the glass and a Na ion in the molten salt is faster and more efficient than the ion exchange between a Na ion in the glass and a K ion in the molten salt. In the second ion exchange step, a Na ion in the vicinity of the glass surface (a shallow region from the outermost surface to a sheet thickness of 20%) and a Li ion in the molten salt are ion-exchanged with each other, and besides, a Na ion in the vicinity of the glass surface (the shallow region from the outermost surface to a sheet thickness of 20%) and a K ion in the molten salt are ion-exchanged with each other. That is, in the second ion exchange step, while a Na ion in the vicinity of the glass surface is released, a K ion, which has a large ionic radius, can be introduced. As a result, while a large depth of layer is maintained, the compressive stress value of the compressive stress layer on the outermost surface can be increased.

    [0115] In the first ion exchange step, the temperature of the molten salt is preferably from 360° C. to 400° C., and the ion exchange time period is preferably from 30 minutes to 6 hours. In the second ion exchange step, the temperature of the ion exchange solution is preferably from 370° C. to 400° C., and the ion exchange time period is preferably from 15 minutes to 3 hours.

    [0116] In order to form the non-monotonic stress profile, it is preferred that the concentration of NaNO.sub.3 be higher than the concentration of KNO.sub.3 in the mixed molten salt of NaNO.sub.3 and KNO.sub.3 to be used in the first ion exchange step, and that the concentration of KNO.sub.3 be higher than the concentration of LiNO.sub.3 in the mixed molten salt of KNO.sub.3 and LiNO.sub.3 to be used in the second ion exchange step.

    [0117] In the mixed molten salt of NaNO.sub.3 and KNO.sub.3 to be used in the first ion exchange step, the concentration of KNO.sub.3 is preferably 0 mass % or more, 0.5 mass % or more, 1 mass % or more, 5 mass % or more, 7 mass % or more, 10 mass % or more, or 15 mass % or more, particularly preferably from 20 mass % to 90 mass %. When the concentration of KNO.sub.3 is too high, there is a risk in that the compressive stress value obtained through ion exchange between a Li ion in the glass and a Na ion in the molten salt may be excessively reduced. In addition, when the concentration of KNO.sub.3 is too low, there is a risk in that the measurement of a stress with a surface stress meter FSM-6000 may become difficult.

    [0118] In the mixed molten salt of KNO.sub.3 and LiNO.sub.3 to be used in the second ion exchange step, the concentration of LiNO.sub.3 is preferably from more than 0 mass % to 5 mass %, from more than 0 mass % to 3 mass %, or from more than 0 mass % to 2 mass %, particularly preferably from 0.1 mass % to 1 mass %. When the concentration of LiNO.sub.3 is too low, it becomes difficult to release a Na ion in the vicinity of the glass surface. Meanwhile, when the concentration of LiNO.sub.3 is too high, there is a risk in that the compressive stress value obtained through ion exchange between a Na ion in the vicinity of the glass surface and a K ion in the molten salt may be excessively reduced.

    [0119] A laminated substrate of the present invention comprises at least a substrate to be processed and a support glass substrate for supporting the substrate to be processed, wherein the support glass substrate is the above-mentioned support glass substrate. The laminated substrate of the present invention preferably comprises an adhesive layer between the substrate to be processed and the support glass substrate. The adhesive layer is preferably formed of a resin, and for example, a thermosetting resin, a photocurable resin (in particular, a UV-curable resin), and the like are preferred. In addition, the adhesive layer preferably has heat resistance that withstands the heat treatment in the manufacturing process for a fan-out type WLP. With this configuration, the adhesive layer is less liable to be melted in the manufacturing process for a fan-out type WLP, and the accuracy of the processing treatment can be enhanced. A UV-curable tape may also be used as the adhesive layer in order to fix the substrate to be processed and the support glass substrate easily.

    [0120] The laminated substrate of the present invention preferably further comprises a peeling layer between the substrate to be processed and the support glass substrate, more specifically between the substrate to be processed and the adhesive layer, or preferably further comprises a peeling layer between the support glass substrate and the adhesive layer. With this configuration, after the substrate to be processed is subjected to predetermined processing treatment, the substrate to be processed is easily peeled from the support glass substrate. From the viewpoint of productivity, it is preferred that the substrate to be processed be peeled from the support glass substrate through use of irradiation light such as laser light. An infrared laser light source, such as a YAG laser (wavelength of 1,064 nm) or a semiconductor laser (wavelength of from 780 nm to 1,300 nm), may be used as a laser light source. In addition, a resin degradable by infrared laser irradiation may be used for the peeling layer. In addition, a substance that absorbs infrared light efficiently and converts the light into heat may also be added to the resin. For example, carbon black, graphite powder, metal powder fine particles, a dye, a pigment, and the like may also be added to the resin.

    [0121] The peeling layer is formed of a material in which “in-layer peeling” or “interfacial peeling” occurs through use of irradiation light such as laser light. That is, the peeling layer is formed of a material in which the interatomic or intermolecular binding force between atoms or molecules is lost or reduced to cause ablation or the like, to thereby cause peeling, through irradiation with light having predetermined intensity. There are the case in which components contained in the peeling layer turn into a gas to be released, to thereby cause separation, through irradiation with irradiation light, and the case in which the peeling layer absorbs light to turn into a gas and the vapor thereof is released, to thereby cause separation.

    [0122] In the laminated substrate of the present invention, it is preferred that the support glass substrate be larger than the substrate to be processed. With this configuration, even when the center positions of the substrate to be processed and the support glass substrate are slightly separated from each other at a time when the substrate to be processed is supported, an edge portion of the substrate to be processed is less liable to protrude from the support glass substrate.

    [0123] A method of manufacturing a semiconductor package of the present invention comprises the steps of: preparing a laminated substrate comprising at least a substrate to be processed and a support glass substrate for supporting the substrate to be processed; and subjecting the substrate to be processed to processing treatment, wherein the support glass substrate is the above-mentioned support glass substrate.

    [0124] It is preferred that the method of manufacturing a semiconductor package of the present invention further comprise a step of conveying the laminated substrate. With this configuration, the treatment efficiency of the processing treatment can be enhanced. The “step of conveying the laminated substrate” and the “step of subjecting the substrate to be processed to processing treatment” are not required to be performed separately, and may be performed simultaneously.

    [0125] In the method of manufacturing a semiconductor package of the present invention, it is preferred that the processing treatment be treatment involving arranging wiring on one surface of the substrate to be processed or treatment involving forming solder bumps on one surface of the substrate to be processed. In the method of manufacturing a semiconductor package of the present invention, during the treatment, a dimensional change is less liable to occur in the substrate to be processed, and hence those steps can be performed properly.

    [0126] Besides the foregoing, the processing treatment may be any of treatment involving mechanically polishing one surface (in general, the surface on an opposite side to the support glass substrate) of the substrate to be processed, treatment involving subjecting one surface (in general, the surface on an opposite side to the support glass substrate) of the substrate to be processed to dry etching, and treatment involving subjecting one surface (in general, the surface on an opposite side to the support glass substrate) of the substrate to be processed to wet etching. In the method of manufacturing a semiconductor package of the present invention, warpage is less liable to occur in the substrate to be processed, and the stiffness of the laminated substrate can be maintained. As a result, the processing treatment can be performed properly.

    [0127] The present invention is further described with reference to the drawings.

    [0128] FIG. 1 is a conceptual perspective view for illustrating an example of a laminated substrate 1 of the present invention. In FIG. 1, the laminated substrate 1 comprises a support glass substrate 10 and a substrate 11 to be processed. The support glass substrate 10 is bonded onto the substrate 11 to be processed so as to prevent a dimensional change of the substrate 11 to be processed. In addition, the support glass substrate 10 comprises lithium aluminosilicate-based glass, has a content of Li.sub.2O of from 0.02 mol % to 25 mol % in a glass composition, and has an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 45×10.sup.−7/° C. or more and 160×10.sup.−7/° C. or less. In addition, a peeling layer 12 and an adhesive layer 13 are arranged between the support glass substrate 10 and the substrate 11 to be processed. The peeling layer 12 is held in contact with the support glass substrate 10, and the adhesive layer 13 is held in contact with the substrate 11 to be processed.

    [0129] As is understood from FIG. 1, the laminated substrate 1 comprises the support glass substrate 10, the peeling layer 12, the adhesive layer 13, and the substrate 11 to be processed, which are laminated and arranged in the stated order. The shape of the support glass substrate 10 is determined depending on the substrate 11 to be processed, and in FIG. 1, both the support glass substrate 10 and the substrate 11 to be processed have a wafer shape. In addition to amorphous silicon (a-Si), for example, silicon oxide, a silicate compound, silicon nitride, aluminum nitride, or titanium nitride may be used for the peeling layer 12. The peeling layer 12 is formed by plasma CVD, spin coating using a sol-gel method, or the like. The adhesive layer 13 is made of a resin and is formed through application, for example, by any of various printing methods, an ink jet method, a spin coating method, a roll coating method, or the like. The adhesive layer 13 is removed by being dissolved in a solvent or the like after the support glass substrate 10 is peeled from the substrate 11 to be processed through use of the peeling layer 12.

    [0130] FIG. 2 are conceptual sectional views for illustrating a manufacturing process for a fan-out type WLP. FIG. 2(a) is an illustration of a state in which an adhesive layer 21 is formed on one surface of a supporting member 20. As required, a peeling layer may be formed between the supporting member 20 and the adhesive layer 21. Next, as illustrated in FIG. 2(b), a plurality of semiconductor chips 22 are bonded onto the adhesive layer 21. In this case, an active surface of each semiconductor chip 22 is brought into contact with the adhesive layer 21. Then, as illustrated in FIG. 2(c), the semiconductor chips 22 are molded with a sealing material 23 of a resin. As the sealing material 23, a material having less dimensional change after compression molding and having less dimensional change during formation of wiring is used. Subsequently, as illustrated in FIG. 2(d) and FIG. 2(e), a substrate 24 to be processed having the semiconductor chips 22 molded therein is separated from the supporting member 20 and is then adhesively fixed onto a support glass substrate 26 via an adhesive layer 25. In this case, in the surface of the substrate 24 to be processed, the surface on an opposite side to the surface in which the semiconductor chips 22 are buried is arranged on the support glass substrate 26 side. Thus, a laminated substrate 27 can be obtained. As required, a peeling layer may be formed between the adhesive layer 25 and the support glass substrate 26. Further, after the obtained laminated substrate 27 is conveyed, as illustrated in FIG. 2(f), a wiring 28 is formed on the surface of the substrate 24 to be processed in which the semiconductor chips 22 are buried, and then a plurality of solder bumps 29 are formed. Finally, after the substrate 24 to be processed is separated from the support glass substrate 26, the substrate 24 to be processed is cut for each semiconductor chip 22 to be used in a later packaging step (FIG. 2(g)).

    [0131] FIG. 3 are conceptual sectional views for illustrating a step of thinning the substrate to be processed through use of the support glass substrate as a backgrind substrate. FIG. 3(a) is an illustration of a laminated substrate 30. The laminated substrate 30 comprises a support glass substrate 31, a peeling layer 32, an adhesive layer 33, and a substrate 34 to be processed (silicon wafer), which are laminated and arranged in the stated order. A plurality of semiconductor chips 35 are formed by a photolithography method or the like on the surface of the substrate to be processed brought into contact with the adhesive layer 33. FIG. 3(b) is an illustration of a step of thinning the substrate 34 to be processed with a polishing device 36. Through this step, the substrate 34 to be processed is mechanically polished to be thinned to, for example, several tens of micrometers. FIG. 3(c) is an illustration of a step of irradiating the peeling layer 32 with UV light 37 through the support glass substrate 31. After the performance of this step, the support glass substrate 31 can be separated as illustrated in FIG. 3(d). The support glass substrate 31 having been separated is reused as required. FIG. 3(e) is an illustration of a step of removing the adhesive layer 33 from the substrate 34 to be processed. After the performance of this step, the substrate 34 to be processed having been thinned can be collected.

    [0132] A glass substrate of the present invention comprises as a glass composition, in terms of mol %, 50% to 65% of SiO.sub.2, 8% to 25% of Al.sub.2O.sub.3, 0% to 10% of B.sub.2O.sub.3, 5.1% to 20% of Li.sub.2O, more than 10% to 16.1% of Na.sub.2O, 0% to 15% of K.sub.2O, 0.01% to 3% of MgO, 0% to 10% of CaO, and 0.01% to 10% of ZrO.sub.2, and has a Young's modulus of 80 GPa or more. In addition, a glass substrate of the present invention comprises as a glass composition, in terms of mol %, 50% to 65% of SiO.sub.2, 8% to 18% of Al.sub.2O.sub.3, 0% to 10% of B.sub.2O.sub.3, 20% to 25% of Li.sub.2O, 0.01% to 10% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 10% of MgO, 0.01% to 10% of CaO, and 0% to 10% of ZrO.sub.2, has a Young's modulus of 85 GPa or more, and has a fracture toughness K.sub.1C of 0.80 MPa.Math.m.sup.0.5 or more. The technical features of the glass substrate of the present invention have already been described in the description section of the support glass substrate of the present invention, and hence detailed description thereof is omitted here.

    [0133] A glass substrate of the present invention comprises as a glass composition, in terms of mol %, 64% to 76% of SiO.sub.2, 4% to 15% of Al.sub.2O.sub.3, 4% to 16% of B.sub.2O.sub.3, 0.1% to 14% of Li.sub.2O, 0.01% to 14% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 7% of MgO, 0% to 7% of CaO, 0% to 7% of SrO, 0% to 7% of BaO, and 0% to 10% of ZrO.sub.2, has a Young's modulus of 60 GPa or more, and has an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 85×10.sup.−7/° C. or less. In addition, a glass substrate of the present invention comprises as a glass composition, in terms of mol %, 64% to 76% of SiO.sub.2, 4% to 15% of Al.sub.2O.sub.3, 4% to 16% of B.sub.2O.sub.3, 0.1% to 14% of Li.sub.2O, 0.01% to 14% of Na.sub.2O, 0% to 15% of K.sub.2O, 0.01% to 7% of MgO, 0.01% to 7% of CaO, 0% to 7% of SrO, 0% to 7% of BaO, and 0% to 10% of ZrO.sub.2, having a Young's modulus of 60 GPa or more, and having an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 85×10.sup.−7/° C. or less. In addition, a glass substrate of the present invention comprises as a glass composition, in terms of mol %, 64% to 76% of SiO.sub.2, 4% to 15% of Al.sub.2O.sub.3, 4% to 16% of B.sub.2O.sub.3, 0.1% to 14% of Li.sub.2O, 0.01% to 14% of Na.sub.2O, 0% to 15% of K.sub.2O, 0% to 7% of MgO, 0% to 7% of CaO, 0.01% to 7% of SrO, 0% to 7% of BaO, and 0% to 10% of ZrO.sub.2, has a Young's modulus of 60 GPa or more, and has an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 85×10.sup.−7/° C. or less. In addition, a glass substrate of the present invention comprises as a glass composition, in terms of mol %, 64% to 76% of SiO.sub.2, 4% to 15% of Al.sub.2O.sub.3, 4% to 16% of B.sub.2O.sub.3, 0.1% to 14% of Li.sub.2O, 0.01% to 14% of Na.sub.2O, 0% to 15% of K.sub.2O, 0.01% to 7% of MgO, 0.01% to 7% of CaO, 0.01% to 7% of SrO, 0% to 7% of BaO, and 0% to 10% of ZrO.sub.2, has a Young's modulus of 60 GPa or more, and has an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 85×10.sup.−7/° C. or less. In addition, a glass substrate of the present invention comprises as a glass composition, in terms of mol %, 64% to 76% of SiO.sub.2, 4% to 15% of Al.sub.2O.sub.3, 4% to 16% of B.sub.2O.sub.3, 1.5% to 8.5% of Li.sub.2O, 0.01% to 14% of Na.sub.2O, 0% to 15% of K.sub.2O, 0.01% to 7% of MgO, 0.01% to 7% of CaO, 0.01% to 7% of SrO, 0% to 7% of BaO, and 0% to 10% of ZrO.sub.2, has a Young's modulus of 60 GPa or more, and has an average linear thermal expansion coefficient within a temperature range of from 30° C. to 380° C. of 38×10.sup.−7/° C. or more and 85×10.sup.−7/° C. or less. The technical features of the glass substrate of the present invention have already been described in the description section of the support glass substrate of the present invention, and hence detailed description thereof is omitted here.

    Example 1

    [0134] Now, the present invention is described by way of Examples. However, Examples below are merely examples, and the present invention is by no means limited to the following Examples.

    [0135] The glass compositions and glass characteristics of Examples (Sample Nos. 1 to 361) of the present invention are shown in Tables 1 to 36. In the tables, the “N.A.” means “unmeasured”, the “Li/(Na+K)” means the molar ratio [Li.sub.2O]/([Na.sub.2O]+[K.sub.2O]), the “Li+Na+K” means the molar ratio [Li.sub.2O]+[Na.sub.2O]+[K.sub.2O], the “Li/P” means the molar ratio [Li.sub.2O]/[P.sub.2O.sub.5], the “(Na—Li)/(Al+B+P)” means the molar ratio ([Na.sub.2O]?[Li.sub.2O])/([Al.sub.2O.sub.3]+[B.sub.2O.sub.3]+[P.sub.2O.sub.5]), the “(B+Na—P)/(Al+Li)” means the molar ratio ([B.sub.2O.sub.3]+[Na.sub.2O]?[P.sub.2O.sub.5])/([Al.sub.2O.sub.3]+[Li.sub.2O]), and the “Si+1.2P-3Al-2Li-1.5Na—K—B” means the [SiO.sub.2]+1.2×[P.sub.2O.sub.5]-3×[Al.sub.2O.sub.3]-2×[Li.sub.2O]-1.5×[Na.sub.2O]—[K.sub.2O]—[B.sub.2O.sub.3]. In addition, a value in parentheses is a calculation value estimated from the glass composition.

    TABLE-US-00001 TABLE 1 (mol %) No. 1 No. 2 No. 3 No. 4 No. 5 No. 6 No. 7 No. 8 No. 9 No. 10 SiO.sub.2 59.07 59.07 60.07 61.07 61.07 61.07 61.07 61.07 61.07  61.07 Al.sub.2O.sub.3 17.81 15.81 17.81 18.81 17.81 16.81 16.81 15.81 15.81  17.81 B.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Li.sub.2O 8.34 8.34 8.34 7.34 7.34 8.34 7.34 7.34 8.34 8.34 Na.sub.2O 11.10 13.10 10.10 9.10 10.10 10.10 11.10 12.10 11.10  9.10 K.sub.2O 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 MgO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 1.16 1.16 1.16 1.16 1.16 1.16 1.16 1.16 1.16 1.16 P.sub.2O.sub.5 2.47 2.47 2.47 2.47 2.47 2.47 2.47 2.47 2.47 2.47 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Li/(Na + K) 0.75 0.64 0.83 0.81 0.73 0.83 0.66 0.61 0.75 0.92 (Na + K)/Li 1.33 1.57 1.21 1.24 1.38 1.21 1.51 1.65 1.33 1.09 Li + Na + K 19.44 21.44 18.44 16.44 17.44 18.44 18.44 19.44 19.44  17.44 Li/P 3.38 3.38 3.38 2.97 2.97 3.38 2.97 2.97 3.38 3.38 P/Li 0.30 0.30 0.30 0.34 0.34 0.30 0.34 0.34 0.30 0.30 (Na − Li)/ 0.14 0.26 0.09 0.08 0.14 0.09 0.19 0.26 0.15 0.04 (Al + B + P) (B + Na − P)/ 0.33 0.44 0.29 0.25 0.30 0.30 0.36 0.42 0.36 0.25 (Al + Li) Si + 1.2P − 3Al − −24.72 −21.72 −22.22 −20.72 −19.22 −18.22 −17.72 −16.22 −16.72  −19.72 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.452 2.459 2.445 2.438 2.440 2.441 2.444 2.447  2.443 2.437 α.sub.30-380° C. 87.3 94.6 83.6 75.0 83.0 81.0 85.0 88.5 87.9  78.0 (×10.sup.−7/° C.) Ts (° C.) 856 N.A. N.A. 915 889 874 867 861 844    N.A. 10.sup.2.5 dPa .Math. s 1,518 1,475 1,535 1,561 1,560 1,547 1,552 1,535 1,524    1,550 (° C.) TL (° C.) 1,049 916 1,088 1,125 1,078 1,085 1,035 976 1,056>    1,125 logη at TL 5.3 6.4 3.9 5.2 5.4 5.2 5.6 6.1 5.2< 4.9 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,248 1,129 1,292 1,389 1,309 1,248 1,264 1,198 1,152    1,326 DOL_ZERO.sub.K 20 24 19 16 19 19 21 24 22    18 (μm) CS.sub.Na (MPa) 287 201 312 279 269 269 248 211 236    299 DOL_ZERO.sub.Na 125 121 126 134 123 123 128 126 143    136 (μm)

    TABLE-US-00002 TABLE 2 (mol %) No. 11 No. 12 No. 13 No. 14 No. 15 No. 16 No. 17 No. 18 No. 19 No. 20 SiO.sub.2 63.07 61.07 63.07 63.07 61.07 61.07 60.30 61.07 59.07 60.07 Al.sub.2O.sub.3 15.81 17.81 15.81 17.81 15.81 15.81 18.95 17.81 15.81 17.81 B.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.20 0.00 2.00 2.00 Li.sub.2O 8.34 8.34 7.34 8.34 7.34 8.34 7.22 8.34 8.34 8.34 Na.sub.2O 11.10 11.10 12.10 9.10 12.10 11.10 8.20 9.10 13.10 10.10 K.sub.2O 0.00 0.00 0.00 0.00 0.00 0.00 0.44 0.00 0.00 0.00 MgO 0.00 0.00 0.00 0.00 2.00 2.00 0.26 2.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 1.16 1.16 1.16 1.16 1.16 1.16 0.00 1.16 1.16 1.16 P.sub.2O.sub.5 0.47 0.47 0.47 0.47 0.47 0.47 4.28 0.47 0.47 0.47 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.05 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.03 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.00 0.00 0.00 0.00 0.00 0.00 0.07 0.00 0.00 0.00 Li/(Na + K) 0.75 0.75 0.61 0.92 0.61 0.75 0.84 0.92 0.64 0.83 (Na + K)/Li 1.33 1.33 1.65 1.09 1.65 1.33 1.20 1.09 1.57 1.21 Li + Na + K 19.44 19.44 19.44 17.44 19.44 19.44 15.86 17.44 21.44 18.44 Li/P 17.73 17.73 15.60 17.73 15.60 17.73 1.69 17.73 17.73 17.73 P/Li 0.06 0.06 0.06 0.06 0.06 0.06 0.59 0.06 0.06 0.06 (Na − Li)/ 0.17 0.15 0.29 0.04 0.29 0.17 0.04 0.04 0.26 0.09 (Al + B + P) (B + Na − P)/ 0.44 0.41 0.50 0.33 0.50 0.44 0.16 0.33 0.61 0.44 (Al + Li) Si + 1.2P − 3Al − −17.12 −25.12 −16.62 −20.12 −18.62 −19.12 −18.79 −22.12 −26.12 −26.62 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.454 2.460 2.457 2.446 2.471 2.469 2.403 2.463 2.462 2.442 α.sub.30-380° C. 86.9 87.1 88.8 79.4 89.2 88.2 73.5 78.4 92.0 82.3 (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. 823 N.A. 806 N.A. 926 N.A. 743 N.A. 10.sup.2.5 dPa .Math. s 1,527 1,528 1,535 1,558 1,489 1,480 1,579 1,507 1,449 1,496 (° C.) TL (° C.) 1,032 1,070 984 1,134 957 1,018 1,108 1,230 904 1,089 logη at TL 5.1 5.1 5.7 4.9 5.7 5 5.5 3.9 5.6 4.9 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. 19.9 N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. 1.5 N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 80 80 N.A. N.A. N.A. N.A. N.A. N.A. 78 N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 967 1,165 1,083 1,449 1,170 1,149 1,072 1,460 932 1,293 DOL_ZERO.sub.K 18 17 17 16 14 12 25 10 14 14 (μm) CS.sub.Na (MPa) 278 305 236 304 224 262 260 309 298 302 DOL_ZERO.sub.Na 116 119 119 137 98 104 126 104 93 107 (μm)

    TABLE-US-00003 TABLE 3 (mol %) No. 21 No. 22 No. 23 No. 24 No. 25 No. 26 No. 27 No. 28 No. 29 No. 30 SiO.sub.2 60.07 61.07 61.07 61.07 61.07 59.07 59.07 59.07 59.07 59.07 Al.sub.2O.sub.3 15.81 18.81 17.81 16.81 16.81 17.81 16.81 18.81 18.81 17.81 B.sub.2O.sub.3 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 Li.sub.2O 8.34 7.34 7.34 8.34 7.34 7.34 8.34 8.34 7.34 9.34 Na.sub.2O 12.10 9.10 10.10 10.10 11.10 12.10 12.10 10.10 11.10 10.10 K.sub.2O 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 MgO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 1.16 1.16 1.16 1.16 1.16 1.16 1.16 1.16 1.16 1.16 P.sub.2O.sub.5 0.47 0.47 0.47 0.47 0.47 0.47 0.47 0.47 0.47 0.47 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Li/(Na + K) 0.69 0.81 0.73 0.83 0.66 0.61 0.69 0.83 0.66 0.93 (Na + K)/Li 1.45 1.24 1.38 1.21 1.51 1.65 1.45 1.21 1.51 1.08 Li + Na + K 20.44 16.44 17.44 18.44 18.44 19.44 20.44 18.44 18.44 19.44 Li/P 17.73 15.60 15.60 17.73 15.60 15.60 17.73 17.73 15.60 19.85 P/Li 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.05 (Na − Li)/ 0.21 0.08 0.14 0.09 0.19 0.23 0.19 0.08 0.18 0.04 (Al + B + P) (B + Na − P)/ 0.56 0.41 0.46 0.46 0.52 0.54 0.54 0.43 0.48 0.43 (Al + Li) Si + 1.2P − 3Al − −23.62 −25.12 −23.62 −22.62 −22.12 −28.62 −27.62 −30.62 −30.12 −29.62 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.455 2.438 2.438 2.440 2.443 2.452 2.456 2.450 2.450 2.450 α.sub.30-380° C. 88.9 73.6 79.6 83.0 83.7 88.0 90.0 82.0 83.0 84.0 (×10.sup.−7/° C.) Ts (° C.) 756 882 862 827 821 819 777 850 856 N.A. 10.sup.2.5 dPa .Math. s 1,488 1,530 1,530 1,508 1,524 1,509 1,474 1,493 1,507 1,480 (° C.) TL (° C.) 967 1,060 1,078 1,091 1,030 991 985 1,051 1,040 1,068 logη at TL 5.3 5.5 5.2 4.8 5.3 5.6 5.3 5.2 5.4 4.8 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. 76 78 N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 860 1,438 1,385 1,218 1,230 1,264 1,087 1,439 1,433 1,225 DOL_ZERO.sub.K 13 12 15 13 15 14 14 12 14 12 (μm) CS.sub.Na (MPa) 259 297 312 324 271 282 292 309 280 340 DOL_ZERO.sub.Na 100 111 119 108 111 106 92 112 118 112 (μm)

    TABLE-US-00004 TABLE 4 (mol %) No. 31 No. 32 No. 33 No. 34 No. 35 No. 36 No. 37 No. 38 No. 39 No. 40 SiO.sub.2 61.07 61.07 61.07 63.58 61.07  61.07  63.40 66.59 63.51 60.94 Al.sub.2O.sub.3 15.81 15.81 17.81 16.55 17.81  19.81  15.88 11.26 16.60 13.57 B.sub.2O.sub.3 2.00 2.00 2.00 0.00 2.00 0.00 0.00 0.00 0.00 0.59 Li.sub.2O 7.34 8.34 8.34 8.19 4.34 8.34 6.37 10.19 8.20 0.03 Na.sub.2O 12.10 11.10 9.10 8.09 13.10  7.10 10.66 5.42 8.12 15.27 K.sub.2O 0.00 0.00 0.00 0.52 0.00 0.00 0.02 1.41 0.52 3.24 MgO 0.00 0.00 0.00 0.33 0.00 0.00 0.01 3.15 0.30 3.54 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.02 0.02 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 1.29 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.53 0.00 0.00 ZnO 1.16 1.16 1.16 0.00 1.16 1.16 1.13 0.00 0.00 0.00 P.sub.2O.sub.5 0.47 0.47 0.47 2.70 0.47 2.47 2.49 0.00 2.71 2.62 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.00 0.00 0.04 0.14 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.02 0.00 0.00 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.16 0.00 0.00 Cl 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.05 Li/(Na + K) 0.61 0.75 0.92 0.95 0.33 1.18 0.60 1.49 0.95 0.00 (Na + K)/Li 1.65 1.33 1.09 1.05 3.02 0.85 1.68 0.67 1.05 617.00 Li + Na + K 19.44 19.44 17.44 16.80 17.44  15.44  17.05 17.02 16.84 18.54 Li/P 15.60 17.73 17.73 3.03 9.23 3.38 2.56 — 3.03 0.01 P/Li 0.06 0.06 0.06 0.33 0.11 0.30 0.39 0.00 0.33 87.33 (Na − Li)/ 0.26 0.15 0.04 −0.01 0.43 −0.06  0.23 −0.42 0.00 0.91 (Al + B + P) (B + Na − P)/ 0.59 0.52 0.41 0.22 0.66 0.16 0.37 0.25 0.22 0.97 (Al + Li) Si + 1.2P − 3Al − −20.62 −21.12 −24.12 −11.87 −22.12  −22.72  −10.00 2.89 −12.14 −3.42 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.449 2.448 2.435 2.404  2.442  2.437 2.428 N.A. 2.404 2.440 α.sub.30-380° C. 87.3 85.9 78.3 79.4 82.8  67.6  81.3 N.A. N.A. 104.3 (×10.sup.−7/° C.) Ts (° C.) 785 781 N.A. N.A. 891    917    876 N.A. 892 925 10.sup.2.5 dPa .Math. s 1,508 1,487 1,519 1,593 1,564    1,541    1,561 N.A. 1,593 1,588 (° C.) TL (° C.) 938> 1,034 1,117 1,145 938>    1,343<    1,008 N.A. 1,145 N.A. logη at TL 5.8< 4.9 4.9 5.14 7.0< 3.5> 6.3 N.A. 5.14 N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 4.0 N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 0.6 N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. 77 N.A. N.A. 77 N.A. 78 70 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,045 1,026 1,379 1,021 1,474    1,376    N.A. N.A. 1,021 N.A. DOL_ZERO.sub.K 15 13 14 26 21    11    N.A. N.A. 26 N.A. (μm) CS.sub.Na (MPa) 255 280 330 310 163    324    N.A. N.A. 310 N.A. DOL_ZERO.sub.Na 105 105 115 131 132    116    N.A. N.A. 131 N.A. (μm)

    TABLE-US-00005 TABLE 5 (mol %) No. 41 No. 42 No. 43 No. 44 No. 45 No. 46 No. 47 No. 48 No. 49 No. 50 SiO.sub.2 62.24 62.24 60.24 60.24 62.24 62.24 60.24 60.24 58.24 56.24 Al.sub.2O.sub.3 17.81 15.81 17.81 15.81 17.81 15.81 17.81 15.81 17.81 17.81 B.sub.2O.sub.3 2.00 2.00 2.00 2.00 0.00 0.00 0.00 0.00 2.00 2.00 Li.sub.2O 8.34 8.34 8.34 8.34 8.34 8.34 8.34 8.34 8.34 8.34 Na.sub.2O 9.10 11.10 11.10 13.10 9.10 11.10 11.10 13.10 9.10 11.10 K.sub.2O 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 4.00 4.00 MgO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.47 0.47 0.47 0.47 2.47 2.47 2.47 2.47 0.47 0.47 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.92 0.75 0.75 0.64 0.92 0.75 0.75 0.64 0.64 0.55 (Na + K)/Li 1.09 1.33 1.33 1.57 1.09 1.33 1.33 1.57 1.57 1.81 Li + Na + K 17.44 19.44 19.44 21.44 17.44 19.44 19.44 21.44 21.44 23.44 Li/P 17.73 17.73 17.73 17.73 3.38 3.38 3.38 3.38 17.73 17.73 P/Li 0.06 0.06 0.06 0.06 0.30 0.30 0.30 0.30 0.06 0.06 (Na − Li)/ 0.04 0.15 0.14 0.26 0.04 0.15 0.14 0.26 0.04 0.14 (Al + B + P) (B + Na − P)/ 0.41 0.52 0.48 0.61 0.25 0.36 0.33 0.44 0.41 0.48 (Al + Li) Si + 1.2P − 3Al − −22.96 −19.96 −27.96 −24.96 −18.56 −15.56 −23.56 −20.56 −30.96 −35.96 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.410 2.426 2.427 2.442 2.413 2.422 2.428 2.436 2.442 2.458 α.sub.30-380° C. 80.3 86.9 86.9 91.8 80.8 88.6 88.7 94.8 96.9 103.9 (×10.sup.−7/° C.) Ts (° C.) 877 775 827 738 917 N.A. 877 N.A. 773 N.A. 10.sup.2.5 dPa .Math. s 1,538 1,517 1,516 1,467 1,580 1,548 1,546 1,498 1,492 1,461 (° C.) TL (° C.) 1,152 1,047 1,030 914 1,126 1,029 1,125 1,066 1,216 941 logη at TL 4.66 4.87 5.33 5.55 5.19 5.62 4.87 4.90 3.74 5.25 (dPa .Math. s) Acid resistance 34.8< N.A. 34.8< N.A. 34.8 28.5 34.8< 34.8< N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance 0.8 N.A. 0.8 N.A. 0.9 0.8 0.9 0.7 N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 78 78 78 79 78 77 77 77 78 79 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,307 932 1,124 751 1,262 1,016 1,151 1,018 810 N.A. DOL_ZERO.sub.K 15.7 14.8 15.4 13.1 21.4 24.4 23.6 26.8 23.1 N.A. (μm) CS.sub.Na (MPa) 279 221 272 212 258 197 324 165 202 N.A. DOL_ZERO.sub.Na 135.7 118.8 116.2 105.0 153.7 158.0 131.9 133.5 85.6 N.A. (μm)

    TABLE-US-00006 TABLE 6 (mol %) No. 51 No. 52 No. 53 No. 54 No. 55 No. 56 No. 57 No. 58 No. 59 No. 60 SiO.sub.2 58.24 56.24 61.24 61.24 60.24 62.24 62.24 60.24 60.24 62.24 Al.sub.2O.sub.3 17.81 17.81 16.81 15.81 16.81 15.81 15.81 17.81 15.81 15.81 B.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.50 0.00 0.00 0.00 0.50 Li.sub.2O 8.34 8.34 8.34 8.34 8.34 8.34 5.84 5.84 5.84 5.84 Na.sub.2O 9.10 11.10 11.10 12.10 12.10 11.10 11.10 11.10 13.10 11.10 K.sub.2O 4.00 4.00 0.00 0.00 0.00 0.00 2.50 2.50 2.50 2.50 MgO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 2.47 2.47 2.47 2.47 2.47 1.97 2.47 2.47 2.47 1.97 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.64 0.55 0.75 0.69 0.69 0.75 0.43 0.43 0.37 0.43 (Na + K)/Li 1.57 1.81 1.33 1.45 1.45 1.33 2.33 2.33 2.67 2.33 Li + Na + K 21.44 23.44 19.44 20.44 20.44 19.44 19.44 19.44 21.44 19.44 Li/P 3.38 3.38 3.38 3.38 3.38 4.23 2.36 2.36 2.36 2.96 P/Li 0.30 0.30 0.30 0.30 0.30 0.24 0.42 0.42 0.42 0.34 (Na − Li)/ 0.04 0.14 0.14 0.21 0.19 0.15 0.29 0.26 0.40 0.29 (Al + B + P) (B + Na − P)/ 0.25 0.33 0.34 0.40 0.38 0.40 0.40 0.36 0.49 0.44 (Al + Li) Si + 1.2P − 3Al − −26.56 −31.56 −19.56 −18.06 −22.06 −16.66 −13.06 −21.06 −18.06 −14.16 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.442 2.455 2.423 2.427 2.431 2.419 2.426 2.432 2.440 2.425 α.sub.30-380° C. 99.8 107.4 88.4 92.1 92.1 87.6 96.7 95.2 102.5 95.3 (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. 860 N.A. N.A. N.A. N.A. 893 N.A. N.A. 10.sup.2.5 dPa .Math. s 1,537 1,494 1,547 1,528 1,529 1,537 1,589 1,593 1,544 1,576 (° C.) TL (° C.) 1,120 1,018 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL 4.78< 5.39 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance 34.8< 34.8< N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance 0.9 0.9 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 77 77 77 77 77 77 74 75 75 75 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 889 N.A. 915 894 1,173 806 N.A. N.A. N.A. N.A. DOL_ZERO.sub.K 36.1 N.A. 28.8 29.9 31.2 24.9 N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) 259 N.A. 255 194 227 237 N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na 95.1 N.A. 132.3 140.8 150.6 147.3 N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00007 TABLE 7 (mol %) No. 61 No. 62 No. 63 No. 64 No. 65 No. 66 No. 67 No. 68 No. 69 No. 70 SiO.sub.2 63.07 63.07 66.40 66.40 63.07 63.07 63.07 63.07 63.07 63.07 Al.sub.2O.sub.3 16.81 16.81 8.51 8.51 16.81 16.81 16.81 16.81 17.21 15.71 B.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.60 0.60 Li.sub.2O 4.34 4.34 4.21 4.21 4.34 4.34 4.34 4.34 4.34 4.34 Na.sub.2O 14.10 13.10 8.55 8.55 13.10 13.10 13.10 13.10 13.10 13.10 K.sub.2O 0.00 1.00 3.73 3.73 0.00 0.00 0.00 0.00 0.00 0.00 MgO 0.00 0.00 0.00 0.00 1.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 1.16 1.16 6.02 4.02 1.16 1.16 1.16 2.16 1.16 1.16 P.sub.2O.sub.5 0.47 0.47 0.81 2.81 0.47 1.47 0.47 0.47 0.47 1.97 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 1.74 1.74 0.00 0.00 1.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.31 0.31 0.34 0.34 0.33 0.33 0.33 0.33 0.33 0.33 (Na + K)/Li 3.25 3.25 2.91 2.91 3.02 3.02 3.02 3.02 3.02 3.02 Li + Na + K 18.44 18.44 16.48 16.48 17.44 17.44 17.44 17.44 17.44 17.44 Li/P 9.23 9.23 5.18 1.50 9.23 2.95 9.23 9.23 9.23 2.20 P/Li 0.11 0.11 0.19 0.67 0.11 0.34 0.11 0.11 0.11 0.45 (Na − Li)/ 0.56 0.51 0.47 0.38 0.51 0.48 0.51 0.51 0.48 0.48 (Al + B + P) (B + Na − P)/ 0.64 0.60 0.61 0.45 0.60 0.55 0.60 0.60 0.61 0.58 (Al + Li) Si + 1.2P − 3Al − −16.62 −16.12 16.89 19.29 −15.12 −13.92 −15.12 −15.12 −16.92 −10.62 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.460 2.461 2.535 2.478 2.460 2.446 2.458 2.472 2.448 2.437 α.sub.30-380° C. 90.5 93.3 90.6 90.4 86.1 85.8 86.0 85.2 85.9 85.8 (×10.sup.−7/° C.) Ts (° C.) 890 902 918 N.A. 903 918 903 899 904 873 10.sup.2.5 dPa .Math. s 1,592 1,488 1,603 1,531 1,591 1,613 1,597 1,596 1,598 1,599 (° C.) TL (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance 33.3< 33.3< 0 N.A. 33.3< 33.3 N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance 0.6 0.6 0.6 N.A. 0.1 0.7 N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 77 77 75 73 78 75 76 77 76 74 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. 1,265 1,290 1,264 N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. 24.6 22.2 25.4 N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. 167 170 175 N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. 122.8 127.7 133.1 N.A. (μm)

    TABLE-US-00008 TABLE 8 (mol %) No. 71 No. 72 No. 73 No. 74 No. 75 No. 76 No. 77 No. 78 No. 79 No. 80 SiO.sub.2 63.07 63.07 63.07 63.22 63.94 66.40 64.76 65.76 64.76 65.76 Al.sub.2O.sub.3 15.71 14.21 17.81 17.00 12.71 10.25 16.25 16.25 16.25 16.25 B.sub.2O.sub.3 0.60 0.60 0.00 0.40 0.40 0.00 0.10 0.10 0.10 0.10 Li.sub.2O 4.34 4.34 4.34 4.34 8.34 4.21 5.20 5.20 5.70 5.70 Na.sub.2O 13.10 13.10 13.10 13.10 11.10 8.55 11.00 11.00 10.50 10.50 K.sub.2O 1.50 1.50 0.00 1.50 0.50 4.23 1.25 1.25 1.25 1.25 MgO 0.00 0.00 0.00 0.00 0.50 0.00 1.00 0.00 1.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 1.16 1.16 1.16 0.00 0.00 5.52 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.47 1.97 0.47 0.40 2.47 0.81 0.40 0.40 0.40 0.40 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.30 0.30 0.33 0.30 0.72 0.33 0.42 0.42 0.49 0.49 (Na + K)/Li 3.36 3.36 3.02 3.36 1.39 3.03 2.36 2.36 2.06 2.06 Li + Na + K 18.94 18.94 17.44 18.94 19.94 16.98 17.45 17.45 17.45 17.45 Li/P 9.23 2.20 9.23 10.85 3.38 5.18 13.00 13.00 14.25 14.25 P/Li 0.11 0.45 0.11 0.09 0.30 0.19 0.08 0.08 0.07 0.07 (Na − Li)/ 0.52 0.52 0.48 0.49 0.18 0.39 0.35 0.35 0.29 0.29 (Al + B + P) (B + Na − P)/ 0.66 0.63 0.57 0.61 0.43 0.53 0.50 0.50 0.46 0.46 (Al + Li) Si + 1.2P − 3Al − −13.92 −7.62 −18.12 −17.53 −5.46 11.17 −11.76 −10.76 −12.01 −11.01 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.458 2.442 2.454 2.438 2.414 2.511 N.A. N.A. N.A. N.A. α.sub.30-380° C. 94.4 93.8 84.8 93.3 88.7 92.8 87.8 88.7 87.7 87.9 (×10.sup.−7/° C.) Ts (° C.) 828 N.A. 937 865 N.A. N.A. 883 899 877 893 10.sup.2.5 dPa .Math. s 1,582 1,567 1,613 1,611 1,486 1,527 1,609 1,639 1,605 1,634 (° C.) TL (° C.) N.A. N.A. N.A. 943 N.A. N.A. 961 965 1,016 1,005 logη at TL N.A. N.A. N.A. 6.69 N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. 2.4 N.A. 33.3< 0.1 0 43.2 48.0 34.1 31.4 (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. 0.2 N.A. 0.6 0.6 0.6 0.5 0.6 0.5 0.5 (NaOH 5 wt % 80° C. 6 h) E (GPa) 76 73 77 76 76 74 77 76 77 76 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. 1,073 1,020 1,058 1,024 DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. 30.5 32.1 26.1 30.3 (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. 229 213 235 236 DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. 108.0 117.5 115.9 115.1 (μm)

    TABLE-US-00009 TABLE 9 (mol %) No. 81 No. 82 No. 83 No. 84 No. 85 No. 86 No. 87 No. 88 No. 89 No. 90 SiO.sub.2 64.24 64.61 64.61  62.99 63.58 63.58 63.58 62.58 66.26 66.26 Al.sub.2O.sub.3 17.81 17.81 18.81  17.81 16.55 16.55 15.55 17.55 16.25 16.25 B.sub.2O.sub.3 0.00 0.10 0.10 0.10 0.00 0.00 0.00 0.00 0.10 0.10 Li.sub.2O 6.34 6.34 7.34 8.90 9.19 7.19 8.69 8.19 5.20 5.70 Na.sub.2O 11.10 9.85 7.85 8.90 7.09 9.09 8.59 8.09 10.50 10.00 K.sub.2O 0.00 1.25 1.25 1.25 0.52 0.52 0.52 0.52 1.25 1.25 MgO 0.00 0.00 0.00 0.00 0.33 0.33 0.33 0.33 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.47 0.00 0.00 0.00 2.70 2.70 2.70 2.70 0.40 0.40 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.57 0.57 0.81 0.88 1.21 0.75 0.95 0.95 0.44 0.51 (Na + K)/Li 1.75 1.75 1.24 1.14 0.83 1.34 1.05 1.05 2.26 1.97 Li + Na + K 17.44 17.44 16.44  19.06 16.80 16.80 17.80 16.80 16.95 16.95 Li/P 13.48 — — — 3.40 2.66 3.22 3.03 13.00 14.25 P/Li 0.07 0.00 0.00 0.00 0.29 0.38 0.31 0.33 0.08 0.07 (Na − Li)/ 0.26 0.20 0.03 0.00 −0.11 0.10 −0.01 0.00 0.32 0.26 (Al + B + P) (B + Na − P)/ 0.44 0.41 0.30 0.34 0.17 0.27 0.24 0.21 0.48 0.44 (Al + Li) Si + 1.2P − 3Al − −17.96 −17.63 −19.63  −22.95 −12.37 −11.37 −10.62 −15.87 −9.51 −9.76 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.424 2.425  2.424 N.A. 2.402 2.407 2.408 2.409 2.416 2.414 α.sub.30-380° C. 84.8 86.6 77.5  88.4 79.0 82.0 84.0 79.7 87.4 86.4 (×10.sup.−7/° C.) Ts (° C.) 949 936 954    N.A. N.A. 915 N.A. 915 917 913 10.sup.2.5 dPa .Math. s 1,617 1,616 1,602    1,556 1,589 1,610 1,575 N.A. 1,644 1,648 (° C.) TL (° C.) 1,087 1,080 1,270<    N.A. 1,180 1,092 1,107 1,136 990 1,034 logη at TL N.A. 5.91 N.A. N.A. N.A. 5.60 N.A. N.A. N.A. 6.24 (dPa .Math. s) Acid resistance 31.9 34.4 34.9  >100 4.1 4.3 2.2 16.6 12.0 8.4 (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. 0.6 1.4  0.0 0.8 0.7 0.7 0.9 0.6 0.6 (NaOH 5 wt % 80° C. 6 h) E (GPa) 78 78 80    N.A. 77 76 77 77 76 76 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,315 1,273 1,319    1,071 1,059 1,074 967 1,138 1,045 1,039 DOL_ZERO.sub.K 26.9 31.1 22.6  17.3 23.4 30.1 24.9 25.0 38.8 37.0 (μm) CS.sub.Na (MPa) 281 294 352    401 388 280 288 339 240 260 DOL_ZERO.sub.Na 134.0 116.0 108.4   87.0 113.8 122.3 120.5 111.5 121.2 129.4 (μm)

    TABLE-US-00010 TABLE 10 (mol %) No. 91 No. 92 No. 93 No. 94 No. 95 No. 96 No. 97 No. 98 No. 99 No. 100 SiO.sub.2 66.26 65.76 63.36 64.36 63.36 63.36 63.50 63.50 63.50  63.50  Al.sub.2O.sub.3 16.25 16.25 17.81 17.81 17.81 17.81 15.56 17.56 15.56  14.56  B.sub.2O.sub.3 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li.sub.2O 4.70 4.70 8.34 8.34 8.84 8.34 8.10 6.10 6.10 6.10 Na.sub.2O 11.00 11.50 9.10 8.10 8.60 8.60 8.00 8.00 10.00  11.00  K.sub.2O 1.25 1.25 1.25 1.25 1.25 1.75 2.15 2.15 2.15 2.15 MgO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.40 0.40 0.00 0.00 0.00 0.00 2.55 2.55 2.55 2.55 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.38 0.37 0.81 0.89 0.90 0.81 0.80 0.60 0.50 0.46 (Na + K)/Li 2.61 2.71 1.24 1.12 1.11 1.24 1.25 1.66 1.99 2.16 Li + Na + K 16.95 17.45 18.69 17.69 18.69 18.69 18.25 16.25 18.25  19.25  Li/P 11.75 11.75 — — — — 3.18 2.39 2.39 2.39 P/Li 0.09 0.09 0.00 0.00 0.00 0.00 0.31 0.42 0.42 0.42 (Na − Li)/ 0.38 0.41 0.04 −0.01 −0.01 0.01 −0.01 0.09 0.21 0.28 (Al + B + P) (B + Na − P)/ 0.51 0.53 0.35 0.31 0.33 0.33 0.23 0.23 0.35 0.41 (Al + Li) Si + 1.2P − 3Al − −9.26 −10.51 −21.75 −19.25 −22.00 −21.50 −10.57 −12.57 −9.57  −8.07  2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.413 2.418 2.431 2.422 2.429 2.431 2.409 2.404  2.414  2.418 α.sub.30-380° C. 87.9 89.5 86.3 84.1 86.9 87.9 87.9 82.6 91.4  93.7  (×10.sup.−7/° C.) Ts (° C.) 923 902 N.A. N.A. N.A. N.A. N.A. 938 860    880    10.sup.2.5 dPa .Math. s 1,658 1,656 1,572 1,595 1,570 1,578 1,579 1,630 1,606    1,574    (° C.) TL (° C.) 939 916 1,092 1,137 1,113 1,084 1,020 1,036 1,014>    1,014>    logη at TL N.A. N.A. N.A. 5.20 N.A. N.A. N.A. 6.41 N.A. N.A. (dPa .Math. s) Acid resistance 16.7 78.6< 76.4< 74.7< 78.2< 78.3< 4.8 16.2 8.0  1.2  (HCl 5 wt % 80° C. 24 h) Alkali resistance 0.6 0.6 0.6 0.6 0.6 0.5 0.8 0.9 0.8  0.6  (NaOH 5 wt % 80° C. 6 h) E (GPa) 75 75 80 80 80 79 76 75 74    74    K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,075 1,021 1,033 1,142 1,020 1,023 843 1,046 895 N.A. DOL_ZERO.sub.K 39.2 37.5 25.3 27.3 24.7 27.4 40.7 44.4 46.9  N.A. (μm) CS.sub.Na (MPa) 234 235 354 401 383 360 287 282 218    N.A. DOL_ZERO.sub.Na 114.9 113.2 119.5 113.8 100.6 104.9 113.8 113.0 108.3   N.A. (μm)

    TABLE-US-00011 TABLE 11 (mol %) No. 101 No. 102 No. 103 No. 104 No. 105 No. 106 No. 107 No. 108 No. 109 No. 110 SiO.sub.2 62.89 62.89 62.89 62.89 62.96 63.36 62.96 62.96 65.65 64.10 Al.sub.2O.sub.3 17.81 18.81 17.81 16.81 18.81 18.81 18.81 18.10 17.56 18.10 B.sub.2O.sub.3 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li.sub.2O 8.34 7.34 7.34 8.34 7.34 7.34 7.34 8.72 6.10 6.33 Na.sub.2O 9.10 9.10 10.10 10.10 8.60 8.60 8.60 7.93 8.00 8.24 K.sub.2O 1.25 1.25 1.25 1.25 0.75 0.75 0.75 0.75 2.15 1.69 MgO 0.00 0.00 0.00 0.00 1.00 1.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.47 0.47 0.47 0.47 0.40 0.00 1.40 1.40 0.40 1.40 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.81 0.71 0.65 0.73 0.79 0.79 0.79 1.00 0.60 0.64 (Na + K)/Li 1.24 1.41 1.55 1.36 1.27 1.27 1.27 1.00 1.66 1.57 Li + Na + K 18.69 17.69 18.69 19.69 16.69 16.69 16.69 17.40 16.25 16.26 Li/P 17.74 15.62 15.62 17.74 18.35 — 5.24 6.23 15.25 4.52 P/Li 0.06 0.06 0.06 0.06 0.05 0.00 0.19 0.16 0.07 0.22 (Na − Li)/ 0.04 0.09 0.15 0.10 0.07 0.07 0.06 −0.04 0.11 0.10 (Al + B + P) (B + Na − P)/ 0.33 0.33 0.39 0.39 0.32 0.33 0.28 0.25 0.33 0.28 (Al + Li) Si + 1.2P − 3Al − −21.65 −22.65 −21.15 −20.15 −21.42 −21.50 −20.22 −19.84 −13.00 −15.33 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.427 2.426 2.430 2.434 2.430 2.433 2.417 2.413 2.417 2.414 α.sub.30-380° C. 87.9 82.6 91.4 93.7 78.1 79.0 79.0 81.4 81.9 80.2 (×10.sup.−7/° C.) Ts (° C.) N.A. 930 887 N.A. 921 927 937 915 974 963 10.sup.2.5 dPa .Math. s 1,569 1,584 1,584 1,556 1,571 1,573 1,594 1,574 1,653 1,636 (° C.) TL (° C.) 1,110 1,086 1,059 1,032 N.A. N.A. N.A. N.A. 1,173 1,204 logη at TL N.A. 5.71 N.A. N.A. N.A. N.A. N.A. N.A. 5.40 5.00 (dPa .Math. s) Acid resistance 67.5 77.1 76.6 61.0 55.7 51.8 38.4 36.0 35.9 33.8 (HCl 5 wt % 80° C. 24 h) Alkali resistance 0.5 0.7 0.5 0.5 0.8 0.7 1.0 0.8 0.7 0.9 (NaOH 5 wt % 80° C. 6 h) E (GPa) 79 79 78 79 80 81 78 78 78 77 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,055 1,176 1,056 894 1,301 1,345 1,227 1,160 1,195 1,171 DOL_ZERO.sub.K 29.0 29.4 29.6 25.3 18.7 18.1 21.3 21.8 31.5 32.7 (μm) CS.sub.Na (MPa) 354 313 295 330 345 362 324 351 290 303 DOL_ZERO.sub.Na 108.5 121.7 124.0 102.4 108.4 97.4 108.6 123.7 108.7 104.6 (μm)

    TABLE-US-00012 TABLE 12 (mol %) No. 111 No. 112 No. 113 No. 114 No. 115 No. 116 No. 117 No. 118 No. 119 No. 120 SiO.sub.2 64.10 62.60 64.50 64.50 64.50 64.50 64.50 64.50 64.50 64.50 Al.sub.2O.sub.3 18.10 18.10 18.50 18.50 18.50 18.50 18.50 18.50 18.50 18.50 B.sub.2O.sub.3 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li.sub.2O 6.33 6.33 6.00 7.00 8.00 6.00 7.00 8.00 6.00 7.00 Na.sub.2O 8.24 8.94 6.00 5.00 4.00 7.00 6.00 5.00 8.00 7.00 K.sub.2O 0.04 0.84 0.76 0.76 0.76 0.76 0.76 0.76 0.76 0.76 MgO 0.00 0.00 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 3.05 3.05 4.00 4.00 4.00 3.00 3.00 3.00 2.00 2.00 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.76 0.65 0.89 1.22 1.68 0.77 1.04 1.39 0.68 0.90 (Na + K)/Li 1.31 1.55 1.13 0.82 0.60 1.29 0.97 0.72 1.46 1.11 Li + Na + K 14.61 16.11 12.76 12.76 12.76 13.76 13.76 13.76 14.76 14.76 Li/P 2.08 2.08 1.50 1.75 2.00 2.00 2.33 2.67 3.00 3.50 P/Li 0.48 0.48 0.67 0.57 0.50 0.50 0.43 0.38 0.33 0.29 (Na − Li)/ 0.09 0.12 0.00 −0.09 −0.18 0.05 −0.05 −0.14 0.10 0.00 (Al + B + P) (B + Na − P)/ 0.22 0.25 0.09 0.04 0.00 0.17 0.12 0.08 0.25 0.20 (Al + Li) Si + 1.2P − 3Al − −11.70 −15.05 −8.06 −8.56 −9.06 −10.76 −11.26 −11.76 −13.46 −13.96 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.396 2.405 2.381 2.379 2.377 2.395 2.393 2.391 2.407 2.405 α.sub.30-380° C. 71.2 78.7 61.7 60.2 59.5 66.8 65.2 64.0 71.9 70.2 (×10.sup.−7/° C.) Ts (° C.) 966 947 981 972 966 976 968 961 974 965 10.sup.2.5 dPa .Math. s 1,635 1,642 1,644 1,632 1,618 1,636 1,623 1,612 1,630 1,618 (° C.) TL (° C.) 1,261 1,086 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL 4.60 5.93 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance 3.9 14.1 1.6 1.9 1.5 3.0 2.5 2.3 5.2 4.3 (HCl 5 wt % 80° C. 24 h) Alkali resistance 1.2 1.1 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 76 75 76 77 77 77 77 78 77 78 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,128 1,106 963 962 963 1,047 1,049 1,055 1,149 1,141 DOL_ZERO.sub.K 21.8 28.9 20.5 21.1 18.6 24.2 21.9 18.6 24.6 22.0 (μm) CS.sub.Na (MPa) 276 262 202 287 286 223 276 286 234 276 DOL_ZERO.sub.Na 132.6 122.6 134.4 119.2 125.3 132.8 124.9 123.6 128.1 123.7 (μm)

    TABLE-US-00013 TABLE 13 (mol %) No. 121 No. 122 No. 123 No. 124 No. 125 No. 126 No. 127 No. 128 No. 129 No. 130 SiO.sub.2 64.50 64.50 64.50 64.50 64.50 64.50 64.50 64.50 64.50 64.50 Al.sub.2O.sub.3 18.50 18.50 18.50 18.50 18.50 18.50 18.50 18.50 18.50 18.50 B.sub.2O.sub.3 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li.sub.2O 8.00 6.38 7.38 8.38 6.38 7.38 8.38 6.38 7.38 8.38 Na.sub.2O 6.00 6.38 5.38 4.38 7.38 6.38 5.38 8.38 7.38 6.38 K.sub.2O 0.76 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 MgO 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 2.00 4.00 4.00 4.00 3.00 3.00 3.00 2.00 2.00 2.00 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 1.18 1.00 1.37 1.91 0.86 1.16 1.56 0.76 1.00 1.31 (Na + K)/Li 0.85 1.00 0.73 0.52 1.16 0.86 0.64 1.31 1.00 0.76 Li + Na + K 14.76 12.76 12.76 12.76 13.76 13.76 13.76 14.76 14.76 14.76 Li/P 4.00 1.60 1.85 2.10 2.13 2.46 2.79 3.19 3.69 4.19 P/Li 0.25 0.63 0.54 0.48 0.47 0.41 0.36 0.31 0.27 0.24 (Na − Li)/ −0.10 0.00 −0.09 −0.18 0.05 −0.05 −0.14 0.10 0.00 −0.10 (Al + B + P) (B + Na − P)/ 0.15 0.10 0.06 0.02 0.18 0.13 0.09 0.26 0.21 0.17 (Al + Li) Si + 1.2P − 3Al − −14.46 −8.63 −9.13 −9.63 −11.33 −11.83 −12.33 −14.03 −14.53 −15.03 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.402 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. α.sub.30-380° C. 69 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) 957 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 10.sup.2.5 dPa .Math. s 1,609 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (° C.) TL (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,129 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K 20.4 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00014 TABLE 14 (mol %) No. 131 No. 132 No. 133 No. 134 No. 135 No. 136 No. 137 No. 138 No. 139 No. 140 SiO.sub.2 61.30 61.00 60.20 59.80 59.80 60.50 61.00 60.50 61.00 60.50 Al.sub.2O.sub.3 15.40 15.00 15.40 16.50 15.40 15.00 15.00 15.00 15.00 15.00 B.sub.2O.sub.3 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li.sub.2O 7.80 8.00 8.00 7.80 7.80 8.00 9.00 9.00 7.00 7.00 Na.sub.2O 7.00 7.80 7.80 7.00 7.00 7.80 6.80 6.80 8.80 8.80 K.sub.2O 2.50 1.50 1.50 2.50 2.50 1.50 1.50 1.50 1.50 1.50 MgO 2.36 2.06 2.46 3.46 2.36 2.06 2.06 2.06 2.06 2.06 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 3.50 4.50 4.50 2.80 4.00 5.00 4.50 5.00 4.50 5.00 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Li/(Na + K) 0.82 0.86 0.86 0.82 0.82 0.86 1.08 1.08 0.68 0.68 (Na + K)/Li 1.22 1.16 1.16 1.22 1.22 1.16 0.92 0.92 1.47 1.47 Li + Na + K 17.30 17.30 17.30 17.30 17.30 17.30 17.30 17.30 17.30 17.30 Li/P 2.23 1.78 1.78 2.79 1.95 1.60 2.00 1.80 1.56 1.40 P/Li 0.45 0.56 0.56 0.36 0.51 0.63 0.50 0.56 0.64 0.71 (Na − Li)/ −0.04 −0.01 −0.01 −0.04 −0.04 −0.01 −0.11 −0.11 0.09 0.09 (Al + B + P) (B + Na − P)/ 0.16 0.15 0.15 0.18 0.13 0.13 0.10 0.08 0.20 0.18 (Al + Li) Si + 1.2P − 3Al − −9.40 −7.90 −9.90 −15.04 −10.30 −7.80 −8.40 −8.30 −7.40 −7.30 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.418 2.410 2.415 2.435 2.417 2.408 2.408 2.405 2.413 2.411 α.sub.30-380° C. 86.5 86.2 86.5 86.3 87.4 86.4 84.6 84.9 88.1 88.5 (×10.sup.−7/° C.) Ts (° C.) 883 875 873 N.A. 879 872 870 864 881 876 10.sup.2.5 dPa .Math. s 1,560 1,554 1,545 1,524 1,553 1,554 1,546 1,543 1,566 1,565 (° C.) TL (° C.) 1,034 1,022 N.A. 1,040 N.A. 1,012 1,080 1,069 992 989 logη at TL 5.56 5.47 N.A. 5.53 N.A. 5.46 N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance 4.6 2.2 0.4 38.8 N.A. 2.3 1.8 2.1 2.2 2.4 (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. 1.1 N.A. N.A. N.A. 1.0 1.1 1.2 1.2 (NaOH 5 wt % 80° C. 6 h) E (GPa) 76 75 N.A. 79 N.A. 77 76 75 75 74 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 919 878 920 1,015 916 873 912 886 923 897 DOL_ZERO.sub.K 35.8 36.5 36.1 29.9 38.0 34.6 29.5 31.8 36.2 36.7 (μm) CS.sub.Na (MPa) 228 223 N.A. 257 N.A. 173 283 291 228 228 DOL_ZERO.sub.Na 108.5 123.2 N.A. 95.5 N.A. 123.5 122.0 119.1 117.8 111.7 (μm)

    TABLE-US-00015 TABLE 15 (mol %) No. 141 No. 142 No. 143 No. 144 No. 145 No. 146 No. 147 No. 148 No. 149 No. 150 SiO.sub.2 58.44 61.24 68.18 68.18 61.28 60.38 68.18 70.18 61.38 60.28 Al.sub.2O.sub.3 16.15 15.40 9.50 9.50 15.40 16.15 9.50 9.50 18.50 18.80 B.sub.2O.sub.3 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li.sub.2O 9.25 8.64 9.00 8.00 7.80 9.25 9.00 9.00 6.80 7.20 Na.sub.2O 6.75 6.46 8.16 8.16 7.00 6.75 6.16 6.16 8.40 8.10 K.sub.2O 0.75 2.50 3.00 3.00 2.50 0.75 3.00 3.00 0.30 0.45 MgO 4.00 2.40 2.00 3.00 2.36 2.06 4.00 2.00 0.50 0.50 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 4.50 3.20 0.00 0.00 3.50 4.50 0.00 0.00 3.96 4.30 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.16 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.10 Li/(Na + K) 1.23 0.96 0.81 0.72 0.82 1.23 0.98 0.98 0.78 0.84 (Na + K)/Li 0.81 1.04 1.24 1.40 1.22 0.81 1.02 1.02 1.28 1.19 Li + Na + K 16.75 17.60 20.16 19.16 17.30 16.75 18.16 18.16 15.50 15.75 Li/P 2.06 2.70 — — 2.23 2.06 — — 1.72 1.67 P/Li 0.49 0.37 0.00 0.00 0.45 0.49 0.00 0.00 0.58 0.60 (Na − Li)/ −0.12 −0.12 −0.09 0.02 −0.04 −0.12 −0.30 −0.30 0.07 0.04 (Al + B + P) (B + Na − P)/ 0.09 0.14 0.45 0.47 0.16 0.09 0.34 0.34 0.18 0.15 (Al + Li) Si + 1.2P − 3Al − −14.09 −10.69 6.34 8.34 −9.42 −12.15 9.34 11.34 −15.97 −18.06 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.425 2.420 2.428 2.426 2.418 2.409 2.424 2.410 2.402 N.A. α.sub.30-380° C. 80.6 87.4 94.3 95.9 87.5 79.5 88.8 86.7 74.9 N.A. (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. 701 685 884 N.A. 713 713 931 N.A. 10.sup.2.5 dPa .Math. s 1,492 1,537 1,427 1,435 1,556 1,534 1,445 1,479 1,596 N.A. (° C.) TL (° C.) 1,117 1,055 879 884 N.A. N.A. N.A. N.A. 1,080 N.A. logη at TL 4.46 5.28 N.A. N.A. N.A. N.A. N.A. N.A. 5.82 N.A. (dPa .Math. s) Acid resistance 8.9 3.9 0.0 0.0 3.8 5.4 0.0 0.0 1.7 N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance 1.3 1.0 0.6 0.6 0.9 1.1 0.5 0.6 1.2 N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 78 77 78 77 76 77 79 78 N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,006 934 506 473 943 957 561 508 1,067 N.A. DOL_ZERO.sub.K 22.0 36.5 17.3 19.8 38.3 25.9 14.7 19.0 25.0 N.A. (μm) CS.sub.Na (MPa) 338 312 136 175 N.A. N.A. N.A. N.A. 291 N.A. DOL_ZERO.sub.Na 116.3 101.3 78.7 62.3 N.A. N.A. N.A. N.A. 132.5 N.A. (μm)

    TABLE-US-00016 TABLE 16 (mol %) No. 151 No. 152 No. 153 No. 154 No. 155 No. 156 No. 157 No. 158 No. 159 No. 160 SiO.sub.2 60.04 60.36 60.53 60.72 60.43 66.16 64.12 62.82 62.35 61.84 Al.sub.2O.sub.3 18.94 18.57 18.51 18.51 18.76 11.85 14.09 15.44 15.95 16.51 B.sub.2O.sub.3 0.10 0.12 0.11 0.11 0.10 0.36 0.31 0.33 0.31 0.21 Li.sub.2O 7.50 7.13 6.91 6.82 7.22 0.52 2.61 3.81 4.24 4.81 Na.sub.2O 7.85 8.21 8.38 8.48 8.08 14.66 12.79 11.74 11.34 10.87 K.sub.2O 0.30 0.35 0.49 0.49 0.44 1.29 1.03 0.87 0.81 0.74 MgO 0.50 0.72 0.67 0.67 0.52 4.64 3.40 2.62 2.35 2.06 CaO 0.00 0.00 0.00 0.00 0.00 0.03 0.03 0.03 0.03 0.03 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 4.50 4.28 4.13 3.94 4.31 0.23 1.43 2.16 2.45 2.77 SnO.sub.2 0.16 0.16 0.16 0.16 0.05 0.15 0.12 0.09 0.09 0.08 Fe.sub.2O.sub.3 0.01 0.01 0.01 0.01 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.01 0.01 0.01 0.01 0.01 Cl 0.10 0.10 0.10 0.10 0.10 0.10 0.08 0.07 0.07 0.07 Li/(Na + K) 0.92 0.83 0.78 0.76 0.85 0.03 0.19 0.30 0.35 0.41 (Na + K)/Li 1.09 1.20 1.28 1.32 1.18 30.48 5.30 3.31 2.87 2.42 Li + Na + K 15.65 15.69 15.78 15.78 15.74 16.47 16.42 16.41 16.39 16.42 Li/P 1.67 1.67 1.67 1.73 1.67 2.29 1.82 1.76 1.73 1.74 P/Li 0.60 0.60 0.60 0.58 0.60 0.44 0.55 0.57 0.58 0.58 (Na − Li)/ 0.01 0.05 0.06 0.07 0.04 1.14 0.64 0.44 0.38 0.31 (Al + B + P) (B + Na − P)/ 0.13 0.16 0.17 0.18 0.15 1.20 0.70 0.51 0.46 0.39 (Al + Li) Si + 1.2P − 3Al − −18.55 −17.25 −17.04 −17.03 −17.78 6.19 −2.16 −7.33 −9.16 −11.24 2Li − 1.5Na − K − B ρ (g/cm.sup.3) N.A. N.A. N.A. N.A. N.A. 2.448 2.439 2.433 2.429 2.426 α.sub.30-380° C. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 10.sup.2.5 dPa .Math. s N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (° C.) TL (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 1,164 1,151 DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 31.6 29 (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 168 198 DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 92.8 89.6 (μm)

    TABLE-US-00017 TABLE 17 (mol %) No. 161 No. 162 No. 163 No. 164 No. 165 No. 166 No. 167 No. 168 No. 169 No. 170 SiO.sub.2 61.42 61.13 60.80 60.45 60.27 60.09 59.88 59.76 59.64 59.64 Al.sub.2O.sub.3 16.87 17.24 17.62 17.85 18.12 18.35 18.55 18.73 18.81 18.91 B.sub.2O.sub.3 0.26 0.24 0.22 0.27 0.26 0.20 0.23 0.22 0.17 0.20 Li.sub.2O 5.23 5.55 5.91 6.31 6.51 6.74 7.02 7.17 7.41 7.41 Na.sub.2O 10.52 10.19 9.85 9.57 9.34 9.13 8.91 8.74 8.64 8.53 K.sub.2O 0.70 0.66 0.62 0.59 0.56 0.53 0.51 0.49 0.48 0.47 MgO 1.85 1.65 1.44 1.29 1.16 1.04 0.90 0.79 0.71 0.65 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 2.97 3.17 3.37 3.50 3.64 3.76 3.86 3.95 4.00 4.05 SnO.sub.2 0.08 0.07 0.07 0.06 0.06 0.06 0.05 0.05 0.05 0.05 Fe.sub.2O.sub.3 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 0.03 TiO.sub.2 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Cl 0.07 0.07 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 Li/(Na + K) 0.47 0.51 0.56 0.62 0.66 0.70 0.74 0.78 0.81 0.82 (Na + K)/Li 2.14 1.96 1.77 1.61 1.52 1.43 1.34 1.29 1.23 1.22 Li + Na + K 16.45 16.40 16.38 16.46 16.41 16.40 16.44 16.41 16.52 16.41 Li/P 1.76 1.75 1.76 1.80 1.79 1.79 1.82 1.81 1.85 1.83 P/Li 0.57 0.57 0.57 0.56 0.56 0.56 0.55 0.55 0.54 0.55 (Na − Li)/ 0.26 0.23 0.19 0.15 0.13 0.11 0.08 0.07 0.05 0.05 (Al + B + P) (B + Na − P)/ 0.35 0.32 0.28 0.26 0.24 0.22 0.21 0.19 0.18 0.18 (Al + Li) Si + 1.2P − 3Al − −12.82 −14.08 −15.46 −16.74 −17.57 −18.34 −19.28 −19.86 −20.40 −20.51 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.423 2.420 2.418 2.416 2.415 2.413 2.412 2.411 2.410 2.409 α.sub.30-380° C. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 10.sup.2.5 dPa .Math. s N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (° C.) TL (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,138 1,133 1,126 1,122 1,122 1,112 1,114 1,114 1,117 1,100 DOL_ZERO.sub.K 26.1 24.8 24.1 23.4 22.8 22.3 22.4 22.3 21.4 22.2 (μm) CS.sub.Na (MPa) 214 216 218 235 236 253 259 260 249 268 DOL_ZERO.sub.Na 90.4 96.7 102.8 95 96.5 97.5 101.5 98.4 107 99.7 (μm)

    TABLE-US-00018 TABLE 18 (mol %) No. 171 No. 172 No. 173 No. 174 No. 175 No. 176 No. 177 No. 178 No. 179 No. 180 SiO.sub.2 59.63 59.52 59.57 59.69 59.77 59.89 59.97 59.86 59.91 59.97 Al.sub.2O.sub.3 18.99 19.00 18.99 18.99 18.94 18.94 18.97 18.97 18.98 18.93 B.sub.2O.sub.3 0.16 0.19 0.21 0.23 0.20 0.12 0.10 0.13 0.18 0.19 Li.sub.2O 7.49 7.65 7.65 7.54 7.57 7.55 7.51 7.66 7.57 7.53 Na.sub.2O 8.45 8.38 8.34 8.30 8.27 8.27 8.24 8.22 8.21 8.22 K.sub.2O 0.47 0.47 0.46 0.46 0.46 0.46 0.45 0.45 0.45 0.45 MgO 0.58 0.53 0.48 0.45 0.43 0.40 0.37 0.33 0.31 0.34 CaO 0.00 0.00 0.03 0.00 0.00 0.00 0.00 0.00 0.00 0.02 SrO 0.00 0.00 0.00 0.03 0.00 0.00 0.00 0.00 0.00 0.01 BaO 0.03 0.00 0.00 0.00 0.03 0.03 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.03 0.03 0.03 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 4.10 4.12 4.15 4.18 4.20 4.22 4.24 4.24 4.23 4.22 SnO.sub.2 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.04 0.05 Fe.sub.2O.sub.3 0.00 0.03 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Cl 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.07 0.06 Li/(Na + K) 0.84 0.86 0.87 0.86 0.87 0.87 0.86 0.88 0.88 0.87 (Na + K)/Li 1.19 1.16 1.15 1.16 1.15 1.16 1.16 1.13 1.14 1.15 Li + Na + K 16.41 16.49 16.45 16.30 16.31 16.27 16.20 16.32 16.23 16.20 Li/P 1.83 1.86 1.84 1.80 1.80 1.79 1.77 1.81 1.79 1.79 P/Li 0.55 0.54 0.54 0.55 0.55 0.56 0.56 0.55 0.56 0.56 (Na − Li)/ 0.04 0.03 0.03 0.03 0.03 0.03 0.03 0.02 0.03 0.03 (Al + B + P) (B + Na − P)/ 0.17 0.17 0.16 0.16 0.16 0.16 0.15 0.15 0.16 0.16 (Al + Li) Si + 1.2P − 3Al − −20.70 −21.06 −20.91 −20.50 −20.23 −19.96 −19.80 −20.17 −20.04 −19.78 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.408 2.408 2.407 2.406 2.405 2.404 2.403 2.403 2.403 2.403 α.sub.30-380° C. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 10.sup.2.5 dPa .Math. s N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (° C.) TL (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,103 1,103 1,102 1,108 1,108 1,108 1,112 1,104 1,109 1,108 DOL_ZERO.sub.K 21.7 21.3 21.3 22 23.4 23.6 23.7 23.5 23.3 24.4 (μm) CS.sub.Na (MPa) 273 274 264 276 258 251 262 271 269 264 DOL_ZERO.sub.Na 100.7 94.9 100.5 106.5 106.7 91.2 101.7 98.4 106.3 99.6 (μm)

    TABLE-US-00019 TABLE 19 (mol %) No. 181 No. 182 No. 183 No. 184 No. 185 No. 18 6 No. 187 No. 188 No. 189 No. 190 SiO.sub.2 60.13 60.16 60.18 60.28 60.15 60.20 60.14 60.38 60.38 60.38 Al.sub.2O.sub.3 18.91 18.92 18.91 18.95 18.93 18.95 18.95 18.57 18.57 18.57 B.sub.2O.sub.3 0.18 0.19 0.22 0.20 0.22 0.17 0.18 0.10 0.10 0.10 Li.sub.2O 7.42 7.38 7.37 7.22 7.40 7.39 7.45 7.13 7.63 7.13 Na.sub.2O 8.20 8.18 8.18 8.20 8.17 8.17 8.17 8.21 8.21 8.21 K.sub.2O 0.45 0.45 0.44 0.44 0.44 0.43 0.43 0.35 0.35 0.85 MgO 0.32 0.29 0.27 0.26 0.23 0.22 0.20 0.72 0.72 0.72 CaO 0.01 0.02 0.02 0.03 0.01 0.01 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.01 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.01 0.01 0.01 0.00 0.02 0.02 0.02 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 4.24 4.27 4.27 4.28 4.29 4.30 4.30 4.28 3.78 3.78 SnO.sub.2 0.04 0.04 0.04 0.05 0.05 0.05 0.05 0.16 0.16 0.16 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.01 0.01 0.01 0.02 0.00 0.00 0.00 TiO.sub.2 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.00 0.00 0.00 Cl 0.07 0.07 0.07 0.07 0.08 0.08 0.08 0.10 0.10 0.10 Li/(Na + K) 0.86 0.86 0.85 0.84 0.86 0.86 0.87 0.83 0.89 0.79 (Na + K)/Li 1.16 1.17 1.17 1.20 1.16 1.17 1.15 1.20 1.12 1.27 Li + Na + K 16.06 16.01 16.00 15.87 16.01 16.00 16.05 15.69 16.19 16.19 Li/P 1.75 1.73 1.73 1.69 1.73 1.72 1.73 1.67 2.02 1.89 P/Li 0.57 0.58 0.58 0.59 0.58 0.58 0.58 0.60 0.50 0.53 (Na − Li)/ 0.03 0.03 0.03 0.04 0.03 0.03 0.03 0.05 0.03 0.05 (Al + B + P) (B + Na − P)/ 0.16 0.16 0.16 0.16 0.16 0.15 0.15 0.16 0.17 0.18 (Al + Li) Si + 1.2P − 3Al − −19.28 −19.14 −19.09 −18.83 −19.22 −19.12 −19.32 −17.22 −18.82 −18.32 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.402 2.402 2.402 2.401 N.A. N.A. 2.401 2.407 2.411 2.413 α.sub.30-380° C. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 10.sup.2.5 dPa .Math. s N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (° C.) TL (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,101 1,094 1,100 1,093 1,096 N.A. N.A. 1,064 1,086 1,067 DOL_ZERO.sub.K 24.8 24.5 23.6 24.3 23.7 N.A. N.A. 27 23 28 (μm) CS.sub.Na (MPa) 272 269 249 246 244 N.A. N.A. 271 294 263 DOL_ZERO.sub.Na 110.8 103.2 111.7 103.1 105 N.A. N.A. 132 127 131 (μm)

    TABLE-US-00020 TABLE 20 (mol %) No. 191 No. 192 No. 193 No. 194 No. 195 No. 196 No. 197 No. 198 No. 199 No. 200 SiO.sub.2 60.28 60.28 60.28 59.88 59.88 59.78 59.78 60.33 60.36 60.38 Al.sub.2O.sub.3 18.67 18.67 18.67 18.57 18.57 18.67 18.67 18.8 18.8 18.8 B.sub.2O.sub.3 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li.sub.2O 7.13 7.63 7.13 7.63 7.13 7.63 7.13 7.20 7.20 7.20 Na.sub.2O 8.21 8.21 8.21 8.21 8.21 8.21 8.21 8.10 8.10 8.10 K.sub.2O 0.35 0.35 0.85 0.35 0.85 0.35 0.85 0.45 0.45 0.45 MgO 0.72 0.72 0.72 0.72 0.72 0.72 0.72 0.50 0.50 0.50 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 4.28 3.78 3.78 4.28 4.28 4.28 4.28 4.30 4.30 4.30 SnO.sub.2 0.16 0.16 0.16 0.16 0.16 0.16 0.16 0.116 0.093 0.07 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Li/(Na + K) 0.83 0.89 0.79 0.89 0.79 0.89 0.79 0.84 0.84 0.84 (Na + K)/Li 1.20 1.12 1.27 1.12 1.27 1.12 1.27 1.19 1.19 1.19 Li + Na + K 15.69 16.19 16.19 16.19 16.19 16.19 16.19 15.75 15.75 15.75 Li/P 1.67 2.02 1.89 1.78 1.67 1.78 1.67 1.67 1.67 1.67 P/Li 0.60 0.50 0.53 0.56 0.60 0.56 0.60 0.60 0.60 0.60 (Na − Li)/ 0.05 0.03 0.05 0.03 0.05 0.03 0.05 0.04 0.04 0.04 (Al + B + P) (B + Na − P)/ 0.16 0.17 0.18 0.15 0.16 0.15 0.16 0.15 0.15 0.15 (Al + Li) Si + 1.2P − 3Al − −17.62 −19.22 −18.72 −18.72 −18.22 −19.12 −18.62 −18.01 −17.98 −17.96 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.408 2.412 2.413 2.410 2.410 2.410 2.411 2.405 2.405 2.404 α.sub.30-380° C. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 10.sup.2.5 dPa .Math. s N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (° C.) TL (° C.) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. logη at TL N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,055 1,088 1,071 1,062 1,038 1,054 1,044 N.A. N.A. N.A. DOL_ZERO.sub.K 25 23 24 24 27 23 27 N.A. N.A. N.A. (μm) CS.sub.Na (MPa) 253 265 260 265 257 297 268 N.A. N.A. N.A. DOL_ZERO.sub.Na 129 140 131 134 130 129 129 N.A. N.A. N.A. (μm)

    TABLE-US-00021 TABLE 21 (mol %) No. 201 No. 202 No. 203 No. 204 No. 205 No. 206 No. 207 No. 208 No. 209 No. 210 SiO.sub.2 63.42 60.41 60.3713 60.367 61.96 60.63 60.96 60.00 61.74 61.53 Al.sub.2O.sub.3 15.12 18.8 18.8 18.8 10.52 10.30 10.35 10.19 10.48 10.45 B.sub.2O.sub.3 0.28 0.10 0.10 0.10 0.00 0.00 0.00 0.00 1.37 0.00 Li.sub.2O 3.61 7.20 7.20 7.20 10.47 10.25 8.20 10.14 10.43 10.40 Na.sub.2O 11.63 8.10 8.10 8.10 12.98 11.19 11.25 11.08 12.94 12.89 K.sub.2O 0.91 0.45 0.45 0.45 1.02 0.00 0.00 0.00 0.00 0.00 MgO 2.66 0.50 0.50 0.50 0.00 4.65 6.23 6.14 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 1.70 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.00 0.00 3.01 2.94 2.96 2.41 3.00 2.99 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 2.15 4.30 4.30 4.30 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.11 0.04 0.08 0.08 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.10 0.10 0.10 0.10 0.00 0.00 0.00 0.00 0.00 0.00 Li/(Na + K) 0.29 0.84 0.84 0.84 0.75 0.92 0.73 0.92 0.81 0.81 (Na + K)/Li 3.47 1.19 1.19 1.19 1.34 1.09 1.37 1.09 1.24 1.24 Li + Na + K 16.16 15.75 15.75 15.75 24.47 21.44 19.45 21.22 23.37 23.29 Li/P 1.68 1.67 1.67 1.67 — — — — — — P/Li 0.60 0.60 0.60 0.60 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ 0.46 0.04 0.04 0.04 0.24 0.09 0.29 0.09 0.21 0.24 (Al + B + P) (B + Na − P)/ 0.52 0.15 0.15 0.15 0.62 0.54 0.61 0.54 0.68 0.62 (Al + Li) Si + 1.2P − 3Al − −5.23 −17.93 −17.97 −17.97 −11.04 −7.54 −3.38 −7.47 −11.36 −9.96 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.430 N.A. 2.403 2.403 2.530 2.542 2.547 2.536 2.527 2.546 α.sub.30-380° C. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) N.A. N.A. N.A. N.A. 704 730 762 721 692 704 10.sup.2.5 dPa .Math. s N.A. N.A. N.A. N.A. 1,331 1,317 1,350 1,308 1,308 1,311 (° C.) TL (° C.) N.A. N.A. N.A. N.A. 858 N.A. N.A. N.A. N.A. 864 logη at TL N.A. N.A. N.A. N.A. 5.50 N.A. N.A. N.A. N.A. 5.37 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. N.A. N.A. N.A. 83 86 86 86 83 84 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00022 TABLE 22 (mol %) No. 211 No. 212 No. 213 No. 214 No. 215 No. 216 No. 217 No. 218 No. 219 No. 220 SiO.sub.2 62.20 62.01 62.15 61.32 61.25 62.66 63.05 62.95 62.92 62.65 Al.sub.2O.sub.3 10.56 11.47 10.55 10.41 10.40 10.64 10.71 10.69 10.69 10.64 B.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Li.sub.2O 10.51 10.48 8.36 8.25 8.24 8.43 8.48 8.47 8.46 8.43 Na.sub.2O 13.03 12.99 13.02 11.83 10.80 12.09 11.11 12.14 12.14 11.88 K.sub.2O 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 MgO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 2.86 6.20 7.32 2.88 2.90 2.89 2.89 3.11 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.63 0.00 0.00 0.00 0.00 1.26 1.70 1.27 0.00 1.26 ZrO.sub.2 3.02 3.01 3.02 1.95 1.95 1.99 2.00 1.00 2.00 1.99 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.55 0.86 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Li/(Na + K) 0.81 0.81 0.64 0.70 0.76 0.70 0.76 0.70 0.70 0.71 (Na + K)/Li 1.24 1.24 1.56 1.43 1.31 1.43 1.31 1.43 1.43 1.41 Li + Na + K 23.55 23.47 21.38 20.08 19.04 20.52 19.60 20.61 20.60 20.30 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ 0.24 0.22 0.44 0.34 0.25 0.34 0.25 0.34 0.34 0.32 (Al + B + P) (B + Na − P)/ 0.62 0.59 0.69 0.63 0.58 0.63 0.58 0.63 0.63 0.62 (Al + Li) Si + 1.2P − 3Al − −10.07 −12.86 −5.77 −4.16 −2.63 −4.25 −2.71 −4.27 −4.27 −3.94 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.556 2.529 2.556 2.552 2.560 2.574 2.588 2.577 2.576 2.575 α.sub.30-380° C. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (×10.sup.−7/° C.) Ts (° C.) 708 726 729 714 718 713 719 708 743 715 10.sup.2.5 dPa .Math. s 1,327 1,352 1,380 1,323 1,310 1,352 1,351 1,332 1,356 1,341 (° C.) TL (° C.) 867 N.A. N.A. N.A. N.A. 883.2 N.A. N.A. N.A. N.A. logη at TL 5.41 N.A. N.A. N.A. N.A. 5.32 N.A. N.A. N.A. N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 83 83 84 N.A. 85 84 84 84 84 83 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00023 TABLE 23 (mol %) No. 221 No. 222 No. 223 No. 224 No. 225 No. 226 No. 227 No. 228 No. 229 No. 230 SiO.sub.2 62.84 62.76 63.11 57.51 57.51 56.93 60.07 63.08 61.08 61.08 Al.sub.2O.sub.3 10.67 10.66 10.72 9.77 9.77 9.67 15.81 13.81 15.81 13.81 B.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Li.sub.2O 7.80 8.44 7.84 23.61 21.62 23.37 8.34 6.34 6.34 6.34 Na.sub.2O 11.91 11.90 11.96 3.44 2.49 1.51 12.10 11.10 11.10 11.10 K.sub.2O 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 MgO 0.00 0.00 0.00 0.00 2.94 2.91 0.00 0.00 0.00 0.00 CaO 3.46 2.88 2.90 2.64 2.64 2.62 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 1.27 1.27 1.27 1.16 1.16 1.15 0.00 0.00 0.00 0.00 ZrO.sub.2 2.00 1.99 2.01 1.83 1.83 1.81 0.00 0.00 0.00 0.00 Y.sub.2O.sub.3 0.00 0.06 0.14 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 1.16 1.16 1.16 1.16 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 2.47 4.47 4.47 6.47 SnO.sub.2 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 Fe.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 TiO.sub.2 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Cl 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Li/(Na + K) 0.66 0.71 0.66 6.86 8.70 15.43 0.69 0.57 0.57 0.57 (Na + K)/Li 1.53 1.41 1.53 0.15 0.11 0.06 1.45 1.75 1.75 1.75 Li + Na + K 19.72 20.34 19.80 27.05 24.11 24.88 20.44 17.44 17.44 17.44 Li/P — — — — — — 3.38 1.42 1.42 0.98 P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.30 0.71 0.71 0.02 (Na − Li)/ 0.39 0.32 0.39 −2.06 −1.96 −2.26 0.21 0.26 0.23 0.23 (Al + B + P) (B + Na − P)/ 0.64 0.62 0.64 0.10 0.08 0.05 0.40 0.33 0.30 0.23 (Al + Li) Si + 1.2P − 3Al − −2.65 −3.95 −2.66 −24.17 −18.77 −21.08 −19.22 −2.32 −10.32 −1.92 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.577 2.576 2.579 N.A. N.A. N.A. 2.451 2.415 2.425 2.404 α.sub.30-380° C. N.A. N.A. N.A. 96.6 91.2 92.2 91.2 82.8 82.7 82.4 (×10.sup.−7/° C.) Ts (° C.) 722 716 727 N.A. 652 N.A. N.A. N.A. 866 846 10.sup.2.5 dPa .Math. s 1,354 1,344 1,362 N.A. 1,141 N.A. 1,504 1,580 1,576 1,572 (° C.) TL (° C.) N.A. N.A. N.A. N.A. 1,033 N.A. 973 930 956 N.A. logη at TL N.A. N.A. N.A. N.A. 3.10 N.A. 5.9 6.4 6.5 N.A. (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 83 83 83 90 91 92 N.A. 73 73 70 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. 0.91 N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. 1,142 N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. 24 N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. 208 N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. 123 N.A. N.A. N.A. (μm)

    TABLE-US-00024 TABLE 24 (mol %) No. 231 No. 232 No. 233 No. 234 No. 235 No. 236 No. 237 No. 238 No. 239 No. 240 SiO.sub.2 59.07 59.07 64.31 64.66 64.43 74.34 74.20 74.87 64.86 64.33 Al.sub.2O.sub.3 19.81 17.81 14.92 14.94 15.02 4.85 4.99 5.00 4.96 4.89 B.sub.2O.sub.3 0.00 2.00 5.03 4.97 5.00 5.38 4.84 5.06 15.24 15.55 Li.sub.2O 6.34 8.34 5.00 10.00 10.01 4.98 5.01 13.76 13.71 1.00 Na.sub.2O 11.10 11.10 5.33 5.30 0.10 10.31 0.26 1.20 0.08 14.08 K.sub.2O 0.00 0.00 5.31 0.02 5.33 0.03 10.59 0.01 1.05 0.04 MgO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.00 0.00 0.002 0.003 0.002 0.002 0.003 0.002 0.002 0.003 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 1.16 1.16 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 2.47 0.47 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.04 0.04 0.09 0.10 0.10 0.10 0.09 0.10 0.10 0.10 Fe.sub.2O.sub.3 0.00 0.00 0.002 0.002 0.002 0.002 0.002 0.001 0.002 0.002 TiO.sub.2 0.00 0.00 0.003 0.004 0.003 0.004 0.004 0.003 0.004 0.004 Cl 0.00 0.00 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) 0.57 0.75 0.47 1.88 1.84 0.48 0.46 11.39 12.15 0.07 (Na + K)/Li 1.75 1.33 2.13 0.53 0.54 2.08 2.17 0.09 0.08 4.09 Li + Na + K 17.44 19.44 15.64 15.32 15.44 15.31 15.87 14.97 14.83 15.12 Li/P 2.57 17.73 — — — — — — — — P/Li 0.39 0.06 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ 0.21 0.14 0.02 −0.24 −0.50 0.52 −0.48 −1.25 −0.67 0.64 (Al + B + P) (B + Na − P)/ 0.33 0.48 0.52 0.41 0.20 1.60 0.51 0.33 0.82 5.03 (Al + Li) Si + 1.2P − 3Al − −26.72 −29.12 −8.80 −13.11 −11.13 28.96 33.38 25.49 6.15 10.95 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.453 2.450 2.386 2.370 2.360 2.410 2.400 2.332 2.326 2.443 α.sub.30-380° C. N.A. 86.0 82.6 68.7 68.9 75.7 77.6 58.8 58.5 80.1 (×10.sup.−7/° C.) Ts (° C.) 913 816 823 817 828 685 737 N.A. 640 685 10.sup.2.5 dPa .Math. s 1,547 1,487 1,610 1,516 1,556 1,362 1,448 1,382 1,146 1,149 (° C.) TL (° C.) N.A. 1,055 988.8 1,149.55 1,143 855.74 817.8 1,070.7 894.56 647.6 or less or more or less logη at TL N.A. 5.0 5.94 4.4 4.6 5.4 6.6 3.76 3.9 8.72 (dPa .Math. s) or more or less or more Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) N.A. 78 71 76 72 79 72 80 79 77 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) 1,453 1,228 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K 18 14 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) 254 321 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na 134 104 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00025 TABLE 25 (mol %) No. 241 No. 242 No. 243 No. 244 No. 245 No. 246 No. 247 No. 248 No. 249 No. 250 SiO.sub.2 64.23 64.43 64.26 64.41 64.48 74.52 74.26 74.87 74.57 65.28 Al.sub.2O.sub.3 4.93 14.92 14.89 14.82 14.77 4.95 4.94 4.95 4.92 4.99 B.sub.2O.sub.3 14.45 5.11 5.26 5.15 5.02 5.20 5.36 4.65 4.93 14.56 Li.sub.2O 1.03 0.99 1.00 0.99 1.00 5.01 4.99 5.00 4.99 8.99 Na.sub.2O 0.29 9.50 9.46 9.43 9.64 5.28 5.29 5.28 5.41 1.03 K.sub.2O 14.97 0.00 0.00 0.00 0.01 0.00 0.00 0.00 0.00 0.00 MgO 0.00 4.90 0.07 0.00 0.00 4.90 0.09 0.00 0.00 4.98 CaO 0.00 0.05 4.94 0.02 0.01 0.04 4.96 0.02 0.00 0.05 SrO 0.00 0.00 0.01 5.01 0.00 0.00 0.01 5.11 0.08 0.00 BaO 0.00 0.00 0.00 0.05 4.98 0.00 0.00 0.00 4.99 0.00 ZrO.sub.2 0.002 0.002 0.002 0.003 0.003 0.002 0.002 0.003 0.002 0.002 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.09 0.10 0.10 0.11 0.09 0.10 0.10 0.10 0.10 0.10 Fe.sub.2O.sub.3 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 TiO.sub.2 0.003 0.003 0.003 0.004 0.004 0.003 0.004 0.004 0.003 0.004 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) 0.07 0.10 0.11 0.11 0.10 0.95 0.94 0.95 0.92 8.77 (Na + K)/Li 14.80 9.58 9.44 9.50 9.61 1.05 1.06 1.06 1.08 0.11 Li + Na + K 16.28 10.49 10.47 10.42 10.65 10.29 10.28 10.28 10.40 10.02 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.04 0.42 0.42 0.42 0.44 0.03 0.03 0.03 0.04 −0.41 (Al + B + P) (B + Na − P)/ 2.47 0.92 0.93 0.92 0.93 1.05 1.07 1.00 1.04 1.11 (Al + Li) Si + 1.2P − 3Al − 17.53 −1.66 −1.86 −1.33 −1.31 36.54 36.17 37.43 36.79 16.21 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.426 2.403 2.421 2.496 2.562 2.352 2.393 2.489 2.572 2.312 α.sub.30-380° C. 84.1 59.8 65.4 68.2 70.1 56.5 60.4 62.3 63.6 49.6 (×10.sup.−7/° C.) Ts (° C.) 730 904 899 897 896 741 721 714 708 682 10.sup.2.5 dPa .Math. s 1,222 1,572 1,583 1,600 1,616 1,527 1,451 1,428 1,411 1,279 (° C.) TL (° C.) 1,032.5 1,146.02 1,196.47 1,288.2 1,282.9 1,035.2 1,059.4 1,038.4 1,018.84 921.5 or more or more or more logη at TL 3.6 5.0 4.6 4.04 4.16 4.6 4.17 4.2 4.2 4.4 (dPa .Math. s) or less or less or less Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 69 74 73 72 71 77 79 80 79 76 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00026 TABLE 26 (mol %) No. 251 No. 252 No. 253 No. 254 No. 255 No. 256 No. 257 No. 258 No. 259 No. 260 SiO.sub.2 65.00 64.38 65.27 64.83 64.61 65.04 64.95 64.73 64.52 64.61 Al.sub.2O.sub.3 4.97 4.98 4.96 14.92 14.92 15.01 15.03 14.81 14.91 14.89 B.sub.2O.sub.3 14.75 15.35 15.03 5.09 5.24 4.87 4.89 5.18 5.33 5.23 Li.sub.2O 8.99 9.01 8.57 5.00 5.00 14.00 13.99 1.01 1.00 0.99 Na.sub.2O 1.05 1.16 1.04 10.02 0.11 0.97 0.09 14.13 0.12 0.08 K.sub.2O 0.00 0.00 0.00 0.03 10.01 0.01 0.94 0.04 14.02 9.12 MgO 0.09 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 4.98 CaO 5.04 0.02 0.01 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SrO 0.01 4.92 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 BaO 0.00 0.06 5.02 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.002 0.003 0.002 0.002 0.003 0.003 0.002 0.002 0.002 0.002 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.10 0.09 0.10 0.10 0.10 0.09 0.09 Fe.sub.2O.sub.3 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 TiO.sub.2 0.003 0.004 0.003 0.003 0.004 0.004 0.003 0.003 0.004 0.003 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) 8.57 7.75 8.23 0.50 0.49 14.31 13.51 0.07 0.07 0.11 (Na + K)/Li 0.12 0.13 0.12 2.01 2.02 0.07 0.07 14.07 14.09 9.30 Li + Na + K 10.03 10.18 9.61 15.05 15.12 14.98 15.03 15.17 15.14 10.19 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.40 −0.39 −0.38 0.25 −0.24 −0.66 −0.70 0.66 −0.04 −0.05 (Al + B + P) (B + Na − P)/ 1.13 1.18 1.19 0.76 0.27 0.20 0.17 1.22 0.34 0.33 (Al + Li) Si + 1.2P − 3Al − 15.81 14.31 16.67 −10.09 −5.57 −14.33 −14.08 −8.13 −1.76 3.48 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.355 2.446 2.527 2.383 2.369 2.353 2.351 2.397 N.A. 2.382 α.sub.30-380° C. 52.4 53.7 54.9 75.7 78.0 60.9 60.5 82.1 N.A. 61.0 (×10.sup.−7/° C.) Ts (° C.) 699 697 683 843 880 N.A. N.A. 872 N.A. 966 10.sup.2.5 dPa .Math. s 1,222 1,210 1,194 1,586 1,672 1,478 1,481 1,663 1,788 1,656 (° C.) TL (° C.) 972.78 974.8 951.02 1,052.8 1,120.3 1,277.92 1,305.6 746.6 N.A. 1,253 or more or more or less or more logη at TL 3.7 3.7 3.8 5.42 5.40 3.4 3.3 9.57 N.A. 4.68 (dPa .Math. s) or less or less or more or less Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 79 79 79 72 66 77 76 68 N.A. 68 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00027 TABLE 27 (mol %) No. 261 No. 262 No. 263 No. 264 No. 265 No. 266 No. 267 No. 268 No. 269 No. 270 SiO.sub.2 64.56 64.63 64.55 64.64 64.56 64.27 64.23 64.66 64.55 64.74 Al.sub.2O.sub.3 14.96 14.88 14.80 14.94 14.93 14.89 14.87 14.93 14.97 15.03 B.sub.2O.sub.3 5.20 5.16 5.34 5.00 5.07 5.35 5.34 5.13 5.21 5.08 Li.sub.2O 1.00 1.01 0.99 5.01 5.01 5.01 5.00 5.01 5.02 5.01 Na.sub.2O 0.09 0.13 0.12 5.29 5.28 5.31 5.45 0.06 0.08 0.12 K.sub.2O 9.09 9.08 9.15 0.01 0.01 0.01 0.01 5.12 5.11 4.95 MgO 0.05 0.00 0.00 4.96 0.05 0.00 0.00 4.98 0.05 0.00 CaO 4.93 0.00 0.00 0.05 5.00 0.02 0.00 0.00 4.91 0.00 SrO 0.00 4.95 0.00 0.00 0.00 4.98 0.00 0.00 0.00 4.92 BaO 0.00 0.05 4.94 0.00 0.00 0.05 4.99 0.00 0.00 0.05 ZrO.sub.2 0.003 0.002 0.003 0.003 0.002 0.002 0.002 0.002 0.003 0.002 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.09 0.10 0.09 0.09 0.10 0.09 0.10 0.10 0.10 0.09 Fe.sub.2O.sub.3 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.002 TiO.sub.2 0.004 0.004 0.005 0.004 0.003 0.003 0.004 0.003 0.004 0.003 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) 0.11 0.11 0.11 0.95 0.95 0.94 0.92 0.97 0.97 0.99 (Na + K)/Li 9.16 9.11 9.32 1.06 1.06 1.06 1.09 1.04 1.03 1.01 Li + Na + K 10.19 10.22 10.27 10.31 10.30 10.33 10.46 10.19 10.20 10.08 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.05 −0.04 −0.04 0.01 0.01 0.01 0.02 −0.25 −0.24 −0.24 (Al + B + P) (B + Na − P)/ 0.33 0.33 0.35 0.52 0.52 0.54 0.54 0.26 0.26 0.26 (Al + Li) Si + 1.2P − 3Al − 3.25 3.52 3.51 −3.13 −3.22 −3.74 −3.90 −0.50 −0.82 −0.59 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.394 2.471 2.533 2.396 2.413 2.487 2.552 2.384 2.400 2.472 α.sub.30-380° C. 66.6 69.2 71.3 54.2 59.4 61.7 63.6 54.4 59.5 61.2 (×10.sup.−7/° C.) Ts (° C.) 961 966 N.A. 870 864 861 861 888 884 888 10.sup.2.5 dPa .Math. s 1,685 1,705 1,725 1,523 1,530 1,553 1,561 1,562 1,571 1,585 (° C.) TL (° C.) 1,169.38 1,231.2 1,228.1 1,147.04 1,166.49 1,226.86 1,178.64 1,163.92 1,179.1 1,231.2 or more or more or less or more logη at TL 5.4 5.07 5.29 4.6 4.4 4.1 4.5 4.7 4.58 4.33 (dPa .Math. s) or less or less or more or less Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 67 66 65 78 77 76 74 74 73 72 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00028 TABLE 28 (mol %) No. 271 No. 272 No. 273 No. 274 No. 275 No. 276 No. 277 No. 278 No. 279 No. 280 SiO.sub.2 64.68 64.70 64.71 65.64 64.86 64.69 64.72 64.87 64.54 64.46 Al.sub.2O.sub.3 14.91 15.09 15.08 14.82 14.92 15.04 15.03 14.99 14.94 15.02 B.sub.2O.sub.3 5.25 5.09 5.06 4.57 5.14 5.12 5.09 4.89 5.27 5.26 Li.sub.2O 4.99 9.01 9.00 8.99 8.99 9.01 9.01 9.00 8.99 5.01 Na.sub.2O 0.10 0.96 0.97 0.94 1.00 0.06 0.07 0.11 0.09 0.05 K.sub.2O 4.99 0.00 0.00 0.00 0.00 0.97 0.97 0.96 0.98 0.00 MgO 0.00 5.00 0.05 0.00 0.00 4.99 0.00 0.00 0.00 7.01 CaO 0.00 0.05 5.03 0.02 0.00 0.03 5.02 0.01 0.00 1.04 SrO 0.00 0.00 0.00 4.87 0.00 0.00 0.00 5.01 0.00 1.02 BaO 4.96 0.00 0.00 0.06 4.98 0.00 0.00 0.06 5.06 1.02 ZrO.sub.2 0.003 0.003 0.000 0.002 0.001 0.001 0.002 0.004 0.006 0.004 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.09 0.10 0.10 0.09 0.09 0.10 0.10 Fe.sub.2O.sub.3 0.002 0.002 0.000 0.001 0.001 0.000 0.002 0.003 0.004 0.003 TiO.sub.2 0.004 0.004 0.000 0.002 0.002 0.001 0.003 0.006 0.009 0.007 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) 0.98 9.38 9.27 9.55 8.99 8.71 8.63 8.46 8.43 ∞ (Na + K)/Li 1.02 0.11 0.11 0.10 0.11 0.11 0.12 0.12 0.12 0.01 Li + Na + K 10.09 9.97 9.98 9.93 9.99 10.04 10.05 10.07 10.06 5.07 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.24 −0.40 −0.40 −0.41 −0.40 −0.44 −0.44 −0.45 −0.44 −0.24 (Al + B + P) (B + Na − P)/ 0.27 0.25 0.25 0.23 0.26 0.22 0.21 0.21 0.22 0.27 (Al + Li) Si + 1.2P − 3Al − −0.44 −5.12 −5.05 −2.78 −4.53 −4.62 −4.55 −4.12 −4.66 4.04 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.534 2.386 2.403 2.477 2.542 2.383 2.400 2.474 2.539 2.471 α.sub.30-380° C. 62.7 48.6 52.5 55.1 56.8 48.6 53.5 55.3 55.2 39.6 (×10.sup.−7/° C.) Ts (° C.) 904 860 849 847 850 865 848 845 N.A. 897 10.sup.2.5 dPa .Math. s 1,605 1,466 1,477 1,490 1,503 1,477 1,484 1,500 1,509 1,485 (° C.) TL (° C.) 1,228.1 1,192.11 1,191.16 1,195.44 1,189.28 1,216.08 1,189.28 1,201.32 1,181.12 1,264.8 or more logη at TL 4.49 4.0 4.0 4.0 4.1 3.9 4.1 4.0 4.2 3.7 (dPa .Math. s) or less Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 70 81 79 78 76 80 78 77 76 83 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00029 TABLE 29 (mol %) No. 281 No. 282 No. 283 No. 284 No. 285 No. 286 No. 287 No. 288 No. 289 No. 290 SiO.sub.2 64.56 64.70 64.40 64.53 64.60 64.46 64.53 64.36 64.57 75.33 Al.sub.2O.sub.3 14.96 14.93 14.94 15.07 15.05 14.99 15.01 14.95 14.88 5.04 B.sub.2O.sub.3 5.24 5.17 5.39 5.17 5.08 5.27 5.13 5.32 5.29 4.88 Li.sub.2O 4.99 5.00 5.00 5.01 5.00 5.00 5.01 5.01 5.01 4.99 Na.sub.2O 0.06 0.11 0.09 0.05 0.09 0.07 0.10 0.08 0.12 5.02 K.sub.2O 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 4.62 MgO 1.02 0.98 1.00 5.01 4.98 4.98 0.05 0.05 0.00 0.00 CaO 7.04 1.01 1.04 5.03 0.06 0.05 5.01 5.09 0.03 0.00 SrO 1.02 6.94 1.01 0.01 5.00 0.01 5.00 0.01 4.96 0.00 BaO 1.00 1.06 7.02 0.00 0.05 5.01 0.06 5.02 5.04 0.00 ZrO.sub.2 0.002 0.002 0.002 0.002 0.002 0.019 0.002 0.002 0.002 0.007 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.09 0.10 0.10 0.09 0.10 0.10 0.10 Fe.sub.2O.sub.3 0.001 0.001 0.001 0.001 0.002 0.015 0.002 0.002 0.001 0.005 TiO.sub.2 0.002 0.003 0.003 0.002 0.003 0.029 0.003 0.004 0.003 0.010 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 0.52 (Na + K)/Li 0.01 0.02 0.02 0.01 0.02 0.02 0.02 0.02 0.02 1.93 Li + Na + K 5.06 5.11 5.09 5.07 5.09 5.07 5.11 5.09 5.12 14.63 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.24 −0.24 −0.24 −0.25 −0.24 −0.24 −0.24 −0.24 −0.24 0.00 (Al + B + P) (B + Na − P)/ 0.27 0.26 0.28 0.26 0.26 0.27 0.26 0.27 0.27 0.99 (Al + Li) Si + 1.2P − 3Al − 4.36 4.58 4.04 4.03 4.26 4.12 4.19 4.04 4.45 33.18 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.486 2.573 2.650 2.434 2.508 2.573 2.521 2.586 2.655 2.401 α.sub.30-380° C. 44.4 46.6 47.4 40.1 42.0 42.8 45.9 47.1 49.2 76.1 (×10.sup.−7/° C.) Ts (° C.) 902 904 905 897 898 904 903 904 907 700 10.sup.2.5 dPa .Math. s 1,495 1,518 1,527 1,478 1,494 1,503 1,507 1,517 1,528 1,417 (° C.) TL (° C.) 1,171.83 1,198.38 1,216.68 1,233.84 1,202.88 1,193.92 1,234.92 1,123.7 1,253.92 934.9 or less logη at TL 4.4 4.3 4.3 3.9 4.2 4.3 4.0 4.9 4.0 4.8 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 81 79 77 83 82 80 80 78 77 76 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00030 TABLE 30 (mol %) No. 291 No. 292 No. 293 No. 294 No. 295 No. 296 No. 297 No. 298 No. 299 No. 300 SiO.sub.2 75.03 75.18 75.04 74.67 75.24 74.75 74.71 74.97 74.50 71.50 Al.sub.2O.sub.3 5.01 5.04 5.02 4.98 5.07 4.96 4.97 4.98 4.94 4.75 B.sub.2O.sub.3 4.90 4.94 4.82 5.32 5.11 5.13 5.20 5.12 5.32 4.87 Li.sub.2O 10.00 9.98 14.01 1.01 0.99 0.99 1.00 1.00 0.99 0.95 Na.sub.2O 4.88 0.05 0.05 13.87 0.11 9.06 8.94 8.74 9.10 13.03 K.sub.2O 0.03 4.71 0.92 0.05 13.39 0.01 0.01 0.00 0.00 0.00 MgO 0.00 0.00 0.00 0.00 0.00 4.95 0.06 0.00 0.00 4.76 CaO 0.00 0.00 0.00 0.00 0.00 0.05 5.01 0.02 0.00 0.04 SrO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 5.01 0.00 0.00 BaO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.05 5.05 0.00 ZrO.sub.2 0.016 0.001 0.011 0.002 0.002 0.002 0.002 0.002 0.002 0.002 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.10 0.09 0.09 0.10 0.09 0.10 0.09 Fe.sub.2O.sub.3 0.012 0.001 0.009 0.002 0.002 0.002 0.002 0.002 0.002 0.002 TiO.sub.2 0.025 0.002 0.018 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) 2.04 2.10 14.41 0.07 0.07 0.11 0.11 0.11 0.11 0.07 (Na + K)/Li 0.49 0.48 0.07 13.81 13.66 9.16 8.92 8.76 9.18 13.73 Li + Na + K 14.91 14.74 14.98 14.93 14.48 10.05 9.95 9.74 10.09 13.98 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.52 −1.00 −1.42 1.25 −0.09 0.80 0.78 0.77 0.79 1.26 (Al + B + P) (B + Na − P)/ 0.65 0.33 0.26 3.20 0.86 2.39 2.37 2.32 2.43 3.14 (Al + Li) Si + 1.2P − 3Al − 27.75 30.37 26.16 31.54 39.39 39.18 39.18 39.81 38.73 30.94 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.368 2.349 2.334 2.431 N.A. 2.374 2.418 2.509 2.592 2.429 α.sub.30-380° C. 66.2 66.0 58.4 76.1 N.A. 61.6 65.2 66.7 67.4 78.3 (×10.sup.−7/° C.) Ts (° C.) 670 693 N.A. 722 N.A. 782 760 757 744 730 10.sup.2.5 dPa .Math. s 1,372 1,416 1,384 1,408 1,522 1,498 1,576 1,480 1,453 1,414 (° C.) TL (° C.) 954 908.6 1,017.8 734.7 N.A. 926.94 991.63 988.66 935.1 921 or less or less or less or less logη at TL 4.4 5.00 4.10 7.36 N.A. 5.6 5.2 4.8 5.1 5.1 (dPa .Math. s) or more or more or more Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 80 75 79 75 N.A. 73 76 77 76 74 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00031 TABLE 31 (mol %) No. 301 No. 302 No. 303 No. 304 No. 305 No. 306 No. 307 No. 308 No. 309 No. 310 SiO.sub.2 71.53 75.17 74.72 74.75 74.98 75.33 75.07 74.83 74.96 75.01 Al.sub.2O.sub.3 4.74 5.02 4.95 4.99 4.98 5.04 4.97 5.01 5.01 5.01 B.sub.2O.sub.3 4.84 5.05 5.24 5.07 5.04 4.86 4.95 5.01 4.90 4.92 Li.sub.2O 0.96 1.00 1.01 5.00 4.99 4.98 4.99 9.00 8.99 9.00 Na.sub.2O 12.98 0.10 0.08 0.04 0.04 0.08 0.08 0.97 0.96 0.92 K.sub.2O 0.00 8.54 8.86 4.95 4.84 4.57 4.82 0.01 0.01 0.00 MgO 0.06 0.00 0.00 5.01 0.06 0.00 0.00 5.01 0.06 0.00 CaO 4.79 0.00 0.00 0.04 4.95 0.00 0.00 0.05 5.02 0.02 SrO 0.00 4.97 0.00 0.00 0.00 4.96 0.00 0.00 0.00 4.96 BaO 0.00 0.05 5.03 0.00 0.00 0.06 4.98 0.00 0.00 0.06 ZrO.sub.2 0.002 0.002 0.002 0.017 0.002 0.007 0.018 0.002 0.002 0.002 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.09 0.09 0.09 0.09 0.10 0.09 0.09 0.10 0.09 0.10 Fe.sub.2O.sub.3 0.002 0.002 0.002 0.013 0.002 0.006 0.014 0.001 0.001 0.002 TiO.sub.2 0.003 0.003 0.004 0.026 0.003 0.011 0.028 0.003 0.003 0.003 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 Li/(Na + K) 0.07 0.12 0.11 1.00 1.02 1.07 1.02 9.14 9.28 9.74 (Na + K)/Li 13.52 8.68 8.86 1.00 0.98 0.93 0.98 0.11 0.11 0.10 Li + Na + K 13.94 9.64 9.95 9.98 9.88 9.64 9.89 9.98 9.96 9.92 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ 1.26 −0.09 −0.09 −0.49 −0.49 −0.50 −0.50 −0.80 −0.81 −0.81 (Al + B + P) (B + Na − P)/ 3.13 0.86 0.89 0.51 0.51 0.49 0.50 0.43 0.42 0.42 (Al + Li) Si + 1.2P − 3Al − 31.09 44.38 43.62 39.69 40.10 40.69 40.30 35.32 35.61 35.68 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.467 2.476 2.570 2.344 2.376 2.461 2.549 2.332 2.368 2.458 α.sub.30-380° C. 80.4 68.6 70.4 56.0 59.9 60.7 62.2 48.4 52.5 53.7 (×10.sup.−7/° C.) Ts (° C.) 718 822 810 776 759 755 743 N.A. N.A. 716 10.sup.2.5 dPa .Math. s 1,350 1,586 1,557 1,592 1,535 1,519 1,499 1,518 1,449 1,443 (° C.) TL (° C.) 846.69 1,017.59 934.5 1,023.26 1,014.27 941.86 889.37 1,174 1,170.44 1,180 logη at TL 5.6 5.3 6.0 5.1 4.9 5.4 5.8 3.9 3.6 3.5 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 77 71 71 73 74 74 75 79 80 80 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00032 TABLE 32 (mol %) No. 311 No. 312 No. 313 No. 314 No. 315 No. 316 No. 317 No. 318 No. 319 No. 320 SiO.sub.2 74.98 74.87 74.79 74.87 74.87 74.86 74.65 74.97 74.71 74.85 Al.sub.2O.sub.3 4.96 4.99 5.00 5.00 4.94 4.99 4.97 4.97 4.91 4.99 B.sub.2O.sub.3 4.93 5.03 5.10 5.03 5.04 4.92 5.18 4.86 5.17 5.00 Li.sub.2O 9.01 9.00 9.00 9.00 9.01 5.00 4.99 5.00 5.00 5.00 Na.sub.2O 0.99 0.03 0.04 0.07 0.05 0.03 0.03 0.07 0.05 0.01 K.sub.2O 0.00 0.94 0.90 0.88 0.92 0.00 0.00 0.00 0.00 0.00 MgO 0.00 4.99 0.06 0.00 0.00 7.00 1.03 1.00 1.01 5.01 CaO 0.00 0.04 5.01 0.00 0.00 1.05 7.02 1.02 1.04 5.03 SrO 0.00 0.00 0.00 4.99 0.01 1.03 1.03 6.96 1.00 0.01 BaO 5.02 0.00 0.00 0.06 5.05 1.02 1.00 1.05 7.00 0.00 ZrO.sub.2 0.002 0.005 0.005 0.000 0.006 0.007 0.000 0.001 0.002 0.001 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.09 0.10 0.10 0.10 0.10 0.09 0.09 0.10 0.10 Fe.sub.2O.sub.3 0.002 0.003 0.002 0.003 0.004 0.001 0.005 0.001 0.003 0.005 TiO.sub.2 0.003 0.001 0.000 0.002 0.002 0.004 0.004 0.004 0.001 0.000 Cl 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.003 0.002 0.002 Li/(Na + K) 9.08 9.30 9.58 9.44 9.28 ∞ ∞ ∞ ∞ ∞ (Na + K)/Li 0.11 0.11 0.10 0.11 0.11 0.01 0.01 0.01 0.01 0.00 Li + Na + K 10.00 9.97 9.94 9.96 9.98 5.03 5.02 5.08 5.06 5.01 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.81 −0.89 −0.89 −0.89 −0.90 −0.50 −0.49 −0.50 −0.49 −0.50 (Al + B + P) (B + Na − P)/ 0.42 0.36 0.37 0.36 0.37 0.50 0.52 0.49 0.53 0.50 (Al + Li) Si + 1.2P − 3Al − 35.66 35.88 35.72 35.85 35.99 44.93 44.55 45.10 44.73 44.86 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.540 2.331 2.365 2.456 2.536 2.395 2.435 2.541 2.634 2.359 α.sub.30-380° C. 55.9 49.0 52.5 54.1 55.5 40.0 44.2 46.1 47.8 40.7 (×10.sup.−7/° C.) Ts (° C.) 704 N.A. N.A. 716 709 838 840 810 773 N.A. 10.sup.2.5 dPa .Math. s 1,419 1,505 1,445 1,448 1,417 1,596 1,528 1,528 1,517 1,573 (° C.) TL (° C.) 1,161.88 1,141.3 1,156.04 1,126.6 1,124.32 1,251.8 1,252.2 1,137.7 1,135.3 1,246.24 or more or more or more or more logη at TL 3.5 4.0 3.7 3.8 3.7 3.96 3.63 4.22 4.14 3.9 (dPa .Math. s) or less or less or less or less Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 80 78 80 80 79 78 79 79 78 78 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00033 TABLE 33 (mol %) No. 321 No. 322 No. 323 No. 324 No. 325 No. 326 No. 327 No. 328 No. 329 No. 330 SiO.sub.2 74.84 74.91 74.71 74.67 74.77 64.82 65.03 64.62 64.70 64.77 Al.sub.2O.sub.3 4.98 4.94 4.95 4.92 4.91 5.01 4.96 4.88 4.95 5.03 B.sub.2O.sub.3 4.93 4.94 5.09 5.10 5.18 15.34 14.93 15.58 15.33 15.43 Li.sub.2O 5.00 5.00 4.99 4.99 4.99 4.99 10.01 9.99 4.99 5.00 Na.sub.2O 0.05 0.04 0.06 0.04 0.08 5.00 4.96 0.09 9.92 0.07 K.sub.2O 0.00 0.00 0.00 0.00 0.00 4.74 0.01 4.73 0.00 9.60 MgO 4.97 4.96 0.06 0.07 0.00 0.00 0.00 0.00 0.00 0.00 CaO 0.06 0.05 5.01 5.08 0.02 0.00 0.00 0.00 0.00 0.00 SrO 5.02 0.01 4.97 0.02 4.92 0.00 0.00 0.00 0.00 0.00 BaO 0.05 5.04 0.05 5.01 5.02 0.00 0.00 0.00 0.00 0.00 ZrO.sub.2 0.001 0.000 0.000 0.001 0.002 0.003 0.001 0.005 0.004 0.003 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Fe.sub.2O.sub.3 0.000 0.000 0.001 0.001 0.003 0.002 0.002 0.000 0.000 0.000 TiO.sub.2 0.002 0.002 0.000 0.000 0.000 0.001 0.000 0.002 0.002 0.000 Cl 0.002 0.002 0.002 0.002 0.002 0.002 0.002 0.001 0.001 0.001 Li/(Na + K) ∞ ∞ ∞ ∞ ∞ 0.51 2.01 2.07 0.50 0.52 (Na + K)/Li 0.01 0.01 0.01 0.01 0.02 1.95 0.50 0.48 0.99 1.93 Li + Na + K 5.05 5.04 5.06 5.03 5.07 14.73 14.98 14.81 14.91 14.67 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.50 −0.50 −0.49 −0.49 −0.49 0.00 −0.25 −0.48 0.24 −0.24 (Al + B + P) (B + Na − P)/ 0.50 0.50 0.52 0.52 0.53 2.04 1.33 1.05 2.54 1.55 (Al + Li) Si + 1.2P − 3Al − 44.90 45.07 44.68 44.76 44.75 12.24 7.76 9.54 9.66 14.53 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.445 2.521 2.479 2.557 2.645 2.389 2.366 2.384 2.403 2.379 α.sub.30-380° C. 42.2 43.3 45.5 46.7 48.6 75.0 66.6 77.5 73.5 74.1 (×10.sup.−7/° C.) Ts (° C.) 820 805 N.A. 791 777 651 633 612 648 669 10.sup.2.5 dPa .Math. s 1,572 1,563 1,534 1,516 1,504 1,181 1,141 1,041 1,145 1,228 (° C.) TL (° C.) 1,240.65 1,206.92 1,261.08 1,251.8 1,252.2 773.95 847.16 764.56 811.55 803.12 or more or more logη at TL 3.9 4.0 3.5 3.51 3.43 5.4 4.2 4.6 4.8 5.3 (dPa .Math. s) or less or less Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 78 77 80 79 79 76 80 80 79 71 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00034 TABLE 34 (mol %) No. 331 No. 332 No. 333 No. 334 No. 335 No. 336 No. 337 No. 338 No. 339 No. 340 SiO.sub.2 65.32 65.08 64.61 64.62 65.15 64.85 65.03 64.69 65.16 64.85 Al.sub.2O.sub.3 4.98 4.95 4.93 4.94 4.96 4.98 4.99 4.97 4.96 4.96 B.sub.2O.sub.3 14.61 14.83 15.28 15.31 14.69 15.05 14.94 15.46 14.90 15.05 Li.sub.2O 13.99 1.01 1.00 0.99 1.00 1.01 1.00 1.01 1.00 5.00 Na.sub.2O 1.01 9.06 9.02 8.97 9.03 0.04 0.05 0.10 0.10 5.01 K.sub.2O 0.00 0.00 0.00 0.01 0.03 8.97 8.93 8.66 8.75 0.00 MgO 0.00 4.92 0.06 0.00 0.00 4.99 0.07 0.00 0.02 4.96 CaO 0.00 0.04 4.99 0.02 0.00 0.00 4.90 0.00 0.00 0.05 SrO 0.00 0.00 0.00 4.97 0.00 0.00 0.00 4.95 0.00 0.00 BaO 0.00 0.00 0.00 0.06 5.03 0.00 0.00 0.06 5.01 0.00 ZrO.sub.2 0.002 0.000 0.001 0.002 0.003 0.003 0.003 0.000 0.001 0.002 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Fe.sub.2O.sub.3 0.000 0.001 0.001 0.003 0.002 0.002 0.000 0.000 0.002 0.001 TiO.sub.2 0.001 0.005 0.002 0.005 0.001 0.006 0.002 0.005 0.001 0.000 Cl 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.001 0.001 Li/(Na + K) 13.89 0.11 0.11 0.11 0.11 0.11 0.11 0.12 0.11 1.00 (Na + K)/Li 0.07 9.01 9.06 9.06 9.02 8.94 9.01 8.68 8.86 1.00 Li + Na + K 15.00 10.06 10.02 9.97 10.07 10.02 9.98 9.77 9.85 10.02 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.66 0.41 0.40 0.39 0.41 −0.05 −0.05 −0.04 −0.05 0.00 (Al + B + P) (B + Na − P)/ 0.82 4.01 4.10 4.09 3.98 2.52 2.50 2.60 2.52 2.01 (Al + Li) Si + 1.2P − 3Al − 6.29 19.80 19.00 19.02 20.00 23.80 24.12 23.49 24.47 17.39 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.332 2.352 2.406 2.504 2.588 2.334 2.381 2.474 2.553 2.336 α.sub.30-380° C. 59.5 62.3 64.7 66.1 67.4 65.4 68.0 69.2 69.3 56.3 (×10.sup.−7/° C.) Ts (° C.) 639 697 706 707 704 724 746 739 736 672 10.sup.2.5 dPa .Math. s 1,147 1,310 1,246 1,223 1,215 1,407 1,334 1,310 1,285 1,289 (° C.) TL (° C.) 937.6 938.7 866.78 857.5 837.35 955.02 925.8 838.48 841.75 931.5 or more or more logη at TL 3.53 4.39 5.2 5.0 5.3 4.9 5.0 5.9 5.8 4.3 (dPa .Math. s) or less or less Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 80 70 75 77 77 63 67 69 70 74 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00035 TABLE 35 (mol %) No. 341 No. 342 No. 343 No. 344 No. 345 No. 346 No. 347 No. 348 No. 349 No. 350 SiO.sub.2 64.95 64.86 65.04 64.98 64.94 65.09 65.60 65.02 64.78 65.01 Al.sub.2O.sub.3 4.95 4.96 4.95 4.98 4.96 5.00 4.99 4.98 4.96 5.02 B.sub.2O.sub.3 14.88 14.92 14.80 14.99 15.09 14.90 14.55 14.90 15.10 14.87 Li.sub.2O 5.00 5.01 4.99 4.99 5.01 5.00 4.99 9.00 9.00 8.99 Na.sub.2O 5.01 4.97 5.07 0.03 0.04 0.09 0.07 0.02 0.03 0.07 K.sub.2O 0.01 0.01 0.01 4.94 4.88 4.71 4.58 0.96 0.96 0.86 MgO 0.06 0.00 0.00 4.96 0.06 0.00 0.02 4.97 0.06 0.00 CaO 5.02 0.02 0.00 0.03 4.93 0.00 0.00 0.04 5.00 0.01 SrO 0.00 5.09 0.00 0.00 0.00 5.06 0.00 0.00 0.00 5.00 BaO 0.00 0.05 5.02 0.00 0.00 0.06 5.09 0.00 0.00 0.06 ZrO.sub.2 0.003 0.002 0.002 0.001 0.000 0.002 0.000 0.000 0.002 0.002 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Fe.sub.2O.sub.3 0.000 0.000 0.002 0.002 0.002 0.002 0.004 0.008 0.003 0.002 TiO.sub.2 0.002 0.002 0.003 0.001 0.001 0.001 0.006 0.002 0.005 0.001 Cl 0.001 0.003 0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005 Li/(Na + K) 1.00 1.01 0.98 1.00 1.02 1.04 1.08 9.19 9.09 9.69 (Na + K)/Li 1.00 0.99 1.02 1.00 0.98 0.96 0.93 0.11 0.11 0.10 Li + Na + K 10.02 9.98 10.08 9.96 9.93 9.80 9.64 9.98 9.99 9.92 Li/P — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ 0.00 0.00 0.00 −0.25 −0.25 −0.25 −0.25 −0.45 −0.45 −0.45 (Al + B + P) (B + Na − P)/ 2.00 1.99 2.00 1.51 1.52 1.50 1.46 1.07 1.08 1.07 (Al + Li) Si + 1.2P − 3Al − 17.68 17.58 17.77 20.10 20.01 20.37 21.41 16.20 15.81 16.15 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.377 2.475 2.559 2.322 2.360 2.448 2.532 2.311 2.351 2.442 α.sub.30-380° C. 59.2 60.7 62.2 57.4 60.0 62.1 62.1 50.2 52.9 54.0 (×10.sup.−7/° C.) Ts (° C.) 683 679 677 689 N.A. 709 689 679 690 590 10.sup.2.5 dPa .Math. s 1,221 1,219 1,206 1,357 1,278 1,254 1,241 1,265 1,221 1,216 (° C.) TL (° C.) 912.44 908.9 903.35 962.62 840.39 787.42 799.61 913 945.82 955.02 logη at TL 4.2 4.3 4.3 4.3 5.5 6.1 5.7 4.4 3.9 3.9 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 77 79 79 69 72 74 75 76 79 80 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    TABLE-US-00036 TABLE 36 (mol %) No. 351 No. 352 No. 353 No. 354 No. 355 No. 35 6 No. 357 No. 358 No. 359 No. 360 No. 361 SiO.sub.2 65.27 64.78 64.37 64.67 64.54 65.00 65.50 65.32 64.83 64.93 64.39 Al.sub.2O.sub.3 4.99 5.00 4.97 4.96 4.95 5.00 4.99 4.97 4.97 4.94 4.92 B.sub.2O.sub.3 14.68 15.10 15.50 15.16 15.34 14.81 14.20 14.57 14.84 14.82 15.65 Li.sub.2O 9.00 4.99 5.00 5.01 5.00 5.00 5.01 5.00 5.00 4.99 4.99 Na.sub.2O 0.05 0.02 0.03 0.07 0.06 0.02 0.05 0.03 0.06 0.04 0.08 K.sub.2O 0.85 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 MgO 0.02 6.93 1.02 1.00 1.01 4.98 4.94 4.92 0.06 0.07 0.00 CaO 0.00 1.04 7.00 1.01 1.04 5.05 0.06 0.05 5.02 5.08 0.04 SrO 0.01 1.03 1.01 6.94 1.00 0.01 5.10 0.01 5.04 0.01 4.87 BaO 5.03 1.01 1.00 1.05 6.96 0.00 0.05 5.03 0.05 4.99 4.95 ZrO.sub.2 0.002 0.003 0.002 0.003 0.002 0.004 0.004 0.000 0.002 0.003 0.000 Y.sub.2O.sub.3 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 ZnO 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 P.sub.2O.sub.5 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 SnO.sub.2 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Fe.sub.2O.sub.3 0.002 0.004 0.002 0.002 0.001 0.003 0.003 0.000 0.002 0.005 0.003 TiO.sub.2 0.003 0.000 0.000 0.004 0.003 0.005 0.001 0.004 0.009 0.007 0.009 Cl 0.005 0.005 0.007 0.007 0.007 0.007 0.007 0.007 0.007 0.007 0.007 Li/(Na + K) 10.00 — — — — — — — — — — (Na + K)/Li 0.10 0.00 0.01 0.01 0.01 0.00 0.01 0.01 0.01 0.01 0.02 Li + Na + K 9.90 5.01 5.04 5.09 5.06 5.02 5.06 5.04 5.07 5.03 5.06 Li/P — — — — — — — — — — — P/Li 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 (Na − Li)/ −0.45 −0.25 −0.24 −0.25 −0.24 −0.25 −0.26 −0.25 −0.25 −0.25 −0.24 (Al + B + P) (B + Na − P)/ 1.05 1.51 1.56 1.53 1.55 1.48 1.43 1.46 1.49 1.50 1.59 (Al + Li) Si + 1.2P − 3Al − 16.69 24.68 23.91 24.48 24.28 25.14 26.25 25.80 24.97 25.23 23.88 2Li − 1.5Na − K − B ρ (g/cm.sup.3) 2.523 2.367 N.A. N.A. 2.610 N.A. 2.420 2.493 N.A. 2.539 2.628 α.sub.30-380° C. 55.5 42.1 (45) (47) 48.7 (41) 43.8 45.0 (45) 48.0 50.0 (×10.sup.−7/° C.) Ts (° C.) 674 827 N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. 10.sup.2.5 dPa .Math. s 1,209 1,371 N.A. N.A. 1,285 N.A. 1,344 1,340 N.A. 1,294 1,276 (° C.) TL (° C.) 948.55 1,011.8 N.A. N.A. 1,019.38 N.A. 1,015.22 996.06 N.A. 1,026.37 1,031.86 logη at TL 3.9 4.6 N.A. N.A. 3.9 N.A. 4.2 4.3 N.A. 3.9 3.7 (dPa .Math. s) Acid resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (HCl 5 wt % 80° C. 24 h) Alkali resistance N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (NaOH 5 wt % 80° C. 6 h) E (GPa) 79 74 N.A. N.A. 77 N.A. 75 74 N.A. 78 79 K.sub.1C (MPa .Math. m.sup.0.5) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. CS.sub.K (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.K N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm) CS.sub.Na (MPa) N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. DOL_ZERO.sub.Na N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. (μm)

    [0136] Samples in the tables were each produced as described below. First, glass raw materials were blended so as to give a glass composition shown in the table, and were melted at 1,600° C. for 21 hours with a platinum pot. Subsequently, the resultant molten glass was poured out on a carbon sheet and formed into a flat sheet shape, followed by being cooled in a temperature region of from an annealing point to a strain point at a rate of 3° C./min. Thus, a glass substrate (glass substrate to be tempered) was obtained. The surface of the resultant glass substrate was optically polished so as to give a sheet thickness of 1.5 mm, and then the glass substrate was evaluated for various characteristics.

    [0137] The density (p) is a value measured by a well-known Archimedes method.

    [0138] The thermal expansion coefficient (α.sub.30-380° C.) at 30° C. to 380° C. is a value measured for an average thermal expansion coefficient with a dilatometer.

    [0139] The temperature (10.sup.2.5 dPa.Math.s) at a viscosity at high temperature of 10.sup.2.5 dPa.Math.s is a value measured by a platinum sphere pull up method.

    [0140] The softening point (Ts) is a value measured based on a method of ASTM C338.

    [0141] The liquidus temperature (TL) was determined as a temperature obtained as described below. Glass powder which had passed through a standard 30-mesh sieve (500 μm) and remained on a 50-mesh sieve (300 μm) was loaded into a platinum boat, and the platinum boat was kept for 24 hours in a temperature gradient furnace and was then taken out of the furnace. At this time, a highest temperature at which devitrification (devitrified stones) was observed with a microscope in glass was measured. The liquidus viscosity (log η at TL) is a value measured for a viscosity at the liquidus temperature by a platinum sphere pull up method, and is logarithmically represented as log η.

    [0142] The Young's modulus (E) is a value calculated by a method in conformity with JIS R1602-1995 “Testing methods for elastic modulus of fine ceramics.”

    [0143] The fracture toughness K.sub.1C is a value calculated by a method in conformity with JIS R1607-2015 “Testing methods for fracture toughness of fine ceramics at room temperature.”

    [0144] The acid resistance test is evaluated as described below. A glass sample having been subjected to mirror polishing treatment on both sides so as to give dimensions of 50 mm×10 mm×1.0 mm was used as a measurement sample. The sample was sufficiently washed with a neutral detergent and pure water, and was then immersed in a 5 mass % HCl aqueous solution warmed to 80° C. for 24 hours. In this case, a mass loss (mg/cm.sup.2) per unit surface area before and after the immersion was calculated.

    [0145] The alkali resistance test is evaluated as described below. A glass sample having been subjected to mirror polishing treatment on both sides so as to give dimensions of 50 mm×10 mm×1.0 mm was used as a measurement sample. The sample was sufficiently washed with a neutral detergent and pure water, and was then immersed in a 5 mass % NaOH aqueous solution warmed to 80° C. for 6 hours. In this case, a mass loss (mg/cm.sup.2) per unit surface area before and after the immersion was calculated.

    [0146] As apparent from the tables, it is conceived that each of Sample Nos. 1 to 361 has an average linear thermal expansion coefficient within the temperature range of from 30° C. to 380° C. of 39.6×10.sup.−7/° C. or more and 107.4×10.sup.−7/° C. or less, a Young's modulus of 63 GPa or more, and a fracture toughness K.sub.1C of 0.91 MPa.Math.m.sup.0.5 or more, and is hence less liable to cause a dimensional change of the substrate to be processed and less liable to be broken at the time of dropping.

    [0147] Subsequently, each of the glass substrates was subjected to ion exchange treatment by being immersed in a KNO.sub.3 molten salt at 430° C. for 4 hours. Thus, a tempered glass substrate having a compressive stress layer in a glass surface was obtained. After that, the glass surface was washed, and the compressive stress value (CS.sub.K) and the depth of layer (DOL_ZERO.sub.K) of the compressive stress layer on the outermost surface were calculated based on the number of interference fringes observed with a surface stress meter FSM-6000 (manufactured by Orihara Industrial Co., Ltd.) and intervals therebetween. Herein, the “DOL_ZERO.sub.K” is a depth at which the compressive stress value becomes zero. In calculation of the stress characteristics, the refractive index and the optical elastic constant of each sample were set to 1.51 and 30.1 [(nm/cm)/MPa], respectively.

    [0148] In addition, each of the glass substrates was subjected to ion exchange treatment by being immersed in a NaNO.sub.3 molten salt at 380° C. for 1 hour. Thus, a tempered glass substrate was obtained. After that, the glass surface was washed, and the compressive stress value (CS.sub.Na) and the depth of layer (DOL_ZERO.sub.Na) of the compressive stress layer on the outermost surface were calculated based on a retardation distribution curve observed with a scattered light photoelastic stress meter SLP-1000 (manufactured by Orihara Industrial Co., Ltd.). Herein, the “DOL_ZERO.sub.Na” is a depth at which the stress value becomes zero. In calculation of the stress characteristics, the refractive index and the optical elastic constant of each sample were set to 1.51 and 30.1 [(nm/cm)/MPa], respectively.

    [0149] As apparent from the tables, it is conceived that each of Sample Nos. 1 to 361, which has a compressive stress value (CS.sub.K) of the compressive stress layer on the outermost surface of 473 MPa or more when having been subjected to the ion exchange treatment with the KNO.sub.3 molten salt, and has a compressive stress value (CS.sub.Na) of the compressive stress layer on the outermost surface of 165 MPa or more when having been subjected to the ion exchange treatment with the NaNO.sub.3 molten salt, can be subjected to ion exchange treatment with any of these molten salts, and is less liable to be broken at the time of dropping.

    Example 2

    [0150] First, glass raw materials were blended so as to give glass compositions of Sample Nos. 2 and 34 shown in Table 1, and were melted at 1,600° C. for 21 hours with a platinum pot. Subsequently, the resultant molten glass was poured out on a carbon sheet and formed into a flat sheet shape, followed by being cooled in a temperature region of from an annealing point to a strain point at a rate of 3° C./min. Thus, a glass substrate was obtained. The surface of the resultant glass substrate was optically polished so as to give a sheet thickness of 0.7 mm for Sample No. 2, and a sheet thickness of 0.8 mm for Sample No. 34.

    [0151] Next, the glass substrate was subjected to ion exchange treatment by being immersed in a NaNO.sub.3 molten salt (concentration of NaNO.sub.3: 100 mass %) at 380° C. for 3 hours, and was then subjected to ion exchange treatment by being immersed in a mixed molten salt of KNO.sub.3 and LiNO.sub.3 (concentration of LiNO.sub.3: 2.5 mass %) at 380° C. for 75 minutes. Further, the surface of the resultant tempered glass substrate was washed, and then the stress profile of the tempered glass substrate was measured with a scattered light photoelastic stress meter SLP-1000 (manufactured by Orihara Industrial Co., Ltd.) and a surface stress meter FSM-6000 (manufactured by Orihara Industrial Co., Ltd.). As a result, the same non-monotonic stress profile as in FIG. 4, that is, a stress profile having a first peak, a second peak, a first bottom, and a second bottom was obtained in each case.

    Example 3

    [0152] First, glass raw materials were blended so as to give glass compositions of Sample Nos. 108 and 145 shown in Table 5, and were melted at 1,600° C. for 21 hours with a platinum pot. Subsequently, the resultant molten glass was poured out on a carbon sheet and formed into a flat sheet shape, followed by being cooled in a temperature region of from an annealing point to a strain point at a rate of 3° C./min. Thus, a glass substrate was obtained. The surface of the resultant glass substrate was optically polished so as to give a sheet thickness of 0.7 mm.

    [0153] Next, the glass substrate was subjected to ion exchange treatment by being immersed in a NaNO.sub.3 molten salt (concentration of NaNO.sub.3: 100 mass %) at 380° C. for 3 hours, and was then subjected to ion exchange treatment by being immersed in a mixed molten salt of KNO.sub.3 and LiNO.sub.3 (concentration of LiNO.sub.3: 1.5 mass %) at 380° C. for 45 minutes. Further, the surface of the resultant tempered glass substrate was washed, and then the stress profile of the tempered glass substrate was measured with a scattered light photoelastic stress meter SLP-1000 (manufactured by Orihara Industrial Co., Ltd.) and a surface stress meter FSM-6000 (manufactured by Orihara Industrial Co., Ltd.). As a result, the same non-monotonic stress profile as in FIG. 5, that is, a stress profile having a first peak, a second peak, a first bottom, and a second bottom was obtained in each case. Accordingly, it is expected that the resultant tempered glass substrate has a low breakage probability at the time of dropping.

    Example 4

    [0154] First, a glass batch obtained by blending glass raw materials so as to give a glass composition shown in the table was loaded into a platinum crucible, followed by being melted at 1,500° C. to 1,700° C. for 24 hours, fined, and homogenized. At the time of melting of the glass batch, the batch was homogenized by being stirred with a platinum stirrer. Next, the molten glass was poured out on a carbon sheet and formed into a sheet shape, followed by being annealed at a temperature around an annealing point for 30 minutes.

    [0155] Subsequently, the glass substrates according to Sample Nos. 1 to 361 were each processed into 000 mm×0.8 mm in thickness, and both surfaces thereof were then subjected to polishing treatment with a polishing device. Specifically, both the surfaces of the glass substrate were sandwiched between a pair of polishing pads having different outer diameters, and both the surfaces of the glass substrate were subjected to polishing treatment while the glass substrate and the pair of polishing pads were rotated together. The polishing treatment was controlled so that part of the glass substrate sometimes protruded from the polishing pads. The polishing pads were each made of urethane, a polishing slurry used for the polishing treatment had an average particle diameter of 2.5 μm, and a polishing rate was 15 m/min. The resultant glass substrates having been subjected to the polishing treatment were each measured for a total thickness variation (TTV) and a warpage level with SBW-331ML/d manufactured by Kobelco Research Institute, Inc. As a result, the total thickness variation (TTV) and the warpage level of each of the glass substrates were found to be 0.38 μm and 28 μm, respectively. The glass substrates were each conceived to be suitable as the support glass substrate.

    INDUSTRIAL APPLICABILITY

    [0156] The support glass substrate of the present invention is suitable as a support glass substrate for manufacturing a WLP or a PLP. The support glass substrate of the present invention is expected to be applied to applications for which high mechanical strength is required, for example, a window glass, a substrate for a magnetic disk, a substrate for a flat panel display, a substrate for a flexible display, a cover glass for a solar cell, a cover glass for a solid state image sensor, and a cover glass for an automobile, in addition to the above-mentioned applications.

    REFERENCE SIGNS LIST

    [0157] 1, 27, 30 laminated substrate [0158] 10, 26, 31 support glass substrate [0159] 11, 24, 34 substrate to be processed [0160] 12, 32 peeling layer [0161] 13, 21, 25, 33 adhesive layer [0162] 20 supporting member [0163] 22, 35 semiconductor chip [0164] 23 sealing material [0165] 28 wiring [0166] 29 solder bump [0167] 36 polishing device [0168] 37 UV light