AUXETIC WEB STRUCTURE OR FIELD STRUCTURE, AND USE
20240131234 ยท 2024-04-25
Inventors
Cpc classification
A61L31/14
HUMAN NECESSITIES
B29C44/357
PERFORMING OPERATIONS; TRANSPORTING
International classification
A61L31/14
HUMAN NECESSITIES
Abstract
An auxetic web structure or field structure useful for a medical implant, combining the advantageous mechanical properties of auxetic structures and stretchable interconnects in such a way as to provide an auxetic structure which is particularly stretchable, while at the same time providing sufficiently large areas which are subjected at most to only minor stresses. This structure takes advantage of the superior mechanical properties offered by auxetic metamechanical materials (hereafter referred to as auxetic) and improves their stretchability and compressibility by incorporating interconnects into the auxetic framework.
Claims
1. An auxetic web structure or field structure comprising: island structure areas and interconnections between the individual island structure areas, wherein there are open spaces between the individual island structure areas, and the connections with the island structure areas form a web structure or field structure; wherein the connections are extensible and are configured as Archimedean spiral connections and/or self-similar fractal design connections; the connections intersect the island structure areas at the same location and at the same angle intersect the auxetic framework at the same location and angle as the previous rigid connectors; the island structure areas are not bendable or are only slightly bendable when subjected to forces, wherein the stresses on the island structure areas are at least one order of magnitude below those of the extensible connection and/or are not or only insignificantly variable in their magnitude and the Poisson's ratio of the structure under uniaxial deformation is negative.
2. An auxetic web structure or field structure according to claim 1, wherein the individual island structure areas and/or the individual connections are designed to vary in size and shape.
3. An auxetic web structure or field structure according to claim 1, wherein at least in sections over the auxetic web structure or field structure, areas are formed identically and/or periodically.
4. An auxetic web structure or field structure according to claim 1, wherein the self-similar fractal design connections comprise Koch's lines, Peano's lines, Hilbert's lines, Moore's loops, Vicsek's loops and branched meshes.
5. An auxetic web structure or field structure according to claim 1, wherein the auxetic web structure or field structure is planar, 2D fabricated and subsequently adapted to 3D surfaces.
6. An auxetic web structure or field structure according to claim 1, wherein at least individual island structure areas for receiving electronics or individual island structure areas equipped with electronics are provided.
7. An auxetic web structure or field structure according to claim 6, wherein the electronics located on the island structure areas are electrically connected to each other via at least one conductor track electrically insulated from the auxetic web structure or field structure on at least one connection of the auxetic web structure or field structure.
8. An implantable structure made of a biocompatible material having the auxetic web structure or field structure according to claim 1, wherein the biocompatible material is a metallic shape memory alloy and the auxetic web structure or field structure is metallic.
9. The implantable structure according to claim 8, wherein the implantable structure has a self-expanding implant shape with a cylindrical and/or spherical and/or hemispherical and/or tubular and/or curved tubular structure at least in sections.
10. The implantable structure according to claim 8, wherein the auxetic web structure or field structure is provided in the form of a common ground electrode.
Description
[0114] The invention is described below with reference to the accompanying figures in the figure description, which is intended to explain the invention and is not necessarily limiting. Showing:
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[0142] As previously shown, prior art stretchable island interconnects are typically connected at the center of the islands, resulting in a Poisson's ratio of zero under uniaxial loading. The structures must be stretched biaxially (in the x and y directions) to achieve expansion, or compressed biaxially to achieve a fully compressed structure. In uniaxial tensile tests (in the y-direction only), the structures exhibit a positive or zero Poisson's ratio. The 2D corrugated network proposed in
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[0152] The structures presented in this invention provide an extremely compliant and deformable substrate that allows any material to become flexible, stretchable, and conformable.
[0153] Wearable devices that are intended to be worn directly on the skin must be able to adapt to extreme motion and the resulting changes in body curvature radius. Stretchable auxetic structures must be able to freely expand and contract to accommodate abrupt changes in deformation.
[0154] The auxetic behavior is shown in the figures below for extensible auxetic structures based on rotating squares of the same size and rotating rectangles of different sizes.
[0155] Finite element analysis (FEM) using COMSOL Multiphysics 5.6 is used in some of the figures below to show the auxetic behavior of the structures according to the invention under a uniaxial compressive force (compressed) and a uniaxial tensile force (stretched). The illustrated structure according to the invention has a negative Poisson's ratio, as shown by the volume expansion in the perpendicular direction under uniaxial displacement. The maximum extensibility of the unit cell depends on the design of the exemplary Archimedean spiral connection used.
[0156] For all FEM simulation results presented, copper was used as the material, assuming a Young's modulus of E=119 GPa, a Poisson's ratio of 0.34, and a density of 8940 kg/m3.
[0157] Analysis of the von Mises stress distribution after applying strain to the unit cell confirms low stresses on the large periodic island structural surfaces, as the stress is concentrated and distributed throughout the ductile joint for all modeled structures.
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[0164] The development of an array based on the presented exemplary structure according to the invention would enable a highly deformable 2D electronic device that can conform to essentially any type of concave or convex 3D surface.
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[0166] An array of a rotating square Archimedean polygonal structure is suitable as a substrate for an implantable medical device, as this would allow improved extensibility and compressibility of the structure to meet crimp requirements to be inserted into the body through a microcatheter For a given stent circumference, traditional auxetic stent structures provide 10 times higher radial forces than current designs (as known, for example, from Dolla, William Jacob S., Brian A. Fricke, and Bryan R. Becker. Structural and drug diffusion models of conventional and auxetic drug-eluting stents. (2007): 47-55.). The addition of tortuous bar structures/connections, also known as stretchable interconnectors, to the framework of auxetic structures reduces the bending stiffness of the overall structure, resulting in crushing and stretching under small applied forces. This means that medical devices based on stretchable auxetic structures are easier to crimp, maneuver, and deploy through a microcatheter.
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[0168] A major advantage of the stretchable auxetic structures presented here is that they can be fabricated planar in 2D and then conform to 3D surfaces. If the structure is made of an amorphous shape memory alloy, it is possible to fabricate, for example, a medical implant entirely using 2D MEMS techniques, and then to shape the shape memory material into an intricate 3D geometry by crystallization of the shape memory alloy. This concept is illustrated in
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[0172] Shape memory alloys (SMAs) are known to have better mechanical properties than conventional metals such as copper. SMAs are the preferred substrate material for the structures presented in the present invention. The shape memory alloy NiTi is biocompatible and is already used in medical devices such as stents. TiNiCu and TiNiCuCo alloys are not biocompatible, but have already been shown to be ultra-low fatigue SMAs capable of cycling between 0% and 2% intrinsic strain for more than 10 million cycles (Chluba, Christoph, et al. Ultralow-fatigue shape memory alloy films. Science 348.6238 (2015): 1004-1007.). Novel stretchable auxetic structures were fabricated from ultra-low fatigue TiNiCuCo thin films (thickness=53 m) to provide proof of concept.
[0173] In
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[0176] Furthermore,
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[0178] All dimensions and values shown in
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[0180] The lower edge is a fixed constraint, while the upper edge undergoes a prescribed uniaxial displacement in the direction of the arrow.
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[0184] In addition,
[0185] All dimensions and values shown in
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[0190] Superelastic recovery of elastic strain after removal of the applied force with extremely low total plastic strain to the structures of 3.75% (unit cell) and 5% (array) is shown in
[0191] The macroscopic yield strength of copper in the extensible auxetic geometries is determined when the yield stress exceeds 200 MPa or the first principal strain exceeds 2%. According to the simulation results, copper thin films with the same dimensions as the unit cell structures experimentally demonstrated in
[0192] All dimensions and values shown in
[0193] For the illustration in
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[0204] In addition,
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[0206] Examples of a 2D wavy mesh design with a square lattice geometry using second-order fractal horseshoe-serpentine connections and square island structure areas and a 2D wavy mesh design with a square lattice geometry using second-order fractal horseshoe-serpentine connections and square island structure areas formed into a 3D cylindrical geometry are shown in
[0207] In
[0208] 17A) Structure under 30% compressive strain from the top edge and 30% compressive strain from the bottom edge. Uniaxial compressive strain of 60% in total.
[0209] 17B) Structure under 20% compression load from the top edge and 20% compression load from the bottom edge. Uniaxial compressive strain of 40% in total.
[0210] 17C) Structure under 10% strain from top edge and 10% strain from bottom edge. 20% total uniaxial tensile strain.
[0211] 17D) Structure under 30% elongation from top edge and 30% elongation from bottom edge. Uniaxial tensile strain of 60% in total.
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[0213] 18A) Structure in equilibrium state
[0214] 18B) Structure under ?5% strain.
[0215] 18C) Structure at ?10% extension
[0216] 18D) Structure under ?20% expansion
[0217] 18E) Structure under ?100% expansion
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[0219] 19A) Structure at equilibrium (0% load).
[0220] 19B) structure under ?10% compression
[0221] 19C) Structure under ?20% compression
[0222] 19D) Structure under ?40% compression.
[0223] Thin films of auxetic shape memory alloys will be the preferred substrate for future medical implants. Shape memory alloys such as TiNi are currently used in passive medical devices such as stents because they are biocompatible and can be made small enough to be inserted into the body's arteries via a microcatheter. The main advantage of using shape memory alloys as a functionalized auxetic backbone for medical implants is that they add functionality to the implant (i.e., self-deployment, shape recovery, superelasticity). Large strains of 6-8% are achieved through thermal and stress-induced phase transformations, therefore auxetic SMAs can expand or deconvolve to much larger volumes than conventional auxetic metals (for example, steel). In addition, non-biocompatible NiTi-based shape memory alloys such as TiNiCu and TiNiCuCo can be engineered to exhibit extremely low fatigue behavior that allows them to undergo ?10 million transition cycles with minimal change in mechanical or thermal behavior, making them attractive for wearable devices.
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[0225] Because the SMA backbone is conductive, both sides of the SMA substrate can be functionalized, increasing the available surface area for device integration. Since the SMA can be a common ground electrode, it can function as a printed circuit board. Examples of devices suitable for functionalization include integrated biosensors and readout components, antennas, piezoelectric devices, batteries, cameras, LEDs, actuators, and the like.
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[0227] This is an example of a series of fabrication steps that can be performed to fabricate and electrically isolate two different devices on adjacent island structure areas after mechanically clamping the auxetic SMA backbone flat, as described in
[0228] In step a), the auxetic base structure consisting of a crystallized shape memory alloy/SMA/shape memory alloy is first fabricated, forming island structure areas 11, 12 and interconnections 13, with the interconnections connecting the island structure areas. In this process or quasi-manufacturing diagram, only two island structure areas 11, 12 are shown as examples, which are then functionalized. Some island structure areas may be functionalized accordingly or may be functionalized further on.
[0229] In step b), a first electrical insulation layer 2 is applied to at least those areas of the structure in which electrical connections and/or electrical components/electronic components are to be applied. A complete coating of the structure can also be carried out.
[0230] In step c), a first electrode 3 is applied so that at least the necessary areas are covered with an appropriate conductive material. So at least the areas of the connections and those island structure areas that require electrical connection are covered with the first electrode 3.
[0231] By this embodiment, an electrical structure is already realized, since the basic structure, namely the metallic auxetic SMA structure (with the shape memory alloy) 11, 12, 13 serves as a common ground electrode and the now applied electrode 3 represents the further conductor. The SMA auxetic backbone is itself then the common ground electrode, so as to connect electrical components.
[0232] In step d), the assembly of the electronic components 41, 42 then takes place, which can be or are of different nature and in particular can be interconnected in combination to form a large system.
[0233] In step e), the last step in this example is then the coating of the overall structure with a biocompatible material. For example, this may be a biocompatible polymer that protects the human body from electronics. The area of the metallic auxetic SMA structure can be omitted here, as this is biocompatible.
[0234] At this point, it should be noted that sensible patterning does not necessarily require that all areas of the auxetic SMA structure 11, 12, 13 be provided with appropriate layers and/or components; rather, there may be empty island structure areas and interconnects that have a supportive function but do not have a load-bearing function for electrical components or even electrical conduction. This differs from the methods in US 2020/0144431 A1, where a semiconductor device had to be patterned with serpentine interconnects on each island structure area and each serpentine of an auxetic lattice structure.
[0235] Not further illustrated, but furthermore also possible, is the positioning of the first electrode above the electrical components or electronic components, so that an electrically insulating layer is first built up on the auxetic SMA structure and then the electronic components or, in general, the components are applied, followed by a further electrically insulating layer followed by the electrode. In addition, further conductors, each separated by electrically insulating layers, can be built up on top of each other. Deviations from this are of course possible for design reasons.
[0236] Upon completion of fabrication of all MEMS components, the SMA is heated above its martensitic phase transformation temperature (typically body temperature ?37? C.) to restore the shape previously established during annealing. If the part is intended as a medical implant, it can now be crimped to be inserted into a microcatheter. If a flat 2D shape was thought of, the functionalized stretchable/flexible device is ready to conform to the underlying substrate (e.g., the skin of a wearable e-tattoo or biosensor). At this stage, the functionalized devices can optionally be embedded (or coated) in a biocompatible polymer if required for the application.
[0237] Various thin-film processes known in the prior art can be used to apply the various functional layers. Preferably, sputtering, in particular magnetron sputtering, should be mentioned in this context. However, other thin-film processes are also possible, such as sol-gel or vapor disposition processes. Reference should also be made to U.S. Pat. No. 8,758,636 B2, which discloses a method of fabricating a medical functional element having a self-supporting lattice structure, specifically describing the fabrication of special shape memory alloy thin film components intended for stent devices.
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[0239] Complex network structures can be constructed.
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[0242] This embodiment can be used as a smart stent, with the 2D detail in
[0243] Auxetic shape memory alloys would be particularly attractive for use in medical implants and stents in arteries of the cardiovascular and neurological systems because the implants could be delivered to the patient through noninvasive endovascular treatments. Negative Poisson's ratio allows auxetic structures to change shape and conform to the surrounding surface, the complex arteries and veins of the body, as shown in
[0244] In addition, it is possible to directly fabricate MEMS and NEMS components to provide the island structure areas of the auxetic structure with integrated sensors and readout components.
[0245] As another example, what is disclosed herein could provide a platform for integrating components such as cameras, lights (LEDs), and sensors to guide/position/track the stent position during placement. With further innovation of this invention, this could be a method that eliminates the need for MRI or X-ray imaging for stent placement in the future. In addition to conforming to the shape of the body, the auxetic structure can also be designed to achieve a compromise between the areal density of the unit cell and the maximum volume expansion of the entire structure. For example, changes in blood flow (pressure) in some arteries can be controlled by designing the areal density of the auxetic structure (i.e., large vs. small island structure areas or large vs. small openings between island structure areas) in the deployed state. Modifying the areal density of the device to restrict blood flow to an aneurysm is desirable, for example, in the case of a flow diverter stent. In addition, noninvasive measurements of medical data, such as blood pressure, could be wirelessly transmitted to the physician if the appropriate sensing elements are functionalized on the islet structure areas, which have only low voltages. In addition, these island structure areas can be equipped with X-ray markers that detect rotation of the stent or device so that the devices can be deployed in a specific position with a specific angle so that the functional islands can be easily placed where they are needed.
[0246] The large tensile stresses associated with the superelastic effect enable auxetic shape memory materials to provide extremely high strength, high working performance, and high actuation density. It has already been shown that auxetic stent structures have higher radial forces at the stent circumference 10 times higher than current stent designs. This means that thinner SMA devices can be fabricated that are easier to squeeze, maneuver, and deploy in the microcatheter.
[0247] The combination of flexibility and strength offered by shape memory alloy auxetic stents could also be useful for other medical applications that require temporary or permanent opening of a narrow passageway. These include stents that require greater radial forces than those required for the brain, for example, for use in the esophagus, urethra, and prostate.
[0248] Because of the above properties of auxetic shape memory materials, the present invention is suitable for functionalizing the exterior of surgical devices or for other temporary medical implants. For example, a flexible/stretchable 3D implant with integrated CO2/O2 sensors, cameras, LEDs, and pressure sensors could be a useful tool for surgeries/procedures where tubes are inserted into the patient's airway as described by Ullah, Ramzan, et al. in Real-Time Optical Monitoring of Endotracheal Tube Displacement. Biosensors 10.11 (2020): 174. For example, if such a device were wrapped around the outside of an intubation tube, it could help physicians/respiratory therapists insert the intubation tube more quickly and accurately. The cameras/LEDs help to find the right place in the trachea for placement (2 cm-5 cm above the carina). The CO2/O2 sensors integrated on the outside of the intubation tube (i.e., directly on (or above) the cuff) could help detect air leak (indicating misplacement of the device either in the lung or esophagus). The current method of detecting correct placement of the tube relies on x-rays. Built-in pressure sensors in the cuff could help physicians monitor the pressure they are applying to the patient as they inflate the cuff (the balloon) to secure the intubation tube. This is just one example of how an auxetic medical SMA implant could be used in conjunction with existing surgical instruments.
[0249] Like the stent placement issues mentioned earlier, confirming intubation tube placement often requires radiography, which is both time-consuming and costly. With the proper arrangement (co-integration) of multiple functional devices, the medical implant disclosed in this invention may eliminate this imaging step in the future.
[0250] Treatment of brain aneurysms also requires a miniaturized medical device that can be deployed noninvasively with current endovascular treatment methods, such as a catheter.
[0251] Flow detour stents, coiling, and woven endobridges (WEBs) are common methods of treating aneurysms. While most types of cerebral aneurysms can be treated with flow diverter stents, there are currently no suitable stent-based intrasaccular devices for the treatment of aneurysms that have the shape of a geodesic dome. Stents also cannot be used for bifurcation-type aneurysms because they can block blood flow in an artery, which can lead to stroke. The most common method of treating this type of aneurysm is to physically occupy the space (e.g., with Pt coils) to restrict further blood flow into the aneurysm. However, a major side effect of this treatment is that the Pt coils are a source of noise that prevents accurate measurement of blood flow in the aneurysm using conventional MRI techniques. The auxetic design according to the invention is capable of providing the same advantages as a WEB device as well as additional advantages because the auxetic design allows more freedom in sizing the device by photolithography than a conventional mesh design. In addition, the low-stress island structure areas of the auxetic structure of the invention are the only type of intrasaccular medical devices that are functionalized and allow direct readout of information related to the healing process, such as blood flow in the aneurysm, device failure, or reduction in the body's response, such as inflammation, to the device.
[0252] The disclosed invention is a unique type of device that can overcome the limitations presented for the modern treatment of intrasacular aneurysms. The modified stretchable auxetic structure according to the invention exhibits synclastic (conformal) bending around dome-shaped curves (as shown in the embodiment example in
[0253] The synclastic bending properties of auxetic SMA implants could also be useful for improving surgical instruments. Because the auxetic substrate can conform to the shape of its surroundings, it could wrap around the outside of existing surgical instruments. This could improve surgical outcomes by allowing physicians to add new devices to their surgical instruments that were not previously available (e.g., lights, cameras, sensors). By integrating sensors on the islet structural surfaces, it would be possible to monitor blood pressure or blood flow inside an aneurysm noninvasively with this device. Noninvasive monitoring of blood flow without MRI imaging could be revolutionary for the treatment of brain aneurysms. In addition, the use of a dome-shaped SMA device inside the aneurysm would be safer for the patient by reducing surgical time and increasing patient safety by reducing anesthesia time, radiation, and contrast exposure.
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[0257] Applications of the technology in particular of the substrate structure according to the present disclosure include: [0258] functionalized medical devices and implants (conformal skin sensors, stents, percutaneous heart valve repair, intrasaccular devices, expandable/collapsible endotracheal tube, functional inferior vena cava (IVC) filter); [0259] Space applications (deformable lightweight space applications, i.e. Substrate structure enabling more functionalization on rovers and spacecraft, deployable solar sails); [0260] Energy collectors integrated directly into car and bicycle tires (e.g., piezoelectric elements); [0261] flexible/stretchable LEDS, displays and cameras (individual pixels/sensors integrated on the Island structure areas integrated); [0262] General structures for wearable and stretchable electronics; [0263] Stretchable electrodes for soft actuators; [0264] Functionalized transportation devices (e.g., indoor/outdoor aircraft, Spacecraft, boats, hot air balloons); [0265] Functionalized outdoor equipment (e.g., solar-heated sleeping bag and tent); [0266] Impact-resistant energy absorbers for vehicles; [0267] Architectural buildings (structures can likely bend around any shape); [0268] Auxetic clothing and functionalized garments (e.g., compression socks, -shirts, pants, shoes, backpacks, tourniquets); [0269] Impact-resistant military equipment (e.g., bulletproof vest).
[0270] The structures disclosed herein can be used in the same applications that conventional auxetic structures are used. In particular, the applications are: [0271] Biomedical: arterial dilator/stent, drug-eluting stent, stent-assisted coiling, smart wound dressing, tissue engineering (i.e. artificial skin), artificial blood vessels, wound pressure pads, surgical devices; [0272] Aerospace: gas turbine engine blades, thermal protection, aircraft noses, wing fairings, acoustic vibration rivets; [0273] Automotive: bumpers, cushions, thermal protection, vibration dampers; [0274] Sensors/Actuators: Wave propagation, vibration/damping structures, smart strain sensors, hydrophone, piezoelectric components; [0275] Military/defense/sports: impact/energy absorbing military equipment with integrated sensor components (e.g., bulletproof vest, helmet, knee pads, etc.).
[0276] If the auxetic web structure or field structure according to the invention is used for functionalized medical devices and implants, they must be able to withstand extreme demands. Biosensors, also called wearable devices, for example, that can be integrated directly on the skin or a substrate worn close to the skin, must be able to adapt to extreme movements and the resulting changes in the body's radius of curvature. Stretchable devices can be fabricated using serpentine structures, mesh structures, and island bridge structures. When fabricated from shape memory alloys, the auxetic structures shown here have many advantages over the stretchable designs for stretchable electronics known in the prior art. Herein, a platform for an extremely compliant and deformable substrate is demonstrated to enable the development of novel stretchable thin film devices. Auxetic shape memory alloy substrates offer superior mechanical properties over the state of the art for flexible/stretchable designs based on copper serpentines in island-bridge configurations. Shape memory alloys have superior mechanical properties over copper that allow them to recover elastically from extremely applied large amounts of strain (theoretically up to >8% elastic).
[0277] There are many applications of shape memory/piezoelectric composites for various energy harvester and microactuator applications. For example, sensitive magnetoelectric sensors based on piezoelectric and magnetostrictive materials can be integrated on shape memory alloys. Miniaturized magnetoelectric composites are appropriately required for applications such as bio-magnetic sensors, antennas, energy harvesters, and surface acoustic wave sensors. In principle, all auxetic sensor concepts can be energized by the motion of the body or blood flow itself when paired with a piezoelectric (or magnetoelectric) energy harvester. Selective fabrication of AlN components on the low voltage islands may enable the development of sensitive magnetoelectric sensors for biomagnetic sensing of sensitive signals coming from the heart and brain. Such magnetoelectric sensors would also be useful for applications such as deep brain stimulation.
[0278] The unique properties of shape memory alloy can increase the mechanical strength/robustness of a stretchable circuit while extending the life of the device/devices. Since SMAs have significantly larger intrinsic strains compared to traditional metals such as copper, tremendous global strains can be achieved through SMA archimedean spiral interconnects and/or self-similar fractal design interconnects. This enables structures with greater areal density into which more active circuit components can be integrated, enabling stretchable devices with higher efficiency. Thanks to a structure with higher areal density, more complex integrated circuits can also be realized. Through compositional design and proper heat treatment, nickel-titanium-based shape memory alloys, such as TiNiCu or TiNiCuCo, can be designed to undergo reversible phase transformation for up to 10 million cycles. Therefore, the implementation of shape memory alloy auxetic substrates would be extremely useful to enable new wearable and deformable electronic applications.
[0279] The auxetic structure improves the conformability of the electronic device to the skin or wearable substrate, preventing premature failure due to delamination problems. Better contact with the skin enables better functioning sensors that measure sensitive bio-magnetic signals. Appropriate wearable sensors for magnetoencephalography (MEG), magnetocardiography (MCG), electroencephalography (EEG), and electrocardiogram (ECG) MCG sensors are possible by fabricating active sensor components on the island structure areas of the auxetic structure. Ultrasonic sensors integrated into the structure would also allow the wearable device to see under the skin. Moreover, these types of designs are also united, useful and preferred for an electronic skin, soft electronics, exoskeletons and other soft robotics applications. Furthermore, if the application requires, it is possible to electrically isolate island structure areas from each other. Similarly, island structure planes could particularly preferentially share a common ground electrode through the SMA.
[0280] An active electronic component is not required on each of the auxetic island structure areas. Moreover, the electronic device need not be specifically a semiconductor device. For example, an implantable structure could be formed that includes a sensor on one island structure area, an actuator on another island structure area, and a transistor (or any other type of electronic device) on another island structure area. In addition, a significant advantage can also be seen in the fact that the low loading on each island structure area allows essentially any type of active or passive device, and they are electrically interconnected via multiple island structure areas, which in turn allows for a large area that can be used for appropriate components. In addition, many other types of materials and devices could now become stretchable (i.e., the material need not be a semiconductor, as is the case, for example, in US 2020/144 431 A1). Essentially, any type of component can remain in its original, traditional, rigid structure.
[0281] The reference signs used in the figures are provided below: [0282] 1 island structure area of a SMA-auxetic structure [0283] 11 first island structure area of a SMA-auxetic structure [0284] 12 second island structure area of an SMA-auxetic structure [0285] 13 interconnection of an SMA-auxetic structure [0286] 2 electrically insulating material [0287] 3 first electrode [0288] 41 first electronic component [0289] 42 second electronic component [0290] 43 third electronic component [0291] 5 biocompatible inclusion [0292] 6 supplementary electrode [0293] 7 substrate