Circuit board having power supply, electrical device having circuit board, and method for producing a circuit board

Abstract

A circuit board having a power supply, an electrical device having a circuit board, and a method for producing a circuit board are disclosed. In an embodiment a circuit board includes a power supply, a carrier substrate and an energy store with a first layer stack having a first electrode layer with a first electrode, a second electrode layer with a second electrode, and an electrolyte layer arranged therebetween, which has an electrolyte, wherein the first electrode, the second electrode and the electrolyte are solid states.

Claims

1. A circuit board comprising: a carrier substrate; an energy store with a first layer stack having a first electrode layer with a first electrode, a second electrode layer with a second electrode, and an electrolyte layer arranged therebetween, which has an electrolyte, wherein the first electrode, the second electrode and the electrolyte are solid states, wherein the energy store is a solid-state battery or a solid-state accumulator, wherein the first layer stack further comprises a first active layer between the first electrode and the electrolyte layer, and a second active layer between the electrolyte layer and the second electrode, wherein the circuit board comprises one or more additional layer stacks, each additional layer stack having a first electrode, a second electrode and an electrolyte layer arranged therebetween, wherein the first layer stack and the additional layer stack together constitute a block, wherein the circuit board further comprises one or more further blocks with layer stacks, and wherein each block is configured to provide an electric potential; one or more metallization layers having structured metallizations in the carrier substrate, wherein the metallization layers are connected by vias to the first and the second electrode of the energy store; an electrical component; and a switch connected to the electrical component and the energy store, wherein the energy store is maintenance-free and temperature resistant, and wherein the energy store is configured to establish a power supply.

2. The circuit board according to claim 1, further comprising an external power connection.

3. The circuit board according to claim 1, further comprising an integrated circuit chip configured for monitoring, controlling or adjusting a parameter of the energy store.

4. An electrical device comprising: the circuit board according to claim 1; and electrical or electronic circuit components connected and wired to the circuit board, wherein the energy store is configured to supply the circuit components at least intermittently with electrical energy.

5. A method for producing the circuit board according to claim 1, the method comprising: providing a material for the carrier substrate; arranging a layer stack having electrode layers and solid-state electrolytes in order to form one or more energy stores on the material of the carrier substrate; and arranging a dielectric material on the layer stack of the one or more energy stores.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Embodiments of the circuit board and details are explained in greater detail in the schematic figures, wherein:

(2) FIG. 1 shows a possible arrangement of the energy store in a carrier substrate;

(3) FIG. 2 shows the arrangement of the energy store on a carrier substrate;

(4) FIG. 3 shows the arrangement of the energy store on the underside of a carrier substrate;

(5) FIG. 4 shows a multi-layer construction of the energy store;

(6) FIG. 5 shows an energy store having additional layers;

(7) FIG. 6 shows a circuit board having additional layers and electrical components;

(8) FIG. 7 shows a circuit board having multiple blocks; and

(9) FIG. 8 shows an electrical device having a circuit board.

DETAILED DESCRIPTION OF THE ILLUSTRATIVE EMBODIMENTS

(10) FIG. 1 shows the possibility of a circuit board LP, in which the energy store ES is arranged in the interior of a carrier substrate TS. To ensure that the energy store ES in the interior of the carrier substrate TS is accessible, there exists a through-connection (via) V, by means of which an electric potential made available by the energy store ES is accessible.

(11) The energy store ES is preferably configured as a multi-layer system having a first electrode and a second electrode, and an electrolyte arranged therebetween. All of the components of the energy store are preferably solid states. The energy store ES does not have any liquid components. As a result, the energy store is practically maintenance-free, temperature-resistant and substantially not sensitive to different forms of external harmful influences.

(12) FIG. 2 shows the possibility of arranging the energy store ES on the upper side of a carrier substrate TS.

(13) FIG. 3 shows the possibility of arranging the energy store on the underside of the carrier substrate TS. To ensure that circuit elements and electrical components can be arranged and wired on the upper side of the carrier substrate and can be supplied with electrical energy, there exists at least one through-connection V, by means of which circuit components on the upper side can be wired to the energy store ES on the underside.

(14) Irrespective of the respective position of the energy store in the carrier substrate, whether on the upper side of the carrier substrate or on the underside of the carrier substrate, the energy store ES can substantially extend over the entire width of the circuit board LP. It is also possible that the energy store merely occupies a region of the base area of the circuit board.

(15) The design of the energy store ES as a layer stack made of thin layers makes possible an extremely low height so that a high specific energy density is obtained. The design height of the circuit board and, therefore, the design height of an associated electrical device is practically unaffected by the additional layers of the energy store.

(16) FIG. 4 shows the possibility of an arrangement of the layer stack of the energy store ES: the energy store has a first electrode EL1 and a second electrode EL2 in a respective associated electrode layer. An intermediate layer ZL having an electrolyte is arranged between the electrodes. The electrolyte likewise consists of a solid state and is substantially permeable for ions, but not for electrons.

(17) It is possible that at least one of the two electrodes, e.g., the first electrode EL1 or—as shown in FIG. 4—the second electrode EL2, is wired to an earth potential. The first electrode EL1 can then make available a different electric potential from the earth potential on the upper side by means of a through-connection V.

(18) FIG. 5 shows the possibility of configuring the energy store ES as a layer stack having five layers. In addition to the first electrode EL1, the intermediate layer ZL and the second electrode layer EL2, there is a first active layer AL1 and a second active layer AL2. The first active layer AL1 is arranged between the electrode layer having the first electrode EL1 and the intermediate layer ZL having the electrolyte E. The second active layer AL2 is arranged between the electrolyte E in the intermediate layer ZL and the second electrode EL2. The first and the second active layer are preferably conductive with respect to ions. They can also be conductive with respect to electrons. Admittedly, it is also possible that they are not conductive for electrons.

(19) FIG. 6 shows the possibility of combining various layer stacks of the energy store. A first layer stack LS1, a second layer stack LS2 and a third layer stack LS3 are arranged above one another. Each layer stack has a first electrode in an electrode layer and a second electrode in a different electrode layer from the first electrode layer. In addition, each layer stack has an electrolyte between the electrodes. Layer stacks arranged next to one another can share material of an electrode. Thus, the first layer stack LS1 and the second layer stack LS2 share material of an electrode, namely of the second electrode EL2 of the first layer stack and of the first electrode of the second layer stack LS2.

(20) In total, the three layer stacks LS1, LS2, LS3 create a first block B1. A part of the electrodes of the various layer stacks in the first block are joined at a first electrode of the block. The remaining electrodes of the layer stacks are joined at a second electrode. The first block B1 makes the two different potentials P1, P2 available by means of these electrodes of the block B1.

(21) The three layer stacks constitute individual battery elements which are connected in parallel within the first block B1.

(22) Electrical components EK1, EK2 are connected and wired on the upper side of the circuit board LP to metallisations M in metallisation layers ML in the interior of the carrier substrate TS by means of through-connections V. Thus, the electrical energy stored in the energy store can be used to supply electrical components on the upper side of the circuit board LP.

(23) Metallisations of different metallisation layers ML can be electrically separated from each other by the dielectric material of the carrier substrate TS.

(24) FIG. 7 shows the possibility of providing different blocks in the circuit board. A first block B1 has three different layer stacks. A second block B2 has three different layer stacks and a third block B3 has three different layer stacks. The first block B1 makes available two different electric potentials P3, P4 at its outer electrodes. The second block B2 makes available a voltage at its outer electrodes, which voltage corresponds to the difference in the electric potentials P3 and P2. The third block B3 makes available a voltage at its outer electrodes, which voltage corresponds to the potential difference between the potentials P1 and P2.

(25) The three blocks B1, B2 and B3 thus make available three voltages. The voltages can be added by series circuits.

(26) It is possible that electrical components EK3, EK4 on the upper side of the circuit board LP are connected by means of metallisations and through-connections having the different electric potentials.

(27) Suitably arranged layer stacks and blocks can accordingly be used to make available different voltages and different electrical capacities for different needs to the different electrical components.

(28) FIG. 8 shows the possibility of providing a corresponding circuit board LP as part of an electrical device EB. In addition to electrical components EK3, EK4 which can be assigned to the circuit board, further circuit components SK can be connected and wired to the circuit board and obtain electrical power from the energy store of the circuit board. A housing G can protect electrical components and circuit components on the upper side of the circuit board from harmful external influences.

(29) The circuit board, the electrical device and method for producing the circuit board are not restricted to the embodiments shown or to the technical details shown. A circuit board can, for example, comprise further layers, layer stacks, blocks and energy stores under a carrier substrate, in the carrier substrate or on the carrier substrate, or additional electrical components or circuit components.