Additive manufacturing method for the addition of features within cooling holes
10464135 ยท 2019-11-05
Assignee
Inventors
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
F05D2230/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K15/0086
PERFORMING OPERATIONS; TRANSPORTING
B23K2103/08
PERFORMING OPERATIONS; TRANSPORTING
F05D2240/81
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K15/0093
PERFORMING OPERATIONS; TRANSPORTING
F05D2260/202
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2240/11
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/13
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2260/2214
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/31
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K26/0006
PERFORMING OPERATIONS; TRANSPORTING
F01D9/065
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B22F7/08
PERFORMING OPERATIONS; TRANSPORTING
F23R2900/00018
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F23R3/002
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/14
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B33Y40/00
PERFORMING OPERATIONS; TRANSPORTING
F05D2260/22141
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B28B1/001
PERFORMING OPERATIONS; TRANSPORTING
F01D5/186
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
B22F7/08
PERFORMING OPERATIONS; TRANSPORTING
F23R3/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B28B1/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y40/00
PERFORMING OPERATIONS; TRANSPORTING
F01D9/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K15/00
PERFORMING OPERATIONS; TRANSPORTING
F01D5/18
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K26/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method for forming a diffusion cooling hole in a substrate includes removing material from the substrate to form a metering section having an inlet on a first side of the substrate and removing material from the substrate to form a diffusing section that extends between the metering section and an outlet located on a second side of the substrate generally opposite the first side. The method also includes forming a feature on a substrate surface within one of the metering section and the diffusing section. Forming the feature includes depositing a material on the substrate surface and selectively heating the material to join the material with the substrate surface and form the feature.
Claims
1. A method for forming a diffusion cooling hole in a substrate, the method comprising: removing material from the substrate to form a metering section having an inlet on a first side of the substrate, the metering section extending along an axis; removing material from the substrate to form a diffusing section that extends between the metering section and an outlet located on a second side of the substrate generally opposite the first side, the diffusing section partially defined by a bottom surface abutting a downstream end of the metering section and diverging laterally therefrom; and forming a feature on a surface within the metering section on a metering section surface abutting the bottom surface of the diffusing section, wherein the feature obstructs a portion of the metering section to form a crescent-shaped opening, and is positioned to obscure a line of sight between the inlet and the diffusing section; wherein forming the feature comprises: depositing a material on the surface; selectively heating the material to join the material with the surface and form the feature.
2. The method of claim 1, wherein the steps of removing material from the substrate to form a metering section and removing material from the substrate to form a diffusing section are performed by a technique selected from the group consisting of casting, drilling, laser drilling, machining, electrical discharge machining and combinations thereof.
3. The method of claim 1, wherein the material deposited on the surface is a metal.
4. The method of claim 1, wherein the material deposited on the surface is a ceramic.
5. The method of claim 1, wherein the material deposited on the surface is selectively melted using a laser.
6. The method of claim 1, wherein the material deposited on the surface is selectively melted using an electron beam.
7. The method of claim 1, wherein the material is deposited on the surface by spraying.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
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(9)
(10) Metering section 22 is adjacent to and downstream from inlet 18 and controls (meters) the flow of air through cooling hole 16. As shown in
(11) Diffusing section 24 is adjacent to and downstream from metering section 22. As shown in
(12)
(13) Cooling holes 16 shown in
(14)
(15) Suitable additive manufacturing techniques for forming raised feature 36 include, but are not limited to, selective laser melting, direct metal laser sintering, selective laser sintering and electron beam melting. The additive manufacturing technique chosen can depend on the type of material used to form raised feature 36. In some embodiments, raised feature 36 is formed of a metal, alloy or superalloy. In these embodiments, any of the aforementioned techniques can be suitable. In other embodiments, raised feature 36 is formed of a ceramic material. In these embodiments, selective laser sintering is typically used to form ceramic raised feature 36. Each of these techniques involves heating a thin layer of material and melting it so that it joins with a substrate. The heating/melting and joining process can be repeated several times until the material has formed the desired raised feature 36.
(16) More particularly, raised feature 36 is formed within cooling hole 16 by depositing a material on bottom surface 28 and selectively heating the material so that it melts and joins with bottom surface 28 following solidification. This process is repeated until the desired feature geometry and thickness has been formed. Joining the material with bottom surface 28 forms raised feature 36 as shown in
(17) Once a layer of material has been deposited on bottom surface 28, the material is selectively heated above its melting temperature so that it fuses and joins with bottom surface 28. The material is heated using a high powered laser or electron beam to deliver the energy necessary to melt the material. In some embodiments where an electron beam is used to heat the material, the entire part can be placed within a vacuum. Where the first layer of material is applied to bottom surface 28 (i.e. the substrate), the laser or electron beam energy may also melt part of bottom surface 28 in some cases, forming a strong bond between bottom surface 28 and raised feature 36. After the melted material has solidified, additional material is deposited and the heating process is carried out again. This series of steps (depositing, heating/melting, solidifying) is repeated until raised feature 36 contains the desired three-dimensional shape and thickness.
(18) Prior to formation, the desired geometric characteristics of raised feature 36 are determined. These characteristics generally include the shape, thicknesses, curvature and other three-dimensional qualities of the desired feature. Once these features have been determined, a computer generates a computer-aided design (CAD) file, additive manufacturing file format (AMF) file or other type of file that provides instructions to control the additive manufacturing operation. This file contains information that controls the layer-by-layer depositing and melting process described above. In some embodiments, an additive manufacturing machine or system deposits the material within cooling hole 16 and selectively melts the material to form raised feature 36.
(19) In cooling hole 16 shown in
(20) While the formation of raised feature 36 on bottom surface 28 has been described, raised feature 36 can be similarly formed on side surfaces 30 and 32 and top surface 34 or on surface 26. Raised feature 36 can also be flat or curved as necessary to divert cooling air through cooling hole 16.
(21) Additive manufacturing techniques can also be used to form other types of raised features, such as cusps in the metering section of a cooling hole.
(22)
(23) Wide corners reduce the thermal mechanical fatigue of wall 10 while sharp corners reduce the likelihood of flow separation of cooling air exiting diffusing section 24, thereby improving cooling effectiveness. Cooling holes can be fine tuned to contain wide corners, sharp corners, or a combination of both wide and sharp corners along the outlet to fit the specific needs based on the cooling hole location. As shown in
(24) While
Discussion of Possible Embodiments
(25) The following are non-exclusive descriptions of possible embodiments of the present invention.
(26) A method for forming a diffusion cooling hole in a substrate can include removing material from the substrate to form a metering section having an inlet on a first side of the substrate and removing material from the substrate to form a diffusing section that extends between the metering section and an outlet located on a second side of the substrate generally opposite the first side. The method can also include forming a feature on a substrate surface within one of the metering section and the diffusing section. Forming the feature can include depositing a material on the substrate surface and selectively heating the material to join the material with the substrate surface and form the feature.
(27) The method of the preceding paragraph can optionally include, additionally and/or alternatively, any one or more of the following features, configurations and/or additional components:
(28) A further embodiment of the foregoing method can include that the steps of removing material from the substrate to form a metering section and removing material from the substrate to form a diffusing section are performed by a technique selected from the group consisting of casting, drilling, laser drilling, machining, electrical discharge machining and combinations thereof.
(29) A further embodiment of any of the foregoing methods can include that the substrate surface on which the feature is formed is located within the metering section.
(30) A further embodiment of any of the foregoing methods can include that the feature obscures a line of sight between the inlet and the outlet.
(31) A further embodiment of any of the foregoing methods can include that the feature obstructs a portion of the metering section to form a cusp-like opening.
(32) A further embodiment of any of the foregoing methods can include that the substrate surface on which the feature is formed is located within the diffusing section.
(33) A further embodiment of any of the foregoing methods can include that the feature includes an apex and a plurality of planar sides extending from the apex.
(34) A further embodiment of any of the foregoing methods can include that the feature is formed along a surface of the substrate adjacent the outlet.
(35) A further embodiment of any of the foregoing methods can include that the outlet before forming the feature includes a corner having a first angle, and wherein the feature forms a second corner having a second angle generally smaller than the first angle.
(36) A further embodiment of any of the foregoing methods can include that the feature is formed along substantially all of the substrate surfaces adjacent the outlet.
(37) A further embodiment of any of the foregoing methods can include that the material deposited on the substrate surface is a metal.
(38) A further embodiment of any of the foregoing methods can include that the material deposited on the substrate surface is a ceramic.
(39) A further embodiment of any of the foregoing methods can include that the material deposited on the substrate surface is selectively heated using a laser.
(40) A further embodiment of any of the foregoing methods can include that the material deposited on the substrate surface is selectively heated using an electron beam.
(41) A further embodiment of any of the foregoing methods can include that the material is deposited on the substrate surface by spraying.
(42) Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.