Filter device including longitudinally coupled resonator elastic wave filter and elastic wave resonator
10469055 ยท 2019-11-05
Assignee
Inventors
- Hideki Iwamoto (Nagaokakyo, JP)
- Keiji Okada (Nagaokakyo, JP)
- Yuichi Takamine (Nagaokakyo, JP)
- Tsutomu Takai (Nagaokakyo, JP)
Cpc classification
H03H9/02574
ELECTRICITY
International classification
H03H9/13
ELECTRICITY
H03H9/70
ELECTRICITY
Abstract
A filter device includes a longitudinally coupled resonator elastic wave filter that includes IDT electrodes including low acoustic velocity regions in outer side portions of center regions of the IDT electrodes and high acoustic velocity regions in outer side portions of the low acoustic velocity regions in a direction orthogonal or substantially orthogonal to an elastic wave propagation direction, and defines and functions as a first bandpass filter, and elastic wave resonators that are electrically connected to the longitudinally coupled resonator elastic wave filter.
Claims
1. A filter device comprising: a longitudinally coupled resonator elastic wave filter that includes a plurality of first IDT electrodes including low acoustic velocity regions in outer side portions of center regions of the first IDT electrodes and high acoustic velocity regions in outer side portions of the low acoustic velocity regions in a direction orthogonal or substantially orthogonal to an elastic wave propagation direction, and defines and functions as a first bandpass filter; an elastic wave resonator that is electrically connected to the longitudinally coupled resonator elastic wave filter; a piezoelectric film including LiTaO.sub.3; and a high acoustic velocity member with an acoustic velocity of propagating bulk waves, which is higher than an acoustic velocity of elastic waves propagating in the piezoelectric film; wherein the piezoelectric film is laminated directly or indirectly on the high acoustic velocity member; the plurality of first IDT electrodes are longitudinally coupled and connected on one surface of the piezoelectric film; the elastic wave resonator includes a second IDT electrode located on one surface of the piezoelectric film; the second IDT electrode includes a plurality of first electrode fingers and a plurality of second electrode fingers which interpose with the first electrode fingers; a film thickness of the piezoelectric film is equal to or smaller than about 10 when a wavelength determined by a pitch of the first and second electrode fingers of the second IDT electrode is ; and a direction connecting front ends of the plurality of first electrode fingers and a direction connecting front ends of the plurality of second electrode fingers define an inclination angle of with respect to a propagation direction of elastic waves excited by the second IDT electrode, which is determined by Euler Angles (, , ) of the LiTaO.sub.3, where is a positive value of larger than 0.
2. The filter device according to claim 1, wherein a thickness of the piezoelectric film is equal to or smaller than about 1.5.
3. The filter device according to claim 1, wherein the elastic wave resonator includes a plurality of elastic wave resonators electrically connected to define a second bandpass filter.
4. The filter device according to claim 3, wherein the second bandpass filter is a ladder filter.
5. The filter device according to claim 3, wherein the filter device is a duplexer including the longitudinally coupled resonator elastic wave filter as a reception filter and the second bandpass filter as a transmission filter.
6. The filter device according to claim 3, wherein the first bandpass filter and the second bandpass filter are provided on a single chip component.
7. The filter device according to claim 3, wherein the first bandpass filter is provided in a first chip component; the second bandpass filter is provided on a second chip component; and the first chip component is different from the second chip component.
8. The filter device according to claim 7, wherein the first chip component and the second chip component are both mounted on a mounting substrate.
9. The filter device according to claim 1, wherein a low acoustic velocity film with an acoustic velocity of propagating bulk waves, which is lower than the acoustic velocity of the elastic waves propagating in the piezoelectric film, is laminated between the high acoustic velocity member and the piezoelectric film, and the piezoelectric film is laminated indirectly on the high acoustic velocity member.
10. The filter device according to claim 1, wherein the piezoelectric film is laminated directly on the high acoustic velocity member.
11. The filter device according to claim 1, wherein each of the first IDT electrodes includes a first busbar, a second busbar spaced away from the first busbar, a plurality of first electrode fingers base ends of which are electrically connected to the first busbar and front ends of which extend toward the second busbar, and a plurality of second electrode fingers base ends of which are connected to the second busbar and front ends of which extend toward the first busbar; and in each of the first IDT electrodes of the longitudinally coupled resonator elastic wave filter: when a direction orthogonal or substantially orthogonal to a direction in which the first and second electrode fingers extend is a width direction, at least one of each of the first and second electrode fingers includes large width portions with larger dimensions in the width direction than dimensions of portions of the first and second electrode fingers at a center in a lengthwise direction at at least one side of the base end side and the front end side relative to the center in the lengthwise direction; at least one of the first and second busbars includes a plurality of cavities which are located along a lengthwise direction of the first or second busbar; and each of the first and second busbars includes an inner busbar portion which is located at a side of the first or second electrode fingers relative to the cavities and extends in the lengthwise direction of the first and second busbars, a center busbar portion in which the cavities are provided, and an outer busbar portion located at an opposite side to the inner busbar portion with the center busbar portion interposed between the outer busbar portion and the inner busbar portion.
12. The filter device according to claim 11, wherein the inner busbar portion includes a band shape extending in the elastic wave propagation direction.
13. The filter device according to claim 11, wherein both of the first electrode fingers and the second electrode fingers include the large width portions.
14. The filter device according to claim 1, wherein each of the first IDT electrodes includes a first busbar, a second busbar spaced away from the first busbar, a plurality of first electrode fingers base ends of which are electrically connected to the first busbar and front ends of which extend toward the second busbar, and a plurality of second electrode fingers base ends of which are connected to the second busbar and front ends of which extend toward the first busbar; when a region in which the plurality of first electrode fingers and the plurality of second electrode fingers overlap with each other in the elastic wave propagation direction is an intersection region, the intersection region includes the center regions in the direction orthogonal or substantially orthogonal to the elastic wave propagation direction and the low acoustic velocity regions provided in the outer side portions of the center regions; the first and second electrode fingers are increased in thickness in the low acoustic velocity regions; and an acoustic velocity in the low acoustic velocity regions is lower than the acoustic velocity in the center regions.
15. The filter device according to claim 1, wherein each of the first IDT electrodes includes a first busbar, a second busbar spaced away from the first busbar, a plurality of first electrode fingers base ends of which are electrically connected to the first busbar and front ends of which extend toward the second busbar, and a plurality of second electrode fingers base ends of which are connected to the second busbar and front ends of which extend toward the first busbar; and a dielectric film that lowers an acoustic velocity is laminated on the first and second electrode fingers in the low acoustic velocity regions.
16. The filter device according to claim 15, wherein the dielectric film laminated on the first and second electrode fingers extends along the elastic wave propagation direction.
17. The filter device according to claim 1, wherein a duty in the first IDT electrodes of the longitudinally coupled resonator elastic wave filter is equal to or lower than about 0.46.
18. The filter device according to claim 1, wherein the inclination angle is in a range of equal to or larger than about 0.4 and equal to or smaller than about 15.
19. The filter device according to claim 1, wherein the high acoustic velocity member is a high acoustic velocity support substrate.
20. The filter device according to claim 1, further comprising a support substrate, wherein the high acoustic velocity member is a high acoustic velocity film and is provided on the support substrate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
(29) Hereinafter, the present invention will be clarified by describing specific preferred embodiments of the present invention with reference to the drawings.
(30) It should be noted that respective preferred embodiments which are described in the specification are exemplary and partial replacement or combination of components between different preferred embodiments is able to be included.
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(32) A filter device 1 is included as a duplexer of a cellular phone. The filter device 1 includes an antenna terminal 2, a reception terminal 3, and a transmission terminal 4. The antenna terminal 2 is connected to an antenna ANT. A first bandpass filter 5 as a reception filter is connected between the antenna terminal 2 and the reception terminal 3. A second bandpass filter 6 as a transmission filter is connected between the antenna terminal 2 and the transmission terminal 4.
(33) The first bandpass filter 5 includes a longitudinally coupled resonator elastic wave filter 11 that implements a piston mode. The piston mode is a technique of significantly reducing or preventing transverse modes. The piston mode will be described more specifically with reference to
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(35) As described above, the low acoustic velocity regions are provided in the outer side regions of the center region in the intersection region and the high acoustic velocity regions are provided in the further outer side regions of the low acoustic velocity regions in the direction orthogonal or substantially orthogonal to the elastic wave propagation direction, thus significantly reducing or preventing the transverse modes by implementing the piston mode.
(36) In
(37) A method of forming the high acoustic velocity regions is also not particularly limited. As illustrated in
(38) Furthermore, as in a fourth example illustrated in FIG. 26, dielectric films 223 and 224 may extend in the elastic wave propagation direction to define the low acoustic velocity regions.
(39) The structure in the piston mode may provide a method of forming the low acoustic velocity portions and the high acoustic velocity portions as long as the relation for the acoustic velocity in
(40) Moreover, as illustrated in an inner busbar portion 111A in
(41) The second bandpass filter 6 is a ladder filter. The ladder filter includes a plurality of elastic wave resonators 21 and 21 as series arm resonators and a plurality of elastic wave resonators 22 and 22 as parallel arm resonators.
(42) The filter device 1 is able to significantly reduce or prevent the transverse mode ripples because the first bandpass filter 5 implements the piston mode. The specific features and elements of the filter device implementing the piston mode are not particularly limited. The detail of the longitudinally coupled resonator elastic wave filter 11 will be described later.
(43) The plurality of elastic wave resonators 21 and 22 defining the second bandpass filter 6 will be described with respect to the elastic wave resonator 21 as a representative component.
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(45) As illustrated in
(46) A material of the piezoelectric film is not particularly limited but any of LiTaO.sub.3, LiNbO.sub.3, ZnO, AlN, or PZT may be preferably included, for example. An IDT electrode 28 is located on the piezoelectric film 27. The support substrate 23 includes silicon in the first preferred embodiment. A material of the support substrate 23 is not particularly limited. A semiconductor material other than silicon may be included. Alternatively, an insulating material, for example, glass or insulating ceramics may be included.
(47) As the material of the support substrate 23, for example, silicon is a preferable material in the first preferred embodiment. In particular, a resistivity thereof is preferably equal to or higher than about 100 cm, more preferably equal to or higher than about 1000 cm, much more preferably equal to or higher than about 4000 cm, for example. As the resistivity is increased, capacitance coupling between an electrode, which will be described layer, and the support substrate 23 is able to be significantly reduced or prevented. Accordingly, insertion loss is able to be further reduced.
(48) Furthermore, silicon has a low thermal expansion coefficient. Accordingly, expansion and contraction of films and the like provided on the support substrate 23 due to change in temperature are able to be significantly reduced or prevented. Accordingly, frequency fluctuation due to thermal load is able to be significantly reduced or prevented, thus further enhancing temperature characteristics. In the example, the thickness of an Si support substrate was set to about 62.5. Moreover, silicon has high heat conductivity, thus efficiently dissipating heat generated in the filter device. Thus, electric power handling capacity is able to be significantly improved.
(49) In addition, the support substrate 23 including silicon is excellent in workability. Accordingly, the support substrate is able to be easily manufactured. Furthermore, the support substrate 23 is able to be easily cut with a dicing machine. The support substrate 23 provides high flexural strength and therefore is able to provide a reduction in thickness of the filter device.
(50) The bonding material layers 24a and 24b include silicon oxide in the first preferred embodiment. A bonding material other than silicon oxide may be included. A material of the bonding material layers 24a and 24b is not particularly limited as long as the bonding material layers 24a and 24b are able to bond the high acoustic velocity film 25 to the support substrate 23.
(51) As a material of the high acoustic velocity film, any of various types of ceramics, for example, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, a DLC film, silicon, sapphire, alumina, cordierite, mullite, steatite, and forsterite, magnesia, diamond, materials containing the above-described respective materials as main components, and materials containing mixtures of the above-described respective materials as main components are preferably included. The high acoustic velocity film 25 includes aluminum nitride in the first preferred embodiment. The high acoustic velocity film 25 is able to be any appropriate material as long as the material provides an acoustic velocity of propagating bulk waves, which is higher than that of elastic waves propagating in the piezoelectric film 27.
(52) The acoustic velocity of the bulk waves is unique to a material and the bulk waves include P waves vibrating in a wave traveling direction, that is, a longitudinal direction and S waves vibrating in a transverse direction as a direction perpendicular or substantially perpendicular to the traveling direction. The above-described bulk waves also propagate in all of the piezoelectric film 27, the high acoustic velocity film 25, and the low acoustic velocity film 26. When an isotropic material is included, the P waves and the S waves are present. When an anisotropic material is included, the P waves, slow S waves, and fast S waves are present. When the surface acoustic waves are excited by the anisotropic material, SH waves and SV waves are generated as the two S waves. In the specification, the acoustic velocity of the elastic waves of a main mode, which propagate in the piezoelectric film 27, indicates that of a mode that provides a pass band as a filter and resonance characteristics as a resonator among three modes of the P waves, the SH waves, and the SV waves.
(53) The low acoustic velocity film preferably includes, for example, any of silicon oxide, glass, silicon oxynitride, tantalum oxide, a compound provided by adding fluorine, carbon, or boron to silicon oxide, and materials containing the above-described respective materials as main components. The low acoustic velocity film 26 includes silicon oxide in the first preferred embodiment. The low acoustic velocity film 26 is able to include any appropriate material as long as the material provides an acoustic velocity of the propagating bulk waves, which is lower than the acoustic velocity of the elastic waves propagating in the piezoelectric film 27.
(54) A close contact layer may be provided between the high acoustic velocity film 25 and the piezoelectric film 27. When the close contact layer is included, a close contact property between the high acoustic velocity film 25 and the piezoelectric film 27 is able to be significantly improved. The close contact layer may include resin or metal, and for example, an epoxy resin or polyimide resin is included.
(55) The high acoustic velocity film 25 is laminated at the lower side of the low acoustic velocity film 26 in the first preferred embodiment. Therefore, energy of the elastic waves is able to be confined in a portion to the high acoustic velocity film 25.
(56) The above-described IDT electrode 28 includes an Al film in the first preferred embodiment. The IDT electrode 28 may include an alloy film containing the Al film as a main body instead of the Al film. Furthermore, the IDT electrode 28 is able to include various metal materials other than Al or alloy containing Al as the main body. Examples of the metal materials include Cu, Mo, W, Ag, Pd, and alloys containing any of these materials.
(57) The elastic wave resonator 21 provides the characteristics that an inclination angle , which will be described later, is a positive numerical value of larger than 0 in the IDT electrode 28. With the characteristics, ripples due to the transverse modes are able to be significantly reduced or prevented. Preferably, the inclination angle is preferably in a range of equal to or larger than about 0.4 and equal to or smaller than about 15, for example. With the inclination angle, the transverse mode ripples are able to be significantly reduced or prevented more effectively.
(58) In the elastic wave resonator 21 including the high acoustic velocity film 25 and the low acoustic velocity film 26, the ripples due to the transverse modes tend to be generated in frequency characteristics. When an LiNbO.sub.3 substrate is included as disclosed in Japanese Unexamined Patent Application Publication No. 2000-286663, generation of the transverse mode ripples is significant and gives an influence on other characteristics. On the other hand, usage of an LiTaO.sub.3 substrate causes no problem related to the transverse mode ripples. However, in the structure including the LiTaO.sub.3 film, the low acoustic velocity film, the high acoustic velocity film, and the support substrate, generation of the transverse mode ripples is significant although LiTaO.sub.3 is included. In particular, when the film thickness of the LiTaO.sub.3 film is equal to or smaller than about 10, the transverse mode ripples are largely generated. In the first preferred embodiment, the above-described inclination angle is set to be in the above-described specific range, thus significantly reducing or preventing the transverse mode ripples more effectively. This feature will be described in detail below. The film thickness of the LiTaO.sub.3 film is preferably equal to or smaller than about 3.5, for example. In this case, Q characteristics are able to be significantly improved. Furthermore, the film thickness of the LiTaO.sub.3 film is preferably equal to or smaller than about 2.5, for example. In this case, a temperature coefficient of resonant frequency is able to be significantly decreased. The film thickness of the LiTaO.sub.3 film is equal to or smaller than about 2.0 more preferably, and an absolute value of TCF is able to be equal to or lower than about 10 ppm/ C., for example. It should be noted that the film thickness of the LiTaO.sub.3 film is more preferably equal to or smaller than about 1.5, for example.
(59) The above-described inclination angle will be described with respect to the IDT electrode 28 as a representative component. As illustrated in
(60) First ends of a plurality of first electrode fingers 28c are connected to the first busbar 28a. The plurality of first electrode fingers 28c extends toward the second busbar 28b side. A direction orthogonal or substantially orthogonal to the first electrode fingers 28c corresponds to the elastic wave propagation direction . Furthermore, a plurality of second electrode fingers 28d are provided, and the plurality of second electrode fingers 28d and the plurality of first electrode fingers 28c interpose each other. One ends of the plurality of second electrode fingers 28d are connected to the second busbar 28b.
(61) First dummy electrode fingers 28e are provided with gaps from the front ends of the first electrode fingers 28c. The first dummy electrode fingers 28e are connected to the second busbar 28b. Second dummy electrode fingers 28f are located with gaps from the front ends of the first electrode fingers 28d. The second dummy electrode fingers 28f are connected to the first busbar 28a.
(62) A virtual line A1 connecting the front ends of the plurality of second electrode fingers 28d defines an angle of with respect to the elastic wave propagation direction in the IDT electrode 28. It should be noted that a direction of a virtual line A2 connecting the front ends of the first electrode fingers 28c is the same or substantially the same as the direction of the virtual line A1 connecting the front ends of the second electrode fingers 28d.
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(64) In the specification, an angle defined by the propagation direction and the direction connecting the front ends of the first electrode fingers 28c of the IDT electrode 28 is the inclination angle . An IDT electrode with the inclination angle that is a positive numerical value of larger than 0 is hereinafter abbreviated as an inclination IDT in some cases.
(65) Next, as the above-described elastic wave resonator 21, characteristics of an elastic wave resonator including a portion in which the one IDT electrode 28 is provided will be described.
(66) Design parameters of the above-described elastic wave resonator are set as follows. Piezoelectric thin film: Y-cut LiTaO.sub.3 film with Cut-Angles of about 55 Intersecting width of electrode fingers of IDT electrode=about 15 Number of pairs of electrode fingers=83 pairs =about 2 m Offset length L=about 2 Duty in IDT electrode=about 0.5 Film thickness of IDT electrode=about 0.08 Film thickness of LiTaO.sub.3 film=about 0.3 Film thickness of silicon oxide films providing bonding material layers=about 0.35 Gap dimension G=about 0.5 m
(67) An elastic wave resonator in a comparative example 1 was manufactured in accordance with the above-described design parameters. It should be noted that the inclination angle was set to 0.
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(69) Furthermore, similar to the comparative example 1, elastic wave resonators in which the inclination angles in the IDT electrodes were about 2.5, about 5.0, about 7.5, about 10, and about 15, for example, were manufactured.
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(73) As shown in
(74) Although not shown in
(75) As shown in
(76) As in the described above, elastic wave resonators in which the above-described inclination angles were 0, about 0.4, about 0.9, about 1, and about 1.5, for example, were manufactured.
(77) As shown in
(78) Accordingly, when the above-described inclination angle is larger than 0, the transverse mode ripples are able to be significantly reduced or prevented. It is preferable that be equal to or larger than about 0.4, for example. The transverse mode ripples are able to thereby be further significantly reduced or prevented. In particular, as illustrated in
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(80) Furthermore,
(81) The elastic wave resonator 21 is able to significantly reduce or prevent the transverse mode ripples as described above. All of the plurality of elastic wave resonators 21 include features and elements as described above and the plurality of elastic wave resonators 22 also include the same or similar structure. Accordingly, the second bandpass filter 6 is able to significantly reduce or prevent the transverse mode ripples.
(82)
(83) As illustrated in
(84) In the first preferred embodiment and
(85) As in the second variation illustrated in
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(88) Also in the longitudinally coupled resonator elastic wave filter 11, the lamination structure including the high acoustic velocity member, the high acoustic velocity film, and the low acoustic velocity film is included as described above. Accordingly, as in the second bandpass filter 6 side, energy of elastic waves is able to be confined in a portion to the high acoustic velocity film 25.
(89) The first IDT electrodes 31 to 39 are described in detail with respect to the first IDT electrode 31 as a representative component. In the first preferred embodiment, a structure that implements the piston mode is not particularly limited as long as the longitudinally coupled resonator elastic wave filter as the first bandpass filter 5 implements the piston mode.
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(91) The longitudinally coupled resonator elastic wave filter 11 in the present preferred embodiment significantly reduces or prevents the transverse mode ripples by implementing the piston mode in the first IDT electrode 31.
(92) The first IDT electrode 31 includes a first busbar 111 and a second busbar 112 spaced away from the first busbar 111. The first busbar 111 and the second busbar 112 extend in parallel or substantially in parallel with the elastic wave propagation direction.
(93) The base ends of a plurality of first electrode fingers 113 are connected to the first busbar 111. The front ends of the plurality of first electrode fingers 113 extend toward the second busbar 112 side from the first busbar 111. That is, the plurality of first electrode fingers 113 extend in the direction orthogonal or substantially orthogonal to the elastic wave propagation direction.
(94) On the other hand, the base ends of a plurality of second electrode fingers 114 are connected to the second busbar 112. The front ends of the plurality of second electrode fingers 114 extend toward the first busbar 111 side from the second busbar 112. That is, the plurality of second electrode fingers 114 also extends in the direction orthogonal or substantially orthogonal to the elastic wave propagation direction.
(95) The plurality of first electrode fingers 113 and the plurality of second electrode fingers 114 interpose each other. Each of the first electrode fingers 113 includes large width portions 113a, 113b, 113c, and 113d. Each of the second electrode fingers 114 also includes large width portions 114a, 114b, 114c, and 114d. The shapes of the large width portions 113a to 113d and 114a to 114d will be described with respect to the large width portion 113a as a representative component. A dimension of the large width portion 113a in the width direction, that is, a dimension thereof along the elastic wave propagation direction is larger than that of a remaining portion of the first electrode finger 113. In the first preferred embodiment, the large width portion 113a includes an isosceles trapezoid shape projecting in the elastic wave propagation direction from each of the side edges of the first electrode finger 113. The large width portions are not limited to include this shape and projecting portions with various shapes, for example, as semicircular-shaped projecting portions, may project in the elastic wave propagation direction from the side edges of the first electrode finger 113.
(96) The large width portions 113a and 113b are close to the base end side of the first electrode finger 113 in the first electrode finger 113. In other words, the large width portions 113a and 113b are located close to the first busbar 111 side. On the other hand, the large width portions 113c and 113d are close to the front end side of the first electrode finger 113, that is, the second busbar 112 side.
(97) The second electrode finger 114 includes the large width portions 114a and 114b at the front end side. The large width portions 114a and 114b and the large width portions 113a and 113b are alternately provided in the direction orthogonal or substantially orthogonal to the elastic wave propagation direction, that is, the direction in which the electrode fingers extend in a region close to the first busbar 111. Similarly, the large width portions 113c and 113d and the large width portions 114c and 114d are alternately provided in the above-described direction in which the electrode fingers extend at the side close to the second busbar 112.
(98) A region V2 illustrated in
(99) The acoustic velocity in the region V2 in which the large width portions 113a, 113b, 114a, and 114b are provided is lower than that in the region V1 as the IDT center region.
(100) In the first preferred embodiment, projecting portions 113e projecting in an electrode finger width direction are provided at the base ends of the first electrode fingers 113. Accordingly, the acoustic velocity in the region V3 in which the projecting portions 113e are provided is lower than that in the region V5 in a high acoustic velocity portion, which will be described later. The acoustic velocity V.sub.3 in the region V3 is higher than the acoustic velocity V.sub.2 in the region V2 because no second electrode finger 114 is present in the region V3. It should be noted that projecting portions 114e are also provided in the second electrode fingers 114.
(101) The region V2 with the lower acoustic velocity is provided by providing the large width portions 113a, 113b, 114a, and 114b as described above is also disclosed in International Publication No. WO 2012/086639 A1 and Japanese Unexamined Patent Application Publication No. 2000-286663. A region in which the large width portions 113c, 113d, 114c, and 114d are provided at the second busbar 112 side is similarly the region V2.
(102) In the first preferred embodiment, the first busbar 111 includes the inner busbar portion 111A, a center busbar portion 111B, and an outer busbar portion 111C. The inner side indicates the side of the first and second electrode fingers 113 and 114 being present in the direction in which the electrode fingers of the IDT electrode extend in the first IDT electrode 31, and the outer side indicates the opposite side thereto.
(103) The inner busbar portion 111A is a portion to which the base ends of the plurality of first electrode fingers 113 are connected. In the preferred embodiment, the inner busbar portion 111A includes an elongated band shape extending in the elastic wave propagation direction. The inner busbar portion 111A is a metalized portion and therefore defines the region V4 with a low acoustic velocity.
(104) A plurality of cavities 115 is dispersedly located along the elastic wave propagation direction in the center busbar portion 111B. In the first preferred embodiment, the cavities 115 are located between coupling portions 116 and 116 extending in the direction in which the electrode fingers extend. In the first preferred embodiment, the coupling portions 116 include the same or substantially the same widths as those of the first electrode fingers 113 and are located at extended places of the first electrode fingers 113. Dimensions and positions of the coupling portions 116 are not limited thereto. Furthermore, although the cavities 115 preferably have rectangular or substantially rectangular shapes in the first preferred embodiment, the shapes thereof are not limited to the rectangular or substantially rectangular shapes.
(105) The coupling portions 116 and the cavities 115 are alternately provided along the elastic wave propagation direction in the center busbar portion 111B. Accordingly, a large area of the center busbar portion 111B is not metalized and the center busbar portion 111B therefore defines the region V5 with a high acoustic velocity. The outer busbar portion 111C does not include cavity. Accordingly, the outer busbar portion 111C is a metalized region and the region V6 is a region with a low acoustic velocity.
(106) An inner busbar portion 112A, a center busbar portion 112B, and an outer busbar portion 112C are similarly provided at the second busbar 112 side. The same reference numerals denote the same or similar portions and description thereof is omitted.
(107) The first IDT electrode 31 includes features and elements as described above in the longitudinally coupled resonator elastic wave filter 11. Therefore, the low acoustic velocity regions are provided in outer side portions of the center region V1 and the high acoustic velocity regions V5 are present in outer side portions of the regions V2 to V4 as the low acoustic velocity regions. Accordingly, the piston mode is able to be provided and the transverse mode ripples are able to be significantly reduced or prevented.
(108) In the longitudinally coupled resonator elastic wave filter 11, the first IDT electrodes 32 to 39 are similar to the first IDT electrode 31. Accordingly, the longitudinally coupled resonator elastic wave filter 11 is able to significantly reduce or prevent the transverse mode ripples by providing the piston mode.
(109) In the first preferred embodiment, the above-described first IDT electrode 31 is able to significantly reduce or prevent the transverse mode ripples more effectively and provide a significantly improved piston mode. This point will be described with reference to
(110) For ease of comparison, characteristics of an elastic wave resonator in which reflectors were provided at both sides of the first IDT electrode 31 were measured.
(111) An IDT electrode 51 in a variation, which is illustrated in
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(113) As shown by a comparison between
(114) In the first preferred embodiment, the acoustic velocities V.sub.1 to V.sub.6 in the respective regions V1 to V6 are as illustrated in
(115) Accordingly, an acoustic velocity difference V between the low acoustic velocity regions and the center region is extremely large. It is therefore considered that the transverse mode ripples are able to be significantly reduced or prevented more effectively. That is, as the acoustic velocity difference V is larger, the piston mode is generated more reliably and the transverse mode ripples are able to be significantly reduced or prevented.
(116) As described above, the electrode structure that implements the piston mode in the longitudinally coupled resonator elastic wave filter is not limited to the above-described structure. That is, instead of the method in which the acoustic velocity is adjusted by providing the large width portions, a method in which the acoustic velocity is adjusted by laminating dielectric films on the electrode fingers, or the like, may be used.
(117) With reference to
(118) In the filter device 1, the Q value in the filter characteristics is able to therefore be significantly increased.
(119) A specific example of the above-described filter device 1 will be described with reference to
(120)
(121) The longitudinally coupled resonator elastic wave filter 11 as the first bandpass filter 5 was included as a 9-IDT type as in the first preferred embodiment, for example.
(122) The electrode finger intersecting width was set to about 23 m, for example. Wavelengths (m) determined by pitches of the electrode fingers of the first IDT electrodes 31 to 39 and the number of pairs of electrode fingers were set as shown in the following Table 1. Furthermore, a wavelength determined by a pitch of electrode fingers of the reflectors was also set as shown in the following Table 1.
(123) TABLE-US-00001 TABLE 1 IDT WAVELENGTH (NUMBER (m) OF PAIRS) REFLECTOR 1.9759 IDTS 31 AND 39 MAIN 1.9774 20.5 IDTS 31 AND 39 NARROW PITCH 1.7862 1.5 IDTS 32 AND 38 NARROW PITCH 1.8404 1.0 (SIDES OF IDTS 31 AND 39) IDTS 32 AND 38 MAIN 1.9248 12.1 IDTS 32 AND 38 NARROW PITCH 1.8584 3.5 (SIDES OF IDTS 33 AND 37) IDTS 33 AND 37 NARROW PITCH 1.8746 4.0 (SIDES OF IDTS 32 AND 38) IDTS 33 AND 37 MAIN 1.9691 17.0 IDTS 33 AND 37 NARROW PITCH 1.871 4.0 (SIDES OF IDTS 34 AND 36) IDTS 34 AND 36 NARROW PITCH 1.8588 3.5 (SIDES OF IDTS 33 AND 37) IDTS 34 AND 36 MAIN 1.9277 12.5 IDTS 34 AND 36 NARROW PITCH 1.7877 1.0 (SIDE OF IDT 35) IDTS 35 NARROW PITCH 1.8166 1.5 IDTS 35 MAIN 1.9781 33.0
(124) In Table 1, narrow pitch indicates a narrow-pitch electrode finger portion. Main indicates a remaining electrode finger portion other than the narrow-pitch electrode finger portion.
(125) All of the duties of the IDT electrodes and the reflectors in the longitudinally coupled resonator elastic wave filter 11 were set to be about 0.5, for example. An interval between the first IDT electrode 31 and the reflector 40 and an interval between the first IDT electrode 39 and the reflector 41 were set to about 0.53.sub.R, for example. It should be noted that .sub.R is a wavelength determined by the pitch of the electrode fingers of the reflectors, that is, about 1.9759 m, for example.
(126) The numbers of electrode fingers of the reflectors were set to 30, for example.
(127) Furthermore, elastic wave resonators 61a and 61c are electrically connected between the longitudinally coupled resonator elastic wave filter 11 and the antenna terminal 2. An elastic wave resonator 61b is electrically connected between a connection point of the elastic wave resonators 61a and 61c and a ground potential. Furthermore, an elastic wave resonator 61d is electrically connected between an output terminal of the longitudinally coupled resonator elastic wave filter 11 and the ground potential. These elastic wave resonators 61a to 61d define a trap and design parameters thereof were as shown in the following Table 2.
(128) TABLE-US-00002 TABLE 2 ELASTIC WAVE RESONATOR 61a 61b 61c 61d IDT WAVELENGTH (m) 1.9045 1.9758 1.9198 1.9659 REFLECTOR WAVELENGTH 1.9045 1.9758 1.9198 1.9659 (m) INTERSECTING WIDTH (m) 15.3 42 27.8 20 NUMBER OF PAIRS OF 70 68 229 62 ELECTRODE FINGERS OF IDT NUMBER OF ELECTRODE 31 31 31 31 FINGERS OF REFLECTORS DUTY 0.5 0.5 0.5 0.5
(129) The design parameters of the series arm resonators S1 to S5 and the parallel arm resonators P1 to P4 were as shown in the following Table 3.
(130) TABLE-US-00003 TABLE 3 S1 P1 S2 P2 S3 P3 S4 P4 S5 IDT WAVELENGTH 2.00105 2.0744 1.8157 2.0987 2.00865 2.0932 2.0308 2.1054 2.012067 (m) REFLECTOR 2.00105 2.0744 1.8157 2.0987 2.00865 2.0932 2.0308 2.1054 2.012067 WAVELENGTH (m) INTERSECTING 24.8 32 26.4 39.1 22.7 52.4 32.5 79.1 28.3 WIDTH (m) NUMBER OF PAIRS 100 57 224 89 69 82 150 62 100 OF ELECTRODE FINGERS OF IDT NUMBER OF 21 21 21 21 21 21 21 21 21 ELECTRODE FINGERS OF REFLECTORS DUTY 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
(131) In the filter device 1 in the example 1, the longitudinally coupled resonator elastic wave filter 11 included the lamination structure in which an SiO.sub.2 film with a thickness of about 673 nm and a LiTaO.sub.3 substrate with a thickness of about 600 nm were laminated on a high acoustic velocity support substrate including Si. Cut-Angles of LiTaO.sub.3 were set to about 50. The inclination angle in the respective elastic wave resonators of the ladder filter was set to about 7.5. Al with a thickness of 157 nm was included in the first and second IDT electrodes.
(132) A dashed line in
(133) A solid line in
(134) As shown in
(135) As shown in
(136) The first preferred embodiment provides the characteristics that the longitudinally coupled resonator elastic wave filter implements the piston mode without including the inclination IDTs as described above, and the ladder filter as the second bandpass filter includes the inclination IDTs without implementing the piston mode. With these characteristics, both of the first and second bandpass filters are able to significantly reduce or prevent the deterioration in the insertion loss.
(137) It is preferable that the duty of the first IDT electrodes in the longitudinally coupled resonator elastic wave filter 11 implementing the piston mode be equal to or lower than about 0.46, for example.
(138) As shown in
(139) In the first preferred embodiment, the structure connected to the longitudinally coupled resonator elastic wave filter 11 is not limited to the second bandpass filter 6 provided by the above-described ladder filter. That is, another second bandpass filter including a plurality of elastic wave resonators may be included. Alternatively, the first preferred embodiment also encompasses an elastic wave resonator that is electrically connected to the longitudinally coupled resonator elastic wave filter 11 instead of the second bandpass filter.
(140) For example, in
(141) The filter device according to the first preferred embodiment may include the longitudinally coupled resonator elastic wave filter 11 and at least one elastic wave resonator is electrically connected without providing the second bandpass filter.
(142) Furthermore, as illustrated in
(143)
(144) It is sufficient that at least one of the elastic wave resonators of the series arm resonators S1 to S5 and the parallel arm resonators P1 to P4 are defined as the elastic wave resonators 21 and 22 with the inclination angles as illustrated in
(145) The elastic wave resonators 21 and 22 with the inclination angles as illustrated in
(146) Furthermore, the first bandpass filter 5 in
(147)
(148) As in an inclination IDT 301 illustrated in
(149) As in an inclination IDT 311 illustrated in
(150) While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.