BALLOON CATHETER HAVING METAL BALLOON AND METHOD OF MAKING SAME
20190328563 ยท 2019-10-31
Inventors
- Christopher T. BOYLE (Flushing, NY, US)
- Steven R. Bailey (San Antonio, TX, US)
- Christopher E. BANAS (Breckenridge, CO, US)
- Julio C. Palmaz (Napa, CA, US)
Cpc classification
Y10S977/845
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
A61F2/958
HUMAN NECESSITIES
A61F2002/9583
HUMAN NECESSITIES
A61M2025/1075
HUMAN NECESSITIES
A61M2025/105
HUMAN NECESSITIES
A61F2/91
HUMAN NECESSITIES
A61F2/82
HUMAN NECESSITIES
G03F7/0002
PHYSICS
A61M2025/1097
HUMAN NECESSITIES
A61M2025/1088
HUMAN NECESSITIES
A61M2025/1086
HUMAN NECESSITIES
A61M2025/1031
HUMAN NECESSITIES
A61F2310/00395
HUMAN NECESSITIES
A61M25/1038
HUMAN NECESSITIES
A61M25/1029
HUMAN NECESSITIES
International classification
A61F2/958
HUMAN NECESSITIES
A61F2/82
HUMAN NECESSITIES
Abstract
A metal balloon catheter having a main tubular body, a metal balloon proximate a distal end of the main tubular body, a central annulus extending along an entire longitudinal aspect of the catheter for accommodating a guidewire therethrough and an inflation annulus adjacent the central annulus which extends along the longitudinal axis of the main tubular body and terminates in fluid flow communication with an inflation chamber of the metal balloon. The metal balloon catheter may be either unitary integral metal catheter in which the main tubular body and the balloon are fabricated of metal, or it may consist of a polymeric main tubular body and a metal balloon.
Claims
1. A balloon catheter device, comprising, comprising a catheter and a balloon affixed thereto, the balloon further comprising an electrically conductive member.
2. The balloon catheter device of claim 1, wherein at least one of the abluminal wall surface or luminal wall surface is substrate wherein at least one electronic circuit is integrated onto the substrate and onto or into at least one of the abluminal wall surface or luminal wall surface of the tubular member.
3. The balloon catheter device of claim 2, wherein at least one of the abluminal wall surface or luminal wall surface further comprises a recess configured to accommodate the at least one electronic circuit.
4. The balloon catheter device of claim 2, wherein the at least one electronic circuit further comprises an integrated circuit, solid-state circuit, LC circuit or RC circuit.
5. The balloon catheter device of claim 3, further comprising at least one electrode in electrical communication with the at least one electronic circuit.
6. The balloon catheter device of claim 2, wherein the balloon catheter device further comprises an elastomeric surface coating on the abluminal wall surface or luminal wall surface.
7. The balloon catheter device of claim 4, wherein the balloon catheter device further comprises an electrically conductive elastomeric surface coating on the abluminal wall surface or luminal wall surface.
8. The balloon catheter device of claim 1 wherein the tubular member comprises a plurality of electrically conductive layers.
9. The balloon catheter device of claim 6 wherein the tubular member further comprises at least one electrically insulated layer.
10. The balloon catheter device of claim 1, wherein the tubular member is a balloon.
11. The balloon catheter device of claim 10, wherein the balloon further comprises conductive projections that project above the surface of the metal balloon.
12. The balloon catheter device of claim 11, wherein the projections are configured as antennas.
13. The balloon catheter device of claim 2, wherein the electrically conductive tubular member is an antenna operably coupled to the at least one electronic circuit.
14. A method of making a balloon catheter device, comprising the steps of: a. providing a substrate suitable for forming a balloon; b. vacuum depositing an electrically conductive material onto the substrate; c. masking portions of the deposited device forming material to define a pattern to be formed on the device forming material; and d. forming a pattern on a surface of the device forming material.
15. The method of claim 14, wherein step b further comprises the step of depositing a shape memory metal.
16. The method of claim 14, further comprising the step of depositing an electrically conductive layer coupling at least one electrical component layer of the plurality of electrical component layers to the device forming material.
17. The method of claim 16, further comprising the step of depositing an electrically conductive layer coupling at least one electrical component layer of the plurality of electrical component layers to another electrical component layer.
18. The method of claim 14, further comprising the step of depositing an electrically insulating layer insulating at least one electrical component layer of the plurality of electrical component layers from another electrical component layer.
Description
BRIEF DESCRIPTION OF THE FIGURES
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] With particular reference to
[0024] With each of the embodiments of the present invention described herein, the metal balloon 14 may consist of a single layer of a single metal, multiple layers of a single metal or a multiple layers of multiple metals. With a laminated structure, the metal balloon 14 may include one or more radiopaque metals to enhance visualization of the metal balloon 14 under x-ray.
[0025] The balloon 14 is coaxially positioned about the body member 12 and defines an inflation lumen 16 between an inner wall of the balloon 14 and the body member 12. As with conventional balloon catheters, the body member 12 is a tubular member and includes an inflation lumen 20 that communicates between the proximal end of the body member 12 and at least one inflation port 22 in fluid flow communication with the inflation lumen of the balloon 14. The inflation lumen 20 may also function as a guidewire lumen, or a discrete guidewire lumen 18 may be provided in the body member 12.
[0026] Conventional balloon catheters typically require a large number of inflation ports 22 in order to meet governmental regulatory requirements for inflation and deflation times. However, it has been found with the present invention, that by fabricating the balloon 14 of a biocompatible metal having a wall thickness between 0.1 and 25 and inflated outer diameters between 0.1 mm and 40 mm, that the regulatory requirements for inflation and deflation times may be met with a single inflation port 22.
[0027] By fabricating the balloon 14 of a biocompatible metal, wall thicknesses between 3 and 12 may be achieved, with the resulting metal balloon 14 exhibiting zero compliance with extremely high tensile strength. An additional advantage resulting from the inventive metal balloon 14 is that certain metals, such as nitinol, exhibit lubricious surface properties which eliminate the need for surface lubricants found with conventional polymeric balloons. Furthermore, in the embodiment where the inventive metal balloon is made from a superelastic material such as nitinol, the metal balloon may be fabricated such that the low profile configuration is associated with lowest strain state of the balloon such that after inflation the balloon reassumes the low profile configuration under its own superelastic properties. In the embodiment where the inventive metal balloon is made from a shape memory material such as nitinol, the metal balloon may be fabricated such that the low profile configuration is associated with lowest strain high temperature state of the balloon such that after inflation the balloon reassumes the low profile configuration upon the application of heat.
[0028] Turning to
[0029] A perfusion metal balloon catheter 50 is illustrated in
[0030] Turning to
[0031] Finally, with reference to
[0032] In accordance with the method of the present invention, vacuum deposition methods as are known in the microelectronics and nano-fabrication arts are preferably employed. It is preferable to employ sputtering or ion beam-assisted evaporative deposition to deposit at least one metal film of a biocompatible metal onto a sacrificial cylindrical substrate. The sacrificial cylindrical substrate has a geometry corresponding to the geometry desired for the inventive metal balloon, and at least one of a plurality of metal film layers are deposited onto the sacrificial cylindrical substrate. After depositing a film having a desired thickness between 0.1 m and 25 m, the substrate and the deposited film are removed from the deposition chamber and the sacrificial substrate is removed by means suitable for the selected substrate. For example, a copper substrate may be employed and then sacrificially removed by chemical etching. Any patterning of nesting regions for a stent and/or projections for creating fold lines for the balloon may be imparted either by depositing metal species through a mask or by etching regions of a deposited film. The entire metal balloon or selected regions of the metal balloon may be subject to post-deposition annealing to alter the crystalline structure of the metal film and effect changes in the material properties of the metal film, such as altering the transition temperature of the annealed regions as well as to create advantageous zero stress-strain configurations such as low profile folds.
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[0035] The deflated geometry depicted in
[0036] In accordance with the preferred embodiment of fabricating the inventive microporous metallic implantable device in which the device is fabricated from vacuum deposited nitinol tube, a cylindrical deoxygenated copper substrate is shaped into a geometrical configuration corresponding to an inflated angioplasty balloon having proximal and distal tapers. The substrate is mechanically and/or electropolished to provide a substantially uniform surface topography for accommodating metal deposition thereupon. A cylindrical hollow cathode magnetron sputtering deposition device was employed, in which the cathode was on the outside and the substrate was positioned along the longitudinal axis of the cathode. A cylindrical target consisting either of a nickel-titanium alloy having an atomic ratio of nickel to titanium of about 50-50% and which can be adjusted by spot welding nickel or titanium wires to the target, or a nickel cylinder having a plurality of titanium strips spot welded to the inner surface of the nickel cylinder, or a titanium cylinder having a plurality of nickel strips spot welded to the inner surface of the titanium cylinder is provided. It is known in the sputter deposition arts to cool a target within the deposition chamber by maintaining a thermal contact between the target and a cooling jacket within the cathode. In accordance with the present invention, it has been found useful to reduce the thermal cooling by thermally insulating the target from the cooling jacket within the cathode while still providing electrical contact to it. By insulating the target from the cooling jacket, the target is allowed to become hot within the reaction chamber. Two methods of thermally isolating the cylindrical target from the cooling jacket of the cathode were employed. First, a plurality of wires having a diameter of 0.0381 mm were spot welded around the outer circumference of the target to provide an equivalent spacing between the target and the cathode cooling jacket. Second, a tubular ceramic insulating sleeve was interposed between the outer circumference of the target and the cathode cooling jacket. Further, because the NiTi sputtering yields can be dependant on target temperature, methods which allow the target to become uniformly hot are preferred.
[0037] The deposition chamber was evacuated to a pressure less than or about 2-510.sup.7 Torr and pre-cleaning of the substrate is conducted under vacuum. During the deposition, substrate temperature is preferably maintained within the range of 300 and 700 degrees Centigrade. It is preferable to apply a negative bias voltage between 0 and 1000 volts to the substrate, and preferably between 50 and 150 volts, which is sufficient to cause energetic species arriving at the surface of the substrate. During deposition, the gas pressure is maintained between 0.1 and 40 mTorr but preferably between 1 and 20 mTorr. Sputtering preferably occurs in the presence of an Argon atmosphere. The argon gas must be of high purity and special pumps may be employed to reduce oxygen partial pressure. Deposition times will vary depending upon the desired thickness of the deposited tubular film. After deposition, the plurality of microperforations are formed in the tube by removing regions of the deposited film by etching, such as chemical etching, ablation, such as by excimer laser or by electric discharge machining (EDM), or the like. After the plurality of microperforations are formed, the formed microporous film is removed from the copper substrate by exposing the substrate and film to a nitric acid bath for a period of time sufficient to remove dissolve the copper substrate.
[0038] While the present invention has been described with reference to its preferred embodiments, those of ordinary skill in the art will understand and appreciate that variations in materials, dimensions, geometries, and fabrication methods may be or become known in the art, yet still remain within the scope of the present invention which is limited only by the claims appended hereto.