MAT USING INFRARED LEDS

20190335542 ยท 2019-10-31

    Inventors

    Cpc classification

    International classification

    Abstract

    A mat using infrared LEDs comprising an infrared LED aluminum package (3), a temperature controller (2) supplying a power supply to an infrared LED chip (13), a FPCB (flexible printed circuit board) having the infrared LED aluminum package (3) mounted therein and including a terminal connecting the infrared LED aluminum package (3) to a wire, and a base sheet (6) for dispersing heat. According to the mat using infrared LEDs, aluminum with high thermal conductivity better radiates heat, the infrared light emitted from the LED is helpful for treatment and health improvement, the thin thickness of the infrared LED aluminum package prevents discomfort when a user lies thereon and the mat which is light in weight is easily movable or rollable for storage.

    Claims

    1. A mat using infrared LEDs, comprising: an infrared LED aluminum package; a temperature controller supplying electrical power to an infrared LED chip; a FPCB (flexible printed circuit board) having the infrared LED aluminum package mounted therein and including a terminal connecting the infrared LED aluminum package to a wire; and a base sheet for dispersing heat, wherein the infrared LED aluminum package comprises: two pieces of aluminum sheets connected together; an insulator inserted between the two pieces of the aluminum sheets; a recess in a frustoconical shape formed at one side of the connected aluminum sheets, the recess including a slope side reflection surface of the frustoconical shape and a bottom reflection surface on which the infrared LED chip is positioned; and a silicon-filled portion to pack the infrared LED chip and the FPCB sealing an electric connection member, wherein the angle of radiation of the reflection surface is freely set between 2060 based on the size of the infrared chip and the purpose of use, the reflection surface is coated with silver or chrome, the silicon-filled portion has a concave lens functioning as a lens to control the angle of radiation of the infrared LED chip, and the maximum temperature of heat of the mat is controllable up to 5055 C., without any other heat source.

    2. The mat using infrared LEDs according to claim 1, wherein the material and thickness of the base sheet are selected to be rollable like a scroll.

    3. The mat using infrared LEDs according to claim 1, wherein the DC temperature controller is a DC type separated to the outside.

    4. The mat using infrared LEDs according to claim 1, wherein the infrared LED aluminum packages are arranged to be spaced apart from one another, about by 1 to 10 cm by 1 to 10 vertically and horizontally, and the mat is under 1 cm in the entire thickness.

    Description

    BRIEF DESCRIPTION OF THE DRAWINGS

    [0026] FIG. 1 is a sectional view of an infrared LED aluminum package applied to a mat according to a preferable embodiment of the present invention;

    [0027] FIG. 2 is a circuit diagram of the arrangement of infrared LEDs and flexible printed circuit boards (FPCBs) wherein the infrared LEDs are mounted according to a preferable embodiment of the present invention; and

    [0028] FIG. 3 is a perspective view of a layer structure of the mat according to the present invention.

    DETAILED DESCRIPTION OF THE PREFERABLE EMBODIMENTS

    [0029] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily practice the present invention. Integer text missing or illegible when filed

    [0030] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments of the invention. As used herein, the singular forms a, an and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises, comprising, includes and/or including, when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element, components, and/or groups thereof.

    [0031] FIG. 1 shows a terminal 11 of an LED package. The LED package is made by connecting two pieces of aluminum sheets 12, 12 as shown. An insulator 14 is inserted between the two pieces of the aluminum sheets 12, 12. A recess 18 in a frustoconical shape is formed between the two pieces of the aluminum sheets 12, 12. The recess 18 includes a slope side reflection surface 15 of the frustoconical shape and a bottom reflection surface on which a infrared LED chip 13 is positioned. To increase reflection efficiency, the aluminum side is coated with silver or chrome.

    [0032] Since aluminum has a thermal conductivity of 201 W/mk, when aluminum is used for the LED package, the radiation effect is high. The infrared LED chip 13 is positioned to be mounted onto an electrode exposed on the bottom of the recess 18. Since the two aluminum sheets 12, 12 are insulated by the insulator 14, a bonding wire is used to be electrically connected to the other electrode than the electrode connected to the infrared LED chip 13. The recess 18 is of a frustoconical shape with the diameter being wider towards the top and narrower towards the bottom. The diameter of the side refection surface 15 of the recess 18 is bigger towards the top and forms a radiation angle R of the LED infrared light. The angle of the reflection surface, that is, the radiation angle may change based on the size or capacity of the infrared LED chip. The reflection surface may be coated with silver or chrome to improve the reflectance.

    [0033] Further, the recess 18 is generally sealed with light transmitting resins, to seal for moisture-proof of the infrared LED chip 13. In the present invention, the recess 18 is filled with light transmitting silicon. The silicon-filled part seals the infrared LED chip 13 and secures a connection wire. The silicon-filled part also functions as a lens to outwardly radiate the infrared light generated from the infrared LED chip 13.

    [0034] In a preferred embodiment, the silicon-filled part has a concave lens 16 with one surface being flat and the other being concave, to radiate the infrared light which is reflected from the reflection surface 15.

    [0035] In the preferred embodiment, the concave lens has a radiation angle of the reflection surface which is 2060.

    [0036] FIG. 2 is a circuit diagram of the mat using the infrared LEDs according to the present invention. The infrared LEDs are arranged, spaced apart from one another about by 1 to 10 cm by 1 to 10 vertically and horizontally, in the mat. The infrared LEDs are connected to one another in parallel vertically and in series horizontally. A positive (+) wire from a DC temperature controller 2 connected to a power line is connected to a positive (+) wire 4 on a flexible printed circuit board (FPCB), and a negative () wire from the DC temperature controller 2 is connected to a negative () wire 4 on the FPCB, so that when the DC temperature controller 2 turns ON, the infrared light of an infrared LED aluminum package 3 radiates through the reflection surfaces. FIG. 2 shows some LEDs only, however, the number of LEDs and the number the serial-parallel structures may vary based on the dimension of the mat. As shown, the infrared LED aluminum packages 3 are mounted to the FPCB, which are processed with thin film materials, such as silicon, etc., for water-proofing and moisture-proofing. The DC temperature controller 2 is used by converting AC to DC, preventing the generation of electric waves.

    [0037] The FPCB, an electronic component which has been developed according to the trends of small and light electronic products, has high operating efficiency, high thermal resistance, high folding endurance, high chemical resistance. Since the FPCB is strong against heat, it sufficiently endures the radiation from the infrared LEDs and does not cause any problems at a temperature of 70 C. or higher. Since the FPCB has high durability at repetitive folding, it is used for the mat of the present invention, enabling the mat to be folded or rolled.

    [0038] With reference to FIG. 3, the infrared LED aluminum packages 3 according to the present invention are mounted to the FPCBs and the FPCBs processed for water-proofing and moisture-proofing are inserted and fixed in a groove formed on a base sheet 6 of the mat by an adhesive, etc. A material, such as a non-woven fabric 8, which has the area corresponding to the area of the base sheet 6, is positioned on the FPCBs with the infrared LED aluminum packages 3, to further secure and cover the FPCBs and prevent a top fabric 7 from discoloring by infrared light. The non-woven fabric 8 may be additionally positioned between the base sheet 6 and the FPCBs. The top fabric 7 which is soft and is directly in touch with a human body is positioned on the non-woven fabric 8. Since the heat from the LEDs is radiated through the aluminum and the base sheet 6, the base sheet 6 has the material or structure to better disperse the heat. The maximum temperature of heating of the mat is controllable up to 50 C.55 C., without any other heat source. When the temperature of the heat is higher than 55 C., the life-span of the infrared LED chip is shortened. At 50 C., a user feels warm and can usually use the mat for six (6) hours, with ease, which time the user can sleep. The base sheet 6 uses a foldable or rollable material. PVC is high in shock-proof and PE which is lighter than PVC is easily movable and highly utilized. At least an organic polymer compound or cellulose may be used for the base sheet 6. Preferably, the thickness of the base sheet 6 may be 5 mm or less. Preferably, the top fabric 7 which is directly in touch with a human body may be made of environment-friendly materials. Further preferably, the non-woven fabric 8 may be made of materials enabling moisture absorption and heat generation.

    [0039] Since the thickness of the infrared LED aluminum package 3 is thin as about 1.05 mm, even if it is perfectly received in the groove of the base sheet 6 or slightly protrudes, it is almost flat and therefore a user does not feel any pressure or discomfort by the infrared LED aluminum packages 3 upon lying on the mat. Thus, the mat is manufactured in the form of a general mat.

    [0040] When the entire thickness of the mat is under 1 cm, it is easily rollable like a scroll.

    [0041] The invention has been described using a preferred exemplary embodiment(s). However, it is to be understood that the scope of the invention is not limited to the disclosed embodiment(s). On the contrary, the scope of the invention is intended to include various modifications and alternative arrangements within the capabilities of persons skilled in the art using presently known or future technologies and equivalents. The scope of the claims, therefore, should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.