Manganese-containing, cobalt-based high-temperature solder alloy, powder, component and soldering method

Abstract

A manganese-containing, cobalt-based alloy with zirconium, tantalum and carbon, and good cohesive joint connections, is provided.

Claims

1. A cobalt-based solder alloy comprising: 8% by weight16% by weight of zirconium (Zr); 6% by weight10% by weight of tantalum (Ta); 0.5% by weight1.5% by weight of carbon (C), 8% by weight12% by weight of manganese (Mn); at least 0.5% by weight of titanium (Ti); and having no boron (B), no silicon (Si), no germanium (Ge) and no gallium (Ga).

2. The cobalt-based solder alloy as claimed in claim 1, including 15% by weight of zirconium (Zr).

3. The cobalt-based solder alloy as claimed in claim 1, including 8% by weight of tantalum (Ta).

4. The cobalt-based solder alloy as claimed in claim 1, including 1% by weight of carbon (C).

5. The cobalt-based solder alloy as claimed in claim 1, including 10% by weight of manganese (Mn).

6. The cobalt-based solder alloy as claimed in claim 1, including 1% by weight of titanium (Ti).

7. The cobalt-based solder alloy as claimed in claim 1, consisting of zirconium (Zr), tantalum (Ta), carbon (C), manganese (Mn), cobalt (Co) and titanium (Ti).

8. The cobalt-based solder alloy as claimed in claim 1, consisting of zirconium (Zr), tantalum (Ta), carbon (C), manganese (Mn), cobalt (Co) and titanium (Ti).

9. The cobalt-based solder alloy as claimed in claim 1, having at most 5% by weight of titanium (Ti).

10. A powder comprising the cobalt-based solder alloy as claimed in claim 1.

11. A component comprising the cobalt-based solder alloy as claimed in claim 1.

12. A method comprising: soldering a substrate using the cobalt-based solder alloy as claimed in claim 1.

13. The method as claimed in claim 12, wherein the soldering the substrate is carried out with a heat treatment for a cobalt-based alloy that differs from a heat treatment for an alloy that has no manganese.

Description

(1) The description shows merely exemplary embodiments of the invention.

(2) It is proposed to work with novel boron- and silicon-free cobalt-based solders which contain manganese (Mn) as the main melting point depressant. Other melting point depressants gallium (Ga) and germanium (Ge) are also preferably absent.

(3) The cobalt-based solder alloy has at least: zirconium (Zr), particularly 8% by weight-16% by weight, very particularly 15% by weight, tantalum (Ta), particularly 6% by weight-10% by weight, very particularly 8% by weight, carbon (C), particularly 0.5% by weight-1.5% by weight, very particularly 1% by weight, manganese (Mn), particularly 8% by weight-12% by weight, very particularly 10% by weight, optionally titanium (Ti).

(4) The starting system is preferably the quaternary system Co-15Zr-8Ta-1C (in percent by weight), which is alloyed with manganese (Mn).

(5) Manganese (Mn) is highly soluble in the cobalt matrix, such that the precipitation of brittle phases can be prevented.

(6) Addition of 10% by weight of manganese (Mn) allows the melting point to be depressed to <1473K.

(7) Furthermore, small quantities of titanium (Ti), from 0.5% by weight to 5% by weight, can be admixed to further lower the melting point. In addition, titanium, alongside tantalum (Ta), functions in the cobalt matrix as a carbide former, and thus strengthens the joining zone.

(8) Substrates which are soldered using the cobalt-based solder alloy differ markedly, i.e. in particular they have other elements or in particular have no manganese.

(9) Although the present invention has been disclosed in the form of preferred embodiments and variations thereon, it will be understood that numerous additional modifications and variations could be made thereto without departing from the scope of the invention.

(10) For the sake of clarity, it is to be understood that the use of a or an throughout this application does not exclude a plurality, and comprising does not exclude other steps or elements.