MICROFLUIDIC COMPONENT PACKAGE

Abstract

A microfluidic component package that is readily integratable within a microfluidic system.

Claims

1. A microfluidic component package comprising an enclosure, one or more microfluidic elements formed within the enclosure, one or more openings formed in the enclosure to allow the one or more microfluidic elements contact with fluid, a mechanism on the enclosure to connect to a surface.

2. The microfluidic component package of claim 1, wherein the enclosure contains an opening to allow fluid to enter and leave the interior of the enclosure, a sacrificial material for temporarily blocking the opening, wherein the sacrificial material is removable after placing the package within a microfluidic system.

3. The microfluidic component package of claim 2, wherein the sacrificial material is a material that can be removed using one of water, solvent, etchant, plasma, and evaporation.

4. The microfluidic component package of claim 1, further comprising electrical contacts coupled to the enclosure to allow electrical signal to enter and leave the enclosure.

5. The microfluidic component package of claim 1, wherein the enclosure also contains optical openings to allow light to enter and leave the enclosure.

6. The microfluidic component package of claim 5, further comprising one or more of lenses, mirrors, diffractive optics, optical filters and optical attenuators positioned within the enclosure.

7. The microfluidic component package of claim 1, further comprising a mechanical coupling to allow mechanical energy enter and leave the enclosure.

8. The microfluidic component package of claim 7, wherein the mechanical energy comprises one or more of pneumatic forces, hydraulic forces, and direct stressing forces.

9. The microfluidic component package of claim 1, further comprising thermal coupling to allow heat energy to enter and leave the enclosure.

10. The microfluidic component package of claim 1, wherein the package is mountable on a printed circuit board.

11. The microfluidic component package of claim 1, wherein the package is encapsulated within a microfluidic system.

12. A method of embedding a microfluidic component package in a sealed microfluidic system, the method comprising: soldering the microfluidic component package onto a printed circuit board; depositing a layer of encapsulating polymer onto the microfluidic component package and the printed circuit board; planarizing the layer of encapsulating polymer to form a flat surface; drilling one or more holes through the layer of encapsulating polymer to produce openings in the microfluidic component package and to expose sacrificial material within the microfluidic component package; removing the sacrificial material to expose microfluidic elements within the microfluidic component package; and bonding a microfluidic layer to the layer of encapsulating polymer to form the sealed microfluidic system.

13. The method of claim 12, wherein the microfluidic component package comprises: an enclosure, one or more microfluidic elements formed within the enclosure, one or more openings formed in the enclosure to allow the one or more microfluidic elements contact with fluid, a mechanism on the enclosure to connect to a surface.

14. The method of claim 13, wherein the sacrificial material is a material that can be removed using one of water, solvent, etchant, plasma, and evaporation.

15. The method of claim 13, wherein the microfluidic component further comprises electrical contacts coupled to the enclosure to allow electrical signal to enter and leave the enclosure.

16. The method of claim 13, wherein the enclosure also contains optical openings to allow light to enter and leave the enclosure.

17. The method of claim 16, wherein the microfluidic component package further comprises one or more of lenses, mirrors, diffractive optics, optical filters and optical attenuators positioned within the enclosure.

18. The method of claim 13, wherein the microfluidic component package further comprises a mechanical coupling to allow mechanical energy to enter and leave the enclosure.

19. The method of claim 18, wherein the mechanical energy comprises one or more of pneumatic forces, hydraulic forces, and direct stressing forces.

20. The method of claim 13, wherein the microfluidic component package further comprises thermal coupling to allow heat energy to enter and leave the enclosure.

Description

BRIEF DESCRIPTION OF FIGURES

[0011] The details of the example embodiments, including structure and operation, may be gleaned in part by study of the accompanying figures, in which like reference numerals refer to like parts. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the disclosure. Moreover, all illustrations are intended to convey concepts, where relative sizes, shapes and other detailed attributes may be illustrated schematically rather than literally or precisely.

[0012] FIG. 1 is a schematic of microfluidic system has micro-channels and active parts that operate as valves, pumps, and similar functions. These are all fabricated at the same time, in the same substrate, as the microfluidics.

[0013] FIG. 2 is a schematic of microfluidic system that utilizes individual devices that are manufactured separately and then embedded within the system when manufacturing the microfluidics.

[0014] FIG. 3 is a cross-sectional view of an exemplary microfluidic component package MFCP with multiple devices and ports, according to embodiments of the present disclosure.

[0015] FIG. 4 is a cross-sectional view of MFCP embedded within a microfluidic system and electronic circuit board, according to embodiments of the present disclosure.

[0016] FIG. 5A illustrates a first step in an exemplary MFCP embedding process, according to embodiments of the present disclosure.

[0017] FIG. 5B illustrates a second step in an exemplary MFCP embedding process, according to embodiments of the present disclosure.

[0018] FIG. 5C illustrates a third step in an exemplary MFCP embedding process, according to embodiments of the present disclosure.

[0019] FIG. 5D illustrates a fourth step in an exemplary MFCP embedding process, according to embodiments of the present disclosure.

[0020] It should be noted that elements of similar structures or functions are generally represented by like reference numerals for illustrative purpose throughout the figures. It should also be noted that the figures are only intended to facilitate the description of the preferred embodiments.

DETAILED DESCRIPTION

[0021] Each of the additional features and teachings disclosed below can be utilized separately or in conjunction with other features and teachings to provide a microfluidic component package and methods of manufacture. Representative examples of the embodiments described herein, which examples utilize many of these additional features and teachings both separately and in combination, will now be described in further detail with reference to the attached drawings. This detailed description is merely intended to teach a person of skill in the art further details for practicing preferred aspects of the present teachings and is not intended to limit the scope of the disclosure. Therefore, combinations of features and steps disclosed in the following detail description may not be necessary to practice the disclosure in the broadest sense, and are instead taught merely to particularly describe representative examples of the present teachings.

[0022] Moreover, the various features of the representative examples and the dependent claims may be combined in ways that are not specifically and explicitly enumerated in order to provide additional useful embodiments of the present teachings. In addition, it is expressly noted that all features disclosed in the description and/or the claims are intended to be disclosed separately and independently from each other for the purpose of original disclosure, as well as for the purpose of restricting the claimed subject matter independent of the compositions of the features in the embodiments and/or the claims. It is also expressly noted that all value ranges or indications of groups of entities disclose every possible intermediate value or intermediate entity for the purpose of original disclosure, as well as for the purpose of restricting the claimed subject matter.

[0023] The various embodiments provided herein are generally directed to a microfluidic component package (MFCP) that can produce a consistent interface between a small microfluidic device and a larger microfluidic system, while also allowing access to electrical, optical, mechanical, and thermal connections. The MFCP may comprise one or more microfluidic devices contained within it, and the MFCP is intended to be embedded within a larger microfluidic system.

[0024] FIG. 3 shows an exemplary MFCP 300, according to embodiments of the present disclosure. The MFCP 300 comprises an enclosure 301 which may be solid filled or may comprise a hollow interior. The enclosure 301 may be paired with a substrate 303 on one or more sides, for example the bottom, to add additional functionality to the package or to assist in attachment to a larger system. Within the enclosure 301 are one or more microfluidic elements that add functionality to a microfluidic system such as micro-channels 305. In the preferred embodiment, the micro-channels 305 are encapsulated within the package or enclosure 301. One or more ports 309 and 315 may be defined to allow access to the microfluidic elements/micro-channels 305 inside the enclosure 301. A sacrificial material 307 may be used to connect a microfluidic element to the port of the package. The sacrificial material 307 is known to be dissolvable or etchable by a suitable chemical. At a later time, a physical connection can be made from the port to the microfluidic element by first making an opening in the enclosure 301 at the location of the port 309, 315, then removing the sacrificial material 307 by dissolving or etching the sacrificial material 307 away using an appropriate chemical. This provides an opening between the outside of the package and the microfluidic elements 305 inside.

[0025] The enclosure 301 may include cavities 311, and may provide optical openings 313, such as lenses, filters, mirrors, and the like. Ports 315 may be used to provide access to other features of the enclosed device, such as pneumatic, hydraulic, mechanical, or thermal access. Ports may be provided on all sides of the enclosure, including ports 317 through the bottom substrate.

[0026] The enclosure 301 may include elements 319 in addition to microfluidic elements, such as microelectronic devices, including light sources, photosensors, computers, and electronics.

[0027] The enclosure 301 may also include features that allow it to be attached to conventional systems, such as tapped holes 321 for screws or contact pads 323 for soldering the device 300 to a printed circuit board. The contact pads 323 also allow electrical energy to enter and leave the package.

[0028] The MFCP may be embedded within any microfluidic system. However, in the preferred embodiment a microfluidic system for embedding the MFCP within comprises a network of microfluidic channels prepared on a printed circuit board.

[0029] FIG. 4 shows the preferred method for embedding the MFCP in a larger microfluidic system 400. In this embodiment, a printed circuit board (PCB) 401 is prepared having a solid material and electrical traces for routing electrical signals. The PCB 401 comprises specific contact pads 403 for connecting to a component such as an MFCP 409. Mounting is most commonly performed using solder 405, which connects the contact pads from the PCB 403 with the contact pads 407 on the MFCP 409. The solder connections 405 provide electrical connection as well as mechanical connection.

[0030] The MFCP 409 that comprises the microfluidic and other elements is encapsulated within a material 411 (e.g., polymer). Openings 413 are provided in the encapsulating material (e.g., polymer) 411 to allow fluidic access from a microfluidic channel 415 to the ports of the MFCP 409. Microfluidic channels 415 are fabricated on the encapsulating material (e.g., polymer) 411 forming the larger microfluidic system 400.

[0031] FIGS. 5A-5D illustrate how an MFCP 501 may be embedded within a printed circuit board and microfluidic system.

[0032] FIG. 5A illustrates a first step in an exemplary MFCP embedding process, according to embodiments of the present disclosure. As shown in FIG. 5A, the MFCP 501 is mounted on a printed circuit board 503 using technology such as soldering.

[0033] FIG. 5B illustrates a second step in an exemplary MFCP embedding process, according to embodiments of the present disclosure. As shown in FIG. 5B, an encapsulating polymer 505 is used to cover the MFCP 501 and printed circuit board 503. The encapsulating polymer 505 is embossed or planarized to produce a suitable surface, for example, a flat surface 507.

[0034] FIG. 5C illustrates a third step in an exemplary MFCP embedding process, according to embodiments of the present disclosure. As shown in FIG. 5C, one or more holes 509 are drilled through the encapsulating polymer 505 to produce openings in the package and expose the sacrificial material 502 within.

[0035] FIG. 5D illustrates a fourth step in an exemplary MFCP embedding process, according to embodiments of the present disclosure. As shown in FIG. 5D, the sacrificial material 502 is removed by dissolution or etching 511, opening up the microfluidic elements within the package. A microfluidic layer 513 is bonded to the encapsulating material to form a sealed microfluidic system.

[0036] All features, elements, components, functions, and steps described with respect to any embodiment provided herein are intended to be freely combinable and substitutable with those from any other embodiment. If a certain feature, element, component, function, or step is described with respect to only one embodiment, then it should be understood that that feature, element, component, function, or step can be used with every other embodiment described herein unless explicitly stated otherwise. This paragraph therefore serves as antecedent basis and written support for the introduction of claims, at any time, that combine features, elements, components, functions, and steps from different embodiments, or that substitute features, elements, components, functions, and steps from one embodiment with those of another, even if the following description does not explicitly state, in a particular instance, that such combinations or substitutions are possible. Express recitation of every possible combination and substitution is overly burdensome, especially given that the permissibility of each and every such combination and substitution will be readily recognized by those of ordinary skill in the art upon reading this description.

[0037] In many instances, entities are described herein as being coupled to other entities. It should be understood that the terms coupled and connected or any of their forms are used interchangeably herein and, in both cases, are generic to the direct coupling of two entities without any non-negligible e.g., parasitic intervening entities and the indirect coupling of two entities with one or more non-negligible intervening entities. Where entities are shown as being directly coupled together, or described as coupled together without description of any intervening entity, it should be understood that those entities can be indirectly coupled together as well unless the context clearly dictates otherwise.

[0038] While the embodiments are susceptible to various modifications and alternative forms, specific examples thereof have been shown in the drawings and are herein described in detail. It should be understood, however, that these embodiments are not to be limited to the particular form disclosed, but to the contrary, these embodiments are to cover all modifications, equivalents, and alternatives falling within the spirit of the disclosure. Furthermore, any features, functions, steps, or elements of the embodiments may be recited in or added to the claims, as well as negative limitations that define the inventive scope of the claims by features, functions, steps, or elements that are not within that scope.