Method for Restoring Damaged Electronic Devices by Cleaning and Apparatus Therefor

Abstract

A method and apparatus for regenerating damaged electronic device by a least one cleaning process and a least one drying process, by submerging one or more electronic devices into an aqueous cleaning liquid in a cleaning chamber (1), and subjecting the aqueous cleaning liquid and the one or more electronic devices to sonication. Drying of the one or more electronic devices is done by periodically heating the cleaning chamber (1) while subjecting the cleaning chamber to reduced pressure and where the cleaning and the drying are carried out in the same cleaning chamber. We hereby achieve a thorough cleaning and restoration of a damaged electronic device.

Claims

1-14. (canceled)

15. A method comprising regenerating damaged electronic device by a least one cleaning process and a least one drying process, the cleaning process further comprising the steps of: submerging one or more electronic devices into an aqueous cleaning liquid in a cleaning chamber, subjecting the aqueous cleaning liquid and the one or more electronic devices to sonication the dying process comprises the step of: drying the one or more electronic devices wherein drying of the one or more electronic devices is done in a drying cycle by periodically heating the cleaning chamber and subjecting the cleaning chamber to reduced pressure and where the cleaning step and the drying step are carried out in the same cleaning chamber, and wherein the drying cycle comprises the steps of: a: heating air entering into the cleaning chamber to a temperature of at least 60 C. at a first reduced pressure of 0.5-0.9 bar, b: maintaining a chamber temperature of 35-80 C. and a second reduced pressure level of 0.5-0.9 bar, c: reducing the pressure to a third pressure level of 0.1-0.5 bar.

16. The method according to claim 15, further comprising repeating steps b-c in the drying cycle at least one, two, three, four, five, six, seven, eight, nine, ten or more times.

17. The method according to claim 15, wherein the frequency and/or the amplitude of the sonic waves is adjusted to the cleaning process and/or varied during at least one cleaning substep.

18. The method according to claim 15, wherein the periodical heating of the cleaning chamber provides a chamber temperature 20-100 C., such 35-80 C. or preferably as 45-70 C.

19. The method according to claim 15, wherein the aqueous cleaning liquid comprises water, such as tap water or demineralised water and optionally the aqueous cleaning liquid further comprises one or more detergents, such as one or more alkaline detergents or acid detergents, or detergents having amphoteric properties and/or mixtures thereof.

20. Apparatus comprising a damaged electronic restoration apparatus by means of a cleaning process according to claim 15, wherein the apparatus comprises: a pressure tight and/or airtight cleaning chamber, at least one liquid inlet arranged for at least partly fill the cleaning chamber with an aqueous cleaning liquid thereby submerging the damaged electronic in the aqueous cleaning liquid at least one liquid outlet arranged for emptying the cleaning chamber for aqueous cleaning liquid one or more sonic probes for subjecting the aqueous cleaning liquid and the electronic device to sonication, and at least one pumping means for subjecting the cleaning chamber to a reduced pressure and wherein the cleaning chamber additionally comprises: one or more air entering means for entering air into the chamber one or more temperature regulating means whereby the cleaning chamber is also configured as a drying chamber, to dry the regenerated electronic devices in a drying cycle having one or more drying steps under reduced pressure, which apparatus is configured so as to perform the drying cycle that comprises the steps of: a: the temperature controlling means heating air entering into the cleaning chamber to a temperature of at least 60 C. and the pumping means controlling the pressure so as to maintain at a first reduced pressure of 0.5-0.9 bar, b: maintaining a chamber temperature of 35-80 C. and the pumping means controlling the pressure to a second reduced pressure level of 0.5-0.9 bar, and c: the pumping means controlling the reducing the pressure to a third pressure level of 0.1-0.5 bar.

21. The apparatus as according to claim 20, wherein filling the cleaning chamber with liquid is done by the at least one pumping means applies a reduced pressure to the cleaning chamber and thereby sucking the aqueous cleaning liquid into the cleaning chamber through the at least one liquid inlet means.

22. The apparatus according claim 20, wherein the liquid inlet means is also functioning as liquid outlet means.

23. The apparatus as according claim 20, wherein the apparatus comprises at least one liquid tank for storing at least a part of the used aqueous cleaning liquid, and means for reuse of aqueous cleaning liquid or liquids in the one or more cleaning steps.

24. The apparatus according claim 20, wherein the cleaning chamber further comprises at least one condensation plate.

Description

DESCRIPTION OF THE DRAWING

[0129] FIG. 1 shows simple view of a damaged electronic restoration apparatus FIG. 2 shows an implementation of sonic probes mounted on the sidewall of the cleaning chamber

[0130] FIG. 3 shows a complete view of an embodiment of the restoration apparatus.

[0131] FIG. 4 shows one embodiment of the method to regenerate damaged electronic devices.

[0132] FIG. 5a-5g shows the inlet and outlet of liquid from the cleaning chamber with only gravity and a vacuum-pump.

DETAILED DESCRIPTION OF THE INVENTION

[0133] The following are examples of how the method and apparatus for restoring damaged electronic devices are accomplished.

[0134] FIG. 1 shows an example of a cleaning chamber for a damaged electronic restoration apparatus.

[0135] The restoration apparatus comprises a cleaning chamber 1 having a lid 2. The 2 lid closes the cleaning chamber 1 in an air and/or pressure tight manner. In the lower end of the chamber are placed two sonic probes 3 placed towards an inner plate 4. In FIG. 1 is the bottom of the cleaning chamber, but the sonic probes might as well be placed towards a side wall. The sonic probes 3 are connected to the inner plate 4 such that the inner plate transfers the vibration from the sonic probes to the aqueous cleaning liquid in the cleaning chamber.

[0136] In the upper part of the cleaning chamber 1 is an outlet 5 for a vacuum pump 6 (not shown in FIG. 1), whereby the vacuum pump 6 may reduce the pressure inside the cleaning chamber 1 to a level below the atmospheric pressure. In the lower end of the cleaning chamber 1 is an inlet/outlet 7 for aqueous cleaning liquid followed by a number of valves 8a, 8b, 8c, 8d. The valves have four connections; two valves 8a, 8b for aqueous cleaning liquids 9, 10, one valve 8c fore drying air 11 and one valve 8d for emptying the aqueous cleaning liquid out of the cleaning chamber 1. In the top of the cleaning chamber 1 is optionally another inlet for air 13 and an extra inlet 14 for cleaning liquid.

[0137] When drying the damaged electronic devices it is possible to remove the moist from the chamber by using a condensation plate 15.

[0138] The base of the cleaning chamber has a slight slant towards the inlet/outlet 7, thereby making it easier to empty the cleaning chamber 1 of liquids.

[0139] When cleaning a damaged electronic device, the damaged electronic device is placed inside the cleaning chamber 1 on the inner plate 4, e.g. by placing the electronic devices in a basket or similar holder. The cleaning chamber 1 is then completely or at least partly filled with an aqueous cleaning liquid.

[0140] The cleaning chamber 1 is preferably filled up with aqueous cleaning liquid by having the vacuum pump 6 applying a vacuum in the cleaning chamber 1. By opening the valve 8a, 8b to one of the connections to the aqueous cleaning liquid inlets 9, 10, the aqueous cleaning liquid will be sucked into the chamber through the inlet/outlet 7 in the bottom of the cleaning chamber 1 by the reduced pressure in the cleaning chamber 1.

[0141] The vacuum applied may be a maximum applicable vacuum which is applied prior to allowing the cleaning liquid to be transferred to the cleaning chamber. The maximum level of vacuum may e.g. be a pressure of 0.01 to 0.2 bar (absolute pressure). This allows for very fast transfer of liquid to the cleaning chamber and further reduces the processing time of the entire restoration process.

[0142] Alternatively, the vacuum pump may gradually apply a vacuum while transferring the cleaning liquid to the cleaning chamber. A pressure of e.g. 0.3-0.5 bar may then be applied to the cleaning chamber while the liquid is transferred to the cleaning chamber.

[0143] Alternatively, the cleaning chamber 1 may be filled with the aqueous cleaning liquid by pumping the aqueous cleaning liquid into the cleaning chamber by a pump (not shown in FIG. 1).

[0144] Another alternative for filling the cleaning chamber 1 with aqueous cleaning liquid is through the inlet 14 in the top of the cleaning chamber 1.

[0145] When the cleaning chamber 1 is at least partly to completely filled with aqueous cleaning liquid the sonic probes 3 subject the cleaning chamber 1 and the damaged electronic device and the aqueous cleaning liquid to sonication, thereby cleaning the damaged electronic device.

[0146] After sonication the cleaning chamber 1 is emptied of the now used aqueous cleaning liquid. Emptying of the cleaning chamber 1 occurs through the inlet/outlet 7 in the lower part of the cleaning chamber 1. By activating the valve 8d to the connection for emptying aqueous cleaning liquid, the now used aqueous cleaning liquid, either runs out of the chamber pulled out by gravity or is pumped out by a pump (not shown in FIG. 1).

[0147] The cleaning substeps may be repeated one or multiple times, possibly also alternating with a rinsing with for example water. Each time the cleaning chamber is filled the partly or full of aqueous cleaning liquid, and then the e aqueous cleaning liquid and the damaged electronic device is subjected to sonication. After sonication, the cleaning chamber 1 is emptied of aqueous cleaning liquid.

[0148] After a thorough cleaning the damaged electronic device is now restored, but needs to be dried to avoid any remaining liquid remaining inside the electronic device to cause new corrosion of the metallic parts or components in the electronic device

[0149] The drying step is carried out under reduced pressure by reducing the pressure to below atmospheric pressure. The vacuum pump 6 (not shown in FIG. 1) reduces the pressure by pumping out air through the outlet 5 for a vacuum pump 6.

[0150] The reduced pressure makes the left over liquid in the damaged electronic device vaporise raising the humidity of the air in the cleaning chamber.

[0151] The humidity of the air in the cleaning chamber 1 may be reduced by circulating air through the cleaning chamber 1, while still keeping the cleaning chamber at reduced pressure. The air enters through the air inlet 13 at the top of the cleaning chamber 1 and out through the inlet/outlet 7 to the drying air outlet 11 at the bottom of the cleaning chamber 1.

[0152] Alternatively the air humidity may be removed by providing a condensation plate 15 in the cleaning chamber 1.

[0153] The reduced pressure is periodically changed during periods with heating the cleaning chamber 1 as discussed above. This improves drying of the restored/damaged electronic devices.

[0154] FIG. 2 shows an alternative positioning of the sonic probes 3. The sonic probes 3 are still connected to an inner plate 4. The inner plate 4 is in a vertical direction in one of the sides of the cleaning chamber 1. There may be more inner plates with more sonic probes, e.g. by applying sonic probes at several inner walls. Preferably, there are sonic probes on two opposite sides of the cleaning chamber, which enables subjecting the cleaning chamber and the aqueous cleaning liquid for sonication from two opposite sides.

[0155] FIG. 3 is an overview of the complete a damaged electronic restoration apparatus for restoring electronic devices damaged by e.g. ingress of liquids.

[0156] The lid 2 is closed by activating a magnetic valve 16a to an air chamber 16b.

[0157] In connection to the lid 2 there is a sprinkler 17 functioning as both an inlet for aqueous cleaning liquid, such as water and/or an inlet for air. The liquid inlet to the sprinkler is controlled by a first liquid inlet valve 18. Similarly is the air inlet controlled by an air valve 19. The air inlet is mainly for reliving the pressure inside the cleaning chamber after a cycle running under reduced pressure.

[0158] In connection to the lid 2 is a pressure relief valve 20 as a safety measurement. Furthermore, another air cylinder 21 is provided to allow movement of the lid 2.

[0159] Mounted on the top of the lid 2 is a heating element 22 arranged to heat the cleaning chamber 1 when drying the damaged now restored electronic device.

[0160] There is an air tank 23 with a check valve 24, which can provide pneumatic pressure to the valve actuators in case the supply of pressurized air to the pneumatically driven valves is interrupted. This can be detected by means of a pressure sensor applied to the pneumatic system. This safety provision also allow for the programme to run to the end and to allow for opening of the lid 2 when the cleaning and drying cycles are finalized, even if pneumatic pressure is interrupted.

[0161] The sonic probes 3 are placed in connection to a side wall of the cleaning chamber 1.

[0162] The cleaning chamber 1 has several three liquid inlets, preferably at least two or at least three liquid inlets arranged to allow liquid into the lower part of the cleaning chamber 1. One of the inlets may also functions as a liquid outlet.

[0163] The first liquid inlet 25 is a water inlet, either to allow addition of tap water or demineralised water into the cleaning chamber 1. The water inlet is controlled by a water inlet valve 26.

[0164] The second inlet 27 is concentrated aqueous cleaning liquid. The concentrated aqueous cleaning liquid is stored in a container 28 and pumped into the cleaning chamber by a first cleaning liquid pump 29. The second inlet 27 is controlled by a first cleaning liquid control valve 30.

[0165] The last inlet 31 is also arranged to function as an outlet for the aqueous cleaning liquid(s). Filling and/or emptying the cleaning chamber through the inlet/outlet is controlled by a number of valves.

[0166] When emptying the cleaning chamber for aqueous cleaning liquid it is emptied through the inlet/outlet 31. The aqueous cleaning liquid may be recovered and stored in one of at least two cleaning liquids tanks 37, 38.

[0167] When emptying aqueous cleaning liquid from the cleaning chamber and into the first liquid tank 37, the outlet 31 is activated by a first liquid outlet valve 32 and then aqueous cleaning liquid is pumped out of the cleaning chamber 1 by a first liquid outlet pump 39 into the liquid tank 37.

[0168] As the aqueous cleaning liquid has been used, the cleaning abilities may have deteriorated. It is there for possible to add extra concentrated cleaning liquid to the used aqueous cleaning liquid to improve the cleaning abilities of the aqueous cleaning liquid. The concentrated cleaning liquid is stored in a second concentrated cleaning liquid container 40 and may be pumped into the first liquid tank 37 by a second concentrate cleaning liquid pump 41.

[0169] When reusing the aqueous cleaning liquid from the spent first cleaning liquid tank 37, the aqueous cleaning liquid is again filled into the cleaning chamber 1. The vacuum pump 6 reduces the pressure in the cleaning chamber to a level under atmospheric pressure after activating the second liquid inlet valve 33 the liquid is sucked into the cleaning chamber thereby filling the cleaning chamber.

[0170] Alternatively, it is possible to empty the aqueous cleaning liquid from the cleaning chamber 1 and into the second liquid tank 38. The outlet 31 is activated by second liquid outlet valve 34 and the aqueous cleaning liquid is pumped out of the cleaning chamber 1 and into the liquid tank by a second cleaning liquid pump 42.

[0171] It is possible to add extra concentrated cleaning liquid to the used aqueous cleaning liquid to improve the cleaning abilities of the aqueous cleaning liquid. The concentrated cleaning liquid is stored in a third concentrated cleaning liquid storage container 43 and may be pumped into the second liquid tank 38 by a third cleaning liquid concentrate pump 44.

[0172] When reusing the aqueous cleaning liquid from the second liquid tank 38, the liquid is again refilled into the cleaning chamber 1. The vacuum pump 6 reduces the pressure in the cleaning chamber 1 after activating the third liquid inlet valve 35 the liquid is sucked into the cleaning chamber and thereby filling the cleaning chamber 1.

[0173] The cleaning chamber 1 may also be emptied by leading spent aqueous cleaning liquid to the sewer. This is done by activating the sewer valve 36 and pump the aqueous cleaning liquid out into the sewer by a sewer pump 45.

[0174] When emptying the cleaning chamber 1 there may be provided one or more liquid purifying means 46, 47, 48, e.g. a filter for removing impurities in the spent aqueous cleaning liquid from the cleaning of the damaged electronic device.

[0175] FIG. 4 is a process diagram of a specific method to clean damaged electronic device placed in the cleaning chamber.

[0176] First the lid is closed 55 and the vacuum pump 6 applies a reduced pressure to the cleaning chamber 56.

[0177] A first cleaning liquid, preferably comprising a soap is added to the cleaning chamber and sonication, preferably by ultrasound, is applied to the cleaning chamber including cleaning liquid and damaged electronic device. After subjecting the cleaning chamber and its content to ultrasound, the cleaning chamber is emptied of cleaning liquid 57 and the cleaning chamber and damaged electronic device is showered in water. Once more the vacuum pumps 6 apply a reduced pressure to the cleaning chamber 58.

[0178] Next a rinsing cycle is applied. Water is added to the cleaning chamber and sonic waves, preferably ultrasound, is applied to the cleaning chamber by means of the sonic probes 3 including water and damaged electronic device, after ultrasound the cleaning chamber is emptied of water 59.

[0179] Once more the vacuum pump 6 applies a reduced pressure to the cleaning chamber 60, after which a cleaning liquid comprising a second soap is added to the chamber and ultrasound is applied to the cleaning chamber including cleaning liquid and the damaged electronic device. After subjecting to ultrasound the cleaning chamber again is emptied of second cleaning liquid 61 and the cleaning chamber 1 and damaged electronic device is showered in rinsing water.

[0180] Next, it is time to dry the restored/damaged electronic device. The pressure in the cleaning chamber is lowered to 0.5-0.7 bar 62 and the cleaning chamber is then heated to approximately at least 40-60 C., or preferably 65-75 C. while keeping the pressure at 0.5-0.7 bar 63. When the cleaning chamber is hot the pressure is reduced to 0.1-0.3 bar while the heating stops 64. The chamber is then left to slowly cool down with the pressure at 0.1-0.3 bar and the liquid inside the restored/damaged electronic device thus evaporates.

[0181] This is repeated at least once or twice: The pressure is raised to 0.5-0.7 bar and the cleaning chamber is heated to at least 40-60 C., or preferably 65-75 C. 65 followed by a drop in pressure to 0.1-0.3 bar while cooling down 66. After cooling down the pressure is increased to 0.6 bar and the cleaning chamber is heated to at least 40-60 C., or preferably 65-75 C. 67 followed by a drop in pressure to 0.1-0.3 bar while cooling down 68.

[0182] As mentioned above, a preferred method comprises a drying cyclus in which the drying cyclus comprises the steps of

[0183] a: heating air 63 entering into the cleaning chamber to a temperature of at least 60 C. at a first reduced pressure of 0.5-0.8 bar,

[0184] b: maintaining a chamber temperature of 35-80 C., in particular around 45-55 C. by periodically heating the circulating air during substep b 64, and a second reduced pressure of of 0.5-0.8 bar,

[0185] c: reducing the pressure to a third reduced pressure level of 0.01-0.5 bar in substep b.

[0186] In step a, a heating boost is applied to the air in the chamber.

[0187] In step b, the pressure is maintained or allowed to increase slightly because of evaporation of water, and in step c, the pressure is reduced even further to drive evaporation of any remaining residual water inside the electronic device and thus ensure efficient drying of the electronic device.

[0188] The steps b-c in the drying cyclus may be repeated at least one, two, three, four, five, six, seven, eight, nine, ten or more times depending on the amount of water that needs to be removed from the electronic devices during the drying step.

[0189] If necessary, in the final repetition of steps b-c, the final substep c may be prolonged in duration in relation to the preceding cycles, to ensure that the internal part of the electronic device is dry and substantially all residual water is drawn out of the electronic device before finalizing the regeneration procedure. In addition the pressure may be reduced even further, e.g. to slightly above absolute vacuum, such as 0.01-0.1 bar in the substep c of the final cyclus.

[0190] The duration of steps a-c may be based on a preset time duration to ensure evaporation of the water present in the electronic device after the washing and/or rinsing steps. In steps a and b the chamber temperature is maintained at the desired level to obtain a chamber temperature of 45-55 C. This may be obtained by step a having a duration of 100-720 seconds, or 180-540 seconds or 240-480 seconds. Step b may have a duration of 60-540 seconds, or 90-360 seconds or 120-240 seconds. Step c may have a duration of 100-720 seconds, or 120-540 seconds or 180-480 seconds.

[0191] The cleaning and drying of the damaged electronic device is finished and the pressure in the cleaning chamber is relieved 69 and the lid may be opened 70.

[0192] The above mentioned temperature and pressures are examples and the drying of the restored/damaged electronic device may be at different temperature and/or pressure.

[0193] FIG. 5a-5g is an alternative embodiment of the damaged electronic restoration apparatus. There are less pumps and the cleaning chamber 1 is emptied of aqueous cleaning liquid by gravity. The access to and from the cleaning chamber 1 and the liquid tanks 37,38 are controlled by three valves, one two-way valve 71 and two three-way valves 72, 73.

[0194] In FIG. 5a the cleaning chamber is filled with aqueous cleaning liquid from the first liquid tank 37. The two-way valve 71 is open to let liquid pass into the cleaning chamber 1, and the first three-way valve 72 is open from the liquid chamber to the first liquid tank. The vacuum pump 6 is reducing the pressure in the cleaning chamber 1, there by sucking the aqueous cleaning liquid from the first liquid tank through a first optional filter 74 into the cleaning chamber.

[0195] When the cleaning chamber is sufficiently filled with aqueous cleaning liquid the two-way valve 71 closes as in FIG. 5b and the cleaning chamber 1 is ready to be subjected to sonication.

[0196] After sonication the cleaning chamber 1 is emptied back into the first liquid tank 37 by activating the two-way valve 71 as seen in FIG. 5c, the three-way 72 valve still is open between the cleaning chamber 1 and the first liquid tank 37.

[0197] Filling and emptying the cleaning chamber to and from the second liquid tank 38 is shown in FIG. 5d-5f. The first three-way valve 72 now has a pass through of liquid from the second liquid tank 38 to the cleaning chamber 1 and is closed off towards the first liquid tank 37.

[0198] The second three-way valve 73 is open and passes liquid from the second liquid tank 38 to the cleaning chamber 1. The two-way valve 7 is also open. When the vacuum pump 6 reduces the pressure in the cleaning chamber 1, the aqueous cleaning liquid is simply sucked into the cleaning chamber 1 through the optional filter 75.

[0199] When the cleaning chamber is partly or completely filled with the second aqueous cleaning liquid, the two-way valve 71 closes and the cleaning chamber 1 is ready to sonication. After sonication, the cleaning chamber 1 is emptied back into the second liquid tank 38 by activating the two-way valve 71.

[0200] When both the three-way valves 72, 73 are open for passage of liquid, and are closed towards the first and second liquid tanks 37,38, the aqueous cleaning liquid is passed to the sewer or similar as seen in FIG. 5g. [0201] 1. Chamber [0202] 2. Lid [0203] 3. Sonic probe [0204] 4. Inner plate [0205] 5. An outlet for a vacuum pump [0206] 6. Vacuum pump [0207] 7. Inlet/outlet [0208] 8. Valves [0209] 9. Connection for aqueous cleaning liquid [0210] 10. Connection for aqueous cleaning liquid [0211] 11. Connection for dry air [0212] 12. Connection for emptying aqueous cleaning liquid [0213] 13. Inlet for air [0214] 14. Inlet for water [0215] 15. Condensation plate [0216] 16. Magnetic valve 16a and air cylinder 16b [0217] 17. Sprinkler [0218] 18. Liquid inlet valve [0219] 19. Air valve [0220] 20. Pressure relief valve [0221] 21. Air cylinder [0222] 22. Heating element [0223] 23. Air tank [0224] 24. Check valve [0225] 25. Inlet for water [0226] 26. Water inlet valve [0227] 27. Inlet for concentrated cleaning liquid [0228] 28. First container for concentrated cleaning liquid [0229] 29. First cleaning liquid pump [0230] 30. First cleaning liquid valve [0231] 31. Inlet/outlet [0232] 32. A first liquid outlet valve [0233] 33. A second liquid inlet valve [0234] 34. A second liquid outlet valve [0235] 35. Third liquid inlet valve [0236] 36. Sewer valve [0237] 37. First liquid tank [0238] 38. Second liquid tank [0239] 39. First liquid outlet pump [0240] 40. Second concentrated cleaning liquid container [0241] 41. Second concentrated cleaning liquid pump [0242] 42. Second cleaning liquid pump [0243] 43. Third concentrated cleaning liquid container [0244] 44. Third concentrated cleaning liquid pump [0245] 45. Sewer pump [0246] 46. Filter [0247] 47. Filter [0248] 48. Filter [0249] 49. - [0250] 50. - [0251] 51. - [0252] 52. - [0253] 53. - [0254] 54. - [0255] 55. Close the lid [0256] 56. Vacuum [0257] 57. Soap, ultrasound, empty [0258] 58. Vacuum [0259] 59. Water, ultrasound, empty [0260] 60. Vacuum [0261] 61. Soap, ultrasound, empty [0262] 62. Vacuum [0263] 63. Heating [0264] 64. Drying [0265] 65. Heating [0266] 66. Drying [0267] 67. Heating [0268] 68. Drying [0269] 69. Relive vacuum [0270] 70. Open lid [0271] 71. Two-way valve [0272] 72. First three-way valve [0273] 73. Second three-way valve [0274] 74. First filter [0275] 75. Second filter