Inductance element

Abstract

An inductance element includes a housing, a core, and a coil. The core is assembled in the housing. The coil includes a wire and two plate-shaped pins. The wire surrounds the core. The two plate-shaped pins are respectively assembled to two ends of the wire. The thickness of each of the plate-shaped pins is less than the diameter of the wire, and the two plate-shaped pins are exposed from the housing through two grooves of the housing, respectively.

Claims

1. An inductance element comprising: a housing defining two grooves and comprising an inner wall and an outer wall, and the two grooves are diagonally defined on the periphery of the housing; a core disposed in the housing; and a coil disposed in the housing and comprising a wire and two plate-shaped pins, wherein the wire surrounds the core, wherein the thickness of each of the plate-shaped pins is less than the diameter of the wire, the two plate-shaped pins are respectively exposed from the housing through the two grooves, wherein the two plate-shaped pins are extended in opposite directions along two parallel paths respectively passing through the two grooves diagonally defined on the periphery of the housing and the two plate-shaped pins are perpendicular to the inner wall and the outer wall, and wherein the two plate-shaped pins are extended straight from an end of the wire, and there is no bend from the end of the wires to the plate-shaped pins.

2. The inductance element according to claim 1, wherein the depth of each of the two grooves is equal to or less than the thickness of each of the two plate-shaped pins.

3. The inductance element according to claim 1, wherein: the core extends along a longitudinal axis from a first end to a second end; and the two grooves are displaced from each other along a direction of the longitudinal axis.

4. The inductance element according to claim 3, wherein: the housing has a top, a bottom, and sidewalls extending between the top and the bottom; and the sidewalls define the two grooves are disposed through the sidewalls.

5. The inductance element according to claim 3, wherein a first of the plate-shaped pins is exposed from the housing by extending straight from a first end of the wire and through a first of the two grooves and a second of the plate-shaped pins is exposed from the housing by extending straight from a second end of the wire and through a second of the two grooves.

6. The inductance element according to claim 1, wherein the two entire plate-shaped pins are oppositely extended from the wire along a direction not parallel to the length direction of the core, respectively.

7. The inductance element according to claim 6, wherein the two plate-shaped pins are oppositely extended from the wire along a direction substantially perpendicular to the length direction of the core, respectively.

8. The inductance element according to claim 6, further comprising an adhesive member disposed on the wire near two ends of the core so that the wire is adhered to the housing.

9. The inductance element according to claim 6, further comprising at least one adhesive member, wherein a thickness is defined between the outer wall of the housing and the inner wall of the housing, so that an adhering surface is formed on each of the two grooves, the adhesive member is disposed on the adhering surface, disposed on the wire near two ends of the core, or disposed on both the adhering surface and a portion of the wire near the two ends of the core, and wherein the depth of each of the two grooves is equal to or less than the thickness of each of the two plate-shaped pins.

10. The inductance element according to claim 6, wherein each of the two plate-shaped pins is adhered to a surface of each of the grooves by an adhesive member.

11. The inductance element according to claim 10, wherein a thickness is defined between the outer wall of the housing and the inner wall of the housing, so that an adhering surface is formed on each of the two grooves and the adhesive members are respectively disposed on the adhering surfaces.

12. The inductance element according to claim 1, wherein the two plate-shaped pins are oppositely extended from the wire along a direction substantially parallel to the length direction of the core, respectively.

13. The inductance element according to claim 12, further comprising an adhesive member disposed between the wire and the housing so that the wire is adhered to the housing.

14. The inductance element according to claim 12, wherein each of the two plate-shaped pins is adhered to a surface of each of the grooves by an adhesive member.

15. The inductance element according to claim 14, wherein a thickness is defined between the outer wall of the housing and the inner wall of the housing, so that an adhering surface is formed on each of the two grooves and the adhesive members are respectively disposed on the adhering surfaces.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The disclosure will become more fully understood from the detailed description given herein accompanying by the following figures, which are illustration only, and thus not limitative of the disclosure, wherein:

(2) FIG. 1 illustrates an exploded view of an existing inductance element;

(3) FIG. 2 illustrates an exploded view of another existing inductance element;

(4) FIG. 3A illustrates an exploded view of an inductance element according to a first embodiment of the instant disclosure;

(5) FIG. 3B illustrates a partial exploded view of the inductance element of the first embodiment;

(6) FIG. 3C illustrates a perspective view of the inductance element of the first embodiment;

(7) FIG. 4 illustrates a top plan view of the inductance element of the first embodiment;

(8) FIG. 5 illustrates a rear elevational view of the inductance element of the first embodiment;

(9) FIG. 6 illustrates a left side elevational view of the inductance element of the first embodiment;

(10) FIG. 7 illustrates a bottom plan view of the inductance element of the first embodiment;

(11) FIG. 8 illustrates a schematic view (1) of an embodiment of an adhesive member of the first embodiment of the inductance element;

(12) FIG. 9 illustrates a schematic view (2) of the embodiment of the adhesive member of the first embodiment of the inductance element; and

(13) FIG. 10 is a top plan view of an inductance element according to a second embodiment of the instant disclosure.

DETAILED DESCRIPTION

(14) FIG. 3A illustrates an exploded view of an inductance element 1 according to a first embodiment of the instant disclosure. Please refer to FIG. 3A, in which the inductance element 1 comprises a coil 10, a core 11, and a housing 12. The core 11 is assembled in the housing 12. The coil 10 comprises a wire 101 and two plate-shaped pins 103a, 103b. The wire 101 surrounds the core 11. The two plate-shaped pins 103a, 103b are respectively at two ends of the wire 101. In this embodiment, the two plate-shaped pins may be assembled to the two ends of the wire 101, respectively. The thickness of each of the plate-shaped pins 103a, 103b is less than the diameter of the wire 101.

(15) FIG. 3B illustrates a partial exploded view of the inductance element 1 of the first embodiment. As shown in FIG. 3B, during the manufacturing of the coil 10, the wire 101 may be winded in an automatic manner, and the two ends of the wire 101 are preserved from being winded. The two plate-shaped pins 103a, 103b are substantially the extensions of the two ends of the wire 101, and the two plate-shaped pins 103a, 103b are oppositely extended from the wire 101 along a direction substantially perpendicular to the length direction D of the core 11. Therefore, after the wire 101 is winded, the plate-shaped pins 103a, 103b are aligned to their proper directions, i.e., the plate-shaped pins 103a, 103b are extended toward two ends of a direction substantially perpendicular to the length direction D of the core 11. Being different from the existing inductance element, the inductance element 1 according to embodiments of the instant disclosure can meet the SMT packaging criteria without the bending procedure for the ends of the wire 101.

(16) Next, the two ends of the wire 101 are pressed so as to form the two plate-shaped pins 103a, 103b each of which may have an even surface, and the thickness of each of the plate-shaped pins 103a, 103b is less than the diameter of the wire 101. Accordingly, the manufacturing of the coil 10 is finished. The two plate-shaped pins 103a, 103b, each having a flat outline, are provided to be soldered on a circuit board (not shown) to meet the SMT packaging criteria. In addition, the two plate-shaped pins 103a, 103b may be provided to be electrically connected to an external circuit (not shown).

(17) The core 11 is formed integrally as a whole. In this embodiment, the core 11 is a cylinder. In addition, in order to allow the inductance element 1 to be utilized for different products and different frequencies, the core 11 made be made of, but not limited to, copper, iron, nickel, etc.

(18) FIG. 3C illustrates a perspective view of the inductance element 1 of the first embodiment. Please refer to FIG. 3A and FIG. 3C. In assembling the inductance element 1, firstly, as shown in FIG. 3A, the core 11 is disposed in the space within the coil 10 which is formed by winding the wire, and then, as shown in FIG. 3C, the coil 10 together with the core 11 are assembled in a receiving space defined in the housing 12 to form the inductance element 1.

(19) As shown in FIG. 3, the housing 12 may be cuboid shaped, and the housing 12 may be made of magnetic materials. The housing 12 defines two grooves 121a, 121b whose positions correspond to the positions of the two plate-shaped pins 103a, 103b. In this embodiment, the two plate-shaped pins 103a, 103b are formed without bending the wire 101, the two grooves 121a, 121b are diagonally defined on the periphery of the housing 12, and the positions of the grooves 121a, 121b correspond to the positions of the plate-shaped pins 103a, 103b.

(20) After the coil 10 and the core 11 are completely received in the housing 12, the two plate-shaped pins 103a, 103b are respectively in contact with the bottom surfaces of the two grooves 121a, 12b and protruded from the housing 12 (i.e. the thickness of the plate-shaped pins 103a, 103b is higher than the depth of the corresponding grooves 121a, 121b).

(21) FIG. 4 illustrates a top plan view of the inductance element 1 of the first embodiment. As shown, the plate-shaped pins 103a, 103b are respectively exposed out of the housing 12 through the grooves 121a, 121b.

(22) FIGS. 5-7 respectively illustrate a rear elevational view, a left side elevational view, and a bottom plane view of the inductance element 1 of the first embodiment.

(23) As shown in FIG. 5, the length direction of the plate-shaped pins 103a, 103b are perpendicular to the outer walls of the housing 12 where the grooves 121a, 121b are defined on. As shown in FIG. 6, the depth of each of the grooves 121a, 121b is less than the thickness of each of the plate-shaped pins 103a, 103b. Therefore, the plate-shaped pins 103a, 103b are protruded from the housing 12 along a direction parallel to the outer wall 122 of the housing 12 (i.e., parallel to the height direction of the housing 12 shown in FIG. 3C). In one embodiment, the depth of each of the grooves 121a, 12b may be equal to the thickness of each of the plate-shaped pins 103a, 103b, such that the surface of each of the plate-shaped pins 103a, 103b is aligned with the periphery of the housing 12. As shown in FIG. 7, the plate-shaped pins 103a, 103b are protruded from the housing 12 along the length direction of the plate-shaped pins 103a, 103b. After the coil 10 and the core 11 are completely received in the housing 12, a circuit board is disposed below the housing 12 and the circuit board faces the opening of the housing 12 (i.e., the opening of the receiving space). And then, the tin solders are applied to a proximate surface of each of the plate-shaped pins 103a, 103b where the proximate surfaces face the circuit board, so that the inductance element 1 is soldered on the circuit board. Accordingly, the inductance element 1 can be securely soldered on the circuit board, and the operator can examine the soldering between the inductance element 1 and the circuit board by naked-eye, or an automated production equipment can be implemented for examine the soldering.

(24) In addition, in order to prevent the coil 10 detaching from the housing 12 due to shaking or impacting, the inductance element 1 further comprises an adhesive member 13. FIGS. 8 and 9 illustrate schematic views of an embodiment of an adhesive member 13 of the first embodiment of the inductance element 1. The adhesive member 13 is disposed on the wire 101 near two ends of the core 11, i.e., the adhesive member 13 may be disposed on the wire 101 near two ends of core 11 to fill the space between the wire 101 and an inner wall 123 of the housing 12 (this embodiment is not shown), or the two ends of the core 11 are directly adhered to the inner wall 123 of the housing 12 via adhesive members 13 (as shown in FIG. 8). Accordingly, the wire 101 of the coil 10 can be adhered to the housing 12 and does not detach from the housing 12 easily.

(25) Please refer to FIGS. 8 and 9, in order to allow the plate-shaped pins 103a, 103b to be firmly disposed in the grooves 121a, 121b, a thickness T is defined between the inner wall 123 and the outer wall 122, so that an adhering surface is formed on each of the grooves 121a, 121b (i.e., the adhering surface of each of the grooves 121a, 121b is the bottom surface of each of the grooves 121a, 121b). Before the coil 10 is received in the housing 12, the adhesive member 13 is disposed on the surface of each of the plate-shaped pins 103a, 103b facing the housing 12, i.e., the adhesive members 13 are disposed between the plate-shaped pins 103a, 103b and the grooves 121a, 121b. The housing 12 defines the thickness T to form the adhering surfaces for disposing the adhesive members 13, the adhesive surfaces of the grooves 121a, 121b and the plate-shaped pins 103a, 103b can be adhered with each other by the adhesive members 13. In other words, each of the plate-shaped pins 103a, 103b is adhered to the adhering surface of the corresponding groove 121a, 121b by the adhesive member 13.

(26) The adhesive member 13 may be, but not limited to, solders, tapes, or resin glues. As long as the wire 101 can be secured in the housing 12 and the plate-shaped pins 103a, 103b can be secured to the grooves 121a, 121b by a material, such material meets the criteria of the adhesive member 13.

(27) Accordingly, based on the first embodiment of the inductance element 1, the thickness of each of the plate-shaped pins 103a, 103b is less than the diameter of the wire 101 to meet the SMT packaging criteria, and the flat surface of the plate-shaped pins 103a, 103b can be provided for soldering, such that the inductance element 1 can be connected to a circuit board. Additionally, because of the adhesive member 13 disposed in the inductance element 1, the coil 10 can be firmly positioned in the housing 12, so that the inductance element 1 can be securely connected to the circuit board. As compared with the existing inductance element which has the terminal pieces and the soldering spots, the inductance element 1 according to embodiments of the instant disclosure has a simple structure and can be manufactured in an easier manner, thereby promoting the stability and the yield of the products. Moreover, as compared with the existing inductance element which applies the electrical connecting portions as the connection part for soldering with a circuit board, the inductance element 1 has a flat surface so as to be soldered with a circuit board firmly. Therefore, in the embodiments of the instant disclosure, the length of the plate-shaped pins 103a, 103b does not need to be increased for ensuring the soldering between the inductance element 1 and the circuit board, thus reducing the material costs. Furthermore, in the first embodiment of the inductance element 1, the plate-shaped pins 103a, 103b are substantially the extensions of the two ends of the wire 101, and the plate-shaped pins 103a, 103b are oppositely extended form the wire 101 along a direction substantially perpendicular to the length direction D of the core 11, therefore, the inductance element 1 can meet the SMT packaging criteria without applying the bending procedure for the plate-shaped pins 103a, 103b. In addition, since the plate-shaped pins 103a, 103b are protruded and exposed from the housing 12, the manufacturing personnel can observe the soldering between the inductance element 1 and the circuit board by naked eye, or the examination of the soldering between the inductance element 1 and the circuit board can be introduced into automated production.

(28) FIG. 10 is a top plan view of an inductance element 1 according to a second embodiment of the instant disclosure. Please refer to FIGS. 3A to 3C and FIG. 10. Alike the first embodiment, the inductance element 1 comprises a coil 10, a core 11, and a housing 12. In the second embodiment, two plate-shaped pins 103a, 103b of the coil 10 are oppositely extended from the wire 101 along a direction substantially parallel to the length direction D of the core 11, respectively. In order to position the coil 10 in the housing 12, adhesive members 13 are not only disposed between the plate-shaped pins 103a, 103b and the bottom surface of the grooves 121a, 121b, but also disposed at two sides of the coil 10 in which the two sides of the coil 10 are perpendicular to the length direction D of the core 11. Accordingly, the coil 10 can be positioned on the inner wall 123 of the housing 12.

(29) Accordingly, based on the second embodiment of the inductance element 1, the thickness of each of the plate-shaped pins 103a, 103b is less than the diameter of the wire 101 to meet the SMT packaging criteria, and the flat surface of the plate-shaped pins 103a, 103b can be provided for soldering, such that the inductance element 1 can be connected to a circuit board. In addition, because the adhesive member 13 disposed in the inductance element 1, the coil 10 can be firmly positioned in the housing 12, so that the inductance element 1 can be securely connected to the circuit board. As compared with the existing inductance element which has the terminal pieces and the soldering spots, the inductance element 1 according to embodiments of the instant disclosure has a simple structure and can be manufactured in an easier manner, thereby promoting the stability and the yield of the products. Moreover, as compared with the existing inductance element which applies the electrical connecting portions as the connection part for soldering with a circuit board, the inductance element 1 according to embodiments of the instant disclosure has a flat surface so as to be soldered with a circuit board firmly. Therefore, in the embodiments of the instant disclosure, the length of the plate-shaped pins 103a, 103b does not need to be increased for ensuring the soldering between the inductance element 1 and the circuit board, thus reducing the material costs. In addition, since the plate-shaped pins 103a, 103b are protruded and exposed from the housing 12, the manufacturing personnel can observe the soldering between the inductance element 1 and the circuit board by naked eye, or the examination of the soldering between the inductance element 1 and the circuit board can be introduced into automated production.

(30) While the disclosure has been described by the way of example and in terms of the preferred embodiments, it is to be understood that the invention need not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structures.