Anti-shock pad and related manufacturing method

Abstract

The present invention provides an anti-shock pad, which includes: a board-shaped compound material structure, manufactured by mixing a composition and foam molding the composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40. The present invention is also related to a method of manufacturing the anti-shock pad.

Claims

1. An anti-shock pad, comprising: a board-shaped compound material structure, manufactured by mixing a composition and foam molding the composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40.

2. The anti-shock pad of claim 1, wherein the secondary substrate further comprises: a silicon binary oxide material, comprising: silicon dioxide particles; and a polydimethylsiloxane.

3. The anti-shock pad of claim 2, wherein the composition comprises the silicon binary oxide material from 6 wt % to 18 wt %.

4. The anti-shock pad of claim 1, wherein in the ethylene-vinyl acetate, a content of the vinyl acetate is 60 wt % to 90 wt % of total weight of the ethylene-vinyl acetate.

5. The anti-shock pad of claim 1, wherein the additive is selected from a group consisting of a foaming agent, a foaming auxiliary, a crosslinking agent, a crosslinking auxiliary, color particles and a filler.

6. The anti-shock pad of claim 1, wherein the composition comprises the vinyl acetate from 5 wt % to 10 wt %, and the ethylene-vinyl acetate from 40 wt % to 63 wt %.

7. The anti-shock pad of claim 1, wherein the composition comprises the polyethylene from 6 wt % to 18 wt %, the styrene butadiene rubber from 3 wt % to 6 wt %, and the thermoplastic elastomer from 2 wt % to 4 wt %.

8. The anti-shock pad of claim 1, wherein the thermoplastic elastomer is a styrene ethylene butylene styrene block copolymer.

9. A method of manufacturing an anti-shock pad, comprising: (1) mixing a composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, the main substrate comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, the secondary substrate comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; (2) foam molding the mixed composition in a mold, to obtain a board-shaped compound material structure; and (3) cutting the obtained board-shaped compound material structure to obtain the anti-shock pad; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40.

10. The method of claim 9, wherein the secondary substrate further comprises: a silicon binary oxide material, comprising: silicon dioxide particles; and a polydimethylsiloxane.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG. 1 is a schematic diagram of an anti-shock pad according to an embodiment of the present invention.

[0024] FIG. 2 is a flowchart of manufacturing method of the anti-shock pad according to an embodiment of the present invention.

DETAILED DESCRIPTION

[0025] In order to fully understand the purpose, feature and efficacy of the present invention, the present invention is illustrated in detail using the follow-up specific embodiments together with the figures, as described below:

[0026] FIG. 1 is a schematic diagram of an anti-shock pad 10 according to an embodiment of the present invention. As shown in FIG. 1, the anti-shock pad 10 of the present invention includes a board-shaped compound material structure 11, which is manufactured by mixing a composition and foam molding the composition. Wherein, the composition may be manufactured using the method illustrated in the following Embodiment 1.

Embodiment 1

The Composition for Manufacturing the Board-Shaped Compound Material Structure

[0027] The composition for manufacturing the board-shaped compound material structure in Embodiment 1-11-3 is prepared according to the prescription ratio as shown in Table 1, but the present invention is not limited thereto.

TABLE-US-00001 TABLE 1 Embodiment Embodiment Embodiment 1-1 1-2 1-3 Main VA (%) 10 6 6 substrate EVA (%) 40 54 58 Secondary PE (%) 18 15 15 substrate SBR (%) 6 3 3 SEBS (%) 4 2 2 Silicon 12 10 6 binary oxide material (%) Additives Foaming agent 2.5 2.5 2.5 (%) Foaming 1.5 1.5 1.5 auxiliary (%) Crosslinking 0.8 0.8 0.8 agent (%) Crosslinking 0.7 0.7 0.7 auxiliary (%) Color 0.5 0.5 0.5 particles (%) Filler (%) 4 4 4

[0028] The ratios of each component in Table 1 are denoted by weight percentage. Wherein, VA stands for vinyl acetate; EVA stands for ethylene-vinyl acetate; PE stands for polyethylene; SBR stands for styrene butadiene rubber; SEBS stands for styrene ethylene butylene styrene block copolymer, which is a thermoplastic elastomer. The abovementioned materials may be purchased from the market.

[0029] The manufacturing method of the silicon binary oxide material included in the secondary substrate in Embodiment 1-11-3 is described in Taiwan Publication No. 201602244, which is incorporated herein in its entirety by reference.

[0030] The above silicon binary oxide material is manufactured by the following method:

[0031] Step One: Obtaining silicon dioxide particles between 50 nm500 m and polydimethylsiloxane with molecular weight between 2005000, mixed and stirred with appropriate amount of additives, to form a mix solution having silicon dioxide and polydimethylsiloxane; letting the mix solution stand, allowing the tiny bubbles in the mix solution to distribute uniformly to form the raw material of colloid solution; wherein the mixing ratio of the silicon dioxide particles and polydimethylsiloxane is between 1260% wt.

[0032] Step Two: Joining appropriate amount of crosslinking agent with the raw material of colloid solution and well mixing to become plastic material of colloid solution, wherein the crosslinking agent may be siloxane monomer or its high molecular polymer (such as PU or EVA).

[0033] Step Three: Filling the plastic material of colloid solution in the mold, where the mold is manufactured using professional techniques such as simulation and analysis of integrating shock stress and structural design according to requirements of shock energy absorption, and its material may be a metal resistant to more than 200 C. and its surface may be passivated to facilitate mold release; and heating and solidifying the plastic material of colloid solution to form the silicon binary oxide material, wherein the heating temperature is between 80120 C. and the heating time is between 24 hours.

Embodiment 2

Manufacturing Method of the Anti-Shock Pad

Embodiment 2-1

[0034] FIG. 2 is a flowchart of manufacturing method of the anti-shock pad according to an embodiment of the present invention. As shown in FIG. 2, the manufacturing method of the board-shaped compound material structure in Embodiment 2-1 includes steps of: Step One S101, mixing the composition as mentioned in Embodiment 1-1; Step Two S102, foam molding the above mixed composition in a mold, to obtain a board-shaped compound material structure; and Step Three S103, cutting the board-shaped compound material structure obtained in Step Two S102, to obtain the anti-shock pad. In the present embodiment, the board-shaped compound material structure is cut to generate the anti-shock pad having thickness 20 mm to comply with the configuration of female bullet-proof vest, for subsequent processing and testing.

[0035] In Step One S101 as mentioned above, the mixing method and process conditions do not have any special limitation, as long as every component in the composition of Embodiment 1-1 can be fully mixed. Preferably, the composition of Embodiment 1-1 may be put in a kneader to perform a first-phase mixing to generate a plastic mixture, where the process temperature is preferably controlled to be between 80 C.150 C., and the mixing time is preferably between 1530 minutes. Afterwards, the plastic mixture is further rolled and mixed with twin rollers, where the process temperature is preferably controlled to be between 80 C.130 C., and the mixing time is preferably between 36 minutes.

[0036] In Step Two S102 as mentioned above, the foam molding method and process conditions do not have any special limitation, and conventional foam molding method in the related art may be applied. Preferably, in a one-time foam molding, a batch-type oil hydraulic press machine is applied to perform crosslink foaming, where the process temperature is preferably controlled to be between 130 C.160 C., the foammolding time is preferably between 3050 minutes, and the foam limit pressure of the oil hydraulic press machine is preferably between 150 kg/cm.sup.2250 kg/cm.sup.2. By controlling the above process parameters, the density of the board-shaped compound material structure may be controlled to be between 0.200.50, and the foaming ratio may be controlled to be between 2040, so as to obtain anti-shock pads having identical features in the follow-up Step Three S103.

[0037] In Step Three S103 as mentioned above, the anti-shock pads after cutting do not have any special limitation on thickness and shape. The persons with ordinary skill in the related art may cut the board-shaped compound material structure obtained in Step Two S102 to generate anti-shock pads having any thickness and shape, to comply with the shapes of various wearable protective equipment (such as the male bullet-proof vest, female bullet-proof vest, helmet, bullet-proof mask, kneecap, and elbow pad). Preferably, the thickness of anti-shock pads after cutting is between 1030 mm.

Embodiment 2-2

[0038] The manufacturing method of the anti-shock pad in Embodiment 2-2 is substantially identical to the manufacturing method in Embodiment 2-1, except that the mixing operation in Step One is performed on the composition of Embodiment 1-2.

Embodiment 2-3

[0039] The manufacturing method of the anti-shock pad in Embodiment 2-3 is substantially identical to the manufacturing method in Embodiment 2-1, except that the mixing operation in Step One is performed on the composition of Embodiment 1-3.

[0040] The test example:

[0041] According to the SATRA TM142 test method, an energy absorption test is performed on the anti-shock pads of Embodiments 2-12-3 in different temperatures, respectively. The test results are as Table 2 shown below.

TABLE-US-00002 TABLE 2 Test result (G) Normal High Foaming temp. Low temp. temp. Embodiment Density ratio 25 C. 10 C. 40 C. 2-1 0.27 30 14 36.5 13 2-2 0.27 30 15 29 11 2-3 0.4~0.42 30 15 37 14

[0042] As shown in Table 2, under the energy absorption test performed in different temperatures, the anti-shock pads of Embodiments 2-12-3 are feasible in environmental temperatures from 10 C. to 40 C. The anti-shock feature appears throughout these temperatures, and is optimal in high temperature.

[0043] According to 20 kN (test process of EN 1621-1:2012 motorcyclists' protective clothing against mechanical impact), under 50 J impact energies, a test is performed on the anti-shock pads of Embodiments 2-12-3, respectively. The test results are as Table 3 shown below.

TABLE-US-00003 TABLE 3 Foaming Test result Passing Embodiment Density ratio (KN) level 2-1 0.27 30 P1: 28.5 Level 1 P2: 30.7 P3: 30.3 2-2 0.27 30 P1: 9.01 Level 2 P2: 9.12 P3: 9.03 2-3 0.4~0.42 30 P1: 10.4 Level 2 P2: 10.0 P3: 10.3

[0044] As can be seen from the above test results, the anti-shock pads of the present invention may comply with the standard of low g-value energy absorption by controlling the density to be between 0.200.50 and controlling the foaming ratio to be between 2040. Accordingly, the anti-shock pads of the present invention are applicable to design of sporting goods (such as shoe-pads, clubs or rackets), medical protection (such as protective clothing for older, sick or disabled persons), or other related applications of various anti-shock requirements (such as helmets or car bumpers). In addition, the anti-shock pads of the present invention may also be applied as the anti-shock pads in the wearable protective equipment such as the male bullet-proof vest, female bullet-proof vest, helmet, bullet-proof mask, knee cap, and elbow pad.

[0045] Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.