Method for fabricating RF resonators and filters

Abstract

A method of fabricating an RF filter comprising an array of resonators comprising the steps of: Obtaining a removable carrier with release layer; Growing a piezoelectric film on a removable carrier; Applying a first electrode to the piezoelectric film; Obtaining a backing membrane on a cover, with or without prefabricated cavities between the backing film and cover; Attaching the backing membrane to the first electrode; Detaching the removable carrier; Measuring and trimming the piezoelectric film as necessary; Selectively etching away the piezoelectric layer to fabricate discrete resonator islands; Etching down through coatings and backing membrane to a silicon dioxide layer between the backing membrane and the cover to form trenches; Applying a passivation layer into the trenches and around the piezoelectric islands; Depositing a second electrode layer over the piezoelectric film islands and surrounding passivation layer; Applying connections for subsequent electrical coupling to an interposer; Selectively removing second electrode material leaving coupled resonator arrays; Creating a gasket around perimeter of the resonator array; Thinning down cover to desired thickness; Optionally fabricating upper cavities between the backing membrane and cover by drilling holes through the cover and then selectively etching away the silicon dioxide; Dicing the wafer into flip chip single unit filter arrays; Obtaining an interposer; Optionally applying a dam to the interposer surface to halt overfill flow; Coupling the flip chip single unit filter array to pads of the interposer by reflow of the solder cap; Encapsulating with polymer underfill/overfill; and Singulating into separate filter modules.

Claims

1. A method of fabricating an RF filter comprising an array of resonators comprising the steps of: (a) Obtaining a removable carrier with release layer; (b) Growing a piezoelectric film on a removable carrier; (c) Applying a first electrode to the piezoelectric film; (d) Obtaining a backing membrane on a cover, with or without prefabricated cavities between the backing film and cover; (e) Attaching the backing membrane to the first electrode; (f) Detaching the removable carrier; (g) Measuring and trimming the piezoelectric film as necessary; (h) Selectively etching away the piezoelectric layer to fabricate discrete resonator islands; (i) Etching down through coatings and backing membrane to a silicon dioxide layer between the backing membrane and the cover to form trenches; (j) Applying a passivation layer into the trenches and around the piezoelectric islands; (k) Depositing a second electrode layer over the piezoelectric film islands and surrounding passivation layer; (l) Applying connections for subsequent electrical coupling to an interposer; (m) Selectively removing second electrode material leaving coupled resonator arrays; (n) Creating a gasket around perimeter of the resonator array; (o) Thinning down cover to desired thickness; (p) Optionally fabricating upper cavities between the backing membrane and cover by drilling holes through the cover and then selectively etching away the silicon dioxide; (q) Dicing the wafer into flip chip single unit filter arrays; (r) Obtaining an interposer; (s) Optionally applying a dam to the interposer surface to halt overfill flow; (t) Coupling the flip chip single unit filter array to pads of the interposer by reflow of the solder cap; (u) Encapsulating with polymer underfill/overfill; and (v) Singulating into separate filter modules.

2. The method of claim 1, wherein the removable carrier with release layer of step (a) comprises a single crystal sapphire substrate with a GaN release layer.

3. The method of claim 1, wherein the piezoelectric layer comprises a single crystal layer comprising Ba.sub.xSr.sub.(1-x)TiO.sub.3, AlN or Al.sub.xGa.sub.(1-x)N.

4. The method of claim 1, wherein the piezoelectric layer has at least one of the following limitations: (i) the piezoelectric layer comprises a single crystal layer comprising Ba.sub.xSr.sub.(1-x)TiO.sub.3 in a <111> orientation (ii) the piezoelectric layer comprises a single crystal layer comprising AlN or AlxGa1-xN in a C-Axis orientation (iii) the piezoelectric layer is up to 2 microns thick.

5. The method of claim 1, wherein the piezoelectric layer comprises the removable carrier is characterized by at least one of the following limitations: the removable carrier comprises sapphire; the removable carrier comprises a release coating of GaN; the removable carrier is a C-axis <0001> with a tolerance of 1%; the removable carrier is a commercially available sapphire C-axis <0001> single crystal wafer with a un-doped GaN having C-axis <0001> with a tolerance of 1 orientation.

6. The method of claim 1, wherein the piezoelectric layer comprises Ba.sub.xSr.sub.(1-x)TiO.sub.3, and step (b) comprises at least one preliminary step selected from step (bi) of depositing a heat dissipating onto reverse side of the carrier to aid heat dissipation during the deposition of the piezoelectric layer and depositing a <100> TiO.sub.2 (rutile) or <111> single crystal SrTiO.sub.3 buffer layer prior to depositing the Ba.sub.xSr.sub.(1-x)TiO.sub.3.

7. The method of claim 1, wherein the piezoelectric layer comprises Al.sub.xGa.sub.1-xN, and step (b) comprises at least one preliminary step selected from step (bi) of depositing a heat dissipating onto reverse side of the carrier to aid heat dissipation during the deposition of the piezoelectric layer and depositing a C-Axis oriented AlN layer and gradually increasing the gallium content.

8. The method of claim 1 wherein step (b) of fabricating the piezoelectric film comprises depositing by molecular beam epitaxy.

9. The method of claim 1, wherein step (c) comprises depositing a first electrode of aluminum onto the piezoelectric film.

10. The method of claim 8, comprising one of the following limitations: (i) the aluminum electrode is 50 nm5 nm to 150 nm5 nm thick; (ii) the aluminum electrode is deposited by PVD; (iii) step (c) further comprises a preliminary step (ci) of depositing an adhesion layer onto the piezoelectric film to aid adhesion of the aluminum characterized by at least one of: the adhesion layer comprises titanium; the adhesion layer is 5-50 nm5% thick, and the adhesion layer is deposited by PVD.

11. The method of claim 1, wherein the backing membrane on cover of step (d) comprises a silicon membrane attached to a silicon cover by a silicon oxide layer optionally further comprising preformed cavities between the silicon membrane and the silicon cover.

12. The method of claim 1 wherein the silicon membrane is single crystal silicon with orientation of <111> or <100> or <110>.

13. The method of claim 1, wherein the upper electrode is a composite electrode comprising a titanium adhesion layer adjacent to the piezoelectric film followed by at least one of the following combinations: (i) An aluminum layer followed by a tungsten layer, a gold bonding layer and the silicon membrane (ii) An aluminum layer followed by a tungsten layer, a gold-indium bonding layer and the silicon membrane (iii) An aluminum layer followed by a tungsten layer, an AlN bonding layer and the silicon membrane (iv) An aluminum layer followed by a tantalum layer, a gold bonding layer and the silicon membrane (v) An aluminum layer followed by a tantalum layer, a gold-indium bonding layer and the silicon membrane (vi) An aluminum layer followed by a tantalum layer, an AlN bonding layer and the silicon membrane (vii) An aluminum layer followed by a molybdenum layer, a gold bonding layer and the silicon membrane (viii) An aluminum layer followed by a molybdenum layer, a gold-indium bonding layer and the silicon membrane (ix) An aluminum layer followed by a molybdenum layer, an AlN bonding layer and the silicon membrane (x) A tungsten layer, a gold bonding layer and the silicon membrane (xi) A tungsten layer, a gold-indium bonding layer and the silicon membrane (xii) A tungsten layer, an AlN bonding layer and the silicon membrane (xiii) A tantalum layer, a gold bonding layer and the silicon membrane (xiv) A tantalum layer, a gold-indium bonding layer and the silicon membrane (xv) A tantalum layer, an AlN bonding layer and the silicon membrane (xvi) A molybdenum layer, a gold bonding layer and the silicon membrane (xvii) A molybdenum layer, a gold-indium bonding layer and the silicon membrane (xviii) A molybdenum layer, an AlN bonding layer and the silicon membrane.

14. The method of claim 13 wherein additional titanium adhesion layers are deposited between each pair of disparate material layers.

15. The method of claim 1 wherein step (e) of attaching the backing membrane on cover comprises depositing an adhesion layer and a bonding layer to the first electrode, and attaching an adhesion layer and bonding layer to the silicon membrane.

16. The method of claim 15 having at least one of the following limitations: (i) the adhesion layer comprises titanium; (ii) the adhesion layer comprises titanium deposited by sputtering and removable with dilute hydrofluoric acid and/or with CF.sub.4/O.sub.2 Plasma; (iii) the bonding layers are identical and may each comprise AuIn, Au or AlN.

17. The method of claim 1 wherein step (f) of detaching the wafer carrier comprises laser lift-off.

18. The method of claim 17 wherein the wafer carrier comprises a sapphire single crystal wafer coated with GaN and the laser lift off comprises irradiating the GaN through the sapphire using a 248 nm excimer square waveform laser.

19. The method of claim 17 wherein step (f) further comprises at least one of: (i) removing GaN by induction coupled plasma, and (ii) wherein if a heat dissipating layer was applied to the reverse of the sapphire carrier to aid deposition of an epitaxial single crystal piezoelectric, first removing said heat dissipating layer by at least one of chemical etching, mechanical polishing and chemical mechanical polishing (CMP).

20. The method of claim 1 wherein step (g) of trimming the piezoelectric membrane to a desired thickness comprises applying a scanning surface ion milling process over the surface of the piezoelectric membrane.

21. The method of claim 1 wherein step (h) of selectively etching away the piezoelectric layer to fabricate discrete resonator islands comprises etching with an induction coupled plasma.

22. The method of claim 1 wherein step (i) of selectively removing coatings, adhesion layer, electrode, silicon down into the silicon oxide comprises at least one of inductive plasma etching and reactive ion etching.

23. The method of claim 1 wherein step (i) is a two stage process where coatings, adhesion layer and electrode are selectively removed down into the silicon to form a wide trench and then, after a further layer of photoresist is applied, a narrow trench is continued through the silicon and down into the silicon oxide providing a stepped interface for subsequent attachment and anchoring of a passivation material.

24. The method of claim 1 wherein step (i) of applying the passivation layer comprises: filling trenches and surrounding piezoelectric islands with photo-sensitive Polyimide or Benzocyclobutene (BCB) by spin-coating followed by selectively exposing and developing the Polyimide or Benzocyclobutene (BCB) on the piezoelectric islands top surfaces or depositing SiO.sub.2, Ta.sub.2O.sub.5 or Si.sub.3N.sub.4 by PECVD.

25. The method of claim 24 wherein the passivation layer between adjacent structures is 3 to 10 microns wide.

26. The method of claim 1 wherein the cavities are 3-10 microns deep.

27. The method of claim 1 wherein step (k) of applying a second electrode comprises depositing an adhesion layer of titanium followed by depositing an aluminum or a tungsten electrode by PVD.

28. The method of claim 1 wherein step (l) comprises at least some of the following steps: Applying Under Bump Metallization (UBM) coating; Applying a layer of copper over the (UBM) coating; Fabricating copper pillars over the layer of copper; Applying solder caps to the copper pillars; Etching away excess copper and UBM away from copper pillars.

29. The method of claim 28 wherein at least one of the following limitations is true: applying an Under Bump Metallization (UBM) coating comprises applying one of a titanium coating, a tungsten coating, a Ti/W, Ti/Mo coating and a Ti/Ta coating, wherein said UBM coating has a thickness of between 500 nm and 1500 nm thick; applying a layer of copper over UBM coating by sputtering; fabricating copper pillars over the layer of copper and covering with solder by laying down a layer of photoresist, developing to form a negative pattern of pillars, electroplating copper into the pattern to required height, electroplating solder caps onto the copper pillars, and removing the photoresist leaving upstanding copper pillars with solder caps; Removing the excess copper and the UBM away from copper pillars comprises one of: exposing to an induction coupled plasma; exposing to Ferric chloride based solution; exposing to Ammonium Persulfate based etchant.

30. The method of claim 1 wherein step (m) of selectively removing the upper electrode material comprises applying an inductively coupled plasma comprising Cl.sub.2+BCl.sub.3+Ar to remove the aluminum and selectively reactive induction etching away the titanium with CF.sub.4 or SF.sub.6 and O.sub.2.

31. The method of claim 1 wherein in step (l) the UBM layer is also selectively retained around perimeter of what becomes the upper electrode after step (m).

32. The method of claim 1 wherein step (n) of creating a gasket comprises at least one of fabricating a SU8 polymer wall around perimeter of the resonator array, and fabricating an epoxy dam on the interposer to define a lower surface of bottom cavity.

33. The method of claim 1 wherein step (o) of thinning down the cover comprises at least technique selected from the group comprising mechanical grinding, chemical mechanical polishing, wet etching with atmospheric downstream plasma (ADP) and dry chemical etching (DCE).

34. The method of claim 1 wherein the backing membrane and cover comprise a silicon wafer membrane coupled to a silicon handle by silicon oxide and step (p) comprises applying a through silicon via etch to create through silicon vias in the silicon cover through to the silicon dioxide layer, and undercut etching away the SiO.sub.2 with HF vapor to create cavities behind the silicon membrane that are bordered by remnants of the silicon dioxide, and are aligned with the piezoelectric resonator films.

35. The method of claim 1 where the backing membrane and cover comprises a silicon film coupled to a silicon handle by silicon dioxide, with pre-formed cavities between the silicon film and the silicon cover, and the pre-formed cavities are carefully aligned with the piezoelectric islands.

36. The method of claim 1 where the step (r) of fabricating an interposer with routing layers comprises the steps of: (i) depositing an etch-resistant barrier layer of onto a sacrificial copper substrate; (ii) sputtering a copper seed layer; (iii) applying a first layer of photo resist to a carrier; (iv) patterning an array of pads; (v) electroplating copper into the patterned array; (vi) stripping photo resist; (vii) applying a second thicker layer of photo resist; (viii) patterning an array of via posts; (ix) electroplating copper into the array of via posts; (x) stripping away the second thicker layer of photo resist; (xi) laminating with polymer film or glass fiber in polymer prepreg; (xii) curing the polymer film or glass fiber in polymer prepreg; (xiii) polishing to expose ends of copper via posts; (xiv) optionally repeating steps (ii) to (vi) or steps (ii) to (xiii) to add additional feature or feature and via layers if required, and (xv) etching away sacrificial substrate.

37. The method of claim 1 where the interposer comprises a low temperature cofired ceramic.

38. The method of claim 1 where the dam is fabricated on the upper surface of the interposer by screen printing an epoxy; by depositing a photo-sensitive thick solder mask or by applying and curing an SU-8 layer.

Description

BRIEF DESCRIPTION OF FIGURES

(1) For a better understanding of the invention and to show how it may be carried into effect, reference will now be made, purely by way of example, to the accompanying drawings.

(2) With specific reference now to the drawings in detail, it is stressed that the particulars shown are by way of example and for purposes of illustrative discussion of the preferred embodiments of the present invention only, and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the invention. In this regard, no attempt is made to show structural details of the invention in more detail than is necessary for a fundamental understanding of the invention; the description taken with the drawings making apparent to those skilled in the art how the several forms of the invention may be embodied in practice. In particular, it will be appreciated that the schematic illustrations are not to scale, and the thickness of some very thin layers is exaggerated. In the accompanying drawings:

(3) FIG. 1 is a schematic not-to-scale cross section representation of a Composite FBAR filter module which combines a plurality of Composite FBAR resonators coupled in half ladder or lattice arrangements or combinations thereof.

(4) FIG. 2 is a simplified circuit of a ladder type RF filter configuration;

(5) FIG. 3 is a graph showing the transmission response of the ladder filter configuration of FIG. 2;

(6) FIG. 4 is a is a simplified circuit of a lattice type RF filter configuration;

(7) FIG. 5 is a graph showing the transmission response of the lattice type filter configuration of FIG. 4;

(8) FIG. 6 is a simplified circuit of a combined ladder and lattice type RF filter configuration;

(9) FIG. 7 is a graph showing the transmission response of the filter configuration of FIG. 6;

(10) FIGS. 8A and 8B are flowcharts illustrating a method of fabricating the Composite FBAR structure of FIG. 1;

(11) FIGS. 9 to 12 and 14 to 54 are schematic representations of the build up achieved by the steps of flowchart of FIGS. 8A, 8B, and 9, and

(12) FIG. 13 is a 180 XRD spectrum of single crystal Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST).

DESCRIPTION OF EMBODIMENTS

(13) By way of example, a design for a Composite FBAR filter module with single crystal Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN or Al.sub.xGa.sub.(1-x)N piezoelectric resonators is detailed hereunder with reference to FIG. 1, together with methods of manufacture with reference to FIGS. 8A and 8B.

(14) With reference to FIG. 1 a Composite FBAR filter module 5 is schematically shown. The filter module 5 comprises a plurality of composite FBAR resonators coupled in half ladder or lattice arrangements or combination thereof. The composite FBAR resonators consist of piezoelectric films 18, 18 that may be Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN or Al.sub.xGa.sub.(1-x)N separated by a passivation material 54 such as SiO.sub.2, Si.sub.3N.sub.4, Ta.sub.2O.sub.5, polyimide and Benzocyclobutene (BCB) and sandwiched between electrode 22, 60.

(15) In the method of construction described hereinbelow, it will be noted that both top and bottom electrodes 22, 60 are deposited onto the piezoelectric material 18 rather than by depositing a piezoelectric material on top of an electrode which is currently standard practice for FBAR filter construction. This enables a wider range of metals such as aluminum to be used as the bottom electrode; aluminum having increased conductivity and being less dense, enables decreasing the electrode weight and the subsequent mechanical damping it causes to the resonator. The upper electrode may be a composite electrode comprising a number of different metal layers including the silicon film 30. However, the electrode resonator material 18 is typically coupled to the silicon film 30 that is preferably single crystal silicon by other layers of upper electrode including a bonding layer (48, 50), adhesion layers 46, 46 and often by a relatively low DC resistance layer and a relatively high acoustic impedance layer.

(16) Thus, in addition to the silicon membrane 30, the upper electrode typically includes titanium adhesion layers, a relatively low DC resistance layer of aluminum, a relatively high acoustic impedance layer of tungsten or molybdenum and gold 50 or gold-indium 48 bonding layers. The silicon film 30 is typically a single crystal silicon and may have any of the following orientations, <100>: <111> and <110>. It typically has a thickness of 1 to 2 microns, but could be up to 10 microns thick. The single crystal silicon film 30 provides a mechanical support layer that has low acoustic losses and is itself attached by a layer of silicon oxide 34 using SOI technology to a cover 32 that is a thicker silicon wafer and is also known as a handle, providing a wafer on handle. Cavities 76 are provided within the silicon oxide layer 34 opposite the piezoelectric resonator films 18. The depth of the cavities is typically 4 to 10 microns. The bonding between the electrode 22 and the silicon film 30 may be achieved in a number of ways, such as by a gold-indium eutectic 48, a gold layer 50 or an AlN layer 52.

(17) A metallic adhesion layer becomes part of the upper electrode. Thin layers of one of these bonding materials may be attached to both the piezoelectric material 18 or first metallic layers thereupon, and to the silicon film 30 by adhesion layers 46, 46 such as titanium and then the thin layers of the bonding material are fused together.

(18) The coated piezoelectric resonator array is attached to an interposer 85 by interconnects comprising solder 68 capped copper pillars 66, and is encapsulated in a polymer underfill/over-mold 72. A gasket 70 is provided around the filter, between the interposer 85 and the lower electrode 60 around the resonator array that defines the filter. The gasket 70 may consist of SU-8 attached to the lower electrode 60 and an epoxy dam 86 may be built up from the interposer 85. The gasket 70 and epoxy dam 86 work together to prevent the underfill/over-mold 72 that seals the unit from penetrating under the resonator array and define a cavity 92 between the lower electrode 60 and the interposer 85. Additional cavities 76 are provided over the piezoelectric films 18, 18 in the space between the silicon membrane 30 and cover 32, by selective removal of the silicon dioxide 34 by etching. A passivation material 54 separates the upper electrode 22, adhesion layers 20, 46, 46, bonding layers 48/50/52 and silicon membrane 30 into separate regions supporting pairs of parallel resonators and separating resonators that are connected in series.

(19) An Under Bump Metallization (UBM) Layer 62 that comprises tungsten or tantalum or molybdenum (possibly with an adhesion layer of titanium), enables fabrication of the copper pillars 66 on the underside of the bottom electrode 60. Other remnants of the UBM 63 serve as stiffening raised frame around the perimeter of the lower electrode 60, which, being aluminum, has a very low weight. This raised frame structure is especially useful in Composite FBARs as it helps minimize lateral-wave spurious modes that otherwise lower the Q factor of the device, regardless of the mode number. With such a raised frame, only the main lateral mode is excited due to the new boundary conditions between the active and outside region of the resonator membrane 18 that are created by the raised frame 63. Additionally, with reference to FIGS. 2 to 7, it will be noted that filters comprise shunt resonators and series resonators. The extra weight of the UBM 63 layer on the electrode creates a mechanical damping effect that can assist in lowering the shunt resonator frequency response vs. the series resonator frequency response and thus improve the overall performance of the filter.

(20) The Commercial FBAR filter market is dominated by Broadcom which uses Aluminum Nitride (AlN) as the piezoelectric thin-film material that best balances performance and manufacturability.

(21) Embodiments of the technology disclosed herein below use AlN or Al.sub.xGa.sub.(1-x)N or Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), which is expected to have fairly high Q and better K.sup.2.sub.eff values.

(22) Because the fabrication method allows single crystal piezoelectric films to be fabricated, improved factors of merit (FOM) are expected when compared to the polycrystalline non-epitaxially grown films currently in use.

(23) With reference to FIG. 2, a simplified circuit of a half ladder type filter configuration created by BAW resonators in series with shunt BAW resonators is shown. In a filter, resonators are combined in a ladder, wherein each rung or stage comprises two resonators: one in series and the other connected in shunt. With reference to FIG. 3, adding rungs to the ladder, improves the rejection of undesired frequencies, creating a signal with less out-of-band rejection (a steeper skirt) but this is at the expense of insertion loss and greater power consumption. With reference to FIG. 4, another resonator configuration may be a lattice, which, as shown in FIG. 5 has poorer cutoff but better out-of-band attenuation.

(24) With reference to FIG. 6, the ladder and lattice type circuits may be combined to provide the transmission response shown in FIG. 7. The possible arrangements of resonators to create filters is beyond the scope of this application, but methods for fabricating resonators that are coupled in series and parallel are discussed hereunder with reference to FIGS. 42 and 43 and this enables arranging the resonators in the various ladder, lattice and combination arrangements.

(25) Referring back to FIG. 1, in preferred embodiments, the resonator film 18 is a single crystal piezoelectric of (BST Al.sub.xGa.sub.(1-x)N) or AlN.

(26) Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST) is tetragonal. <111> single crystal BST may be deposited onto Al.sub.2O.sub.3 single crystal substrates.

(27) AlN and AlGaN are HCP type Wurtzite crystal structures (C plane orientation). A strong C axis texture is the most important prerequisite for AlN and AlGaN FBAR filters because the acoustic mode of the FBAR needs to be longitudinally activated and the piezoelectric axis of AlN and AlGaN is along c-axis. The addition of gallium to AlN makes it easier to match lattice spacing of the film with that of the substrate.

(28) Since there are no grain boundaries in a single crystal, the attenuation of the acoustic signal is minimal. This also minimizes the lost energy that is otherwise transferred into heat and which has to be dissipated.

(29) Single crystal and strongly textured Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN and Al.sub.xGa.sub.(1-x)N films have smoother surfaces than randomly oriented films. This results in reduced scattering loss and higher Q-factors. Furthermore, rough surfaces, especially at high frequencies, are a major cause of the loss of the metal electrodes interfaces because of a skin effect. The smooth electrodepiezolelectric interfaces obtainable in highly textured and single crystal films with both upper and lower electrodes deposited thereupon are thus extremely advantageous.

(30) Composite FBAR structures consist of a thin piezoelectric film 18 sandwiched between top and bottom electrodes 22, 60. In the past, the electrode 22 was first deposited and then the piezoelectric layer 18 was fabricated thereupon. This required the electrode 22 to be made from a heavy metal such as platinum, molybdenum, tungsten or gold, which allow the high deposition temperatures required for subsequent piezoelectric film deposition thereupon. However, most of these metals have poor DC resistance, potentially deteriorating the Q factor of the resonator. In preferred embodiments described herein the electrodes 22, 60 are deposited onto the piezoelectric film 18 using physical vapor techniques. This enables lightweight metals such as aluminum to be used, either on its own or in conjunction with other metal layers to form composite electrodes. Aluminum has a high conductivity and so a thinner electrode is possible. Aluminum is much less dense than refractory metals and so the weight of the electrodes and their damping effect is less. The quality and coupling of the resonators and filters thus formed are vastly superior to those of the prior art.

(31) Aluminum is expected to readily adhere to AlN and AlxGa(1-x)N due to the Al ions of the piezoelectric film. If, however, electrode adhesion proves difficult, an adhesion layer which adheres to both the single crystal and to the electrode may be used. For example, titanium may be appropriate. Such adhesion layers typically have thickness of tens of nanometers.

(32) The mechanism used in ferroelectric Composite FBAR transducers is electrostriction which is the electric field induced piezoelectric effect. The top and bottom electrodes 22, 60 are used to apply direct current (DC) and radio frequency (RF) signals. The preferred Composite FBAR Composite structure described herein consists of a thin film single crystal Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), Al.sub.xGa.sub.(1-x)N or AlN film 18 sandwiched between top and bottom aluminum electrodes 22, 60. The AlN or Al.sub.xGa.sub.(1-x)N film 18 converts mechanical to electrical energy and vice versa.

(33) To provide stiffening without substantial weight, a low acoustic-loss single crystal silicon membrane layer 30 with possible orientation of <111>, <100> or <110> may be coupled to the piezoelectric films 18. The silicon layer 30 may have a thickness in the range of 1 m to 10 m, with the lowest possible thickness being preferable for best performance high frequency resonators. It should be noted that in Composite FBARs there are odd and even resonance modes, where each mode exhibits peak Q and K.sup.2eff Coupling as a function of the Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN and Al.sub.xGa.sub.(1-x)N to silicon membrane thickness ratio. The peak K.sup.2eff values decrease with mode number because the fraction of acoustic displacement across the Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN and Al.sub.xGa.sub.(1-x)N is reduced. However, the peak Q factor values increase with mode number, since the fraction of acoustic displacement across the low loss silicon layer increases. Hence, careful selection of the resonance mode is required for optimal FOM and low thickness silicon membranes with low thickness Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN and Al.sub.xGa.sub.(1-x)N films are desired for higher frequencies filters. In should also be noted that higher harmonic modes naturally render a higher frequency for a given film thickness and this may alleviate the requirement for trimming. Consequently, operating an FBAR at its second or higher harmonic mode frequency can extend the FBAR operation frequency range, as long as its figure of merit (FOM) remains high. Cavities 76, 92 are provided above and below the piezoelectric 18 on silicon 30 combination. The structure is encapsulated with a polymer 72 and mounted on an interposer 85 and coupled thereto with copper pillars 66 that are typically about 40-50 m wide and about 40 m high and joined to upper contact pads 82 of the interposer 85 with solder 68. A polymer gasket 70 which may be fabricated from SU-8 to have a high form factor and/or a dam 86 (typically epoxy) may be provided around the perimeter of the filter structure to keep the polymer over-mold/under-fill (MUF) 72 from entering the lower cavity 92. The interposer 85 may be constructed using well established fabrication technologies.

(34) The Composite FBAR shown in FIG. 1 has such a piezoelectric 18 on silicon membrane 30 Composite FBAR structure, preferably wherein the piezoelectric film 18 is a Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN and Al.sub.xGa.sub.(1-x)N and the electrodes 22, 60 are fabricated from lightweight aluminum.

(35) Although RF resonators are primarily used as filters, they find other uses, including as sensors, for example. There is also interest in tunable resonators that can operate at different frequencies.

(36) FIGS. 8A and 8B show the steps of the main process flow for fabricating a Composite FBAR filter, and schematic illustrations of the build-up are shown in FIGS. 9-12, 14-53.

(37) With reference to FIGS. 8A, 8B, and 9, the method consists of first obtaining and providing a removable wafer carrier with a release layerstep (a), a schematic, not to scale representation of this is shown in FIG. 9 which represents a c-axis <0001>1 Sapphire wafer 10 with an un-doped Gallium Nitride (UGaN) release layer C-axis <0001>1 12 thereon. Such sapphire wafers 10 with UGaN 12 deposited thereon are commercially available with diameters of 2, 4 and 6 in thicknesses of from 430 m, and have a polished surface with an RMS smoothness of less than 1 nm. The UGaN layer 12 typically has a thickness of 4 m and a polished surface having an RMS of less than 1 nm ready for epitaxial growth thereon. These coated substrates were developed for the Light Emitting Diode (LED) industry and are commercially available from various Chinese manufacturers including San'an Optoelectronics Co., Ltd. (San'an) and Suzhou Nanowin Science and Technology Co., Ltd. (NANOWIN).

(38) Alternatively, an AlN single crystal wafer cleaved from a large single crystal such as a single crystal grown by the Czochralski method, and having an appropriate laser absorbing release film thereupon could be used.

(39) A piezoelectric film comprising Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), Al.sub.xGa.sub.(1-x)N or AlN is now deposited onto the removable carrier 10step (b). With reference to FIG. 10, to aid heat dissipation and thus thickness distribution during subsequent deposition of a Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN and Al.sub.xGa.sub.(1-x)N or AlN piezoelectric film, a metal layer 14 may deposited on the back of the sapphire wafer 10step (bi), i.e. the side opposite to the side coated with GaN 12. The thickness of the metal layer 14 depends on the metal used. In this instance, with an Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN and Al.sub.xGa.sub.(1-x)N or AlN piezoelectric material 18 subsequently deposited (see below) titanium is a good candidate for the heat dissipating metal layer 14, and an appropriate thickness for the heat dissipating layer 14 is about 150 nm. The heat dissipating metal layer 14 may be deposited by sputtering, for example.

(40) The Gallium Nitride release layer 12 is typically about 4 nm thick with an RMS roughness of less than 2 nm. Because of the lattice matching between the <0001> plane of the GaN 12 and Sapphire 10, Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), AlN or Al.sub.xGa.sub.(1-x)N may be laid down as a single crystal film. Adjusting the percentage of gallium helps ensure lattice matching and thin films having a thickness of between 100 nm and 2000 nm and typically 200-400 nm in the case of Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST) and 200 nm to 2000 nm in the case of AlN or Al.sub.xGa.sub.(1-x)N are then deposited in this manner using oxide molecular beam epitaxy (MBE) using targets of barium, strontium and titanium or Al and Gastep (b).

(41) Molecular beam epitaxy (MBE) is a high purity low energy deposition technique that allows for low point defect manufacturing. It is possible to control the barium to strontium (or aluminum to gallium) ratio with high accuracy of 1% and this affects the Q factor and coupling of the film.

(42) The epitaxially grown Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), Al.sub.xGa.sub.(1-x)N or AlN films may have a RMS roughness of less than 1.5 nm. This minimizes the so called ripple effect.

(43) As shown in FIG. 12, to facilitate deposition of a single crystal piezoelectric layer 18 of Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST, a buffer layer 16 of rutile TiO.sub.2 and/or SrTiO.sub.3 may first be deposited step b(ii).

(44) To the best of our knowledge, Applicant is the first person to create a single crystal layer of Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST) and FIG. 13 is a 180 XRD spectrum of the structure of FIG. 12 showing that a single crystal membrane of BST was obtained.

(45) However, It will be noted that commercially available Al.sub.xGa.sub.(1-x)N thin films with x of 5, 10, 13, 20, 30, 50 and 100% and XRD FWHM of a fraction of a degree are available from various sources. For example single crystal Al.sub.0.2Ga.sub.0.8N with a c plane orientation <0002> having a thickness of 1 or 2 m deposited on a 4 m GaN release layer on a 4 sapphire substrate is available from Kyma Technologies.

(46) In prior art resonators, the lower electrode is first deposited and then the piezoelectric film is deposited thereon. Consequently, due to the high temperature fabrication of the piezoelectric film, refractory metals such as molybdenum, tungsten, platinum or gold are traditionally used for the lower electrode

(47) Since in the present technology, the first electrode 22 is deposited onto the piezoelectric film, a wide range of metals may be used such as aluminum. It will be appreciated that aluminum has a relatively low DC resistance when compared to these refractory metals, and thus using aluminum electrodes is expected to increase the Q factor of the filter.

(48) FIG. 14 shows the equivalent structure with a piezoelectric film 18 of Al.sub.xGa.sub.(1-x)N or AlN without a buffer layer 16. For simplicity, the remaining structures shown in FIGS. 15 to 53 do not show the buffer layer 18.

(49) A first electrode layer 22 is now deposited over the piezoelectric membrane 10step (c). With reference to FIG. 16, to aid adhesion, an adhesion layer 20 such as a titanium layer that may be as little as 5 nm thick, but could be as much as 50 nm is first deposited onto the piezoelectric membrane 18step (ci). Then an aluminum electrode layer 22 having a thickness of, say, 50 nm to 150 nm is deposited thereoverstep (cii). Both the adhesion layer 20 and the electrode layer 22 may be deposited by sputtering, for example. Tolerances of 5% are acceptable and easily obtainable.

(50) At a first approximation, the resonant frequency fR of a piezoelectric resonator is given by the following equation: fR=/L/2t where L is the longitudinal acoustic velocity in the normal direction of the piezoelectric layer, t is the thickness of the piezoelectric film and is the acoustic wavelength of the longitudinal wave.

(51) However, in practice, the acoustic properties of the other layers of the resonator affect the resonator performance. In particular, the mass loading effect of the electrodes which tend to be made of heavy metals such as molybdenum and platinum, due to the need to withstand the fabrication temperature of the piezoelectric material.

(52) Although described for depositing aluminum onto Ba.sub.xSr.sub.(1-x)TiO.sub.3 (BST), Al.sub.xGa.sub.(1-x)N or AlN, it will be appreciated that PVD or CVD with otherwise, low density, high conductivity electrode materials 22 over different piezo layers may be used with the same method. For example, carbon nano-tubes (CNT) over single crystal AlN or Al.sub.xGa.sub.(1-x)N may be considered. Aluminum is particularly attractive for resonator electrodes since it has high electrical and thermal conductivity and a low density, so hardly lowers the overall Q factor of the resonator. However, previous manufacturing routes wherein the electrode was deposited prior to deposition of the piezoelectric, ruled out aluminum. In this regard it will be noted that adding an aluminum bottom electrode after etching away a Si carrier wafer and exposing the back side of the piezoelectric layer, has significant yield challenges and complicates the packaging process of the filter and thus lowers the final yield.

(53) The piezoelectric film 18, adhesion layer 20 and aluminum electrode 22 are deposited over the entire sapphire wafer 10 as a continuous layer.

(54) A backing film on handle 28 is obtainedStep (d). This is a commercially available silicon on insulator (SOI) product. The backing film on handle 28 is typically a silicon wafer film 30 sandwiched to a silicon carrier 32 by a silicon oxide layer 34.

(55) A commercially available backing film on handle 28 obtainable from KST World Corp (www.kstworld.co.jp) or OKMETIC (www.okmetic.com) that is suitable is shown schematically in FIG. 17 and consists of a silicon film 30 that comes in thicknesses in the typical range 1 to 10 m that is coupled by a SiO2 box 34 that is typically 3-10 m thick to a Silicon handle 32 that is typically at least 400 m thick.

(56) An alternative SOI product 36 shown in FIG. 18 is a silicon wafer 38 attached to a silicon carrier 42 by a silicon oxide layer 40, but with a preformed air cavity 44. Such a structure is commercially available from Icemos (www.icemostech.com).

(57) Both SOI products 28, 36 may be obtained pre-coated with metal coatings on the silicon film 30, 38 aiding their attachment to the piezoelectric filmelectrode sandwich.

(58) With reference to FIG. 19, the commercially available film 30 (38) on handle 32 (42) product 28 (36) is attached to the electrode 22 of the stackstep (e).

(59) There are a number of ways that the silicon film 30 (38) may be attached to the electrode 22. For example, with reference to FIG. 20 an adhesion layer such as titanium 46 may be deposited onto the electrode layer 22 and this can be coated with an adhesive layer consisting of a gold-indium eutectic alloy 48 comprising 0.6% gold and 99.4% indium. The AuIn eutectic melts at 156 C. and by hot pressing at about 200 C., the adhesion layer may be attached to the silicon membrane 30 of the SOI wafer 28. Optionally, a titanium bonding layer 46 is attached to the silicon membrane 30 and an adhesive layer of gold-indium eutectic alloy 48 is attached to this. The two adhesion layers are fused together by the hot processing. The bonding layers created by this technique are rather thick, and the process is capable of some variation. With reference to FIG. 21, an alternative process relies on the fact that both the exposed surface of the silicon wafer film 30 (38) and the surface of the electrode layer 22 are very smooth. By coating both surfaces with adhesion layers of titanium 46, 46 that are typically 2-4 nm thick and may be deposited by sputtering, and then depositing pure gold 50 (50) coatings of thicknesses of 10-40 nm onto the adhesion layers 46 (46) the two gold coatings 50, 50 may be brought together at room temperature and the coatings fused together (see for example Shimatsu, T. & Uomoto, M. (2010). Atomic diffusion bonding of wafers with thin nanocrystalline metal films. Journal of Vacuum Science Technology B: Microelectronics and Nanometer Structures. 28 (4). pp. 706-714.). This technique requires a lower temperature and a thinner gold layer 50 than the AuIn layer shown in FIG. 20.

(60) With reference to FIG. 22, a further alternative process is to again coat both surfaces with adhesion layers of titanium 46, 46 that are typically 2-4 nm thick, and then deposit aluminum nitride 52 (52) coatings having thicknesses of 10-40 nm onto the adhesion layers 46 (46). The two aluminum nitride 52 (52) coatings may be activated with Ar plasma and when brought into contact at room temperature and pressure, fuse together. The bond can be strengthened by annealing at 300 C. in a N2 atmosphere, typically for a period of 3 hr.

(61) It will be appreciated that the stack of titanium adhesion layers 20, 46, 46 and the gold-indium or gold bonding layers 48, 50 serve with the aluminum electrode 22 layer as the upper electrode. This composite electrode can take advantage of the inherent characteristics such as DC resistance, acoustic impedance and weight (density) of the different materials, to provide different properties to the composite electrode.

(62) An alternative composite electrode may include an aluminum lower layer and gold-indium/gold/AlN bonding layers with an intermediate double layer of titanium and tungsten or titanium and molybdenum between the aluminum and the bonding layer. Titanium, tungsten and molybdenum may all be deposited by sputtering, and the titanium layer serves as an adhesion layer. The addition of a tungsten or molybdenum layer not only increases the acoustic impedance but additionally serves as a barrier layer between the gold of the bonding layer and the aluminum layer. In such a structure, the thickness of the aluminum layer may be as little as 50 nm. The titanium-tungsten or titanium-molybdenum is typically also 50 nm or slightly thicker. In such structures the gold bonding layer may be reduced to the minimum thickness that allows bonding while the aluminum, titanium-tantalum, titanium-tungsten or titanium-molybdenum serve as the main metals of the composite electrode, since they provide a desirable balance of low DC resistivity with high acoustic impedance.

(63) In general, it is advisable to process at as low a temperature as possible to minimize the likelihood of damage to the piezoelectric film and its electrodes and to further minimize warpage of the stack due to differences in the coefficient of thermal expansion of silicon and sapphire. It is further advised that the bonding layer thickness should be as thin as possible in order to enhance the Q factor value but that higher bonding layer thicknesses are also possible thorough careful balancing of the DC resistance, weight and acoustic impedances of the composite electrode.

(64) Once the silicon film and handle 28 is attached, the sapphire substrate 10 may be removedstep (f). If a thermal layer such as titanium 14 is deposited on the back of the substrate, this may be removed by chemical mechanical polishing, for example, giving the structure shown schematically in FIG. 23.

(65) Then, the GaN 12 may be irradiated through the sapphire substrate 10 using a 248 nm excimer laser to disassociate the GaN 12 enabling lift off of the sapphire substrate 10. Such a pulsed laser, with a square waveform is available from IPG Photonics. This process is known as laser lift off and results in the structure shown schematically in FIG. 24.

(66) Residual GaN 12 may be removed using Inductively Coupled Plasma (ICP) with Cl2, BCl3 and Ar for exampleFIG. 25. This can be achieved at temperatures of below 150 C., avoiding heat treatment of the piezoelectric thin film 18 and of the aluminum 22 and other layers. The Inductively Coupled Plasma (ICP) is a commercially available process, used by NMC (North Microelectrics) China Tool and by SAMCO INC, for example.

(67) After removing the GaN 12 a thickness measurement and trimming process of the piezoelectric film 18 may be required to obtain perfect frequency response which is related to the film thicknessstep (g). The trimming process uses Ar+ Ion beam milling and this process may be used to tailor any metal adhesion, barrier or oxide layers such as SiO.sub.2 Al.sub.2O.sub.3, AlN, W, Mo, Ta, Al, Cu, Ru, Ni or Fe where the wafers is held in a 4 axis chuck and rotated accordingly. A commercially available system known as InoScan is available from Meyer Burger, Germany. A trimmed piezoelectric layer 18 is shown in FIG. 26 which is flipped over. It should be noted that in order to obtain high performance RF filters with a high yield, the thickness of the piezoelectric layer may need to be trimmed to tenths of a nanometer (single digit angstroms).

(68) The same ICP process that is used to clean the back side of the piezoelectric 18 may then be used to pattern the piezoelectric layer 18 into arrays of piezoelectric islands for fabricating filters and the likestep (h). By way of example only, a schematic top view is shown in FIG. 27 and a side view in FIG. 28. Although rectangular islands of piezoelectric are shown, the islands may, of course, have any shape as dictated by the shape of the lithography mask tool. It will be noted that patterning the piezoelectric layer 18 into separate membranes just after the laser lift off processing reduces the risk of the piezoelectric layer cracking due to stress release across the wafer.

(69) An induction coupled plasma (ICP) using Cl.sub.2+BCl.sub.3+Ar, CF.sub.4+O.sub.2 or Cl.sub.2+O.sub.2+Ar and SF.sub.6+O.sub.2 is then applied to respectively remove the aluminum, adhesion layers, the high acoustic impedance layer, bonding layer and silicon membrane 30 down to expose the top surface of the silicon oxide 34 creating trenches 21step (i). A top view of the structure is shown in FIG. 29 and a side view in FIG. 30. With reference to FIG. 54, usefully, the high acoustic impedance layer 22, bonding layer 48/50/52, adhesion layers 46 are traversed by the trench 21 created by the ICP which penetrates into the silicon membrane 30. Then the trench 21 is re-patterned with photoresist and a narrower trench 27 is etched through the rest of the silicon layer 30 into the silicon dioxide 34. This creates a stepped interface between the silicon membrane 30 and the subsequently deposited passivation layer 54 (see below) and enables secure anchoring of the passivation layer 54 to the silicon membrane 30 in step (j) since the surface of the interface can still be several microns, even if the silicon membrane 30 itself is only a micron or so thick. penetrates the rest of the and silicon membrane 30 silicon layer is party traversed and then repatterned with photoresist to create a step. The silicon membrane 30 has to be fully traversed since silicon is a conductor, albeit not a particularly good one. The narrower trench 27 that separates the individual silicon membranes is typically 3 to 10 micron wide so that the individual silicon membranes are insulated from each other by a barrier of the passivation material 54 that is 3 to 10 microns wide.

(70) The induction coupled plasma (ICP) process operates at a temperature of less than 150 C. and does not adversely affect the piezoelectric membranes 18, 18 which are protected by the photo-resist mask. Inductively Coupled Plasma (ICP) is a commercially available process, used by NMC (Beijing North Microelectronics) China Tool and by SAMCO INC, for example.

(71) A schematic top view of the resulting structure is shown in FIG. 29 and a schematic side view is shown in FIG. 30.

(72) A passivation layer 54 such as SiO.sub.2, Si.sub.3N.sub.4, Ta.sub.2O.sub.5, a photo-sensitive Polyimide or BCB (Benzocyclobutene) is applied into the trenches 21 thus producedstep (j). The same passivation material 54 may be used to cover the piezoelectric islands 18, 18 with windows then being opened down through the passivation layer to the piezoelectric islands. Where a photosensitive polyimide or BCB is used, this is achieved by selective exposure, which is a precision process that includes the known series of sub-processes such as spin-coat, exposure, development and cure of photo-sensitive polymer passivation layers. Photo-sensitive polyimide passivation materials are available from HD Microsystems and are a standard industry solution for Flip Chip and Wafer Level Chip Scale Packages (WL-CSP) devices such as that described in this specification. Photo-sensitive BCB is commercially available as Cyclotene from Dow Chemicals.

(73) Ta.sub.2O.sub.5, SiO.sub.2 and Si.sub.3N.sub.4 may be deposited using PE-CVD processes as known.

(74) A schematic top view of the resulting structure is shown in FIG. 31 and a schematic side view is shown in FIG. 32.

(75) The upper electrodes are now appliedstep (k). An adhesion layer 58 such as titanium is first depositedstep 3(ki)FIG. 33, and then the top electrode 60 is then depositedstep (kii)FIG. 34. Both the adhesion layer 58 and the electrode 60 may be deposited by sputtering, for example. Tolerances of 5% are acceptable and easily obtainable.

(76) Couplings are now applied to connect the structure to an interposer, described below. Firstly, an Under Bump Metallization (UBM) layer 62 may now be appliedstep (l) by depositing a layer of metal that may be Ti/W, Ti/Ta or Ti/Mo (typically about 25 nm titanium, followed by about 50 nm of tungsten, tantalum or molybdenumstep (li), FIG. 35. Sputtering may be used.

(77) The structure may then be covered with a layer of copper 64 that is typically about 1 m thick, by sputtering, for examplestep (lii)see FIG. 36; the Under Bump Metallization layer 62 keeps the copper 64 and aluminum 60 separate.

(78) Next, copper pillars 66 may be fabricatedstep (liii), FIG. 37. These are typically about 40-50 m in diameter and about 40 m high. They may be fabricated by depositing a layer of photoresist 65, patterning and then electroplating copper 66 into the pattern.

(79) With reference to FIG. 38, solder 68 may then be deposited into the pattern to cap the copper pillars 66step (liv). This could be achieved by electroplating or electro-less plating a suitable material into the photoresist pattern used for fabricating the copper pillars 66. Then the photoresist is stripped awaystep (lv), FIG. 39.

(80) The copper layer 64 around the copper pillars 66 is now etched awaystep (lvi), FIG. 40. This may be accomplished by exposing to a solution of ammonium hydroxide at an elevated temperature. Alternatively, copper chloride or other commercially available Cu micro-etch solution may be used as the etchant. The UBM 62 is now selectively removedstep (vii), FIG. 41, leaving perimeter sections 63 over what will become the edges of the upper electrode to add weight to the edges of the effective resonators. Such raised frame structure is especially effective in Composite FBARs to help minimize lateral-wave spurious modes that otherwise lower the Q factor of the device, regardless of the mode number. With such structures, only the main lateral mode is excited due to the new boundary conditions created by the raised frame between the active and outside region of the resonator membrane 18.

(81) With reference to FIG. 42, by way of schematic illustration only, top and side views of a pair of piezoelectric capacitors coupled in parallel is shown, and with reference to FIG. 43, by way of schematic illustration only, top and side views of a pair of piezoelectric capacitors coupled in series is shown. The superfluous aluminum 60 beyond that required for the electrode may be selectively removed by applying an inductively coupled plasma comprising Cl.sub.2+BCl.sub.3+Ar and the excess parts of the titanium adhesion layer 58 thereby exposed may be selectively removed by reactive induction etching away with CF4 and O2.

(82) It will be noted that the extra weight of the UBM 63 layer provides mechanical damping that can lower the shunt resonator frequency response vs. the series resonator frequency response, and thus improve the overall performance of the filter.

(83) With reference to FIG. 44, a polymer gasket 70 may now be fabricated around an array or resonators defining a filterStep (n). This may be achieved using SU-8 technology. SU-8 is a commonly used epoxy-based negative photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. SU8 can be deposited as a viscous polymer that can be spun or spread over a thickness ranging from below 1 m to beyond 300 m. It is an attractive material since it can be deposited as a tall thin wall that can be about 55 m high and thus compatible with the solder capped copper pillars, whilst having a width of from 10 to 30 m.

(84) At this stage, as shown in FIG. 45, the array of filters may be attached to a tape 72 with the copper pillars 66 and SU8 gasket 70 side facing downwards, and the silicon handle 32 may be thinned down to about 90 micronsstep (o), using chemical mechanical polishing (CMP), to produce the structure shown in FIG. 46. Other possible thinning techniques include mechanical grinding, chemical polishing, wet etching together with atmospheric downstream plasma (ADP) and dry chemical etching (DCE), for example,

(85) Unless a SOI substrate 36 having prefabricated cavities 44FIG. 18was used, cavities 76 are now formed in the SiO.sub.2 34 layerstep (p). Through silicon via etching (TSV) is used to drill holes 74 through the thinned down silicon handle 32 to the SiO.sub.2 box 34step p(i), FIG. 47 opposite each of the piezoelectric films 18, 18.

(86) The Silicon Oxide 34 may then be selectively etched away with HF vapor in accordance with the formula SiO.sub.2+4 HF(g).fwdarw.SiF.sub.4(g)+H.sub.2O through the silicon via holes 74 to form cavities 76,step p(ii), FIG. 48. Dry vapor etching is preferable to a wet etch since this enables penetration of small features and prevents the membrane and cover from sticking together.

(87) Up until this stage, the filters are fabricated in arrays using on wafer fabrication techniques. The array is now diced into separate filter unitsstep (q).

(88) Dicing may take place by mechanical blades, plasma or laser. Plasma or laser may be preferred with some designs in order to avoid membrane damages.

(89) Such dicing tools are available by Disco Japan.

(90) An interposer 85 is now procured step (r). By way of enablement only, a two layer interposer 80 may be fabricated by copper electroplating of pads 80 and vias 82 into photoresist on a sacrificial copper substrate, followed by laminating with a dielectric material 84 having a polymer matrix such as polyimide, epoxy or BT (Bismaleimide/Triazine), Polyphenylene Ether (PPE), Polyphenylene Oxide (PPO) or their blends, either provided as a film, or as a prepreg reinforced with glass fibers for additional stiffness. More details may be found in U.S. Pat. No. 7,682,972 to Hurwitz et al. titled Advanced multilayer coreless structures and method for their fabrication incorporated herein by reference. There are, however, alternative established manufacturing routes for fabricating appropriate interposers. An appropriate interposer 85 with copper pads 80 and vias 82 in a dielectric with polymer matrix 84 is shown in FIG. 49.

(91) Alternatively, an interposer with a low temperature cofired ceramic LTCC matrix may be used.

(92) In general, the interposer 85 should be thin so that the overall package remains thin. However, it will be appreciated that different resonators 18, 18 may be interconnected via routing layers within the interposer 85, and additional layers may be built up if required.

(93) With reference to FIG. 50, usefully an epoxy dam structure 86 may first be deposited on the interposer surfacestep (s). The epoxy dam structure 86 may be fabricated by silk-screening an epoxy polymer, or by laminating a dry-film epoxy dam barrier that is photo-imageable. The last method is preferred as it provides high position accuracy with respect to the SU8 gasket 70 on the filter die. It should be noted that dry films may be deposited in several layers to achieve desired thicknesses. As with the gasket 70 around each filter array, the dam 86 could also be fabricated from SU-8. The dam 86 is designed to fit around the gasket 70 and could be slightly larger or smaller in area than the area surrounded by the gasket 70 to be positioned on the inside or outside of the gasket 70. Indeed two dams 86 (one encircling and the encircled by the gasket) or a plurality of gaskets 70 could be provided.

(94) As shown in FIG. 51, the interposer may then be attached to the Composite FBAR resonator array by aligning and melting the solder caps 68 on the copper pillars 66step (t).

(95) As shown in FIG. 52, the array device may be encapsulated in polymer 90step (u); the dams 86 and SU8 gaskets 70 working together preventing under fill of the cavity 92 within the gasket 70.

(96) In this manner, the closely aligned SU8 connected to the Composite FBAR array and the epoxy dam connected to the substrate prevents under-fill 72 from filling the cavity 92 under the piezo resonators 18, 18.

(97) The array of resonators is then diced into separate filter modulesstage (v), giving the structure shown in FIG. 1, for testing, packaging and shipment.

(98) The interposer 85 may be a functional substrate with embedded inductors, lines and couplers. It should be noted the interposer 85 may subsequently be placed on the same IC Substrate together with controllers, power amplifiers and switches to generate a fully integrated Front End Module (FEM). This allows all components to be designed together to achieve optimum system performance.

(99) Thus single crystal Composite FBARs are shown and described.

(100) In resonator/filter designs with a Ba.sub.xSr.sub.(1-x)TiO.sub.3 piezoelectric layer, the top electrode may be split into two sections: the Al electrode itself and a separated Al line that runs bias voltage to the piezoelectric membrane and causes it to resonate. This bias voltage is usually between 5V to 40V, the voltage depending on the resonator frequency. For example, Tests performed on 2700 Piezo thick BST at 19V have caused the BST to resonate at 6.5 GHz.

(101) Single crystal Ba.sub.xSr.sub.(1-x)TiO.sub.3 Filters are potentially tunable using capacitors build around the filter on the same silicon carrier. It has been established by numerous research groups that single crystal BST has a tunability ratio of 1:8 or even 1:10 whereas amorphous or polycrystalline BST has only has 1:3 to 1:4 tunability.

(102) Single crystal BST, AlN and AlGaN FBAR resonators and thus filters have the following advantages: Such filters may save up to half of the RF power wasted as heat in prior art filters because the single crystal orientation enables polarization of the excited acoustic wave. The filters disclosed herein may operate at higher frequencies since the thickness of the ultra-thin piezoelectric membrane necessary for high frequencies is supported by an additional silicon membrane (composite FBAR). Having a composite electrode and structure that includes a silicon membrane, such filters may have second or higher harmonic mode frequencies that can extend the operating frequency range of the FBAR Single crystal BST, AlN and AlGaN FBARs disclosed herein use well-known MEMS and LED FAB manufacturing processes rather than dedicated and expensive Si FABs. This may simplify and reduce the investment and total cost to manufacture the filter device. Single crystal FBARs manufacturing processes disclosed herein use the low cost back-end processes well established and with high yields available by multiple wafer bumping and assembly houses.

(103) Although discussed hereinabove with reference to communication filters, it will be appreciated that thickness-shear-based Composite FBARs and surface generated acoustic wave-based Composite FBARs are also used in other applications. For example they are widely used in biosensors since they provide high sensitivity for the detection of biomolecules in liquids.

(104) Thus persons skilled in the art will appreciate that the present invention is not limited to what has been particularly shown and described hereinabove. Rather the scope of the present invention is defined by the appended claims and includes both combinations and sub combinations of the various features described hereinabove as well as variations and modifications thereof, which would occur to persons skilled in the art upon reading the foregoing description.

(105) In the claims, the word comprise, and variations thereof such as comprises, comprising and the like indicate that the components listed are included, but not generally to the exclusion of other components.