Circuit protection assembly

Abstract

A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.

Claims

1. A circuit protection assembly, comprising a protection element with a positive temperature coefficient (PTC) of resistance comprising of a polymer-based conductive composite layer securely clamped and fixed between two metal electrode plates, wherein: (a) the copper clad laminate which has a through hole in a middle thereof, and wherein the protection element is provided in the through hole. (b) Conductive parts are used to connect protection element with the protected circuit electrically. (c) The polymer-based conductive composite material is made by at least one polymer filled by at least one conductive filler which has a resistivity less than 100 .Math.cm. And the diameter of conductive filler is 0.1 m50 m.

2. The circuit protection assembly according to claims 1, wherein the structure of copper clad laminate is a single-layer, double-layer or multi-layer laminate and the copper clad laminate is laminated with copper foil above and below a substrate by adhesive layer. The substrate is papery substrate, glass fiber fabric substrate, paper and glass fiber fabric composite substrate or ceramic substrate.

3. The circuit protection assembly according to claim 1, wherein the adhesive layer is one of phenolic resin, epoxy resin, polyester resin, bismaleimide-triazine resin, polyimide resin, polyphenylene ether, styrene-maleic anhydride copolymers, polycyanate ester resin, polyolefin resin and mixtures thereof.

4. The circuit protection assembly according to claims 1, wherein the polymer based material is polythene, chlorinated polyethylene, oxidized polyethylene, polyvinyl chloride, butadiene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycarbonate, polyamide, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polyoxymethylene, polytetrafluoroethylene, phenolic resin, ethylene, Fluorinated ethylene propylene, polyvinyl fluoride, maleic anhydride grafted polyethylene, polypropylene, polyvinylidene fluoride, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl-methacrylate, ethylene-acrylic acid copolymer and mixtures thereof.

5. The circuit protection assembly according to claims 1, wherein the conductive filler is selected from one kind of or the mixture of conductive carbons, metals, conductive ceramics.

6. The circuit protection assembly according to claims 5, wherein the conductive ceramic powder is one kind of mixtures of metal nitride, metal carbide, metal boride, metal silicide and layered ceramic powders.

7. The circuit protection assembly according to claims 6, wherein the layered ceramic powder is Sc.sub.2InC, Ti.sub.2AlC, Ti.sub.2GaC, Ti.sub.2InC, Ti.sub.2TlC, V.sub.2AlC, V.sub.2GaC, Cr.sub.2GaC, Ti.sub.2AlN, Ti.sub.2GaN, Ti.sub.2InN, V.sub.2GaN, Cr.sub.2GaN, Ti.sub.2GeC, Ti.sub.2SnC, Ti.sub.2PbC, V.sub.2GeC, Cr.sub.2SiC, Cr.sub.2GeC, V.sub.2PC, V.sub.2AsC, Ti.sub.2SC, Zr.sub.2InC, Zr.sub.2TlC, Nb.sub.2AlC, Nb.sub.2GaC, Nb.sub.2InC, Mo.sub.2GaC, Zr.sub.2InN, Zr.sub.2TlN, Zr.sub.2SnC, Zr.sub.2PbC, Nb.sub.2SnC, Nb.sub.2PC, Nb.sub.2AsC, Zr.sub.2SC, Nb.sub.2SC, Hf.sub.2SC, Hf.sub.2InC, Hf.sub.2TlC, Ta.sub.2AlC, Ta.sub.2GaC, Hf.sub.2SnC, Hf.sub.2PbC, Hf.sub.2SnN, Ti.sub.3AlC.sub.2, V.sub.3AlC.sub.2, Ta.sub.3AlC.sub.2, Ti.sub.3SiC.sub.2, Ti.sub.3GeC.sub.2, Ti.sub.3SnC.sub.2, Ti.sub.4AlN.sub.3, V.sub.4AlC.sub.3, Ti.sub.4GaC.sub.3, Nb.sub.4AlN.sub.3, Ta.sub.4AlC.sub.3, Ti.sub.4SiC.sub.3, Ti.sub.4GeC.sub.3 and mixtures thereof.

8. The circuit protection assembly according to claims 1, wherein the conductive parts are used to connect the PTC protective element in series with the protected circuit to form a galvanic circle.

9. The circuit protection assembly according to claims 8, wherein the conductive part is selected from one of metal nickel, copper, aluminum, zinc, tin, bismuth, indium, silver, gold and their alloy. The shape of conductive part can be point, line, strap, lamellar, column, full round hole, half round hole, arc hole or blind hole.

10. The circuit protection assembly according to claims 9, wherein the outer surface of copper clad laminate is covered with insulating paint.

11. The circuit protection assembly according to claims 10, wherein the PTC protection element that has sandwich structure consisting of two metal electrode slices with the polymer-based conductive composites plated in the middle is provided in the through hole of copper clad laminate. The upper and lower prepreg adhesive layer are hot-pressed on the upper and lower surfaces of the laminate. The upper and lower copper foils are respectively adhered to the upper and lower prepreg layer during hot-pressing. The upper metal electrode plate is electrically connected to the upper copper foil by No. 2 conductive part. The lower metal electrode plate is electrically connected to the lower copper foil by No. 1 conductive part. The lower and upper copper foil can be processed into various shapes of external circuit.

12. The circuit protection assembly according to claims 10, wherein the PTC protection element that has sandwich structure consisting of two metal electrode slices with the polymer-based conductive composites plated in the middle is provided in the through hole of copper clad laminate. The upper and lower prepreg adhesive layer are hot-pressed on the upper and lower surfaces of the laminate. The upper and lower copper foils are respectively adhered to the upper and lower prepreg layer during hot-pressing. Then the right and left copper foil are formed from the copper foil by etching. The upper metal electrode plate is electrically connected to the copper foil on the right by No. 2 conductive part. The lower metal electrode plate is electrically connected to the copper foil on the left by No. 1 conductive part.

13. The circuit protection assembly according to claims 10, wherein the PTC protection element that has sandwich structure consisting of two metal electrode slices with the polymer-based conductive composites plated in the middle is provided in the through hole of copper clad laminate. The upper and lower prepreg adhesive layer are hot-pressed on the upper and lower surfaces of the laminate. The upper and lower copper foils are respectively adhered to the upper and lower prepreg layer during hot-pressing. Then the upper right, upper left and lower copper foil are formed from the copper foil by etching. The upper metal electrode plate is electrically connected to the upper right copper foil by No. 2 conductive part, then the lower copper foil is electrically connected to the upper right foil by No. 3 conductive part. The lower metal electrode plate is electrically connected to the upper left copper foil by No. 1 conductive part.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG. 1 shows the schematic diagram of protection element with PTC of Resistance according to the present invention.

[0027] FIG. 2 shows a sectional structure diagram of the implementation No.1.

[0028] FIG. 3 shows a sectional structure diagram of the implementation No. 2.

[0029] FIG. 4 shows a sectional structure diagram of the implementation No. 3.

REFERENCE NUMERALS IN THE DRAWINGS

[0030] 100, 200, 300, 400Protection Element.

[0031] 110a, 210a, 310a, 410aLower Metal Electrode Plate.

[0032] 110b, 210b, 310b, 410bUpper Metal Electrode Plate

[0033] 120, 220, 320, 420Polymer-based Conductive Composites

[0034] 231a, 331a, 431aLower Insulation Coating.

[0035] 231b, 331b, 431bUpper Insulation Coating.

[0036] 232, 332, 432Copper Clad Laminate

[0037] 233a, 333a, 433aLower Adhesive Layer.

[0038] 233b, 333b, 433bUpper Adhesive Layer.

[0039] 240a, 340a, 440aConductive Part No. 1.

[0040] 240b, 340b, 440bConductive Part No. 2.

[0041] 440cConductive Part No. 3.

[0042] 250aLower Copper Foil.

[0043] 250bUpper Copper Foil.

[0044] 350a, 350bLeft Copper Foil, Right Copper Foil;

[0045] 450a, 450bUpper Left Copper Foil, Upper Right Copper Foil.

[0046] 450cLower Copper Foil.

DETAILED DESCRIPTION OF THE INVENTION

1. Material Preparation

[0047] Circuit Protection Element with Positive Temperature Coefficient of Resistance:

[0048] In the preparation, the invention precisely weights the polymer and conductive filler according to the formula. Setting the internal mixer at a temperature of 180 C. and a speed of 30 turns per minute, putting the polymer in the mixer for mixing 3 minutes, and then adding the conductive filler to go on mixing 15 minutes, finally the polymer-based conductive composite material will be finished.

[0049] The polymer-based conductive composite material with positive temperature coefficient (PTC) of resistance which is melted and mixed above, is flattened by a mill to achieve the polymer-based composite material 120 with thickness 0.20.25 mm. The protective element 100 with positive temperature coefficient of resistance is shown in FIG. 1.

[0050] Material 120 is disposed between two symmetric electrode plates 110a and 110b, and the rough surfaces of metal electrode plates 110a and 110b are tightly connected with the polymer-based conductive composite material 120 through thermo-compression bonding. The temperature of thermo-compression bonding is at 180 C. to hot press with the pressure at 12 Mpa for 10 minutes and then cold press it 10 minutes in the cold press machine. The sheet of PTC is obtained.

[0051] The sheet of PTC is punched or sliced to make a protective element 100 with suitable size.

2. Circuit Protection Assembly

[0052] (a) The copper clad laminate which has a through hole in a middle thereof to dispose the protection element.

[0053] (b) Conductive parts are electrically connected to the protection element with the protected circuit.

[0054] (c) The polymer-based conductive composite material made by at least one polymer is filled by at least one conductive filler which has a resistivity less than 100 .Math.cm, with a diameter of conductive filler being 0.1 m50 m.

[0055] The conductive parts as mentioned above is selected from one of metal nickel, copper, aluminum, zinc, tin, bismuth, indium, silver, gold and their alloy. The shape of conductive part can be point, line, strap, lamellar, column, full round hole, half round hole, arc hole or blind hole.

Implement No. 1

[0056] As shown in FIG. 2: the circuit protection assembly is composed of copper foil laminate, protective elements with positive temperature coefficient of resistance and conductive components. The protection element 200 which has the same or similar structure and performance with protection element 100 is placed in the through hole of the copper clad laminate 232. The protection element has sandwich structure consisting of the upper metal electrode plate 210a and the lower metal electrode plate 210b with the polymer-based conductive composite 220 placed therebetween. The upper prepreg adhesive layer 233b and the lower prepreg adhesive layer 233a are hot-pressed on the upper and lower surfaces of the laminate 232. The upper copper foil 250b and the lower copper foil 250a are respectively adhered to the upper prepreg layer 233b and lower prepreg layer 233a during hot-pressing. The upper metal electrode plate 210b is electrically connected to the upper copper foil 250b by conductive part 240b. The lower metal electrode plate 210a is electrically connected to the lower copper foil 250a by conductive part 240a. The lower copper foil 250a and the upper copper foil 250b can be processed into various shapes of external circuit. The outer surface of copper clad laminate is covered with insulating paint to form upper and lower insulation coating 231b and 231a respectively to prevent other components from electrical contact with external lines, and an identifier can print on insulating paint.

Implement No. 2

[0057] As shown in FIG. 3: the circuit protection assembly is composed of copper foil laminate, protective elements 300 with positive temperature coefficient of resistance and conductive components. The protection element 300 which has the same or similar structure and performance with protection element 100 is placed in the through hole of the copper clad laminate 332. The protection element has sandwich structure consisting of the upper metal electrode plate 310a and the lower metal electrode plate 310b with the polymer-based conductive composite 320 placed in the middle. The upper prepreg adhesive layer 333b and the lower prepreg adhesive layer 333a are hot-pressed on the upper and lower surfaces of the laminate 332. The upper copper foil 350b and the lower copper foil 350a are respectively adhered to the upper prepreg layer 333b and lower prepreg layer 333a during hot-pressing. Then the right copper foil 350a and left copper foil 350b are formed from the copper foils 350a and 350b by etching. The upper metal electrode plate 310b is electrically connected to the copper foil 350b on the right by conductive part 340b.

[0058] The right copper foil 350a and the left copper foil 350b can be processed into various shapes of external circuit. The lower metal electrode plate 310a is electrically connected to the copper foil 350a on the right by conductive part 340a. The outer surface of copper clad laminate is covered with insulating paint to form upper and lower insulation coating 331b and 331a respectively to prevent other components from electrical contact with external lines, and an identifier can print on insulating paint.

Implement No. 3

[0059] As shown in FIG. 4: the circuit protection assembly is composed of copper foil laminate, protective elements 400 with positive temperature coefficient of resistance and conductive components. The protection element 400 which has the same or similar structure and performance with protection element 100 is placed in the through hole of the copper clad laminate 432. The protection element has sandwich structure consisting of the upper metal electrode plate 410a and the lower metal electrode plate 410b with the polymer-based conductive composite 420 placed in the middle. The upper prepreg adhesive layer 433b and the lower prepreg adhesive layer 433a are hot-pressed on the upper and lower surfaces of the laminate 432. The upper copper foil 450b and the lower copper foil 450a are respectively adhered to the upper prepreg layer 433b and lower prepreg layer 433a during hot-pressing. Then the upper right foil 450a, upper left foil 450b and lower copper foil 450c are formed from the copper foil by etching. The upper metal electrode plate 410b is electrically connected to the upper right copper foil 450b by conductive part 440b, then the lower copper foil 450c is electrically connected to the upper right foil 450b by conductive part 440c. The lower metal electrode plate 410a is electrically connected to the upper left copper foil 450a by conductive part 440a. The copper foils 450a, 450b and 450c can be processed into various shapes of external circuit. The outer surface of copper clad laminate is covered with insulating paint to form upper and lower insulation coating 431b and 431a respectively to prevent other components from electrical contact with external lines, and an identifier can print on insulating paint.

[0060] The present invention's characteristics and contents are explained as above, but the explanation is still limited or just refers to some particular part, the invention's characteristics maybe will more than the contents that are illustrated in the paper. Therefore, the invention's protective range will not be limited in the contents of the implementation part, but should include the combination of all the contents that showed in different part, and the various of replacement and embellishment that accord with the invention, which is covered by claims of the invention.