Device for heat dissipation from an endoscopic illumination apparatus

Abstract

Device for an endoscopic illumination apparatus comprising a heat pipe having a first end region and a second end region; a first heat source; a heat dissipation element for dissipating thermal energy from said first heat source; a heat sink spaced apart from the first heat source; and a clamping element, wherein the clamping element is reversibly detachably mounted on the heat dissipation element such that the first end region of the heat pipe is held between the heat dissipation element and the clamping element, wherein the heat pipe is adapted to conduct the thermal energy of the heat source to the heat sink, wherein the second end region of the heat pipe is spaced apart from the first end region, and wherein the second end region ends in the heat sink.

Claims

1. A heat dissipating device configured to dissipate heat from an endoscopic illumination device comprising: one or more a heat pipes each including a first end portion and a second end portion; a heat dissipation element configured to dissipate thermal energy from a first heat source associated with the endoscopic illumination device; a heat sink; and a clamp, wherein the clamp is reversibly detachably mounted on the heat dissipation element such that the first end portions of the one or more heat pipes are held between the heat dissipation element and the clamp, wherein the one or more heat pipes are adapted to conduct the thermal energy of the first heat source to the heat sink, and wherein the second end portion of the one or more heat pipes ends in the heat sink.

2. The heat dissipating device of claim 1, wherein the heat source is one or more lights.

3. The heat dissipating device of claim 2, wherein the one or more lights are one or more LEDs.

4. The heat dissipating device of claim 1, wherein the clamp is detachably screwed, pinned or bolted to the heat dissipation element.

5. The heat dissipating device of claim 1, wherein the one or more heat pipes, the heat dissipation element and the clamp include a thermally conductive material.

6. The heat dissipating device of claim 5, wherein the thermally conductive material includes one or more of aluminum and/or copper.

7. The heat dissipating device of claim 1, wherein a thermal coupling heat-conducting paste is applied between a surface of the heat-dissipating element, a surface of the first end region of the one or more heat pipes and a surface of the clamp.

8. The heat dissipating device of claim 1, further comprising one or more second heat pipes, a second heat dissipating element, a second clamp, and a second heat source associated with the endoscopic illumination device, the one or more second heat pipes each having a first end portion and a second end portion, wherein the second heat dissipation element is configured to dissipate thermal energy from the second heat source, wherein the second clamp is reversibly detachably mounted on the second heat dissipation element such that the first end portion of the one or more second heat pipes are held between the second heat dissipation element and the second clamp, wherein the one or more second heat pipes are adapted to conduct the thermal energy of the second heat source to the heat sink, and wherein the second end portion of the one or more second heat pipes ends in the heat sink.

9. The heat dissipating device of claim 8, wherein the second heat source is a second light.

10. The heat dissipating device of claim 9, wherein the second light is one or more LEDs.

11. The heat dissipating device of claim 8, wherein the second clamp is detachably screwed, pinned or bolted to the heat dissipation element.

12. The heat dissipating device of claim 8, wherein the heat pipe, the heat dissipation element and the clamping element include a thermally conductive material.

13. The heat dissipating device of claim 12, wherein the thermally conductive material includes one or more of aluminum and/or copper.

14. The heat dissipating device of claim 8, wherein a heat-conducting paste is applied between a surface of the second heat-dissipating element, a surface of the first end region of the one or more second heat pipes and a surface of the second clamp.

15. The heat dissipating device of claim 1, further comprising one or more second heat pipes, a second clamp, and a second heat source, the one or more second heat pipes each having a first end portion and a second end portion, wherein the heat dissipation element is further configured to dissipate thermal energy from the second heat source associated with the endoscopic illumination device, wherein the second clamp is reversibly releasably mounted on the heat dissipation element such that the first end portion of the one or more second heat pipes is held between the heat dissipation element and the second clamp, wherein the one or more second heat pipes are adapted to conduct the thermal energy of the second heat source to the heat sink, wherein the second end portion of the one or more second heat pipes ends in the heat sink.

16. The heat dissipating device of claim 15, wherein the second heat source is a second light.

17. The heat dissipating device of claim 16, wherein the second light is one or more LEDs.

18. The heat dissipating device of claim 15, wherein the second clamp is detachably screwed, pinned or bolted to the heat dissipation element.

19. The heat dissipating device of claim 1, further comprising: a cooling body forming the heat sink of the device; and a fan adapted to force an air flow over the heat sink.

20. The heat dissipating device of claim 1, wherein the heat dissipation element and the clamp include one or more complementary semi-cylindrical recesses adapted to receive one of the one or more heat pipes.

21. The heat dissipating device of claim 1, further comprising: one or more second heat pipes each including a first end portion and a second end portion; a second heat dissipation element; and a second clamp, wherein: the heat dissipation element and the clamp are located on a first plane, and the second heat dissipation element and the second clamp are located on a second plane perpendicular to the first plane.

22. The heat dissipating device of claim 21, wherein there are a plurality of heat pipes and a plurality of second heat pipes, and the plurality of heat pipes are arranged in a parallel configuration, and the plurality of second heat pipes are arranged in a parallel configuration.

23. A heat dissipating device configured to dissipate heat from an endoscopic illumination device comprising: a plurality of first heat pipes each including a first end portion and a second end portion; a plurality of second heat pipes each including a first end portion and a second end portion; a first heat dissipation element and a first clamp configured to dissipate thermal energy from a first heat source associated with the endoscopic illumination device; a second heat dissipation element and a second clamp also configured to dissipate thermal energy from the first heat source; and a heat sink connected by the plurality of first heat pipes and the plurality of second heat pipes to the first heat dissipation element and the first clamp, and the second heat dissipation element and the second clamp, respectively, wherein the clamps are detachably mounted on their respective heat dissipation elements such that the first end portions of the plurality of first heat pipes are held between the first heat dissipation element and the first clamp, and the first end portions of the plurality of second heat pipes are held between the second heat dissipation element and the second clamp, wherein the plurality of heat pipes are adapted to conduct the thermal energy from the first heat source to the heat sink, and wherein the second end portions of the first and the second plurality of heat pipes are located in the heat sink.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Embodiments are disclosed in the drawings and are explained in the following description. In the figures:

(2) FIG. 1 is a top view of an endoscopic lighting apparatus with a refinement of the device;

(3) FIG. 2 is a perspective view of the refinement of the device;

(4) FIG. 3 is a top view of the refinement shown in FIG. 2;

(5) FIG. 4 is a perspective view of a second refinement of the device;

(6) FIG. 5 is an exploded view of the second refinement;

(7) FIG. 6 is a perspective view of a first refinement of the clamping element;

(8) FIG. 7 is a perspective view of a second refinement of the clamping element;

(9) FIG. 8 is a perspective view of heat pipes and heat sink in the soldered state;

(10) FIG. 9 is a sectional view of the perspective view shown in FIG. 8; and

(11) FIG. 10 is a sectional view of the heat pipe(s) in the clamped state.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

(12) FIG. 1 shows an endoscopic lighting apparatus with a refinement of the device. The endoscopic lighting apparatus is marked in its entirety with the reference number 100, the device with the reference number 10.

(13) In the refinement shown in FIG. 1, the endoscopic illuminating apparatus 100 comprises the device 10, an optical unit 12, a light source driver board 14 and a power supply unit 16 as main components.

(14) A main board is not shown in the sectional view. The main board may be arranged above the power supply unit 16 and may be seen as the control and evaluation unit of the endoscopic illumination apparatus 100. The power supply unit 16 is adapted to supply the endoscopic illumination apparatus 100 and all its components with electrical energy and comprises, for example, a power of up to 150 W with convection cooling, up to 250 W with conduction cooling and up to 550 W with forced cooling.

(15) The optical unit 12 forms the “core” of the endoscopic illumination apparatus 100 and is adapted to focus light emitted by one or more light sources 18, 18′ in such a way that the light is introduced as a concentrated light beam into a light guide 20. Here, the optical unit 12 comprises a basic carrier, which may be, for example, made of aluminum. The first and the second light source 18, 18′ are plate-shaped light emitting diodes (e.g. in SMD design). The first and second light source 18, 18′ are arranged orthogonally to each other. The first light source 18 is arranged opposite the light guide 20, thus facing the latter.

(16) An optical lens 22 (e.g. a collimator optic) is arranged in front of the first and the second light source 18, 18′ and in front of the light guide 20, respectively. The lenses 22 may each be held by a lens holder. The lenses 22 are adapted to align or collimate the light generated by the light sources 18, 18′. The optics 22, 22′, 22″ connected in front of the first and the second light source 18, 18′ focus the generated light on a center of a beam splitter 24. The beam splitter 24 is aligned with respect to the two light sources 18, 18′ in such a way that it has a 45° position to each of the two light sources 18, 18′.

(17) The beam splitter 24 is adapted to allow the light from the first light source 18 to pass in a straight line, i.e. without deflection, in the direction of the light guide 20, whereas the beam splitter 24 deflects the light originating from the second light source 18′ and collimated by the lens 22′ by 90° in the direction of the light guide 20. For this purpose, the beam splitter 24 may, for example, have a partially transmissive coating. The light directed into the light guide 20 is collimated again by the lens 22″ before entering the light guide 20. The light collimated by the optical unit 12 in this way can be directed through the light guide 20 to a location to be illuminated by the endoscopic illumination apparatus 100.

(18) To control the light sources 18, 18′ during operation, the main board may be supplied with electrical energy by means of the power supply unit 16. Control signals for controlling the light sources 18, 18′ may be transmitted from the main board to the respective light source driver board. The light source driver board(s) transforms the power to the respective light source 18, 18′. Although the light sources 18, 18′ are high-power light-emitting diodes having a high efficiency, during operation of the two light sources 18, 18′ rejected heat is generated which, if not dissipated, can lead to a heat accumulation, e.g. in a housing 26 of the endoscopic illumination apparatus 100. The light sources 18, 18′ are therefore heat sources 28, 28′, wherein the first light source 18 represents a first heat source 28 and the second light source 18′ represents a second heat source 28′. In other configurations also only one heat source 28, 28′ or one light source 18, 18′ may be present.

(19) To dissipate the thermal energy (or rejected heat) generated at the light sources 18, 18′, the device 10 comprises a heat dissipation element 30, 30′. In the present case, the device 10 comprises a first heat dissipation element 30 and a second heat dissipation element 30′. The first heat dissipation element 30 is arranged in a direct periphery of the first heat source 28. The second heat dissipation element 30′ is arranged in a direct periphery of the second heat source 28′. The light sources 18, 18′ may be mounted on the heat dissipation elements 30, 30′. The heat dissipation elements 30, 30′ may be connected to the base carrier of the optical unit 12. In other refinements, which are not shown here, only one heat dissipation element 30, 30′ can be used, which is further adapted to dissipate the thermal energy of both heat sources 28, 28′. Such a heat dissipation element 30, 30′ may, for example, have an L-shape and thus may be adapted to dissipate the thermal energy from both the first and the second heat source 28, 28′. In a further refinement, three or more heat dissipation elements may also be used, wherein the number of heat dissipation elements can be determined, for example, on the basis of the power loss to be dissipated.

(20) The thermal energy of the first heat source 28 dissipated by the first heat dissipation element 30 is dissipated via a first heat pipe 32 to a heat sink 34 which is at a distance from the first heat source 28. In the present case, the device also comprises a second heat pipe 32′. The first and second heat pipe 32, 32′ may each comprise a plurality (>2) of heat pipes. The thermal energy of the second heat source 28′ dissipated by the second heat dissipation element 30′ is dissipated via the second heat pipe 32′ to the heat sink 34 which is at a distance from the second heat source 28. In the present case, the heat sink 34 is formed by a cooling body 36, which may be a laminated aluminum cooling body. In other refinements, however, the cooling body 36 may also be a different type of cooling body (e.g. with a finned structure, an extruded cooling body or a forged cooling body) or may be composed of several cooling bodies lined up or arranged side by side. In principle, it is also possible that the device 10 comprises two separate heat sinks 34.

(21) In the present case, the first and second heat pipe 32, 32′ are tubular or rod-shaped and differ in their respective shape. Here the shape, i.e. the course of the tube, of the respective heat pipe 32, 32′ is adapted to the position and positioning of the heat dissipation elements 30, 30′. The heat pipes 32, 32′, for example, comprise several straight pipe sections as well as several bends and/or bent pipe sections.

(22) The first heat pipe 32 is reversibly detachably mounted on the first heat dissipation element 30 by means of a first clamping element 38 such that a first end region 40 of the first heat pipe 32 is held between the first heat dissipation element 30 and the first clamping element 38. The second heat pipe 32′ may be reversibly detachably mounted on the second heat dissipation element 30′ by means of a second clamping element 38′ such that a first end region 40′ of the second heat pipe 38′ is held between the second heat dissipation element 30′ and the second clamping element 38′. In a case where there is only one heat dissipation element 30, 30′, where both clamping elements 38, 38′ may be mounted on the single heat dissipation element 30, 30′.

(23) In the present case, the first and the second heat pipe 38, 38′ are adapted to conduct the thermal energy of the first and second heat source 28, 28′ to the heat sink 34, which is spaced apart from the heat sources 28, 28′. A second end region 42 of the first heat pipe 32, which is spaced apart from the first end region 40, ends in the heat sink 34, and a second end region 42′ of the second heat pipe 32′, spaced apart from the first end region 40′ of the second heat pipe 32′, and may also end in the heat sink 34 (see in particular FIG. 5).

(24) The endoscopic lighting apparatus 100 of FIG. 1 comprises, in addition to the cooling body 36 forming the heat sink 34, a fan 44, which is adapted to force an air flow into the direction 45 of the heat sink 36 or in the opposite direction 45′ away from said heat sink 36. In the present case, the fan 44 generates an air flow pointing into the direction 45 of the heat sink 36. In other refinements, a suction fan 44 may also be used, which sucks the air in the opposite direction 45′ away from heat sink 36. In addition, in FIG. 1 another fan 44 is arranged in the periphery of the power supply unit 16 and is adapted to suck the thermal energy emitted by the power supply unit 16, the light source driver board 14 and the, in some exemplary embodiments, overlying main board (not shown), out of the housing 26. In a further refinement, the fan 44 can also be arranged on heat sink 36 such that air can be sucked through the heat sink.

(25) For a better overview, FIGS. 2 and 3 again show the device 10 together with the optical unit 12 in an insulated form, i.e. without the remaining components of the endoscopic lighting apparatus 100 shown in FIG. 1.

(26) FIGS. 4 and 5 show the device 10 as a refinement in a perspective view (FIG. 4) and in an exploded view (FIG. 5). In FIG. 4 it can be seen that both the first heat pipe 32 and the second heat pipe 32′ each comprise a plurality (in the present case, each four) of heat conducting tubes, which are led from the first and second heat dissipation element 30, 30′ to the heat sink 36 and which both end in the latter. The respective second end regions 42, 42′ of the first and second heat pipe 32, 32′ end in the heat sink 36 and, in the present case, penetrate it completely when viewed in a transverse direction of the heat sink 36.

(27) The heat dissipation elements 30, 30′ may each be plate-shaped and comprise several recesses 46. The clamping elements 38, 38′ may comprise the same number of recesses 46 as the heat dissipation elements 30, 30′. Thus, the first end region 40 of the first heat pipe 32 can be enclosed by the first heat dissipation element 30 and the first clamping element 38. The first end region 40′ of the second heat pipe 32′ may be enclosed by the second heat dissipation element 30′ and the second clamping element 38′. In some exemplary embodiments, the first and/or second heat pipes 32, 32′ may be tubular.

(28) In FIG. 4, the clamping elements 38, 38′ are each attached to the respective heat dissipation element 30, 30′ by several screws 48. In other refinements, the clamping elements 38, 38′ may also be attached to the heat dissipation elements 30, 30′, for example by bolts.

(29) In the exploded view of the device 10 in FIG. 5, it can be seen that the respective first end regions 40, 40′ as well as the respective second end regions 42, 42′ of the first and second heat pipe 32, 32′ run in a straight line and are tapered at an outer end of the conical shaped heat pipe, respectively.

(30) The two heat dissipation elements 30, 30′ may be mounted to the optical unit 12 with several bolts 52 (not shown here). A fan mounting frame 50 may be mounted, e.g. using several screws, on the heat sink 36, which fan mounting frame 50 is adapted to provide a mounting platform for the fan 44.

(31) A heat-conducting paste for thermal coupling may also be applied between a surface of the first heat dissipation element 30, a surface of the first end region 40 of the first heat pipe 32 and a surface of the first clamping element 38. In other configurations, one or more heat-conducting pads and/or heat-conducting paste may be applied between the light sources 18, 18′ and the heat dissipating elements 30, 30′.

(32) FIGS. 6 and 7 show two refinements of the clamping element 38, 38′, wherein the clamping element 38 shown in FIG. 6 differs from the clamping element 38′ shown in FIG. 7 in that it comprises an additional notch 54 on one side of its rectangular outer edge. The notch 54 has no functional advantage but is of a purely constructive nature. As can be seen in FIGS. 6 and 7, the rectangular body of the clamping elements 38, 38′ is traversed in a transverse direction by the several semi-cylindrical recesses 46.

(33) FIG. 8 shows a perspective view of the heat pipes 32, 32′ in a state where the heat pipes 32, 32′ are soldered to the heat sink 36. It can be seen that the first end regions 40, 40′ of the heat pipes 32, 32′ are exposed, i.e. not clamped with the heat dissipation elements 30, 30′ and the clamping elements 38. FIG. 9 shows a sectional view of FIG. 8. It can be seen that the heat pipes 32, 32′ penetrate the cooling body 36 in a transverse direction and are soldered to it.

(34) FIG. 10 shows another sectional view of the heat pipes 32, 32′ in a clamped/screwed state. Here, the heat pipes 32, 32′ are clamped between the heat dissipation element 30, 30′ and the clamping element 38. In the present case, the clamping is done by screwing via the screws 48.