DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

Abstract

The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising: a distribution body, and a substrate holder, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the distribution body and the substrate holder are moveable relative to each other, wherein the distribution body has a distribution body length (l) and a distribution body width (w), and wherein the distribution body length (l) is smaller than the substrate holder length (L).

Claims

1. A distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising: a distribution body, and a substrate holder, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the distribution body and the substrate holder are moveable relative to each other, wherein the distribution body has a distribution body length and a distribution body width (w), and wherein the distribution body length is smaller than the substrate holder length (L).

2. The distribution system according to claim 1, comprising at least two distribution bodies being arranged on opposite sides of the substrate holder.

3. The distribution system according to claim 1, wherein the substrate holder length (L) is a multiple of the distribution body length.

4. The distribution system according to claim 1, comprising multiple distribution bodies being arranged adjacent to each other on a side of the substrate holder, wherein the sum of the distribution body length of the multiple distribution bodies is equal to or larger than the substrate holder length (L).

5. The distribution system according to claim 1, wherein the distribution body length amounts to about 50% or less of the substrate holder length (L), preferably about 20% or less of the substrate holder length (L).

6. The distribution system according to claim 1, wherein the distribution body width (w) is essentially equal to or larger than the substrate holder width (W).

7. The distribution system according to claim 1, wherein the distribution body is moveable relative to the substrate holder.

8. The distribution system according to claim 1, wherein the substrate holder is moveable relative to the distribution body.

9. The distribution system according to claim 1, further comprising a drive unit configured to move the distribution body and the substrate holder relative to each other.

10. The distribution system according to claim 9, wherein the drive unit is configured to move the distribution body and the substrate holder parallel or with an angle relative to each other.

11. (canceled)

12. The distribution system according to claim 9, wherein the drive unit is configured to drive the distribution body and/or the substrate holder.

13. The distribution system according to claim 9, wherein the drive unit is configured to drive a relative scanning motion between the distribution body and the substrate holder along the substrate holder length (L).

14. The distribution system according to claim 9, wherein the drive unit is configured to drive a relative agitation motion between the distribution body and the substrate holder along the substrate holder width (W) and/or along the substrate holder length (L).

15. The distribution system according to claim 1, wherein the openings of the distribution body comprise jet holes configured to direct the process fluid in the direction of the substrate holder.

16. The distribution system according to claim 1, wherein the openings of the distribution body comprise drain holes configured to drain off the process fluid from the substrate holder.

17. The distribution system according to claim 1, wherein the distribution body comprises at least one anode (12).

18. The distribution system according to claim 1, wherein the substrate holder and/or the substrate is the cathode.

19. The distribution system according to claim 1, further comprising: a rinsing unit configured to provide a liquid to rinse the substrate holder and/or the substrate, and/or a drying unit configured to provide a gas flow to dry the substrate holder and/or the substrate, wherein the rinsing unit and/or the drying unit is/are arranged at the distribution body or is/are provided as a separate part separate to the distribution body.

20. (canceled)

21. A processing line for a chemical and/or electrolytic surface treatment of a substrate, comprising: at least a distribution system according to claim 1, and at least a plating station, wherein the substrate is guided through the plating station in a transport direction (X), and wherein a surface of the substrate to be treated is arranged substantially perpendicular to the transport direction (X), or wherein the surface of the substrate to be treated is substantially aligned with the transport direction (X).

22. A distribution method for a chemical and/or electrolytic surface treatment of a substrate, comprising: providing a distribution body with several openings for a process fluid and/or an electric current, providing a substrate holder configured to hold the substrate to be treated, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W), the distribution body has a distribution body length and a distribution body width (w), and the distribution body length is smaller than the substrate holder length (L), and moving the distribution body and the substrate holder relative to each other.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Exemplary embodiments of the disclosure will be described in the following with reference to the accompanying drawings:

[0069] FIGS. 1a to 1c shows schematically and exemplarily an overview of the distribution system according to the disclosure, wherein a distribution body is moved relative to a substrate holder.

[0070] FIGS. 2a to 2c show schematically and exemplarily a distribution system according to the disclosure, wherein FIG. 2a shows a perspective view of a cross section of the distribution system, FIG. 2b shows an enlarged view of the detail II-b in FIG. 2a, and FIG. 2c shows a partial front view of FIG. 2b.

[0071] FIG. 3 shows schematically and exemplarily a perspective view of approximately a half of the distribution body according to the disclosure.

[0072] FIG. 4 shows schematically and exemplarily a top view of the substrate holder according to the disclosure mounted on a transport system.

[0073] FIG. 5 shows schematically and exemplarily a processing line for a surface treatment of a substrate, comprising the distribution system according to the disclosure.

[0074] FIG. 6 shows schematically and exemplarily part of the processing line of FIG. 5 in cross section.

[0075] FIGS. 7a and 7b show schematically and exemplarily an enlarged view of the detail VII in FIG. 6, wherein FIG. 7a is a front view in direction of the distribution body width and 7b is a side view along the distribution body length.

[0076] FIG. 8 shows schematically and exemplarily a processing line for a surface treatment of a substrate, comprising the distribution system according to the disclosure.

[0077] FIG. 9 shows schematically and exemplarily a processing line for a surface treatment of a substrate, comprising the distribution system according to the disclosure.

[0078] FIG. 10 shows a schematic and exemplary flow diagram of a distribution method according to the disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS

[0079] FIGS. 1a to 1c show schematically and exemplarily an embodiment of a distribution system 1 comprising a substrate holder 2 and a distribution body 3 for a process fluid 28 (see FIGS. 6 and 7) for a chemical and/or electrolytic surface treatment of a substrate 4. The substrate holder 2 and the distribution body 3 are arranged on a transport system 5 comprising two lateral guiding rails 6. FIGS. 1a to 1c show the substrate holder 2 holding the substrate 4 and the distribution body 3 is arranged above the substrate holder 2 and the substrate 4 in a Z-direction.

[0080] The substrate holder 2 is of a rectangular shape, a length L of which extends in an X-direction, and a width W extends substantially perpendicular to the length L, in a Y-direction. The distribution body 3 has a rectangular shape having a length 1 and a width w, wherein the length 1 extends in the same direction as the length L of the substrate holder 2, but the length 1 of the distribution body 3 is smaller than the length L of the substrate holder 2. The width w of the distribution body 3 is substantially equal to the width W of the substrate holder 2.

[0081] In this embodiment, the substrate holder 2 is fixed in position and the distribution body 3 is movable relative to the substrate holder along the X-direction, which is shown by the FIGS. 1a to 1c. Additionally, a movement of the distribution body 3 relative to the substrate holder 2 along the Y-direction is also possible. The movement along the X-direction corresponds to a scanning movement from one end of the substrate holder 2 to the other end thereby enabling the chemical and/or electrical surface treatment of the substrate while the movement along the Y- and/or Z-direction correspond to a low or even higher frequency agitation movement of the distribution body 3 relative to the substrate 4. FIGS. 1a to 1c show a horizontal mount of the substrate holder 2 and the distribution body 3, while a vertical arrangement would be also possible.

[0082] FIG. 2a shows schematically and exemplarily an embodiment of the distribution system 1 in a cross-sectional view of FIG. 1b, FIG. 2b shows an enlarged view of the detail II-b of FIG. 2a in a perspective view and FIG. 2c shows a partial enlarged front view of FIG. 2b. The distribution body 3 comprises jet holes 7 (see also FIG. 3) extending in the thickness direction Z such that the process fluid 28 exiting the jet holes 7 is directed substantially perpendicular to a surface 8 of the substrate 4 to be treated. Between adjacent jet holes 7, there are arranged through holes 9 functioning as drain holes allowing the process fluid 28 to flow from a front face 10 of the distribution body 3 to a rear face 11 of the distribution body 3. The front face 10 of the distribution body 3 corresponds to a surface facing towards the substrate 4 (and the substrate holder 2) while the rear face 11 is arranged opposite to the front face 10, thus facing away from the substrate 4. The distribution body 3 and the substrate 4 are spaced apart from each other.

[0083] Further, the distribution body 3 accommodates an anode 12 being one electrode of at least two electrodes to enable electrolytic treatment processes. The substrate holder 2 and/or the substrate 4 may act as a cathode 13 either by accommodating a cathode or by being connected to a cathode. For example, metal may be deposited on the substrate 4 by means of a galvanic reaction. The process fluid 28 is an electrolytic liquid and the electric field generated by the anode 12 and the cathode by means of the arrangement of the distribution body 3 comprising the anode 12 and the substrate 4 functioning as the cathode, always extends through the distribution body 3. By means of a suitable positioning of the distribution body 3 with regard to the substrate 4, regions of the substrate 4 may therefore be approached by the electrolytic liquid with a particularly uniform incoming flow and under a uniform electric field such that a reaction occurs uniformly at these locations.

[0084] FIG. 3 shows schematically and exemplarily a perspective view of approximately a half of the distribution body 3. The distribution body 3 comprises an inlet 13, a flow control array 14, the jet holes 7 and the through holes 9. The inlet 13 is an entry of the process fluid into the distribution body 3. The flow control array 14 is arranged upstream of the jet holes 7 and the drain holes 9 with respect to a flow of the process fluid 28 and comprises several flow control elements 15. The flow control elements 15 upstream of the jet holes 7 allows equilibrating the flow of the process fluid 28 towards the jet holes 7 resulting in a uniform flow distribution. The uniform flow distribution leads to a uniform treating process, e.g. a plating process, and uniform plating results on the substrate 4 without reducing the overall flow speed of the process fluid 28. The jet holes 7 may have a diameter of about 1 mm, and the drain holes 9 being located adjacent to the jet holes 7 may have a diameter of about 5 mm. Due to the different size relation of the drain holes 9 and the jet holes 7, the liquid pressure and the flow speed are much lower in the drain holes 9. The process fluid 28 having reached the rear face 11 is re-pumped into the inlet 13 by means of a pump (not illustrated).

[0085] FIG. 4 shows schematically and exemplarily a top view of the substrate holder 2 mounted on the guiding rails 6 of the transport system 5. The substrate holder 2 may be a vacuum substrate holder. The size of the substrate holder 2 depends on the size of the substrate 4, which can vary from 1500 mm?1850 mm to 2940 mm?3370 mm and more.

[0086] The transport system 5 may be part of a processing line 16 as schematically and exemplarily shown in FIG. 5. The processing line 16 comprises several chambers 17, each of which related to a predefined processing station. The processing line 16 as illustrated in FIG. 5 comprises the following stations: [0087] a starting station 18 for manually or automatically guiding the substrate holder 2 into the processing line 16, [0088] a mounting station 19 for mounting the substrate 4 to be treated to the substrate holder 2, [0089] a pre-wetting station 20 for pre-wetting the substrate 4 to reduce/eliminate and protect the substrate from surface-foreign particles and/or to avoid the formation of air-bubbles on the substrate, [0090] a treating station 21 for chemically and/or electrolytically treating, e.g. plating, the surface 8 of the substrate 4 by means of the distribution system 1, [0091] a rinsing station 22 for rinsing the substrate 4 with a rinsing fluid to wash off the process fluid which remains on the substrate 4, [0092] a drying station 23 for drying the substrate 4, [0093] a demounting station 24 for demounting the substrate 4 from the substrate holder 2, and [0094] an ending station 25 for manually or automatically guiding the substrate holder 2 out of the processing line 16.

[0095] The processing line 16 may comprise more or less processing steps. Additionally or alternatively, some of the processing steps may be included in one single chamber, e.g., the treating, the rinsing and the drying of the substrate 4. FIG. 6 shows schematically and exemplarily the pre-wetting station 20, the treating station 21, the rinsing station 22 and the drying station 23 of the processing line 16 of FIG. 5 in cross section, wherein the treating station 21 is configured as a plating station 21. The substrate 4 being mounted on the substrate holder 2 is guided by the guiding rails 6 of the transport system in a transport direction corresponding to the X-direction first in the pre-wetting station 20. In the pre-wetting station 20, the substrate is sprayed with a cleaning and/or pre-wetting liquid 26 exiting spray nozzles 27 to reduce/eliminate and protect from surface-foreign particles and/or to avoid the formation of air-bubbles on the substrate, and especially inside crevices present on the substrate surfaces 8 of substrate 4 to be treated.

[0096] Next, the substrate 4 enters the plating station 21. At the plating station 21, the substrate 4 is treated by means of the distribution body 3 as described above. When seen in the transport direction X, the length 1 of the distribution body 3 is smaller than the length L of the substrate 4. Thus, for treating the whole surface 8 of the substrate 4, the substrate 4, by means of the substrate holder 2, and/or the distribution body 3 need to be moved. It should be noted that FIG. 6 shows the distribution body 3 several times to highlight the difference in the length of the substrate 4 and the distribution body 3 in the X-direction.

[0097] According to an exemplary embodiment, the relative movement between the substrate holder 2 holding the substrate 4 and the distribution body 3 is realized by moving the substrate holder 2 holding the substrate 4 relative to the distribution body 3 being mounted in a substantially fixed position. The fixed position means that the distribution body 3 is not moveable in the X-direction but is still capable of performing agitation and therefore, movable in the Y-direction and/or Z-direction.

[0098] The substrate 4 being arranged above the distribution body 3, regarding the Z-direction, is moving along the transport direction X (see also FIG. 7a). As illustrated in the FIGS. 7a and 7b, while the substrate 4 is moved relative to the distribution body 3, the distribution body 3 discharges the process fluid 28 via the jet holes 7 with high speed towards the surface 8 to be treated, illustrated by the arrows 29. The process fluid 28 is supplied via the inlet 13, schematically illustrated by the arrow 30 in FIG. 7b. The process fluid 28, which fills the gap between the substrate 4 and the distribution body 3, returns via the drain holes 9 into a tank 31 containing the processing fluid 28, illustrated by the arrows 32. The distribution body 3 is at least partially immersed in the processing fluid 28, such that the anode 12 is fully immersed.

[0099] FIGS. 6, 7a and 7b illustrate an embodiment, wherein, in the Z-direction, the substrate 4 is arranged above the distribution body 3, and the distribution body 3 is at least partially immersed in the processing fluid 28 being stored in the processing fluid tank 31. As an alternative, the substrate 4 functioning as the cathode may be moved underneath the distribution body 3. As a further alternative, the substrate 4 may be arranged and moved between at least two distribution bodies 3, one distribution body 3 being arranged above the substrate 4 and the other distribution body 3 being arranged underneath the substrate 4.

[0100] FIGS. 6, 7a and 7b illustrate the processing line 16 being designed for a bottom-up processing. The bottom-up processing defines a processing, in which the substrate 4 is arranged such that a bottom side surface of the substrate 4 corresponds to the surface 8 to be treated, and wherein surface-treatment accessories, e.g. the spray nozzles 27, the distribution body 3, rinsing units 33, drying units 34, etc. are arranged underneath the substrate 4 with regard to the Z-direction. Further, the processing line 16 may be designed for a top-down processing and/or a double side processing. The top-down processing defines a processing, in which the substrate 4 is arranged such that a top side surface of the substrate 4 corresponds to the surface 8 to be treated and wherein the surface-treatment accessories are arranged above the substrate 4 with regard to the Z-direction. The double side processing defines a processing combining the bottom-up treatment and the top-down treatment, that means, the substrate 4 is arranged such that both opposite side surfaces, the bottom side surface and the top side surface, of the substrate each corresponds to the surface 8 to be treated. Therefore, for the double side processing, the surface-treatment accessories are arranged above as well as underneath the substrate 4 with regard to the Z-direction.

[0101] With reference back to FIG. 5, the processing line 16, can also be envisioned as a so called roll-to-roll process. Roll-to-roll processing is also known as web processing, reel-to-reel (R2R) processing and particularly allows processing of extremely long substrates, which are sufficiently flexible to be transported in rolls. In this case, the starting station 18 and the ending station 25 are designed for supplying and receiving a substantially rectangular substrate with an extremely long length, in a rolled-up status. For example, such substrates may have up to a few metres in width and may have up to several kilometres in length, e.g. 50 kilometres. In the field of electronic devices, roll-to-roll processing is defined as a process of creating electronic devices on a roll of flexible substrates, such as plastic or metal foils, and can be used for, e.g. the manufacturing of flexible or rollable displays.

[0102] According to another exemplary embodiment, the relative movement between the substrate holder 2 holding the substrate 4 and the distribution body 3 is realized by moving the distribution body 3 relative to the substrate holder 2 holding the substrate 4, being in a fixed position. The substrate 4 functioning as the cathode may be horizontally immersed in the process fluid 28. Regarding the Z-direction, the distribution body 3 is placed above the substrate 4, substantially parallel to the surface 8 to be treated and is movable in the X-direction allowing scanning the surface 8 of the substrate 4 from one end to the other end in the X-direction for treating the surface 8 of the substrate 4, e.g. by plating of a metal or a metal alloy onto the surface 8. As an alternative, the distribution body may be at least partially immersed, such that the anode 12 is immersed in the process fluid, and moved underneath the substrate holder 2 holding the substrate 4 with the surface 8 directed towards the distribution body 3. As a further alternative, the substrate 4 may be arranged between at least two distribution bodies 3, one distribution body 3 being arranged and moved above the substrate 4 and the other distribution body 3 being arranged and moved underneath the substrate 4.

[0103] In yet another embodiment, instead of placing the distribution body 3 substantially parallel to the surface 8 of the substrate 4, the distribution body 3 is placed substantially non-parallel to the surface 8 of the substrate 4 in order to provide for an additional design parameter to influence the deposition uniformity. Thus, the front face 10 of the distribution body 3 displays a variation in the distance from the substrate 4 in the X-direction.

[0104] For all above described embodiments, the vertical distance between the distribution body 3 and the substrate 4 is predefined for achieving a required electrolyte flow as well as a required current density distribution to obtain a high quality, uniform metal or metal alloy deposition. Further, the scanning speed, meaning the speed with which the relative movement is performed, is defined to mainly achieve the required plating thickness and uniformity distribution for the plating material, e.g. metal or metal alloy. Further, the applied current density, the deposition temperature, as well as the composition of the process fluid 28, e.g. concentration of the metal ions or ions from multiple metal species, are additional parameters for achieving a preferred plating speed and for defining the quality of the deposited layer. The scanning movement may be realized by moving the distribution body 3 and/or the substrate holder 2 by a drive unit (not illustrated).

[0105] Although, the anode 12 is described as being accommodated in the distribution body 3, thereby moving with the distribution body 3, the anode 12 may be provided separately from the distribution body 3 and/or in a stationary position.

[0106] With reference back to FIGS. 5 and 6, after the treatment of the surface 8 of the substrate 4 is finished, the substrate is moved to the rinsing station 22 comprising a rinsing unit 33 for rinsing the substrate 4, and the drying station 23 comprising a drying unit 34, e.g. a gas flow. Alternatively, the rinsing and drying of the substrate 4 may be performed in the plating station 21 in the same bath tank 31 by draining or replacing the process fluid 28 from the bath tank 31 as well as from the distribution body 3 with rinsing fluid, e.g. water. The drying may be performed by replacing the rinsing fluid with a gas flow, e.g. air or nitrogen flow through the distribution body 3. As an alternative, a separate second body, a rinse-and-drying body may follow the distribution body 3 in a certain distance performing the removal of the process fluid 28 residues with rinsing fluid and then drying the substrate 4. In an embodiment, the rinsing and/or drying of the substrate 4 may be performed on both sides of the substrate 4.

[0107] Instead of performing the relative movement only in one direction once, it is also possible to perform the relative movements as a back-and-forth movement, such that the distribution body 3 may scan the substrate 4 two or multiple times.

[0108] Furthermore, it should be noted that the front face 10 of the distribution body refers to the face directed towards the substrate 4, and the surface 8 refers to the surface to be treated, which is directed towards the distribution body 3. Thus, seen in the Z-direction, when the substrate 4 is arranged above the distribution body 3, the surface 8 to be treated corresponds to the bottom surface of the substrate 4 and the front face 10 corresponds to the top face of the distribution body 3. When the substrate 4 is arranged underneath the distribution body 3, the surface 8 to be treated corresponds to the top surface of the substrate 4 and the front face 10 corresponds to the bottom face of the distribution body 3. In other words, the front face 10 of the distribution body and the surface 8 of the substrate 4 are arranged facing each other.

[0109] FIGS. 8 and 9 show each an embodiment of the processing line 16 comprising several chambers 17, each of which is related to a predefined processing station. The processing line 16 as illustrated in FIG. 8 comprises the following stations: [0110] a starting station 18 for manually or automatically guiding the substrate holder 2 into the processing line 16, [0111] a mounting station 19 for mounting the substrate 4 to be treated to the substrate holder 2, [0112] a pre-wetting station 20 for pre-wetting the substrate 4 to reduce/eliminate and protect the substrate 4 from surface-foreign particles and/or to avoid the formation of air-bubbles on the substrate 4, [0113] a treating station 21 for chemically and/or electrolytically treating, e.g. plating, the surface 8 of the substrate 4 by means of the distribution system 1, [0114] a rinsing station 22 for rinsing the substrate 4 with a rinsing fluid to wash off the process fluid which remains on the substrate 4, [0115] a drying station 23 for drying the substrate 4, [0116] a demounting station 24 for demounting the substrate 4 from the substrate holder 2, and [0117] an ending station 25 for manually or automatically guiding the substrate holder 2 out of the processing line 16.

[0118] The processing line 16 may comprise more or less processing steps. Additionally or alternatively, some of the processing steps may be included in one single chamber, e.g., the treating, the rinsing and the drying of the substrate 4.

[0119] Contrary to the exemplary processing line 16 illustrated in FIG. 5, the processing line 16 illustrated in FIG. 8 is configured to treat the substrate 4 substantially vertically. This means that the substrate 4 is arranged substantially orthogonally to the overall transport direction (here, the X-direction) in the chambers 17. The means for treating and/or processing the substrate 4, further referred to as processing means, such as the spray nozzles 27 for pre-wetting the substrate 4, the distribution body 3 for treating the surface 8 of the substrate 4, the rinsing and drying units 33, 34 etc., are arranged correspondingly. Thus, the at least one distribution body 3 is arranged such that the scanning motion is performed along the Z-direction enabling a scanning of the surface 8 from top to bottom and/or from bottom to top of the substrate 4. The agitation movement is then performed in the Y- and/or X-direction. Also an additional agitation movement in the Z-direction, overlayed to the scanning motion can be envisioned.

[0120] Thus, according to the exemplary embodiment shown in FIG. 8, the starting station 18, the mounting station 19, the demounting station 24 and the ending station 15 are configured in the same way as the corresponding stations 18, 19, 24 and 25 as shown in FIG. 5. The pre-wetting station 20 may correspond to the pre-wetting station 20 of FIG. 5 or may be built to treat the substrate 4 in a mainly vertical direction.

[0121] The treating station 21 may be built in a way to enable vertical processing of the substrate 4, wherein the at least one distribution body 3 may be scanning the surface 8 of the substrate 4 from top to bottom or from bottom to top and/or in an agitated mode, back and forth.

[0122] The rinsing station 22 and the drying station 23 may also be built in a vertical design for treating the substrate in a mainly vertical direction.

[0123] In this embodiment, the substrate 4 can be immersed in an electrolyte bath, e.g. in the processing fluid 28, and at least one distribution body 3 is scanning the substrate 4 from top to bottom or from bottom to top. The overall deposition process can also be carried out by a multiple scan repeated from one direction to the other, or through alternate scanning from varying sides of the substrate 4. In this case, the processing fluid 28 is supplied through an immersion-type system, e.g. a separate tank filled with the processing fluid 28 (not illustrated), and/or additionally from within the at least one distribution body 3, dispensing the processing fluid 28 onto at least one of the surfaces 8. The implementation may also include two distribution bodies 3, one on each side, or multiple distribution bodies 3, with more than one on each side. Only the substrate areas in the vicinity of a distribution body are being plated with material.

[0124] Alternatively, the substrate 4 may be supplied with the processing fluid 28 only from within the at least one distribution body 3 dispensing the required processing fluid 28 onto at least one of the surfaces 8.

[0125] According to a further embodiment, the substrate 4 may be supplied with the processing fluid 28 through a processing fluid film being formed by a thin processing fluid film being distributed from the top of the substrate 4 flowing downwards, thereby uniformly wetting the surface 8 to be treated, e.g. like a waterfall of processing fluid 28, and/or from within the at least one distribution body 3, dispensing the processing fluid 28 onto at least one of the surfaces 8.

[0126] In other embodiments, the pre-wetting station 20 and the treating station 21 may be included in the same processing chamber 17, configured to process the substrate 4 in a mainly vertical direction. Additionally, or alternatively, the rinsing station 22, 22 and the drying station 23, 23 may be integrated in one processing chamber 17.

[0127] FIG. 9 shows an embodiment of the processing line 16 configured to move or guide a substrate 4 through fixed (stationary) arranged processing means for treating the surface 8 of the substrate 4. Thus, the surface 8 of the substrate 4 is processed by moving the substrate 4 relative to the processing means. In FIG. 9, the treating station 21 is configured as a plating station 21 and comprises two sub-plating stations 211, 212. It is also possible, that the plating station 21, 21 comprises less or more than two sub-plating stations.

[0128] In another embodiment, the processing line 16 only comprises one processing chamber 17 within which the pre-wetting station 20, 20, the plating station 21, 21, the rinsing station 22, 22 and the drying station 23, 23 are arranged such that pre-wetting, plating, rinsing and drying of the substrate 4 is carried out within one processing chamber 17. During pre-wetting, rinsing and drying of the substrate 4, the at least one distribution body 3 can be located in a parking position, e.g. at the bottom of the processing chamber 17.

[0129] In yet another embodiment, a vertical, or partly vertical, or a mixed horizontal and vertical roll-to-roll processing of the substrate 4 may be implemented. In such case, the starting station 18 and the ending station 25 may be designed for supplying and receiving a substantially rectangular substrate 4 with an extremely long length, in a rolled-up status. The processing chambers 17 may be applied especially in a mixed orientation, e.g. the pre-wetting station 20 can be in a mainly horizontal design and operation mode while all the other processing chambers 17 are in a vertical implementation. It may also be possible to arrange the individual processing stations in a way to be able to perform multiple subsequent plating steps to obtain a higher throughput, and/or a better plating uniformity, and/or to deposit or plate different materials in a subsequent manner (see FIG. 9).

[0130] FIG. 9 shows an exemplary embodiment combining all of the above. This means, the processing line 16 comprises only one processing chamber 17 having four sections, each corresponding to one of the pre-wetting station 20, the plating station 21, the rinsing station 22 and the drying station 23. The pre-wetting station 20 mixes vertical and horizontal processing, e.g. for combining immersion and spray for pre-wetting the substrate 4. The plating station 21 comprises two sub-plating stations 211, 212, which exemplarily perform a double-sided plating process.

[0131] The first sub-plating station 211 exemplarily and schematically shows the distribution system 1 arranged for vertically processing the substrate 4 double-sided. The second sub-plating station 212 exemplarily and schematically shows the distribution system 1 arranged for horizontally processing the substrate 4 double-sided. Between the first and the second sub-plating stations 211, 212, the substrate 4 is guided at an oblique angle, preferably of 45 degrees. The drying station 23 exemplarily and schematically shows a drying unit 34 arranged for vertically processing the substrate 4 double-sided.

[0132] It is to be noted that the embodiment as shown in FIG. 9 is only exemplary and may further include features of previously described embodiments. For example, the processing line 16 of FIG. 9 may be configured to process the substrate 4 single-sided. Furthermore, all possible variations described with regard to the FIGS. 5, 6, 7a and 7b are also applicable to the vertical and/or oblique and/or mixed horizontal, vertical and oblique configuration of the substrate as exemplarily illustrated in FIGS. 8 and 9.

[0133] FIG. 10 shows a flow diagram of an exemplary distribution method 100 for a chemical and/or electrolytic surface treatment of the substrate 4. According to the distribution method 100, in a step S1, there is provided a distribution body 3 comprising several openings, e.g. the jet holes 7 and the drain holes 9, for the process fluid 28 and/or an electric current. Further, in a step S2, there is provided a substrate holder 2 configured to hold the substrate 4 to be treated. The substrate holder 2 has the substrate holder length L and the substrate holder width W, the distribution body 3 has the distribution body length 1 and the distribution body width w, and the distribution body length 1 is smaller than the substrate holder length L. In a step S3, the distribution body 3 and the substrate holder 2 are moved relative to each other, thereby performing a surface treatment of the surface 8 of the substrate 4.

[0134] While the disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The disclosure is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed disclosure, from a study of the drawings, the disclosure, and the dependent claims.

[0135] In the claims, the word comprising does not exclude other elements or steps, and the indefinite article a or an does not exclude a plurality. A single unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.