PREPARATION OF NANOSTRUCTURED TITANIUM

Abstract

The present disclosure relates to the preparation of bulk nanostructured pure titanium at cryogenic temperatures using rolling, allowing the whole microstructures of pure titanium to be refined into the one that the mean grain size is smaller than 100 nm.

Claims

1. A method for preparing a bulk nanostructured pure titanium from a pure titanium plate comprising: providing at least one roller; injecting liquid nitrogen onto the pure titanium plate to cool down the pure titanium plate to a temperature between 125 C. and 50 C.; and rolling the cooled pure titanium plate by the at least one roller to form the bulk nanostructured pure titanium.

2. The method of claim 1, wherein the at least one roller includes two rollers respectively located on both sides of the pure titanium plate.

3. The method of claim 1, wherein the step of rolling has a rolling speed between 0.05 and 2 rad/min.

4. The method of claim 1, wherein the cooled pure titanium plate is rolled 15 to 30 times.

5. The method of claim 1, wherein the pure titanium plate has a thickness between 2 mm and 10 mm.

6. The method of claim 1, wherein the bulk nanostructured pure titanium comprises grain sizes of less than 100 nm.

7. The method of claim 1, wherein the liquid nitrogen is injected from at least one liquid nitrogen sprayer.

8. The method of claim 1, wherein the at least one liquid nitrogen sprayer includes two liquid nitrogen sprayers respectively located on both sides of one of the at least one roller.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0017] Embodiments of the present invention are described in more detail hereinafter with reference to the drawings, in which:

[0018] FIG. 1 shows a schematic diagram of rolling a pure titanium plate according to an embodiment of the presently claimed invention;

[0019] FIG. 2 shows a cross section diagram of a die with built-in channels for liquid nitrogen flow used in equal channel angular pressing according to an embodiment of the presently claimed invention;

[0020] FIG. 3A shows a photo of a cross section of an ECAP die according to an embodiment of the presently claimed invention;

[0021] FIG. 3B shows a photo of a cryogenic ECAP system according to an embodiment of the presently claimed invention;

[0022] FIG. 4A shows a TEM bright field image of a titanium processed at cryogenic temperature according to an embodiment of the presently claimed invention;

[0023] FIG. 4B shows a histogram of counts N on grain sizes according to an embodiment of the presently claimed invention;

[0024] FIG. 5 shows a tensile curve of a titanium plate processed by cryogenic rolling according to an embodiment of the presently claimed invention;

[0025] FIG. 6 shows a tensile curve of a titanium bar processed by cryogenic ECAP according to an embodiment of the presently claimed invention; and

[0026] FIG. 7 shows a tensile curve of a titanium bar processed by ECAP at room temperature.

DETAILED DESCRIPTION

[0027] In the following description, a bulk nanostructured pure titanium and the corresponding fabrication methods are set forth as preferred examples. It will be apparent to those skilled in the art that modifications, including additions and/or substitutions may be made without departing from the scope and spirit of the invention. Specific details may be omitted so as not to obscure the invention; however, the disclosure is written to enable one skilled in the art to practice the teachings herein without undue experimentation.

[0028] The present invention relates to the preparation of bulk nanostructured pure titanium at cryogenic temperatures using equal channel angular pressing and rolling, allowing the whole microstructures of pure titanium to be refined into the one that the mean grain size is smaller than 100 nm.

[0029] FIG. 1 shows a schematic diagram of rolling a pure titanium plate according to an embodiment of the presently claimed invention. The cryogenic rolling system 10 comprises two rollers 11a, 11b, and two liquid nitrogen (LN.sub.2) nozzles 12a, 12b. The LN.sub.2 nozzles 12a, 12b, located at both sides of the roller 11a, eject LN.sub.2 flows 14a, 14b towards a Ti plate 13 for cooling down the Ti plate 13 to a cryogenic temperature. The pure Ti plate 13 is cooled down to 125-50 C. by the LN.sub.2 flows 14a, 14b before being rolled by the two rollers 11a, 11b to form bulk nanostructured pure titanium.

[0030] The temperature of the pure titanium plates is controlled by the flow speed of LN.sub.2. Preferably, the thickness of the pure titanium plates is 2-5 mm, the rolling speed is 0.05-2 rad/min, and the rolling is carried out for 15-30 times at a percentage of reduction on thickness.

[0031] FIG. 2 shows a schematic diagram of a die with built-in channels for liquid nitrogen flow used in equal channel angular pressing according to an embodiment of the presently claimed invention. A cryogenic ECAP system 20 comprises an ECAP die 21 and a punch pin 22. The ECAP die 21 comprises an angular channel 23, LN.sub.2 channels 24a, 24b, and a LN.sub.2 inlet 25 and a LN.sub.2 outlet 26. The angular channel 23 is bent through an angle of 120 degree. A liquid nitrogen flow is injected into the LN.sub.2 channels 24a, 24b through the LN.sub.2 inlet 25 for cooling down the ECAP die 21, and then is released from the ECAP die 21 through the LN.sub.2 outlet 26. A pure Ti bar 27 is inserted into the angular channel 23, cooled down to 75-50 C. by the cooled ECAP die 21, and further pressed within the angular channel 23 by the punch pin 22 under cooling of the ECAP die 21 for forming a bulk nanostructured pure Ti bar.

[0032] The temperature of the pure titanium plates is controlled by the flow speed of LN.sub.2. Preferably, the diameter of pure titanium bar is 10-15 mm, the pressing speed is 4-10 mm/min, and the pressing is carried out for 2-3 times.

[0033] As shown in FIG. 3A, an ECAP die 30 comprises an angular channel 31, a plurality of LN.sub.2 channels 32, and LN.sub.2 inlet/outlet 33. A pure Ti bar 34 is pressed into the angular channel 31 by a punch pin 35. As shown in FIG. 3B, the ECAP die 30 is installed in an ECAP system 36.

[0034] At the room temperature or other elevated temperatures, titanium treated by ECAP usually possesses a mean grain size larger than 100-200 nm. On the contrary, the ECAP processing on titanium at cryogenic temperatures may prevent the small grains from growing into large grains. In addition, the ECAP processing on titanium at cryogenic temperatures could facilitate the deformation twinning, leading to further refinement of grains which have the sizes of several hundreds of nano-meters. Similar results are obtained through the rolling process at cryogenic temperatures. Accordingly, different ranges of cryogenic temperatures are used under the different processing methods that are able to optimize the mechanical properties of the processed titanium.

[0035] FIG. 4A shows a TEM bright field image of a titanium processed at cryogenic temperature. The corresponding processing process was shown as follows. Cryogenic rolling with a percentage reduction on the thickness of Ti plate of 2% was carried out for 15-30 times until the total percentage reduction of its thickness reached 91%. The average of temperatures at the Ti plates before and after rolling was 125 C. The rolling speed is 0.1 rad/min. FIG. 4B shows the corresponding histogram of counts N on grain sizes of the processed titanium. As shown in FIG. 4B, the grain sizes of most of the processed titanium are below 100 nm.

[0036] Mechanical testing was preformed in the present invention as mentioned below.

[0037] Commercial pure (CP) Ti (grade 2) with a thickness of 2 mm was used as the starting material. The as-received plate was cut into a rectangular shape with a width of 12 mm and a length of 100 mm. The average of temperatures at the Ti plates before and after rolling was 125 C. The rolling speed is 0.1 rad/min. Cryogenic rolling with a percentage reduction on the thickness of Ti plate of 1-2% was carried out for 15-30 times until the total percentage reduction on its thickness reached 91%. The mechanical strength of the processed titanium plate was tested. As shown in the tensile curve of FIG. 5, the processed titanium plate has mechanical strength larger than 750 MPa and ductility larger than 10%.

[0038] Commercial pure (CP) Ti (grade 2) was used as the starting material. The Ti bar with a diameter of 15 mm and length of 80 mm was loaded into the ECAP die channel before the die was cooled by the LN.sub.2. The ECAP processing was carried out on the Ti bar when the temperature of its top surface reached 75 C. The pressing speed is 4.2 mm/min. The Ti bar was subjected to ECAP processing with route BC for 3 passes. The mechanical strength of the processed titanium bar was tested. As shown in the tensile curve of FIG. 6, the processed titanium bar has mechanical strength in a range of 750-960 MPa and ductility larger than 10%.

[0039] For comparison, the mechanical properties of a Ti bar with a diameter of 10 mm treated by ECAP at room temperature were tested. As shown in FIG. 7, the processed Ti bar provides engineering stress with a range only with 750-875 MPa, which is lower than that of the Ti bar processed at cryogenic temperature.

[0040] The bulk nanostructured titanium with grain sizes smaller than 100 nm prepared by the present invention is applicable in medical implant application. More specifically, they are applied in orthopedic and cardiovascular devices, dental substitutes, and maxillofacial surgery and vascular stents.

[0041] The foregoing description of the present invention has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations will be apparent to the practitioner skilled in the art.

[0042] The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to understand the invention for various embodiments and with various modifications that are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the following claims and their equivalence.