Elastic wave device

Abstract

An elastic wave device includes a piezoelectric substrate, a first dielectric film disposed on the piezoelectric substrate, and an IDT electrode laminated on the first dielectric film. The resistivity of the piezoelectric substrate is equal to or lower than the resistivity of the first dielectric film. The resistivity of the first dielectric film is equal to or lower than about 110.sup.14 .Math.cm.

Claims

1. An elastic wave apparatus comprising: a piezoelectric substrate; a first dielectric film disposed on the piezoelectric substrate; and an interdigital transducer (IDT) electrode laminated on the first dielectric film; wherein resistivity of the piezoelectric substrate is equal to or lower than resistivity of the first dielectric film, and the resistivity of the first dielectric film is equal to or lower than about 110.sup.14 .Math.cm.

2. The elastic wave device according to claim 1, further comprising a second dielectric film that covers a periphery of the IDT electrode.

3. The elastic wave device according to claim 2, wherein the resistivity of the first dielectric film is lower than resistivity of the second dielectric film.

4. The elastic wave device according to claim 1, wherein the first dielectric film is disposed only directly under the IDT electrode.

5. The elastic wave device according to claim 1, wherein the first dielectric film is doped with an impurity.

6. The elastic wave device according to claim 5, wherein the impurity is boron or phosphorus.

7. The elastic wave device according to claim 2, wherein the first dielectric film is made of a material doped with an impurity and a material of the second dielectric film is doped with the impurity.

8. The elastic wave device according to claim 1, wherein the piezoelectric substrate is made of a material subjected to a reduction process.

9. The elastic wave device according to claim 1, wherein the piezoelectric substrate is made of one of piezoelectric single crystal and a piezoelectric ceramic.

10. The elastic wave device according to claim 1, wherein the resistivity of the first dielectric film is in a range of about 110.sup.12 to about 110.sup.14 .Math.cm.

11. The elastic wave device according to claim 1, wherein the first dielectric film is made of one of silicon oxide, silicon nitride, silicon oxynitride, aluminum nitride, tantalum oxide, titanium oxide, and aluminum oxide.

12. The elastic wave device according to claim 1, wherein the IDT electrode includes nickel-chrome, platinum, titanium, aluminum-copper, and titanium in this order.

13. The elastic wave device according to claim 1, wherein the IDT electrode is made of at least one of aluminum, copper, platinum, gold, silver, titanium, nickel, chromium, molybdenum, tungsten, and an alloy thereof.

14. The elastic wave device according to claim 1, further comprising reflectors provided on opposite ends of the piezoelectric substrate.

15. The elastic wave device according to claim 14, wherein the reflectors and the IDT electrode define a one-port surface acoustic wave resonator.

16. The elastic wave device according to claim 2, wherein the second dielectric film includes at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum nitride, tantalum oxide, titanium oxide, and aluminum oxide.

17. The elastic wave device according to claim 2, further comprising a protective film disposed on the second dielectric film.

18. The elastic wave device according to claim 17, wherein the protective film is a silicon nitride film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1A is a schematic elevational cross-sectional view of an elastic wave device according to a first preferred embodiment of the present invention, and FIG. 1B is a schematic plan view that illustrates an electrode structure thereof.

(2) FIG. 2 is a partially cutaway cross-sectional view that illustrates a main portion in the elastic wave device according to a variation of the first preferred embodiment of the present invention.

(3) FIG. 3 is a schematic elevational cross-sectional view of an elastic wave device according to a second preferred embodiment of the present invention.

(4) FIG. 4 is a partially cutaway cross-sectional view that illustrates a main portion in the elastic wave device according to a variation of the second preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(5) The present invention is clarified below by describing concrete preferred embodiments of the present invention with reference to the drawings. The preferred embodiments described in the specification are merely illustrative and not limiting, and it is noted that configurations can be partially replaced or combined between different preferred embodiments.

(6) FIG. 1A is a schematic elevational cross-sectional view of an elastic wave device according to a first preferred embodiment of the present invention. An elastic wave device 1 includes a piezoelectric substrate 2. The piezoelectric substrate 2 includes first and second principal surfaces 2a and 2b. A first dielectric film 3 is disposed on the first principal surface 2a of the piezoelectric substrate 2. An IDT electrode 4 is laminated on the first dielectric film 3.

(7) As the piezoelectric substrate 2, a substrate made of a piezoelectric single crystal, such as lithium tantalate (LiTaO.sub.3) or lithium niobate (LiNbO.sub.3), can be used. As the piezoelectric substrate 2, a substrate made of piezoelectric ceramics can also be used. Here, resistivity of the piezoelectric substrate 2 is equal to or lower than resistivity of the first dielectric film 3. Accordingly, in cases where static electricity is generated, the static electricity is able to be discharged to the piezoelectric substrate 2 side.

(8) The piezoelectric substrate 2 may preferably be obtained by dividing a wafer subjected to a reduction process. In the case where the piezoelectric substrate 2 is a substrate subjected to the reduction process, its resistivity is lower than that in the case where it is not the substrate subjected to the reduction process. Because the piezoelectric substrate in the present preferred embodiment is subjected to the reduction process, it has a lower resistivity, as described above, and the static electricity is able to be more effectively discharged to the piezoelectric substrate 2 side.

(9) The resistivity of the first dielectric film 3 in a preferred embodiment of the present invention preferably is equal to or lower than about 110.sup.14 .Math.cm, for example. In contrast to this, in the case where a traditional dielectric material, for example, silicon oxide, is used, the resistivity is approximately 110.sup.15 to 10.sup.16 .Math.cm. Accordingly, the resistivity of the first dielectric film 3 according to a preferred embodiment of the present invention is lower than that in the traditional case. The resistivity of the piezoelectric substrate 2 preferably is about 110.sup.7 to 110.sup.13 .Math.cm in an example case where the piezoelectric substrate 2 is made of LiNbO.sub.3 subjected to the reduction process.

(10) That is, the resistivity of the first dielectric film 3 in a preferred embodiment of the present invention is nearer to the resistivity of the piezoelectric substrate 2 than that made of the traditional dielectric material. Accordingly, if static electricity is generated in a manufacturing step or the like, the static electricity is able to be discharged to the piezoelectric substrate 2 side more easily. In a preferred embodiment of the present invention, the resistivity of the first dielectric film 3 may preferably be in the range of about 110.sup.12 to about 110.sup.14 .Math.cm, for example.

(11) The material of the first dielectric film 3 is not particularly limited, and it can be a dielectric material doped with an impurity. As that dielectric material, any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, aluminum nitride, tantalum oxide, titanium oxide, and aluminum oxide, may be used. Examples of the impurity may include boron (B) and phosphorus (P). In the case where the first dielectric film 3 is made of the dielectric material doped with the impurity, its resistivity is much nearer to the resistivity of the piezoelectric substrate 2. Preferably, the material of the first dielectric film 3 may be a material in which a dielectric material of a second dielectric film 7 described below is doped with the impurity. In that case, the manufacturing step can be simplified.

(12) In the present preferred embodiment, the IDT electrode 4 is made of a metal film in which nickel-chrome (NiCr), platinum (Pt), titanium (Ti), aluminum-copper (AlCu), and titanium (Ti) are laminated in this order from below. The IDT electrode 4 can be made of an appropriate metal material, for example, aluminum (Al), copper (Cu), platinum (Pt), gold (Au), silver (Ag), titanium (Ti), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), or an alloy whose principal component is any one of these metals. The IDT electrode 4 is not particularly limited. Like in the present preferred embodiment, a structure in which a plurality of metal films made of any of these metals or alloys are laminated may be used.

(13) Although schematically illustrated in FIG. 1A, an electrode structure illustrated in FIG. 1B is disposed on the piezoelectric substrate 2. That is, the IDT electrode 4 and reflectors 5 and 6 arranged on opposite sides in a propagation direction of the surface acoustic wave of the IDT electrode 4 are disposed and define a one-port surface acoustic wave resonator. The electrode structure including the IDT electrode in the present invention is not particularly limited. A combination of a plurality of resonators may define a filter. Examples of such a filter may include a ladder filter, longitudinally coupled resonator-type filter, and lattice filter.

(14) The IDT electrode 4 includes two comb-shaped electrodes 4A and 4B. Each of the comb-shaped electrodes 4A and 4B includes a plurality of electrode fingers. The electrode fingers in the comb-shaped electrode 4A and the electrode fingers in the comb-shaped electrode 4B interlock with each other.

(15) In a preferred embodiment of the present invention, the electromechanical coupling coefficient of an elastic wave excited by the IDT electrode 4 is able to be adjusted by adjustment of the thickness or composition of the first dielectric film 3.

(16) In the first preferred embodiment, the IDT electrode 4 is covered with the second dielectric film 7. The second dielectric film 7 is disposed on the first dielectric film 3. The presence of the second dielectric film 7 leads to improvement in the temperature characteristics. In addition, the resistivity of the first dielectric film 3 is lower than the resistivity of the second dielectric film 7. Accordingly, in cases where static electricity is generated, the static electricity is able to be discharged to the piezoelectric substrate 2 side through the first dielectric film 3.

(17) The material of the second dielectric film 7 is not particularly limited. As that material, silicon oxide, silicon nitride, silicon oxynitride, aluminum nitride, tantalum oxide, titanium oxide, and aluminum oxide, can be used. As described above, the material of the first dielectric film 3 may preferably be the material in which the dielectric material of the second dielectric film 7 is doped with the impurity. In that case, the first dielectric film 3 can have a resistivity lower than that of the second dielectric film 7 without significantly changing the manufacturing step.

(18) A silicon nitride film 8 being a protective film is disposed on the second dielectric film 7. In a preferred embodiment of the present invention, the protective film is able to disposed as needed.

(19) In the step of assembling the elastic wave device 1, static electricity may be generated by frictional charging or the like.

(20) If a traditional elastic wave device is charged with static electricity, a potential difference arises between one comb-shaped electrode and the other comb-shaped electrode in the IDT electrode, and this may cause electrostatic breakdown.

(21) In contrast to this, the elastic wave device 1 in the present preferred embodiment includes the first dielectric film 3 disposed between the piezoelectric substrate 2 and IDT electrode 4, as previously described. The resistivity of the piezoelectric substrate 2 is equal to or lower than the resistivity of the first dielectric film 3, and the resistivity of the first dielectric film 3 preferably is equal to or lower than about 110.sup.14 .Math.cm, for example.

(22) Thus, in the elastic wave device 1 according to the present preferred embodiment, the resistivity of the piezoelectric substrate 2 is reduced, and furthermore, the resistivity of the first dielectric film 3 is preferably near the resistivity of the piezoelectric substrate 2. Therefore, in cases where static electricity is generated by frictional charging or the like, it is able to be discharged to the piezoelectric substrate 2 side. That is, because charging the IDT electrode 4 with static electricity is able to be reduced, electrostatic breakdown is less likely to occur in the IDT electrode 4.

(23) In a preferred embodiment of the present invention, in a region where the electrode fingers in one comb-shaped electrode and the electrode fingers in the other comb-shaped electrode in the IDT electrode are engaged with each other, the first dielectric film may be positioned at least directly under the electrode fingers. Accordingly, as in a variation of the first preferred embodiment illustrated in FIG. 2, the first dielectric film 3 may be disposed only directly under the electrode fingers in the IDT electrode 4.

(24) In the variation of the first preferred embodiment illustrated in FIG. 2, the first dielectric film 3 and IDT electrode 4 are laminated in this order on the piezoelectric substrate 2. The first dielectric film 3 is disposed only directly under the electrode fingers in the IDT electrode 4. In addition, the second dielectric film 7 is disposed on the piezoelectric substrate 2 so as to cover the above first dielectric film 3 and IDT electrode 4.

(25) FIG. 3 is a schematic elevational cross-sectional view of an elastic wave device 21 according to a second preferred embodiment of the present invention. In the second preferred embodiment, the second dielectric film and silicon nitride film are not disposed. The other respects are the same as in the first preferred embodiment.

(26) In the elastic wave device 21 in the second preferred embodiment, the first dielectric film 3 and IDT electrode 4 are laminated in this order on a piezoelectric substrate 22. That is, the first dielectric film 3 is disposed between the piezoelectric substrate 22 and IDT electrode 4. The resistivity of the above piezoelectric substrate 22 is equal to or lower than the resistivity of the first dielectric film 3, and the resistivity of the first dielectric film 3 is equal to or lower than about 110.sup.14 .Math.cm, for example.

(27) Thus, in the second preferred embodiment, the resistivity of the first dielectric film 3 is made near to the resistivity of the piezoelectric substrate 22. Accordingly, in cases where static electricity is generated, the static electricity is able to be discharged to the piezoelectric substrate side. Therefore, the electrostatic breakdown of the IDT electrode is significantly reduced.

(28) In this configuration, the first dielectric film 3 may be disposed at least directly under the electrode fingers in the IDT electrode 4. This is because such an arrangement enables static electricity to be discharged to the piezoelectric substrate 22 side.

(29) Accordingly, advantages of preferred embodiments of the present invention can also be achieved by the adoption of the structure in which the first dielectric film 3 is disposed only directly under the electrode fingers in the IDT electrode 4 as in a variation of the second preferred embodiment illustrated in FIG. 4.

(30) While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.