APPARATUS FOR PRODUCING N-LAYER OPTICAL INFORMATION CARRIERS AND METHOD THEREFOR

Abstract

A device for manufacturing an n-layered optical information carrier having an injection molding unit for manufacturing a carrier body with a first information layer, and furthermore, a first embossing unit for manufacturing a second information layer. The second information layer has an input via which information carriers can be received in the embossing unit. The embossing unit moreover has an output unit via which the coated information carriers are output. (n2) additional embossing units are associated with the device, for manufacturing in each case an additional information layer, wherein n is greater than two. The respective units are linked to one another so that the n-layered information carrier is manufactured in an inline manufacturing. The (n2) additional embossing units can be coupled to and uncoupled from the device, wherein the additional embossing units in each case have an input and an output unit.

Claims

1. A device (1) for manufacturing an n-layered optical information carrier, comprising: an injection molding unit (10, 10) for manufacturing a carrier body with a first information layer; a first embossing unit (20) for manufacturing a second information layer, which comprises an input via which information carriers can be received in the embossing unit (20), wherein the embossing unit moreover comprises an output unit (27) via which the coated information carriers are output; and (n2) additional embossing units (20, 20), associated with device, for manufacturing in each case an additional information layer, wherein n is greater than two, and the respective units (10, 20; 10, 20) are linked to one another so that the n-layered information carrier is manufactured in an inline manufacturing, and that the (n2) additional embossing units (20) are coupled to and uncoupled from the device, wherein the additional embossing units (20, 20) in each case comprise an input and an output unit (27).

2. The device (1) according to claim 1, further comprising a control device which controls the manufacturing process.

3. The device (1) according to claim 2, wherein the control unit is programmed so that the change of the manufacturing process for manufacturing different multi-layered optical information carriers requires only a few setting steps.

4. The device (1) according to claim 1, wherein a coupling (5, 5) between the different additional embossing units (20) occurs in that the output unit (27) of one of the additional embossing units (20) is connected to the input of the next of the additional embossing units (20) in the arrangement.

5. The device (1) according to claim 1, wherein at least one uncoupled embossing unit (20) can be coupled to an additional injection molding unit (10), so that thereby an additional independent device (1) for manufacturing a multi-layered information carrier is formed.

6. The device (1) according to claim 5, further comprising a space for positioning the additional injection molding unit (10), in which the additional injection molding unit (10) is arranged and connected to the at least one uncoupled embossing unit (20).

7. A method for manufacturing an n-layered optical information carrier, comprising the following steps: manufacturing of a carrier body with a first information layer in an injection molding process, wherein the first information layer is provided with a reflective layer; application of a second information layer by means of an embossing process, wherein the second information layer is provided with a corresponding reflective layer; and application of (n2) additional information layers by means of the embossing process and providing each of the information layers with a corresponding reflective layer, wherein n is greater than two, wherein the n-layered information carrier is manufactured in an inline manufacturing, wherein each information layer, except for the first one, is manufactured on its own embossing unit (20), and the process is terminated after the last applied information layer by the application of a cover layer.

8. The method according to claim 7, wherein the manufacturing process is terminated after the application of two or more layers.

9. The method according to claim 8, further comprising removing unused embossing units (20) from the control system.

10. The method according to claim 9, wherein the embossing units (20) removed from the control system are supplied to an additional process and incorporated in terms of the control system in this additional process.

11. The method according to claim 10, wherein the embossing units (20) are not spatially moved during the uncoupling from the first process and the incorporation in an additional process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The invention is explained below in several embodiment examples.

[0028] FIG. 1 shows the diagrammatic setup of a device according to the invention with n=4.

[0029] FIG. 2 shows the layout of an embossing unit.

[0030] FIG. 3 shows the incorporation of an embossing unit in an additional device.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0031] FIG. 1 shows a device 1 for manufacturing a four-layered optical data carrier. During the injection molding in the injection molding unit 10, the first information layer is introduced into the carrier body. The injection molding unit 10 is connected via a transport device 5 to the first embossing unit 20. There, the second information layer is applied, and the carrier body is transferred via an additional transport device to the second embossing unit 20. There, in turn, the third information layer is applied, the information carrier is transferred by means of an additional transport device 5 to the fourth embossing unit 20, where it is provided with the fourth information layer and completed with a cover layer. By the arrangement of any desired number of embossing machines one after another in a row, an optical data carrier having any desired number of information layers can thus be manufactured in one manufacturing line.

[0032] In FIG. 2, an embossing unit 20 is explained in further detail based on an embodiment example. Via the transport device 5, the information carrier reaches the embossing unit 20. When the information carrier leaves the injection molding unit 10, then it is provided with a reflective coating in the metallization device 22. Subsequently, the embossing lacquer is coated in a coating device for the embossing 23. It has been found to be advantageous to carry out this coating in two steps. The first approximately 80% of the layer thickness is applied and cured; subsequently the rest of the lacquer is applied, so that, during the embossing process in the embossing device 21 where the lacquer is cured with the embossing matrix applied, less radiation, in particular less UV radiation, has to be introduced for the curing, so that the associated material stress of the carrier body is considerably reduced thereby. After the subsequent metallization in the device 22, the information carrier is checked for optical defects in the quality inspection device 26, and, if the result of the check is positive, it is deposited in the output unit 27 onto the transport device 5 which transfers the information carrier to the next embossing unit 20. When the process for manufacturing the layers is running in a stable manner, the quality inspection device 26 can also be removed from the process, and the quality control can occur only after the application of the last layer.

[0033] In the last embossing unit 20 in the device arrangement, the information carrier is supplied to the coating device for cover lacquer 24 after the metallization 22, in order to be supplied subsequently to the coating device for the surface protective layer 25. There, the surface is coated with a thin scratch-resistant layer. After passing the quality inspection device 26, in which the optical information carrier is checked in particular for optical defects, the information carrier in the output unit 27 is stored on an output station on which no transport device 5 is arranged.

[0034] In the example shown in FIG. 3, the device 1 from FIG. 1 is converted for the manufacturing of a two-layered optical information carrier. Here, the last two embossing units 20 have been uncoupled. In each case, an additional injection unit 10 has been associated with these embossing units 20 and connected to a transport device 5. Thus, starting from the previous device for manufacturing a four-layered optical data carrier, three devices for manufacturing a two-layered information carrier 1, 1 can be manufactured. In this way, the individual embossing units 20, 20 can be used in a versatile manner, which leads to a higher workload and thus to a more advantageous manufacturing in terms of unit cost.