INTEGRATED MICROWAVE THERMAL ANTI-ICING SYSTEM
20230002064 · 2023-01-05
Inventors
- Steven M. Kestler (San Diego, CA, US)
- Joseph V. Mantese (Ellington, CT, US)
- Gurkan Gok (Milford, CT, US)
Cpc classification
H05B2214/02
ELECTRICITY
B64D15/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
B64D29/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An assembly is provided for a structure. This assembly includes a composite skin and a thermal anti-icing system. The composite skin extends between an exterior surface and an interior surface. The thermal anti-icing system includes a susceptor and a waveguide. The susceptor and the waveguide are integrated into the composite skin between the exterior surface and the interior surface. The waveguide is configured to direct microwaves to the susceptor for melting and/or preventing ice accumulation on the exterior surface.
Claims
1. An assembly for a structure, comprising: a composite skin extending between an exterior surface and an interior surface; and a thermal anti-icing system comprising a susceptor and a waveguide, the susceptor and the waveguide integrated into the composite skin between the exterior surface and the interior surface, and the waveguide configured to direct microwaves to the susceptor for melting and/or preventing ice accumulation on the exterior surface.
2. The assembly of claim 1, wherein the composite skin extends between the exterior surface and the interior surface without interruption.
3. The assembly of claim 1, wherein the susceptor is arranged between the waveguide and the exterior surface.
4. The assembly of claim 1, wherein the composite skin comprises a first layer, a second layer and a third layer between the first layer and the second layer; the first layer comprises the susceptor; and the second layer comprises the waveguide.
5. The assembly of claim 4, wherein the third layer comprises microwave transparent material.
6. The assembly of claim 1, wherein the composite skin comprises a plurality of layers; a first of the plurality of layers comprises the susceptor and the waveguide; and the waveguide is laterally spaced from the susceptor within the first of the plurality of layers.
7. The assembly of claim 6, wherein a second of the plurality of layers comprises microwave transparent material.
8. The assembly of claim 1, wherein at least one of the susceptor or the waveguide comprises metal.
9. The assembly of claim 1, wherein the susceptor comprises fiber reinforcement within a polymer matrix.
10. The assembly of claim 1, wherein the thermal anti-icing system further comprises a reflector configured to reflect microwaves travelling away from the susceptor and the exterior surface back towards the susceptor.
11. The assembly of claim 10, wherein the reflector is integrated into the composite skin between the exterior surface and the interior surface.
12. The assembly of claim 10, wherein the reflector is arranged between the interior surface and the waveguide.
13. The assembly of claim 10, wherein the reflector comprises metal.
14. The assembly of claim 1, wherein the microwaves are transmitted at a frequency between one gigahertz (1 GHz) and ten gigahertz (10 GHz).
15. The assembly of claim 1, wherein the microwaves are transmitted at a frequency between forty gigahertz (40 GHz) and eighty gigahertz (80 GHz).
16. The assembly of claim 1, wherein the microwaves are transmitted at a frequency between twenty gigahertz (20 GHz) and twenty-five gigahertz (25 GHz).
17. The assembly of claim 1, wherein the microwaves are transmitted at a frequency between one-hundred and fifty gigahertz (150 GHz) and two-hundred gigahertz (200 GHz).
18. The assembly of claim 1, further comprising: a nacelle inlet structure for an aircraft propulsion system; the nacelle inlet structure comprising the composite skin.
19. An assembly for an aircraft propulsion system, comprising: a nacelle structure including a skin that forms an exterior surface of the nacelle structure, the skin formed by a plurality of layers of material bonded together; and a thermal anti-icing system comprising a susceptor and a waveguide, the susceptor formed by at least a portion of a first of the plurality of layers of material, the waveguide formed by at least a portion of a second of the plurality of layers of material, and the waveguide configured to direct microwaves to the susceptor for melting and/or preventing ice accumulation on the exterior surface.
20. An assembly for an aircraft propulsion system, comprising: a nacelle structure including a skin that forms an exterior surface of the nacelle structure, the skin including a susceptor, a waveguide and a reflector; and a thermal anti-icing system configured to direct microwaves through the waveguide to the susceptor for melting and/or preventing ice accumulation on the exterior surface, wherein the reflector is configured to direct stray microwaves back towards the susceptor.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0029]
[0030]
[0031]
[0032]
[0033]
[0034]
[0035]
DETAILED DESCRIPTION
[0036]
[0037] The aircraft structure 22 includes at least one exterior skin 26; e.g., a multi-layered, composite skin. This exterior skin 26 is configured to form an exterior surface 28 of the aircraft structure 22 such as an aerodynamic flow surface. The exterior skin 26, for example, may be configured with a nacelle of a propulsion system for the aircraft; e.g., the aircraft structure 22 may be a nacelle structure. The exterior skin 26, more particularly, may be configured as or otherwise included as part of a noselip of the nacelle. Alternatively, the exterior skin 26 may be configured with another component/structure of the aircraft such as its fuselage or a wing.
[0038] The aircraft structure 22 and its exterior skin 26 extend laterally in a first direction (e.g., an x-axis direction) along an x-axis. The aircraft structure 22 and its exterior skin 26 extend laterally in a second direction (e.g., a y-axis direction) along a y-axis. The aircraft structure 22 and its exterior skin 26 extend vertically in a vertical direction (e.g., a z-axis direction) along a z-axis. Note, the term “lateral” may be used herein to generally describe the first lateral direction, the second lateral direction and/or any other direction within the x-y plane. Also note, the term “vertical” may be used herein to describe a depthwise panel direction and is not limited to a gravitational up/down direction. Furthermore, for ease of illustration, the x-y plane is shown as a generally flat plane. However, in other embodiments, the x-y plane and, thus, the aircraft structure 22 and/or its exterior skin 26 may be curved and/or follow an undulating geometry. For example, the x-y plane and, thus, the aircraft structure 22 and/or its exterior skin 26 may be arcuate, cylindrical, conical, frustoconical, or tapered with or without radial undulations. In such embodiments, a solely vertical direction (e.g., z-axis direction) may be defined relative to a position of interest on the x-y plane. For example, on a spherical x-y plane, the vertical direction (e.g., z-axis) direction is a radial direction.
[0039] The exterior skin 26 is configured as a relatively thin body that extends laterally within the x-y plane. The exterior skin 26 has a vertical thickness 30. This skin vertical thickness 30 extends vertically between opposing side surfaces 32 and 34 of the exterior skin 26, where the skin exterior surface 32 may form the structure exterior surface 28. The exterior skin body may be solid, non-porous vertically between the skin exterior surface 32 and the skin interior surface 34. Material(s) of the exterior skin 26 may thereby extend between the skin exterior surface 32 and the skin interior surface 34 without any interruptions; e.g., pores, voids, chambers, cavities and/or any other types of apertures. The present disclosure, however, is not limited to such an exemplary solid, non-porous exterior skin configuration.
[0040] The thermal anti-icing system 24 is configured to melt and/or prevent ice accumulation on the exterior surface 28, 32. The thermal anti-icing system 24 of
[0041] The susceptor 36 is configured to absorb electromagnetic energy (e.g., microwave radiation, also referred to as “microwaves”) and convert that absorbed electromagnetic energy into heat. The susceptor 36, for example, may be configured as a thin layer (or strip, or wire) of material. Examples of the susceptor material may include, but are not limited to: indium tin oxide (ITO); aluminum (Al) or an alloy thereof; ferrous metal such as stainless steel; titanium (Ti) or an alloy thereof; Inconel alloys; chromium (Cr) or an alloy thereof; graphite; composites of metal(s) and ceramic(s) (e.g., cermets); doped silicon carbide; and/or metal oxide(s). Another example of the susceptor material includes (e.g., fiber) reinforcement material within a polymer matrix, where a thickness of the susceptor material may be sized to be about or exactly one-quarter (¼) of the wavelength of the microwaves generated by the microwave system 38. An example of the reinforcement material is fiberglass. An example of the polymer matrix is thermoset epoxy resin. The present disclosure, however, is not limited to the foregoing exemplary susceptor materials.
[0042] The microwave system 38 includes a microwave source 40 and a microwave transmission system 42. The microwave source 40 may be configured to generate microwaves at a frequency of, for example, between 2.3 gigahertz (GHz) and 2.6 gigahertz; e.g., at exactly or about (e.g., +/−0.01 or 0.02) 2.45 gigahertz (GHz). Of course, in other embodiments, the microwave source 40 may generate the microwaves at a frequency at or above 2.6 gigahertz and/or at a frequency at or below 2.3 gigahertz. For example, the microwave source 40 may be configured to generate microwaves at a frequency between one and ten gigahertz; e.g., between one and three gigahertz, or more specifically between 2.2 and 2.7 gigahertz for example. The microwave source 40 may also or alternatively be configured to generate microwaves at a frequency between fifteen and thirty gigahertz; e.g., between twenty and twenty-five gigahertz. The microwave source 40 may also or alternatively be configured to generate microwaves at a frequency between forty and eighty gigahertz; e.g., between 60 and 77 gigahertz. The microwave source 40 may also or alternatively be configured to generate microwaves at a frequency between one-hundred and forty (140) and two-hundred and ten (210) gigahertz; e.g., between one-hundred and fifty (150) and two-hundred (200) gigahertz.
[0043] The microwave source 40 may be configured as or otherwise include a vacuum electron device (VED) such as, but not limited to, a magnetron, a klystron and a gyrotron. The microwave source 40 may alternatively be configured as or otherwise include a solid state device; e.g., a solid state microwave source. Such a solid state device may include one or more radio-frequency (RF) transistors configured to generate the microwaves. Generally speaking, a solid state device may have some advantages over a vacuum electron device. For example, a solid state device may require less (e.g., 10-100× less) operational power than a vacuum electron device; e.g., 20-50 volts versus 4000 volts. A solid state device may have a longer useful lifetime than a vacuum electron device; e.g., 15-20 plus years versus 500-1000 hours. A solid state device may have a lower mass and, thus, weigh less than a vacuum electron device. A solid state device may have improved control over a vacuum electron device.
[0044] The microwave source 40 may be configured to generate a continuous output (e.g., stream) of the microwaves. The microwave source 40 may also or alternatively be configured to generate an intermittent (e.g., pulsed) output of the microwaves.
[0045] The microwave transmission system 42 is configured to transmit the microwaves generated by the microwave source 40 to a desired location or locations. The microwave transmission system 42 is further configured to selectively direct the microwaves at/to the susceptor 36 as described below in further detail.
[0046] The microwave transmission system 42 of
[0047] The waveguides 44 may be configured as dielectric waveguides. Examples of a dielectric waveguide include, but are not limited to, a microstrip, a coplanar waveguide and a stripline. Each waveguide 44, for example, may be configured as a layer (or strip, or wire) of material. This waveguide material may be metal such as, but not limited to, indium tin oxide (ITO). The waveguide material may be a fluoropolymer such as, but not limited to, polytetrafluoroethylene (PTFE) (e.g., Teflon® material) or polyvinylidene fluoride (PVDF). The waveguide material may also or alternatively include other polymeric materials and/or ceramics. The present disclosure, however, is not limited to the foregoing exemplary waveguide materials.
[0048] One or more of the waveguides 44 (e.g., the upstream waveguide 44A) may be at least partially or completely covered by an insulating material 46. This insulating material 46 is a microwave resistive material such as, but not limited to, metal or alumina (e.g., Al.sub.2O.sub.3) or silica (e.g., SiO.sub.3). The present disclosure, however, is not limited to the foregoing exemplary insulating materials.
[0049] Referring to
[0050] The exterior skin 26 of
[0051] The interior skin layer 48B may form the skin interior surface 34. The exterior skin layer 48A may form the exterior surface 28, 32. The intermediate skin layers 48C-D are arranged sequentially vertically between the other skin layers 48A and 48B.
[0052] At least one of the skin layers 48 (e.g., 48C) may at least partially or completely form the susceptor 36. The (e.g., exterior) intermediate skin layer 48C of
[0053] The susceptor 36 of
[0054] Referring again to
[0055] The downstream waveguide 44B of
[0056] Referring again to
[0057] Each of the skin layers 48 has a vertical thickness along the z-axis. The susceptor layer 52 vertical thickness may be equal to or different (e.g., less or greater) than the vertical thicknesses of any one or more of the remaining skin layers 48. Generally speaking, the susceptor layer 52 vertical thickness is selected based on a frequency of interest of the electromagnetic radiation. The susceptor layer 52 vertical thickness may also or alternatively be selected to be one-quarter (¼) of a wavelength of the electromagnetic radiation at the frequency of interest. The waveguide layer 56 vertical thickness may similarly be equal to or different (e.g., less or greater) than the vertical thicknesses of any one or more of the remaining skin layers 48. The present disclosure, however, is not limited to such exemplary susceptor and/or waveguide layer vertical thicknesses.
[0058] The intermediate skin layer 48C is described above as forming the susceptor 36. The present disclosure, however, is not limited to such an exemplary construction. In some embodiments, for example referring to
[0059] The intermediate skin layer 48E is described above as forming the downstream waveguide 44B. The present disclosure, however, is not limited to such an exemplary construction. In some embodiments, for example referring to
[0060] During operation of the thermal anti-icing system 24 of
[0061] Referring to
[0062] The reflector 66 may be configured as a layer (or strip) of material. This reflector material may be metal such as, but not limited to, indium tin oxide (ITO). Typically, the reflector material has a conductance of less than one ohm-per-square inch (1 Ω/in.sup.2). The present disclosure, however, is not limited to the foregoing exemplary reflector materials or reflector conductance.
[0063] The reflector 66 of
[0064] The exterior skin 26 of
[0065] The reflector 66 of
[0066] Referring to
[0067] The reflector layer 68 vertical thickness may be equal to or different (e.g., less or greater) than the vertical thicknesses of any one or more of the remaining skin layers 48.
[0068] In some embodiments, each of the thermal anti-icing system components 36, 44B and 66 may be formed by or otherwise includes in a discrete one of the skin layers 48 of the exterior skin 26; e.g., see
[0069] In some embodiments, the microwave source 40 of
[0070] In addition to facilitating heating of the exterior skin 26, the thermal anti-icing system 24 of the present disclosure is also relatively resistant to foreign object damage (FOD). For example, during operation, the aircraft structure 22 of
[0071]
[0072] The inlet structure 72 of
[0073] While the exterior skin 26 and the thermal anti-icing system 24 is described above as being configured with the inlet structure 72, the present disclosure is not limited to such an exemplary application. Rather, the exterior skin 26 and the thermal anti-icing system 24 of the present disclosure may be configured with any aircraft structure which would benefit from including de-icing capability. Furthermore, the exterior skin 26 and the thermal anti-icing system 24 of the present disclosure may alternatively be configured for non-aircraft applications. For example, the exterior skin 26 may form an exterior surface of an airfoil such as, but not limited to, a wind turbine blade. In another example, the exterior skin 26 may for an exterior surface of another type of vehicle that would benefit from anti-icing; e.g., an automobile, a boat, etc.
[0074] While various embodiments of the present invention have been disclosed, it will be apparent to those of ordinary skill in the art that many more embodiments and implementations are possible within the scope of the invention. For example, the present invention as described herein includes several aspects and embodiments that include particular features. Although these features may be described individually, it is within the scope of the present invention that some or all of these features may be combined with any one of the aspects and remain within the scope of the invention. Accordingly, the present invention is not to be restricted except in light of the attached claims and their equivalents.