POWER SEMICONDUCTOR MODULE

Abstract

Power semiconductor module, including a base plate with at least one substrate located on the base plate, wherein an electronic circuit is provided on the at least one substrate, wherein located on the at least one substrate are electrical connectors comprising a DC+ power terminal, a DC power terminal and an AC power terminal and further a control connector, wherein the power semiconductor module is designed as a half-bridge module including a first amount of switching power semiconductor devices and a second amount of switching power semiconductor devices, wherein the base plate includes a contact area, a first device area and a second device area, wherein the contact area is positioned in a center of the base plate such, that the first device area is positioned at a first side of the contact area and that the second device area is positioned at a second side of the contact area, the second side being arranged opposite to the first side, wherein the DC+ power terminal, the DC power terminal, the AC power terminal and the control connector are positioned in the contact area, wherein the first amount of switching power semiconductor devices is positioned in the first device area and wherein the second amount of switching power semiconductor devices is positioned in the second device area, wherein all the power semiconductor devices in the first device area are located in two parallel lines being aligned parallel to the width of the base plate and wherein all the power semiconductor devices in the second device area are located in two parallel lines being aligned parallel to the width of the base plate.

Claims

1. A power semiconductor module, comprising a base plate with at least one substrate located on said base plate, wherein an electronic circuit is provided on said at least one substrate, wherein located on the at least one substrate are electrical connectors comprising a DC+ power terminal, a DC power terminal and an AC power terminal and further a control connector, wherein the power semiconductor module is designed as a half-bridge module comprising a first amount of switching power semiconductor devices and a second amount of switching power semiconductor devices, wherein the base plate comprises a contact area, a first device area and a second device area, wherein the contact area is positioned in a center of the base plate such, that the first device area is positioned at a first side of the contact area and that the second device area is positioned at a second side of the contact area, the second side being arranged opposite to the first side, wherein the DC+ power terminal, the DC power terminal, the AC power terminal and the control connector are positioned in the contact area, wherein the first amount of switching power semiconductor devices is positioned in the first device area and wherein the second amount of switching power semiconductor devices is positioned in the second device area, wherein all the power semiconductor devices in the first device area are located in two parallel lines being aligned parallel to the width of the base plate and wherein all the power semiconductor devices in the second device area are located in two parallel lines being aligned parallel to the width of the base plate, and wherein the distance between any power semiconductor device and any of the fixing positions of the DC+ power terminal, the DC power terminal and the AC power terminal is 6 mm, the connecting area has a length in the range of 15 mm to 40 mm, at least one of the first device area and the second device area has a length in the range of 20 mm to 40 mm.

2. The power semiconductor module according to claim 1, wherein the first amount of switching power semiconductor devices comprises IGBT devices and diodes and that the second amount of switching power semiconductor devices comprises IGBT devices and diodes.

3. The power semiconductor module according to claim 2, wherein the IGBT devices and the diodes are arranged such, that all IGBT devices are located in a first line of each device area being aligned parallel to the width of the base plate, and that all diodes are provided in a second line of each devices area being aligned parallel to the width of the base plate.

4. The power semiconductor module according to claim 1, wherein the DC+ power terminal and the DC power terminal are guided to the first side of the power semiconductor module and in that the AC power terminal is guided to the second side of the power semiconductor module.

5. The power semiconductor module according to claim 1, wherein the control connector is connected to he substrate by bond wires.

6. (canceled)

7. (canceled)

8. (canceled)

9. The power semiconductor module according to claim 1, wherein the connecting area is formed rectangular.

10. The power semiconductor module according to claim 1, wherein four substrates are positioned on the base plate, wherein each substrate carries a part of the electric circuit.

11. The power semiconductor module according to claim 1, wherein at least two substrates are arranged identically.

12. The power semiconductor module according to claim 2, wherein the DC+ power terminal and the DC power terminal are guided to the first side of the power semiconductor module and in that the AC power terminal is guided to the second side of the power semiconductor module.

13. The power semiconductor module according to claim 3, wherein the DC+ power terminal and the DC power terminal are guided to the first side of the power semiconductor module and in that the AC power terminal is guided to the second side of the power semiconductor module.

14. The power semiconductor module according to claim 2, wherein the control connector is connected to the substrate by bond wires.

15. The power semiconductor module according to claim 3, wherein the control connector is connected to the substrate by bond wires.

16. The power semiconductor module according to claim 4, wherein the control connector is connected to the substrate by bond wires.

17. The power semiconductor module according to claim 2, wherein the connecting area is formed rectangular.

18. The power semiconductor module according to claim 3, wherein the connecting area is formed rectangular.

19. The power semiconductor module according to claim 4, wherein the connecting area is formed rectangular.

20. The power semiconductor module according to claim 2, wherein four substrates are positioned on the base plate, wherein each substrate carries a part of the electric circuit.

21. The power semiconductor module according to claim 3, wherein four substrates are positioned on the base plate, wherein each substrate carries a part of the electric circuit.

22. The power semiconductor module according to claim 2, wherein at least two substrates are arranged identically.

23. The power semiconductor module according to claim 3, wherein at least two substrates are arranged identically.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0041] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.

[0042] In the drawings:

[0043] FIG. 1 shows a schematic view onto a part of a power semiconductor module; and

[0044] FIG. 2 shows a schematic view to the power semiconductor module according to FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

[0045] Within the following description of the drawings, the same reference numbers refer to the same components. Generally, only the differences with respect to the individual embodiments are described. When several identical items or parts appear in a figure, not all of the parts have reference numerals in order to simplify the appearance.

[0046] FIGS. 1 and 2 show a view of a power semiconductor module 10. FIG. 1 shows the top view of the power semiconductor module 10 without the power and auxiliary terminals and the gate print.

[0047] The power semiconductor module 10 comprises an electronic circuit being provided on a base plate 12, wherein located on the base plate 12 are electrical connectors comprising a DC+ power terminal 14, a DC power terminal 16 and an AC power terminal 18. With this regard, FIG. 1 shows only the positions 14, 16, 18 at which the respective power terminals 14, 16, 18 shall be fixed and thus the fixing positions 14, 16, 18. Further, the positions are shown at which the control circuit should be located. With this regard, connecting positions 20 are shown which are designed for receiving the gate conductor and connecting positions 22 are shown which are designed for receiving the emitter conductor.

[0048] In detail, the base plate 12 carries four substrates 11, 13, 15, 17 which carry the respective positions 14, 16, 18, 20, 22.

[0049] It is further shown that the power semiconductor module 10 is designed as a half-bridge module and thus comprises a first amount 24 of switching power semiconductor devices 26, 28 and a second amount 30 of switching power semiconductor devices 32, 34. The first amount 24 may be called low side switch and the second amount 30 may be called high side switch.

[0050] It is further provided that the base plate 12 comprises a contact area 36, a first device area 38 and a second device area 40, wherein the contact area 36 is positioned in a center of the base plate 10 such, that the first device area 38 is positioned at a first side of the contact area 36 and that the second device area 40 is positioned at a second side of the contact area 36, the second side being arranged opposite to the first side. Like can be seen, the DC+, DC and AC power terminals and the control connectors are positioned in the contact area 36, wherein the first amount 24 of switching power semiconductor devices 26, 28 is positioned in the first device area 38 and wherein and the second amount 30 of switching power semiconductor devices 32, 34 is positioned in the second device area 40. With regard to the power semiconductor devices 26, 28, 32, 34, it may be provided that the devices 26, 34 are diodes and that the devices 28, 32 are IGBTs. Further, it is shown that all the chips or power semiconductor devices 26, 28, 32, 34, respectively are arranged such, that they are located on a line 42, 44, 46, 48 being aligned parallel to the width of the base plate (12) and thus essentially perpendicular to the current flow. Each device area 38, 40 may comprise one geometric line 44, 46 being aligned parallel to the width of the base plate (12) in which diodes as power semiconductor devices 26, 34 are provided and a further geometric line 42, 48 being parallel to the line 44, 46 in which IGBT devices as power semiconductor devices 28, 32 are provided and thus as well being aligned parallel to the width of the base plate (12). The geometric lines 42, 48 defined the location of diodes as power semiconductor devices 42, 48. These lines 42, 44, 46, 48 are further parallel to a geometrical central line 50 which proceeds through the center of the contact area 36 and which is parallel to the width of the base plate (12) and which may symmetrically divide the base plate 12 in a part carrying the first device area 38 and a part carrying the second device area 40.

[0051] FIG. 2 further shows that the DC+ and DC power terminals 14, 16 are guided to the first side and in that the AC-terminal 18 is guided to the second side.

[0052] Therefore, the contacts of the outer DC+ and DC power terminal 14, 16 are on the left. The contacts of the outer AC power terminal 18 is on the right. The DC+ and DC power terminals 14, 16 are guided low inductively to the center of the power semiconductor module 10 and exemplarily to the contact area 36. Also the AC power terminal 18 is guided towards the center of the power semiconductor module 10 and exemplarily to the contact area 36. All control signals are also guided via a gate print to the center of the power semiconductor module 10 and exemplarily to the contact area 36.

REFERENCE SIGNS LIST

[0053] 10 power semiconductor module [0054] 11 substrate [0055] 12 base plate [0056] 13 substrate [0057] DC+ power terminal [0058] 14 position [0059] 15 substrate [0060] 16 DC power terminal [0061] 16 position [0062] 17 substrate [0063] 18 AC power terminal [0064] 18 position [0065] 20 position [0066] 22 position [0067] 24 first amount [0068] 26 power semiconductor device [0069] 28 power semiconductor device [0070] 30 second amount [0071] 32 power semiconductor device [0072] 34 power semiconductor device [0073] 36 contact area [0074] 38 first device area [0075] 40 second device area [0076] 42 line [0077] 44 line [0078] 46 line [0079] 48 line [0080] 50 central line