Method for producing non-metal self-heatable molds

Abstract

A multi-layered composite mold structure (10) is provided. The multi-layered composite mold structure (10) comprises a multi-layered member including (a) at least one metal heating layer (11); (b) at least one metal heat distribution layer (13); (c) at least one laminate composite layer (12); and (d) a surface layer (14). A process for preparing the multi-layered composite mold structure is also provided.

Claims

1. A composite mold structure comprising a multi-layered member including: (a) at least one heating layer; (b) at least one metal heat distribution layer; (c) at least two laminate composite layer; and (d) at least one surface layer comprising a quasi-isotropic laminate material, wherein the at least one metal heat distribution layer is disposed under the surface layer and the at least one metal heat distribution layer distributes heat uniformly throughout the surface layer of the composite mold structure and wherein the at least one heating layer is embedded between at least two said laminate composite layers; and wherein the surface layer comprises fabric materials impregnated and cured with thermosets or thermoplastic materials.

2. The composite mold structure of claim 1, wherein the at least one heating layer comprises heating wire, heating tube or heating mat encapsulated with cured laminate composite.

3. The composite mold structure of claim 1, wherein the at least one metal heat distribution layer comprises a perforated metal plate, sheet, foil or combination thereof or a non-perforated metal plate, sheet, foil or combination thereof.

4. The composite mold structure of claim 3, wherein metal plate, sheet, foil or combination thereof comprises steel, cooper, aluminum or metal alloys.

5. The composite mold structure of claim 3, wherein the perforated metal layer is a mesh type metal layer.

6. The composite mold structure of claim 1, wherein at least one of the laminate composite layer comprises fiber or fabric materials impregnated and cured with thermosets or thermoplastic materials.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) For the purpose of illustrating the present invention, the drawings show a form of the present invention which is presently preferred. However, it should be understood that the present invention is not limited to the embodiments shown in the drawings.

(2) FIG. 1 is a cross-sectional side view of a portion of one embodiment of the present invention showing a multilayered structure of the present invention. The embodiment shown in FIG. 1 is shown as a flat or planar multi-layer geometry such as a sheet, but is not limited thereto. Molds of curved geometries (not shown) are also included in the present invention.

(3) FIG. 2 is a schematic top view of a multilayered mold structure of the present invention showing a layout of a number of thermocouples (T1-T12) attached to the surface of the mold structure at various points of the mold for testing purposes. The setup shown in FIG. 2 is used for collecting temperature data as the temperature response of a mold with and without a metal layer implanted in the mold.

(4) FIG. 3 is a graphical illustration showing the recorded temperature profile of a mold without a metal layer, such as an aluminum layer, implanted in the mold. The temperature of the mold is recorded at the various surface locations of a mold as depicted in FIG. 2.

(5) FIG. 4 is a graphical illustration showing the recorded temperature profile of a mold with a metal layer implanted in the mold. The temperature of the mold is recorded at the various surface locations of the mold as depicted in FIG. 2.

DETAILED DESCRIPTION

(6) Non-metal mold herein means the utilization of non-metal materials in the construction of the mold main body.

(7) Self-heatable herein means heating elements being an integral part of the mold design and fabrication.

(8) Surface temperature uniformity herein means the temperature distribution across the mold surface wherein the temperature from one point on the surface to another point on the surface does not vary by more than a certain quantity of degrees; and wherein the temperature difference is not more than 5% (or less than 5%). Surface temperature uniformity can be quantified by measuring the largest temperature variation across the mold surface.

(9) One-shot finishing herein means that a whole mold body can be infused and cured simultaneously in one step.

(10) Permeable heating and metal layer herein means a perforated, metal layer adapted to being heated and adapted for allowing resin to flow through the perforations of the layer from one side to the other side of the layer. The permeable heating and metal layer is preferably used in a one-shot finishing step of the mold construction process of the present invention.

(11) A broad embodiment of the present invention is directed to providing a composite mold structure comprising a layered member including at least one heating layer and one metal heat distribution layer in one embodiment; and a multilayered composite mold structure comprising a multi-layered member including (a) at least one heating layer; (b) at least one metal heat distribution layer; (c) at least one laminate composite layer; and (d) a surface layer in another embodiment.

(12) With reference to FIG. 1, there is shown one embodiment of the present invention mold structure comprising a multi-layer composite mold structure in the form of multiple sheet, film or layer members. The multi-layer composite mold structure is indicated by general numeral 10 and includes a heating layer 11 embedded in one or more laminate composite heat transfer layers 12, a metal heat distribution layer 13 and one or more laminate surface layers 14 together with core material layer 16 inserted one or more laminate backing layers 15. The layers are bonded together as shown in FIG. 1 to make up the sheet member or multi-layer composite mold structure 10.

(13) The heating layer 11 of the composite mold structure can be for example a fluid heating layer, an electrical heating layer, or other conventional heating layers known in the art. For example, the fluid of the fluid heating layer can include water, oil or mixtures thereof flowing in a conduit such as pipes embedded in the mold heating layer The electrical heating layer can include, for example, a heating wire, a heating mat, a heating fabric, or other conventional heating structures known in the art. The heating layer 11 of the composite mold structure is used to provide heat to the mold. In one preferred embodiment, the composite mold structure may be heated to a temperature of from about 20 C. to about 300 C., from about 30 C. to about 200 C. in another embodiment, and from about 40 C. to about 150 C. in still another embodiment.

(14) Generally, the heating layer of the composite mold structure may have a thickness of from about 10 microns (m) to about 30 millimeters (mm) in one embodiment, from 100 m to about 25 mm in another embodiment, and from about 1 mm to about 20 mm in another embodiment.

(15) The laminate composite heat transfer layer 12 of the composite mold structure is present in the mold structure to provide support, strength, heat transfer and electrical insulation to the mold structure. In one embodiment, the laminate composite heat transfer layer 12 of the composite mold structure can be for example a thermoset-based composite layer such a thermoset composite comprising a reinforced material in a cured resin matrix. For example, the laminate composite heat transfer layer lamina made of fibers, as the reinforcing material, in a cured resin system. The fibers can include for example carbon fiber, glass fibers, basalt fibers, aramid fibers, boron fibers, thermoplastic fibers, or combinations thereof. The resin system may include, for example, a thermosettable material such as an epoxy, a vinyl ester, a polyurethane, a polyimide, a polyamide, a polyester, or combinations thereof.

(16) Generally, the laminate composite heat transfer layer of the composite mold structure may have a thickness of from about 500 m to about 20 mm in one embodiment, from about 500 m to about 10 mm in another embodiment, and from about 1 mm to about 5 mm in another embodiment.

(17) In one preferred embodiment, the resin system useful in producing the composite mold structure of the present invention can be, for example, a curable formulation or composition comprising at least one epoxy compound as component (I) and a curing agent as component (II) to form the curable formulation that can be cured to form a thermoset material. For example, the epoxy compound useful in the present invention may include any conventional epoxy compound. In general, the curing agent (also referred to as a hardener or crosslinking agent), component (II), is blended with the epoxy resin compound, component (I), to prepare the curable formulation or composition that is to be cured into a shaped article such as the composite mold structure or any of the layers of the composite mold structure.

(18) One embodiment of the epoxy compound useful in the curable composition of the present invention may be for example a single epoxy compound used alone; or in a combination of two or more epoxy compounds such as any of the epoxy compounds described in Lee, H. and Neville, K., Handbook of Epoxy Resins, McGraw-Hill Book Company, New York, 1967, Chapter 2, pages 2-1 to 2-27, incorporated herein by reference. In a preferred embodiment, the epoxy compound may include for example epoxy resins based on reaction products of polyfunctional alcohols, phenols, cycloaliphatic carboxylic acids, aromatic amines, or aminophenols with epichlorohydrin. A few non-limiting embodiments include, for example, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, resorcinol diglycidyl ether, and triglycidyl ethers of para-aminophenols. Other suitable epoxy resins known in the art include for example reaction products of epichlorohydrin with o-cresol novolacs, hydrocarbon novolacs, and, phenol novolacs. The epoxy compound may also be selected from commercially available epoxy resin products such as for example, D.E.R. 331, D.E.R. 332, D.E.R. 354, D.E.R. 580, D.E.N. 425, D.E.N. 431, D.E.N. 438, D.E.R. 736, or D.E.R. 732 epoxy resins available from The Dow Chemical Company.

(19) In general, the curing agent, component (II), blended with the epoxy resin compound, component (I), to prepare the curable composition may comprise, for example, any conventional curing agent known in the art useful for including in a curable composition. The curing agent useful in the curable composition, may be selected, for example, but are not limited to, anhydrides, carboxylic acids, amine compounds, phenolic compounds, or mixtures thereof.

(20) Examples of curing agents useful in the present invention may include any of the co-reactive or catalytic curing materials known to be useful for curing epoxy resin based compositions. Such co-reactive curing agents include, for example, polyamine, polyamide, polyaminoamide, dicyandiamide, polymeric thiol, polycarboxylic acid and anhydride, and any combination thereof or the like. Suitable catalytic curing agents include tertiary amine, quaternary ammonium halide, Lewis acids such as boron trifluoride, and any combination thereof or the like. Other specific examples of co-reactive curing agent include diaminodiphenylsulfone, styrene-maleic acid anhydride (SMA) copolymers; and any combination thereof. Among the conventional co-reactive epoxy curing agents, amines and amino or amido containing resins and phenolics are preferred.

(21) Generally, the amount of the curing agent used in the curable composition of the present invention to prepare a composite may be measured in terms of a ratio of the amount of epoxy compound to the amount of curing agent. For example, the ratio of epoxy compound to curing agent may be from about 100/1 to about 100/1,000 in one embodiment, from about 100/1 to about 100/500 in another embodiment; and from about 100/10 to about 100/200 in still another embodiment, based on the total weight of the curable composition.

(22) Other compounds that may be optionally added to the curable composition may include compounds that are normally used in resin formulations known to those skilled in the art for preparing curable compositions and thermosets. The optional compounds that can be added to the curable composition may include, for example, a cure catalyst to facilitate the reaction of the epoxy resin compound with the curing agent; de-molding agents; other accelerators a solvent to lower the viscosity of the formulation further, other resins such as a phenolic resin that can be blended with the epoxy resin of the formulation, other epoxy resins different from the epoxy compound of the present invention (for example, aromatic and aliphatic glycidyl ethers; cycloaliphatic epoxy resins; and divinylarene dioxides such as divinylbenzene dioxide), other curing agents, fillers, pigments, toughening agents, flow modifiers, adhesion promoters, diluents, stabilizers, plasticizers, catalyst de-activators, flame retardants, defoamer, wetting agent and mixtures thereof.

(23) Generally, the amount of other optional components, when used in the present invention, may be for example, from 0 wt % to about 1,000 wt % in one embodiment, from about 0.01 wt % to about 1,000 wt % in another embodiment; and from about 0.1 wt % to about 100 wt % in still another embodiment.

(24) The process for preparing the curable composition includes admixing (I) at least one epoxy compound; (II) at least one curing agent composition, and (III) optionally, other ingredients as needed. For example, the preparation of the curable resin formulation of the present invention is achieved by blending, in known mixing equipment, the epoxy compound, the curing agent composition, and optionally any other desirable additives.

(25) All the compounds of the curable formulation are typically mixed and dispersed at a temperature enabling the preparation of an effective curable epoxy resin composition having the desired balance of properties for a particular application. For example, the temperature during the mixing of all components may be generally from about 20 C. to about 200 C. in one embodiment, from about 0 C. to about 100 C. in another embodiment, and from about 20 C. to about 80 C. in still another embodiment. A lower mixing temperature helps to minimize reaction of the epoxide and hardener in the composition to maximize the pot life of the composition, but also increases the epoxide and hardener mixture viscosity and decreases the filler loading.

(26) The preparation of the curable formulation, and/or any of the steps thereof, may be a batch or a continuous process. The mixing equipment used in the process may be any vessel and ancillary equipment well known to those skilled in the art.

(27) The process of curing of the curable composition may be carried out by conventional processes well known to those skilled in the art. For example, the curing can be carried out at a predetermined temperature of generally from about 10 C. to about 300 C. in one embodiment; from about 10 C. to about 200 C. in another embodiment; and from about 25 C. to about 150 C. in still another embodiment. The curing can be carried out, for example, for a predetermined period of time of generally from about 1 minute to about 1 week in one embodiment, from about 10 minutes to about 2 days in another embodiment, and from about 1 hour to about 24 hours in still another embodiment. Below a period of time of about 1 minute, the time may be too short to ensure sufficient reaction under conventional processing conditions; and above about 1 week, the time may be too long to be practical or economical.

(28) The metal heat distribution layer 13 of the composite mold structure is present in the mold structure to provide a uniform surface temperature to the mold structure. Advantageously, the mold structure's property related to temperature fluctuation is minimized across the surface of the mold structure. In one preferred embodiment for example, the composite mold structure exhibits a fluctuation in temperature of from about 0 C. to about 20 C. in one embodiment, from about 0 C. to about 10 C. in another embodiment, and from about 0 C. to about 5 C. in another embodiment depending on the set mold temperature.

(29) The metal heat distribution layer 13 of the composite mold structure can be for example steel, aluminum, copper, a metal alloy, or other conventional metals used in manufacturing a mold structure as known in the art.

(30) The metal heat distribution layer 13 may be perforated including mesh type or non-perforated. When the metal heat distribution layer contains perforation, the one or more perforations can be of any size and shape as desired. For example, the shape of the perforations can be round, rectangle, diamond-shaped or any other conventional shape known in the art. When the perforations are one or more round holes or rectangular holes, the diameter of the round hole or the edge width of the rectangular hole can be for example from 200 m to 5 mm and the hole space can range from about 2 mm to about 50 mm.

(31) Generally, the metal heat distribution layer 13 may have a thickness of from about 10 m to about 2 mm in one embodiment, from about 50 m to about 1 mm in another embodiment, and from about 100 m to about 500 m in still another embodiment.

(32) The mold surface layer 14 of the composite mold structure is present in the mold structure to provide mechanical properties, chemical resistance, and surface glossiness to the mold structure. The mold surface layer 14 of the composite mold structure can be for example thermoset based laminate layer.

(33) The mold surface layer can include for example a hardened or cured non-woven fiber mat in a thermoset resin. The fiber mat can generally be from about 50 grams per square meter (g/m.sup.2) to about 2,000 g/m.sup.2 in one embodiment, from about 100 g/m.sup.2 to about 1,000 g/m.sup.2 in another embodiment, and from 200 g/m.sup.2 to about 500 g/m.sup.2 in still another embodiment.

(34) Generally, the mold surface layer 14 may have a thickness of from about 50 m to about 5 mm in one embodiment, from about 200 m to about 2 mm in another embodiment, and from about 500 m to about 1 mm in still another embodiment.

(35) The laminate composite backing layer 15 of the composite mold structure is present in the mold structure to provide support, strength and heat conservation to the mold structure. The laminate composite backing layer 15 of the composite mold structure can be for example a thermoset-based composite layer.

(36) For example, the laminate composite backing layer 15 can include lamina made of fibers in a cured resin system. The fibers can include for example carbon fiber, glass fibers, or basalt fiber, aramid fiber, boron fiber, thermoplastic fiber, or combinations thereof. The resin system may include, for example, a thermosettable material such as an epoxy, a vinyl ester, a polyurethane, a polyimide, a polyamide, a polyester, or combinations thereof.

(37) Generally, the laminate composite layer 15, including a sandwich-type construction, may have a thickness of from about 3 mm to about 100 mm in one embodiment, from about 5 mm to about 50 mm in another embodiment, and from about 10 mm to about 20 mm in still another embodiment.

(38) The composite mold structure of the present invention may include a core material layer 16, which can be an optional layer. However, generally the core material layer is preferably used in one preferred embodiment of the composite mold structure. For example, the core material can be used to make a sandwich-type structure wherein the sandwich includes the core material disposed, for example, in-between the heating layer and the backing layer.

(39) The core material layer 16 is useful for increasing the mold panel stiffness, for increasing the heat insulation of the mold structure, and/or for decreasing the weight of the mold structure. Generally, by utilizing a sandwich-type structure for the composite mold structure, the mold panel stiffness of the composite mold structure can be increased from about 2 times to about 100 times in one embodiment, from about 2 times to about 30 times in another embodiment, and from about 2 times to about 10 times in still another embodiment without significantly adding extra weight to the mold. In a preferred embodiment, the mold panel stiffness of the composite mold structure can be increased from about 5 times to about 30 times.

(40) In addition, the heat insulation of the composite mold structure is generally increased from about 2 times to about 100 times in one embodiment, from about 2 times to about 30 times in another embodiment, and from about 2 times to about 10 times in still another embodiment. In a preferred embodiment, the heat insulation of the composite mold structure can be increased from about 5 times to about 30 times.

(41) The composition of the core material can be selected from, for example, a polymer-based foam core, a light weight plant wood material, or other conventional materials known in the art.

(42) Generally, the core layer 16 may have a thickness of from about 2 mm to about 100 mm in one embodiment, from about 5 mm to about 50 mm in another embodiment, and from about 5 mm to about 20 mm in still another embodiment.

(43) The composite mold structure of the present invention may include, as an optional layer, a gel-coat layer which can be used, for example, to increase the mold surface quality of the composite mold structure. For example, the gel-coat layer can be a thermoset or a thermoplastic layer or other conventional materials known in the art.

(44) Generally, the gel-coat layer may have a thickness of from about 100 m to about 2 mm in one embodiment, from about 200 m to about 1 mm in another embodiment, and from about 500 m to about 1 mm in still another embodiment.

(45) The composite mold structure of the present invention may include, as an optional layer, a heat insulation layer to increase the insulation value of the composite mold structure. Most conventional heat insulation materials can be used in the heat insulation layer of the present invention. For example, the insulation layer can be a polymer-based foam, asbestos, or other conventional materials known in the art.

(46) In general, when the heat insulation layer is used in the mold structure, the insulation value of the composite mold structure may be increased by about 100% to about 1,000% in one embodiment.

(47) When the core material is used in a mold sandwich panel of the mold structure, and the thickness of the core material is for example greater than 50 mm, an insulation layer may not be needed. However, when an insulation layer is used, generally, the insulation layer may have a thickness of from about 3 mm to about 50 mm in one embodiment, from about 5 mm to about 20 mm in another embodiment, and from about 10 mm to about 20 mm in another embodiment.

(48) Apart from the most commonly used mold manufacturing process of layer-by-layer casting or laminating, the mold manufacturing process useful in the present invention can also include a step-by-step process, a one-shot vacuum infusion process, or a light Resin Transfer Molding (RTM) process.

(49) One embodiment of the process of manufacturing the composite mold structure of the present invention can include for example a one-shot infusion fabrication process which can include one or more of the following steps:

(50) (1) Applying a thin surface layer to a master mold using a gel-coat or laminate via injection molding;

(51) (2) Laying up a non-woven fiber mat layer adjacent to the layer(s) of step 1 by hand or via an automatic machine;

(52) (3) Laying up perforated metal layer adjacent to the layer(s) of step 2 by hand or via an automatic machine;

(53) (4) Laying up fabric layers adjacent to the layer(s) of step 3 by hand or via an automatic machine;

(54) (5) Laying up perforated heating layers adjacent to the layer(s) of step 4 by hand or via an automatic machine;

(55) (6) Laying up fabric layers adjacent to the layer(s) of step 5 by hand or via an automatic machine;

(56) (7) Laying up a core material layer adjacent to the layer(s) of step 6 by hand or via an automatic machine;

(57) (8) Laying up a fabric layer adjacent to the layer(s) of step 7 by hand or via an automatic machine;

(58) (9) Laying up a release layer adjacent to the layer(s) of step 8 by hand or via an automatic machine;

(59) (10) Laying up a resin flow distribution layer adjacent to the layer(s) of step 9 by hand or via an automatic machine;

(60) (11) Installing a resin flow inlet and an air flow outlet;

(61) (12) Sealing the whole package with vacuum foil;

(62) (13) Impregnating the mold panel preform with epoxy resin system by infusion or an injection process;

(63) (14) Curing the panel of step 13 under room temperature (for example about 25 C.) or at an elevated temperature (for example from about 40 C. to about 200 C.);

(64) (15) Removing the release layer of step 9, the resin flow assist layer of step 10 and resin flow inlet and air flow outlet of step 11 after the mold panel is cured;

(65) (16) De-molding the mold panel from the master mold;

(66) (17) Installing the mold panel to the mold supporting frame; and/or

(67) (18) Post-curing the mold panel with mold heating system.

(68) In the above mentioned one-shot infusion process, steps (2), (4), (7) and (18) are optional steps, and the other remaining steps are useful steps for obtaining further benefits of the present invention. The mold of the present invention can also be manufactured with one or several layers fabricated separately and then assembled together using different joining techniques including, but not limiting to, mechanical techniques such as riveting and bolting; and chemical bonding techniques.

(69) With reference to FIG. 1, there is shown one embodiment of the present invention mold structure which comprises, for example, one or more heating layers 11; one or more laminate composite heat transfer layers 12; one or more metal heat distribution layers 13; one or more laminate surface layers 14; one or more laminate backing layers 15; and one or more core layers 16. The above layers are bonded together to form the multi-layer mold structure of the present invention.

(70) The composite mold structure shows several improved properties over conventional composite mold structures used in mold products. For example, the composite mold structure of the present invention advantageously has better mold surface temperature uniformity and faster thermal equilibrium, good prevention of metal layer from chemical erosion and being worn-out, improved mold panel stiffness and dimension stability during heating and cooling by using a sandwich structure.

(71) The composite mold structure of the present invention, assembled and prepared as described above, may be used for manufacturing a curved or a flat molded article. In one preferred embodiment, the assembled composite mold structure of the present invention is used in manufacturing, for example, light-weight high quality self-heatable tooling in industries like alternative energy, transportation, and consumerism.

(72) The mold structure of the present invention may utilize a thin layer of high thermal conductivity metal layer embedded between a mold surface layer made of quasi-isotropic laminate material and a heating layer to achieve high temperature uniformity across mold surface.

(73) The composite mold structure of the present invention made as described above shows several improved properties over conventional mold structures. For example, the mold structure of the present invention advantageously has better mold surface temperature uniformity and faster thermal equilibrium. In addition, the layers of the mold structure can prevent or minimize the metal layer from chemical erosion and from being worn-out. And, the multi-layered mold structure exhibits increased mold panel stiffness and dimensional stability during heating and cooling, particularly when using a sandwich-type structure.

EXAMPLES

(74) The following examples and comparative examples further illustrate the present invention in detail but are not to be construed to limit the scope thereof.

Example 1 and Comparative Example A

(75) A first multi-layer mold structure was made by the following general process:

(76) (1) Apply a 2 mm thick composite surface layer(s) to a master mold via injection molding;

(77) (2) Apply a heat conductive adhesive layer(s) adjacent to the layer(s) of step (1) with spatula;

(78) (3) Lay up a 1 mm thick aluminum sheet layer(s) adjacent to the layer(s) of step (2) by hand;

(79) (4) Lay up fabric layer(s) adjacent to the layer(s) of step (3) by hand;

(80) (5) Lay up non-woven fiber mat layer(s) adjacent to the layer(s) of step (4) by hand;

(81) (6) Laying up perforated heating layer(s) adjacent to the layer(s) of step (5) by hand;

(82) (7) Lay up fabric layer(s) adjacent to the layer(s) of step (6) by hand;

(83) (8) Lay up perforated foam core material layer(s) adjacent to the layer of step (7) by hand;

(84) (9) Lay up fabric layer(s) adjacent to the layer(s) of step (8) by hand;

(85) (10) Lay up release layer(s) adjacent to the layer(s) of step (9) by hand;

(86) (11) Lay up resin flow distribution layer(s) adjacent to the layer(s) of step (10) by hand;

(87) (12) Install a resin flow inlet above the layer(s) of step (11) and an air flow outlet away from the layer(s) of step (11) but close to the layer(s) of step (10);

(88) (13) Seal the resultant whole package with vacuum foil;

(89) (14) Impregnate the resultant mold panel preform with an epoxy resin system by infusion or an injection process;

(90) (15) Cure the panel of step (14) under room temperature (for example about 25 C.) or at an elevated temperature (for example from about 40 C. to about 80 C.);

(91) (16) Remove the release layer(s) of step (10), the resin flow assist layer(s) of step (11); and resin flow inlet and air flow outlet of step (12) after the mold panel is cured;

(92) (17) De-mold the mold panel from the master mold;

(93) (18) Install the mold panel to the mold supporting frame; and

(94) (19) Post-cure the mold panel with a mold heating system.

(95) Another second multi-layer mold structure was made the same way as the first mold of Example 1 except that the second mold was made without embedding a 1 mm thick aluminum plate between the mold surface layer and the heating layer (Comparative Example A).

(96) As shown in Table I, the resultant mold with the aluminum plate of Example 1 yielded a greater than 60% improvement on mold surface temperature uniformity for all the tested mold setting temperatures from 30 C. to 80 C. compared to the same mold structure without implanting the aluminum plate (Comparative Example A) under the same boundary conditions (e.g. room temperature where the mold is exposed to and without extra heat insulation layer). In addition, the time for the mold surface in Example 1 to reach a steady state temperature distribution is one hour compared to two hours when using the mold structure of Comparative Example A. Steady state herein means mold surface temperature does not change with time. This reduction in time from two hours to one hour was an unexpected result in the present invention.

(97) A temperature profile for a mold structure can be obtained by a system, generally indicated by numeral 20, shown in FIG. 2 wherein a mold structure 21 is embedded with a series of thermocouples 22 (T1-T12) for measuring temperature at various locations on the surface of the structure 21. The plurality of thermocouples 22 are spaced uniformly on the structure 21. The layout of the temperature data collection points shown in FIG. 2 can be spaced according to a square or rectangular grid with the distance in the horizontal direction (width) shown by arrows 23, 25 and 27, respectively; and in the vertical direction as shown by arrows 24, 26, and 28, respectively.

(98) The recorded temperature data for the mold without the aluminum layer and the mold with the aluminum layer are given in FIGS. 3 and 4, respectively. In the experimental set up in this Example 1, temperature data are collected using K-type thermocouples.

(99) TABLE-US-00001 TABLE I Resultant Steady State Mold Temperature of Example 1 and Comparative Example A Comparative Example A Example 1 (mold without aluminum layer) (mold with aluminum layer) Maximum Measured Maximum Measured Mold Set Temperature Difference Temperature Difference Temperature of Mold Surface Time to Reach of Mold Surface Time to Reach ( C.) ( C.) Steady State ( C.) Steady State 30 5 2 hours 2 1 hour 40 10 2 hours 4 1 hour 50 15 2 hours 6 1 hour 60 20 2 hours 7 1 hour 70 25 2 hours 8 1 hour 80 30 2 hours 10 1 hour