Stretchable electronics for dentistry applications and method of making the same

Abstract

The present invention relates to a method for producing a stretchable conductor and/or electrical connection including providing a stretchable substrate, a liquid metal, a conductive metal and an adhesion material in a same evaporator chamber; depositing the liquid metal; depositing the adhesion material; depositing the conductive metal; wherein the liquid metal, the conductive metal and the adhesion material are deposited by evaporation; and the deposition by evaporation is made in vacuum.

Claims

1. A method for producing a stretchable conductor and/or electrical connection comprising providing a stretchable substrate, a liquid metal, a conductive metal and an adhesion material in a same evaporator chamber; depositing the liquid metal; depositing the adhesion material; depositing the conductive metal; wherein the liquid metal, the conductive metal and the adhesion material are deposited by evaporation in vacuum; the liquid metal, the conductive metal and the adhesion material are deposited at different deposition rates, which are variable during the process; and said adhesion material, said conductive metal and said liquid metal are deposited under the form of layers or combine each other to form a conductive layer on the stretchable substrate.

2. The method according to claim 1, wherein the adhesion material is deposited before the conductive metal.

3. The method according to claim 1 further comprising a step of depositing the liquid metal onto the stretchable substrate and/or before depositing the adhesion material.

4. The method according to claim 1, wherein the liquid metal is successively, alternatively or continuously deposited.

5. The method according to claim 1, wherein the liquid metal has a deposition rate of 0 nm/s while depositing the adhesion material and the conductive metal.

6. The method according to claim 1 further comprising a step of depositing the liquid metal after depositing the adhesion material and before depositing the conductive material.

7. The method according to claim 1, wherein the liquid metal is continuously deposited by evaporation during the whole process and the deposition of the adhesion material and conductive metal.

8. The method according to claim 1, wherein the liquid metal is deposited before depositing the adhesion material, during depositing said adhesion material, after depositing said adhesion material and before depositing the conductive material, during depositing said conductive material and after depositing said conductive material.

9. The method according to claim 1, wherein the deposition by evaporation is made by a physical vapor deposition method selected from a deposition by sublimation process, cathodic arc deposition, electron beam physical vapor deposition, thermal evaporation, evaporative deposition, pulse laser deposition, sputter deposition and/or from chemical vapor deposition, electron beam evaporation, thermal evaporation, electro-plating, molecular beam epitaxy.

10. The method according to claim 1, wherein the stretchable substrate comprises an elastomeric material.

11. The method according to claim 1, wherein the liquid metal is selected from gallium, mercury, chromium, alloys or oxides thereof and from metal being liquid or semi-liquid at 90 C. at atmospheric pressure condition; and the adhesion material is metallic selected from Cr, Ti and the conductive material is metallic selected from Au, Ag, Cu, Pt, Pd.

12. The method according to claim 1, wherein the deposition of the metals and the material onto the stretchable substrate is patterned.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1A shows the metal deposited onto the elastic substrate is damaged after being in contact with another object. FIG. 1B shows the liquid metal encapsulated in elastic substrates.

(2) FIG. 2 show an electrical strip patterned on PDMS at rest, namely at rest, (FIG. 2A) or under stretching (FIG. 2B).

(3) FIG. 3 shows a schematic view of a thermal evaporator. Under vacuum, the electrical currents (5, 6, 7) flowing in thermal sources (2, 3, 4) heat up the materials to be evaporated. The vapors deposit these materials on the substrate above (1). By adjusting the current in the sources, the deposition rate changes. Multiple active sources are used at the same time.

(4) FIG. 4 shows a scheme of the deposition rate of the liquid metal, the adhesion material and the conductive metal during the method of the invention; the solid line represents the deposition rate (phases A to G) of the liquid metal, the dotted line represents the deposition rate of the adhesion material (phase B) and the dashed line represents the deposition rate of the conductive metal (phase D). Phase A: the liquid metal is deposited at a deposition rate >0 nm/s before depositing the adhesion material layer. Phase B: the deposition rate of the liquid metal is adjusted while the adhesion material layer is deposited. Phase C: the deposition of the adhesion material is stopped and the deposition rate of the liquid metal is adjusted. Phase D: the deposition rate of the liquid metal is adjusted while the conductive metal is deposited. Phase E: the deposition of the conductive metal is stopped and the deposition rate of the liquid metal is adjusted. Phase F: the deposition rate of the liquid metal is increased to obtain a final coating of liquid metal. Phase G: the deposition of the liquid metal is stopped.

(5) FIG. 5 shows example structures resulting from the deposition of thin metal on an elastic substrate; (a) traditional method: Cr is: deposited as an adhesion layer on PDMS (elastomeric material); Au guarantees good conduction; (b) liquid metal can be added on top of the Au layer; (c) liquid metal can be evaporated before or after the other materials in any order; (d) more complex structures with superior performance are obtained depending on the deposition rate and evaporating simultaneously the different metals and material.

(6) FIG. 6 shows the transition between a classical printed circuit board (6) and a stretchable circuit (7) provided by the method of the invention. The stretchable circuit comprises an elastic substrate (4) on which conductive lines with pads (5) are patterned. The classical printed circuit board comprises a rigid or flexible board (1) on which conductive lines with pads (2) are patterned. The pads on the classical printed circuit board contain a slot in which an adhesive is present (3). FIG. 6A shows a portion of classical printed circuit board and a portion of a stretchable circuit, to be put in mutual contact. FIG. 6B represents a side cut view of the formation of the contact in the transition between the classical printed circuit board and the stretchable circuit.

(7) FIG. 7A shows a stretchable capacitive array patterned on PDMS. FIG. 7B shows an array of stretchable capacitive pressure sensors patterned on PDMS (1). A transition (3) formed using the method of the invention is used to provide the electrical connections to a flexible PCB (2). The electronics on the flexible PCB (4) read the signals from the sensor array and evaluate the distribution of the forces applied on the sensors by dental cusps (5).

(8) FIG. 8 shows a sample used for tensile stretching tests. A thin and narrow conductive line (2) is patterned with the method of the invention on a thin elastic substrate (1). The two extremities of the lines are connected to electric wires (3) using an adhesive on the top (4). Such sample is then stretched linearly using a computer-controlled machine in the direction depicted by the black arrows, while the electrical resistance of the line is measured.

(9) FIG. 9 shows an example measurement of the electrical resistance for various mechanical elongations of a sample prepared as in FIG. 8.

DETAILED DESCRIPTION OF THE INVENTION

(10) The present disclosure may be more readily understood by reference to the following detailed description presented in connection with the accompanying drawing figures, which form a part of this disclosure. It is to be understood that this disclosure is not limited to the specific conditions or parameters described and/or shown herein, and that the terminology used herein is for the purpose of describing particular embodiments by way of example only and is not intended to be limiting of the claimed disclosure.

(11) As used herein adhesion material is a material that is used to improve the metal adhesion to the substrates.

(12) As used herein conductive material is a metal that is solid at room conditions and presents the highest conductivity among the evaporated materials.

(13) As used herein liquid metal is a metal material that is in a liquid or semi-liquid state up to a temperature of 90 C. and at atmospheric pressure condition.

(14) As used herein, deposition rate means the amount of material deposited on the substrate per time unit, e.g. in a second.

(15) As used herein, transition in the context of a connection means line, track of the electronic board and any conductive path between two regions or two components.

(16) The invention relates to a method for producing a stretchable conductor and/or electrical connection comprising providing a stretchable substrate, a liquid metal, a conductive metal and an adhesion material in a same evaporator chamber; depositing the liquid metal; depositing the adhesion material; depositing the conductive metal; wherein the liquid metal, the conductive metal and the adhesion material are deposited by evaporation; and the deposition by evaporation is made in vacuum.

(17) In particular, the invention relates to a method for producing a stretchable conductor and/or electrical connection comprising providing a stretchable substrate, a liquid metal, a conductive metal and an adhesion material in a same evaporator chamber; depositing the liquid metal onto the stretchable substrate; depositing the adhesion material; depositing the conductive metal; wherein the liquid metal, the conductive metal and the adhesion material are deposited by evaporation; and the deposition by evaporation is made in vacuum.

(18) In one embodiment, the method of the invention further comprises a step of depositing the liquid metal onto the stretchable substrate and/or before depositing the adhesion material.

(19) In one embodiment, the method of the invention further comprises a step of depositing the liquid metal onto the conductive metal and/or after depositing the conductive metal.

(20) In one embodiments the liquid metal is successively, alternatively or continuously deposited.

(21) In another embodiment, while depositing the adhesion material and/or the conductive metal, the liquid metal is not deposited or the liquid metal has a deposition rate of 0 nm/s.

(22) In a further embodiment, the method of the invention further comprises a step of depositing the liquid metal after depositing the adhesion material and before depositing the conductive material.

(23) In one embodiment, the liquid metal is continuously deposited by evaporation during the whole process and the depositions of the adhesion material and conductive metal.

(24) In another embodiment, the liquid metal is successively deposited. While depositing the adhesion material and/or the conductive metal, the liquid metal is not deposited or the liquid metal has a deposition rate of 0 nm/s. The liquid metal is deposited before depositing the adhesion material and after depositing the conductive material.

(25) In a further embodiment, in the method of the invention, the liquid metal, the conductive metal and the adhesion metal are deposited by evaporation at different deposition rates, which are variable during the process. The liquid metal may be deposited through the whole process of the production of the stretchable substrate and through all the steps of depositing the adhesion material and the conductive material (FIG. 4, phases A to G). The liquid metal may be deposited at variable or different deposition rates during die whole process.

(26) In particular, according to FIG. 3, the liquid metal placed in (4), the conductive metal placed in (2) and the adhesion material placed in (3) are deposited on the substrate (1) by evaporation at different deposition rates, which are variable during the process. The deposition rate of the liquid metal may be different from the deposition rate of the conductive metal and/or from the deposition rate of the adhesion material. The deposition rate of the liquid metal is different from the deposition rate of the conductive metal and/or from the deposition rate for the adhesion material, when the liquid metal is deposited together with the conductive metal and/or the adhesive material.

(27) Since the evaporation temperatures of the metals and the material are depending on the pressure in the chamber and the type of material, the deposition rate of the metals and the material is controlled by adjusting the current in the sources (5, 6, 7) (see FIG. 3). The higher is the current, the higher is the evaporation rate. The currents may be in the range from 0 A to 500 A, 5 A to 500 A, 5 A to 70 A, or 50 A to 500 A. The deposition rates during the deposition process may be in the range from 0 to 12 /s (ngstm/second), or from 0 to 1.2 nm/s. The currents are preferably in the range from 0 A to 100 A. The deposition rates during the deposition process are preferably in the range from 0 to 3 nm/s. The temperatures of the sources may be in the range from 0 C. to 1500 C., or 0 C. to 200 C., and when the source is warmed up or heated, the temperatures of the heated sources may be in the range from 200 to 1500 C.

(28) In another embodiment, the adhesion material and the conductive material are alternatively deposited by evaporation in the method of the invention. While depositing the adhesion material and/or the conductive metal, the liquid metal is not deposited or the liquid metal has a deposition rate of 0 nm/s. The liquid metal is deposited before depositing the adhesion material and after depositing said adhesion material, and before depositing the conductive material and after depositing said conductive material

(29) In a particular embodiment the adhesion material in the method of the invention is deposited before the conductive metal.

(30) In another embodiment of the method of the invention, the liquid metal is deposited before depositing the adhesion material, while depositing said adhesion material, after depositing said adhesion material and before depositing the conductive material, while depositing said conductive material and after depositing said conductive material.

(31) In a further embodiment of the method of the invention, the deposition by evaporation is made by a physical vapor deposition method selected from a deposition by sublimation process, cathodic arc deposition, electron beam physical vapor deposition, thermal evaporation, evaporative deposition, pulsed laser deposition, sputter deposition and/or from chemical vapor deposition, electron beam evaporation, thermal evaporation, electro-plating, molecular beam epitaxy.

(32) According to another embodiment, preferably in the case of using thermal evaporation (see FIG. 3) as a deposition method, the method of the invention further comprises the following steps: positioning of the liquid metal, the conductive metal and the adhesion material on the different thermal sources (2, 3, 4) of the evaporator chamber; optionally adding an evaporation mask onto the stretchable substrates (1) to pattern the liquid metal, the adhesion material and the conductive metal in certain regions of the substrate, the thermal sources corresponding to the source onto which the liquid metal is placed, are progressively heated up until the liquid metal evaporates and deposits on the substrate; the thermal source corresponding to the source onto which the adhesion material is placed (3) is activated by adjusting the current flowing in the source (7) to have a deposition rate resulting in the deposition of a thin layer of material; the thermal source corresponding to the source onto which the adhesion material is placed (3), is turned off; the thermal source corresponding to the source onto which the conductive metal is placed (2), is activated by adjusting the current flowing in the source (5) to have a deposition rate resulting in the deposition of a thin layer of this metal; the thermal source corresponding to the source onto which the conductive metal is placed (2), is turned off; the current (6) continuously flowing into the sources corresponding onto which the liquid metal is placed (4), is increased to deposit the liquid metal under the form of a thin layer; the thermal source corresponding to the sources onto which the liquid metal is placed (4), is turned off.

(33) Thin layer means a thickness of the layer after deposition of the metal or the material from 1 nm to 200 nm. To make stretchable conductors, the thickness of the adhesion material (e.g. Cr) is about 5 nm and the conductive material (e.g. Au) is about 30 nm.

(34) The different metal layers resulted from the metallization in the method of the invention have an overall thickness of less than 100 nm or in the range from >0 nm to <100 nm, preferably from a few nanometers (>0 nm) to 100 nm, from 3 nm to 100 nm.

(35) In a further embodiment of the method, the deposition of the metals and the material onto the stretchable substrate is patterned. Said pattern may be made through an evaporation mask and/or photolithography etching techniques.

(36) In a further embodiment of the method of the invention, the stretchable substrate comprises an elastomeric material. The stretchable substrate or elastic substrate comprises elastomeric material. A non-exhaustive and non-limiting list of suitable stretchable and/or elastic materials according to the present invention comprises polymeric materials such as silicone (for example polydimethylsiloxane PDMS), stretchable or flexible polychlorobiphenyl, nitrile rubber, polyimide, latex, polyurethane, polyisoprene (synthetic rubber), any kind of elastomers, the Tango family of rubber-like materials (for example TangoPlus or FullCure930), polyurethane foam (foam rubber), XPS foam, polystyrene foam, phenolic foam, styrenic block copolymers, polyolefin blends, elastomeric alloys, thermoplastic polyurethanes (TPU), thermoplastic copolyester, thermoplastic polyamides and the like.

(37) The stretchable conductor and/or electrical connection comprises electrically conductive material being any suitable material able to conduct the electrical current. Said material includes but is not limited to liquid metal and conductive metal.

(38) The liquid metal is selected from metals including but not limiting to gallium, mercury as well as alloys thereof or oxides thereof. The liquid metal (e.g Ga alloys) or a metal with a low melting point (e.g. pure Ga) is combined with the adhesion material and the conductive metal during the evaporation to improve the mechanical property (elasticity and stretchability) of the stretchable conductor and/or electrical connection, said mechanical property is limited to the capacity of deformation of the elastomeric material used for the stretchable substrate.

(39) The conductive metal is selected from metal including but not limiting to copper, silver, gold, aluminum, platinum, palladium and the like as well as alloys or oxides thereof. It allows creating an electrical connection with low resistance.

(40) The adhesion material forms a layer and includes but is not limited to Cr, and Ti. It provides an adhesion between the stretchable substrate and the conductive metal.

(41) In particular, in the method of the invention, the liquid metal is selected from gallium, mercury, chromium, alloys or oxides thereof and from metal being liquid or semi-liquid at less than 90 C. at atmospheric pressure condition; the adhesion material is metallic selected from Cr, Ti and the conductive material is metallic selected front Au, Ag, Cu or Au, Ag, Cu, Pt, Pd.

(42) According to the method of the invention, the adhesion material, the conductive metal and the liquid metal are evaporated in an evaporator chamber under vacuum. The liquid metal is evaporated before, during and after the other metal (conductive metal) and the adhesion material are evaporated. The deposition rate of the liquid metal changes during the process to ensure a proper layer adhesion and a proper combination between metals and materials. The vapor of the liquid metal in the chamber during the whole process combines with the other metal vapors before they deposit onto the substrate. At the end of the process, at room temperature and ambient conditions, the liquid metal is semi-liquid and combined with the other metals to ensure optimal mechanical and electrical properties for application in the stretchable electronics (see FIGS. 2 and 5).

(43) In an aspect, the invention provides a stretchable conductor and/or electrical connection obtained by the method of the invention.

(44) Since the deposition rates of the liquid metal are variable during the whole process, the method of the invention provides stretchable conductors and/or electrical connections, which may have different structures. Said structures include elastic or stretchable substrates forming a stretchable support onto which the adhesion material, the conductive material and the liquid metal are successively deposited (see FIG. 5b), elastic substrates onto which the liquid metal is alternatively deposited in any order between the adhesion and conductive layer (see FIG. 5c) and elastic substrates onto which the liquid metal is deposited continuously first with the adhesion material and then with the conductive material (see FIG. 5d).

(45) The invention also provides a stretchable conductor and/or electrical connection comprises the stretchable substrate, an adhesion material, a conductive metal and a liquid metal, wherein said adhesion material, said conductive metal and said liquid metal are under the form of layers.

(46) According to one embodiment, the stretchable conductor and/or electrical connection further comprises a liquid metal layer onto the stretchable substrate. This liquid metal layer may be optional. The stretchable substrate may be covered by a first liquid metal layer, if present, or directly by the adhesive layer, if said first liquid metal layer is absent.

(47) According to a further embodiment, the stretchable conductor and/or electrical connection further comprises a liquid metal layer onto the conductive metal layer.

(48) According to one embodiment, the adhesion material layer is covered by the conductive metal layer being covered by the liquid metal layer.

(49) In a further embodiment, the adhesion material layer, the conductive metal layer and the liquid metal layer of the stretchable conductor and/or electrical connection are successive layers or alternating layers.

(50) In one embodiment the stretchable conductor and/or electrical connection may further comprise a liquid metal layer between the adhesive material layer and the conductive metal layer.

(51) In one embodiment, the stretchable conductor and/or electrical connection may comprise an adhesion material layer comprising liquid metal and adhesion material and a conductive metal layer comprising liquid metal and conductive metal.

(52) In an embodiment, the stretchable conductor and/or electrical connection is stretchable for more than 100% of the initial length depending on the deformation capacity of the stretchable substrate. The deformation of the stretchable conductor and/or electrical connection is more than 300% of elongation, in the range from 100% to 500%, from 100% to 300% of the initial length. In a particular case, a stretchable conductor and/or electrical connection providing by the metallization of CrAuGa alloy stretches and remains conductive in the whole elastic range of 500% elongation of the substrate being PDMS.

(53) In an aspect, the invention provides a device comprising one or more stretchable conductors and/or electrical connections according to the invention.

(54) In one embodiment, the device of the invention is selected from a strain gauge, a capacitive pad, a ground plane, a sensor, a capacitive sensor, a capacitive sensor array, an electronic mechanic connection.

(55) In a further embodiment, the device of the invention is for use in measuring dental occlusion and dental forces though capacitive means. Accordingly, the device for use in measuring dental occlusion of a subject through capacitive means, characterized in that it comprises: a substrate reversibly deformable upon dental occlusion; and a sensor incorporated within said substrate comprising at least one capacitive pad and transmission conductive lines, said transmission conductive lines operatively connecting the capacitive pad to a micro controller unit.

(56) In another embodiment, the device of the invention is an electronic and mechanic connection comprising two circuit pads, wherein at least one of the pads is a stretchable conductor and/or electrical connection according to invention, namely obtained by the method of the invention.

(57) The present invention is now illustrated by way of examples. These examples do not limit the scope this invention, which is defined by the appended claims.

EXAMPLES

(58) Novel Transition from Stretchable to Flexible Electronics Circuit

(59) The method of the invention resulting into deposited metals on elastic substrates allows to put in electrical contact the flexible electronic board to the stretchable one (see FIG. 6). The liquid metal evaporated and combined with Au can remain in contact with the flexible electronic metal parts.

(60) A pad (2, 5) is patterned on both the flexible substrate (1) and the stretchable one (4) to increase the contact region of the two circuits. A pattern is created in the flexible board with photolithography and etching techniques. In this region an adhesive is placed (3) to improve the adhesion between the two substrates (see FIG. 6A). The amount of this adhesive is below the level of the metallization, pulling the stretchable PCB (6) towards the flexible one (7), improving the electrical contact (see FIG. 6B). Further encapsulation and mechanical clumps can be added in this region to improve the adhesion.

(61) Using the method of invention, a sample for mechanical stretching tests was prepared (see FIG. 8). The sample consists of a narrow conductive line (2) was patterned on thin silicone (1). Such a line has 5 cm length and 250 m width at rest. The metal deposition was performed by evaporating Cr, Au and Ga at a rate of 1 nm/s, 3 nm/s and 0.1 nm/s respectively. The deposition of the Ga occurred along the entire process. Electrical wires (3) are directly connected to the pads on the sample using an adhesive (4). The sample was then tested. A computer-controlled mechanical test machine linearly extended the sample (as indicated by the arrows in FIG. 6) and the resistance of the line for different values of strain was measured (see FIG. 9). The line remains electrically conductive up to 100% of strain and more.

(62) Application in Dentistry

(63) The method of the invention also allows the use of stretchable electronics in fields of technological application where the stress and deformation of the substrate are much higher than the current state of the art. Furthermore, this invention introduces the possibility of interlacing stretchable electronics substrates with traditional electronic substrates without using harmful conductive pastes and other liquid conductors allowing stretchable electronics to be used in fields of application where toxicity is forbidden (e.g. the dental or medical field).

(64) Using the method of invention, a pressure sensitive capacitive sensor array on biomedical silicone have been fabricated (FIG. 7A). The sensor array (1) has been connected (3) to a semi-rigid electronic board (2) without using any conductive pastes or harmful materials (FIG. 7B). The electronics on the board (4) processes the signals gathered by the sensor array and evaluates the patient occlusion. Upon dental forces and stresses (5), the electronics elements adapt their shape to the dental topology, stretches, compresses and relaxes while remaining conductive and elastic even for high deformations.

REFERENCES

(65) [1] U.S. Pat. No 7,491,892 B2Stretchable and elastic interconnects, Princeton University [2] S. P. Lacour et al, Electronic dura mater for long term multimodal neural interfaces, Science 9, January 2015, Vol. 347 no. 6218 pp. 159-163 [3] A. P. Gerratt, N. Sommer, S. P. Lacour and A. Billard, Stretchable capacitive tactile skin on humanoid robot fingersFirst experiments and results, 2014 IEEE-RAS International Conference on Humanoid Robots, Madrid, 2014, pp. 238-24510 [4] N. Tiercelin, P. Coquet, R. Sauleau, V. Senez and H. Fujita, Polydimethylsiloxane membranes for millimeter wave planar ultra flexible antennas, Journal of Micromechanics and Microengineering, IOP Publishing, 2006, pp. 2389-2395 [5] J. W. Boley, E. L. White, G. T.-C. Chiu, R. K. Kramer, Direct Writing of Gallium-Indium Alloy for Stretchable Electronics, Advanced Functional Materials 23, June 18, Vol. 24, pp. 3501-3507.