INTEGRATED RF LIMITER
20190267953 ยท 2019-08-29
Inventors
Cpc classification
H03F2200/444
ELECTRICITY
H03F2200/211
ELECTRICITY
H03G11/00
ELECTRICITY
International classification
H03G11/00
ELECTRICITY
Abstract
A limiter circuit is integrated into an RF power amplifier. The limiter circuit automatically starts adding attenuation at the input of the RF power amplifier after a predetermined input power level threshold is exceeded, thereby extending the safe input drive level to protect the amplifier. In a preferred embodiment of the invention, the limiter circuit is implemented using a pseudomorphic high electron mobility transistor (PHEMT) device or a metal semiconductor field effect transistor (MESFET) device. Diode connected transistors or Schottky diodes may also be used in the limiter circuit.
Claims
1-24. (canceled)
25. A power amplifier module comprising: a signal input; a power amplifier stage of a first power amplifier, the power amplifier stage of the first power amplifier including a first transistor; and a first limiter connected between the signal input and the power amplifier stage of the first power amplifier, the first limiter including at least a first pseudomorphic high electron mobility transistor connected to a base of the first transistor and a first diode connected to a collector of the first transistor.
26. The power amplifier module of claim 25 wherein the first transistor is a heterojunction bipolar transistor.
27. The power amplifier module of claim 25 wherein the power amplifier stage of the first power amplifier is formed in a III-V semiconductor material.
28. The power amplifier module of claim 25 wherein the first limiter further includes a second diode connected in series to the first diode.
29. The power amplifier module of claim 25 wherein the first diode is implemented by a second pseudomorphic high electron mobility transistor.
30. The power amplifier module of claim 25 wherein the first diode is implemented by a metal-semiconductor field-effect transistor.
31. The power amplifier module of claim 25 wherein the first diode is a Schottky barrier diode.
32. The power amplifier module of claim 25 further comprising a power amplifier stage of a second power amplifier, the power amplifier of the second power amplifier including a second transistor, and the second power amplifier configured to support a different power level than the first power amplifier.
33. The power amplifier module of claim 32 further comprising a second limiter connected between the signal input and the power amplifier stage of the second power amplifier.
34. The power amplifier module of claim 33 wherein the second limiter includes at least a second pseudomorphic high electron mobility transistor connected to a base of the second transistor and a second diode connected to a collector of the second transistor.
35. The power amplifier module of claim 32 further comprising a switch configured to select between a first path associated with the first power amplifier and a second path associated with the second power amplifier.
36. The power amplifier module of claim 25 wherein the first limiter circuit is configured to attenuate a signal received at the signal input when an input power level satisfies a threshold.
37. The power amplifier module of claim 25 wherein the first limiter further includes a direct current blocking capacitor connected to the first pseudomorphic high electron mobility transistor.
38. A wireless device comprising: an antenna; and a power amplifier module including a signal input, a power amplifier stage of a first power amplifier, and a first limiter, the power amplifier stage of the first power amplifier including a first transistor, and the first limiter connected between the signal input and the power amplifier stage of the first power amplifier, and including at least a first pseudomorphic high electron mobility transistor connected to a base of the first transistor and a diode connected to a collector of the first transistor.
39. The wireless device of claim 38 wherein the wireless device is a cellular phone.
40. The wireless device of claim 38 wherein the diode is implemented by a second pseudomorphic high electron mobility transistor, is implemented by a metal-semiconductor field-effect transistor, or is a Schottky barrier diode.
41. The wireless device of claim 38 wherein the power amplifier module further includes a power amplifier stage of a second power amplifier and a second limiter connected between the signal input and the power amplifier stage of the second power amplifier, the power amplifier of the second power amplifier including a second transistor, and the second power amplifier configured to support a different power level than the first power amplifier.
42. The wireless device of claim 41 wherein the second limiter includes at least a second pseudomorphic high electron mobility transistor connected to a base of the second transistor and a second diode connected to a collector of the second transistor.
43. The wireless device of claim 41 wherein the power amplifier module further includes a switch configured to select between a first path associated with the first power amplifier and a second path associated with the second power amplifier.
44. The wireless device of claim 38 wherein the first limiter circuit attenuates a signal received at the signal input when an input power level satisfies a threshold.
Description
BRIEF DESCRIPTION OF DRAWING
[0004] These and other objects, features and advantages of the invention will be more readily apparent from the following detailed description in which:
[0005]
[0006]
[0007]
[0008]
DETAILED DESCRIPTION
[0009]
[0010]
[0011] With RF applied to RFIN in the normal operational input power range, M2 is biased to be in a fully on low loss state. When the input level reaches a certain power level determined by the combination of the diodes, resistors and the RF gain of the first stage (Q6), the source and drain voltage of M2 will increase to become more positive relative to the gate causing M2 to start pinching off or go into a high loss state.
[0012]
[0013] As shown in
[0014] Illustratively, the HBT and field effect transistor (FET) devices are formed in a III-V semiconductor material such as Gallium Nitride, Indium Phosphide, or Gallium Arsenide/Indium Gallium Phosphide. In some applications, it may be advantageous to integrate the HBT and the FET device in a single semiconductor crystal by epitaxially growing the HBT device on an epitaxially grown FET device. Such a device and the process for making it in a GaAs/InGaP epitaxial growth process is described in U.S. Pat. No. 7,015,519, which is incorporated herein by reference. Other materials may also be used.
[0015] As will be apparent to those skilled in the art, numerous variations may be practiced within the spirit and scope of the present invention.