Method for preparing the remainder of a donor substrate, substrate produced by said method, and use of such a substrate

Abstract

A method is used to prepare the remainder of a donor substrate, from which a layer has been removed by delamination in a plane weakened by ion implantation. The remainder comprises, on a main face, an annular step corresponding to a non-removed part of the donor substrate. The method comprises the deposition of a smoothing oxide on the main face of the remainder in order to fill the inner space defined by the annular step and to cover at least part of the annular step, as well as heat treatment for densification of the smoothing oxide. A substrate is produced by the method, and the substrate may be used in subsequent processes.

Claims

1. A method for preparing a remainder of a donor substrate comprising: removing a layer from the donor substrate by delamination in a plane weakened by ion implantation, the remainder of the donor substrate including an annular step on a main face of the donor substrate, the annular step corresponding to a non-removed part of the donor substrate; depositing a smoothing oxide on the main face of the remainder of the donor substrate and filling an inner space defined by the annular step with the smoothing oxide and covering at least part of the annular step with the smoothing oxide; and then heat treating and densifying the smoothing oxide.

2. The method of claim 1, wherein the smoothing oxide comprises a spin-on glass.

3. The method of claim 2, wherein the heat treatment is performed at a temperature of between 225° C. and 900° C.

4. The method of claim 3, wherein the heat treatment is carried out in a nitrogen atmosphere.

5. The method of claim 4, wherein depositing the smoothing oxide comprises forming a layer having a thickness at least equal to one and a half times a height of the annular step.

6. The method of claim 5, further comprising, before depositing the smoothing oxide, removing a peripheral zone of the main surface damaged by ion implantation.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Other features and advantages of embodiments of the present disclosure will emerge from the following detailed description of examples of embodiments of the present disclosure with reference to the appended figures, in which:

(2) FIGS. 1A-1E depict the various steps of an example of a layer removal method;

(3) FIG. 2 depicts the remainder obtained after the layer removal;

(4) FIGS. 3A and 3B depict the various steps of a first embodiment according to the invention;

(5) FIGS. 4A-4D depict the various steps of a second embodiment according to the invention.

DETAILED DESCRIPTION

(6) For the sake of simplifying the following description, the same references are used for elements that are identical or perform the same function.

(7) The figures are schematic depictions, which, for the sake of readability, are not to scale.

(8) The present disclosure relates to a method for preparing the remainder of a donor substrate in order to make it usable.

(9) This remainder is generally obtained following the removal, from the donor substrate 1, of a thin layer 5 by delamination in a plane 3 weakened by ion implantation, the remainder 1′ comprising, on a main face 10, an annular step 11 corresponding to a non-removed part of the donor substrate 1. The thin layer 5 is transferred to a support substrate 4.

(10) The donor substrate 1 and the support substrate 4 may consist of any materials. This may be a semiconductive material (such as silicon, SiGe, germanium, gallium nitride), an insulator (such as sapphire or glass) or a piezoelectric material (such as lithium tantalate or lithium niobate).

(11) The donor substrate 1 and/or the support substrate 4 may be provided with a surface insulator layer 2 comprising, for example, a silicon or aluminum oxide, or a silicon or aluminum nitride. It may thus have been formed by deposition, oxidation or nitriding, as appropriate.

(12) The donor substrate 1 and the support substrate 4 may advantageously be disk-shaped silicon wafers, the diameter of which is typically 200 mm, 300 mm or even 450 mm. At least one of these wafers may have a surface insulator layer, such that a silicon-on-insulator wafer is obtained at the end of the method. However, the present disclosure is not limited to these materials, this shape or these dimensions alone.

(13) FIG. 1 depicts the various steps of an example of a layer removal method of the Smart Cut type, resulting in the remainder 1′ used in embodiments of the present disclosure.

(14) This type of method comprises providing a donor substrate 1, illustrated by FIG. 1A, optionally followed by a step of oxidation of the donor substrate 1 illustrated by FIG. 1B with the formation of a surface oxide layer 2 as described previously.

(15) Next, a first step, illustrated by FIG. 1C, of formation of a plane 3 weakened by implantation of light species into the donor substrate 1 is carried out, so as to form a thin layer 5 between this plane and the implanted surface of the donor substrate 1. The weakened plane 3 is typically produced by implantation of hydrogen and/or of noble gas. Thus, the light species may be selected from hydrogen and helium ions at doses of between 5e15 and 1e17 at/cm′.

(16) As regards the implantation energy, it is typically between 10 keV and 200 keV and defines the implantation depth of the ions.

(17) In a second step, illustrated by FIG. 1D, subsequent to the first step, the support substrate 4 is assembled with the implanted surface of the donor substrate 1, to form an assembly to be fractured. This assembly is preferentially produced by molecular adhesion, i.e., by direct adhesion of the surfaces to one another without adding adhesive material (aside from water), and by using adhesion forces mainly of the van der Waals or covalent type.

(18) The assembly step may be preceded by any prior surface treatment of the donor substrate 1 and of the support substrate 4, such as one or more cleaning operations, plasma activation, etc.

(19) In a following step, illustrated by FIG. 1E, the assembly to be fractured is subject to a fracturing heat treatment step. This step aims to develop microcavities, platelets, and/or other types of defects that are precursors to the fracture in the weakened plane 3. It leads to the initiation and propagation of the fracture wave along the weakened plane 3 so as to transfer the thin layer 5 to the support substrate 4.

(20) This fracturing heat treatment may also help to strengthen the degree of adhesion between the donor substrate 1 and the support substrate 4.

(21) At the end of this fracturing heat treatment step, and as depicted in FIG. 1E, both the thin layer 5 transferred to the support substrate 4 and a remainder 1′, depicted in more detail in FIG. 2, of the donor substrate 1 from which the useful layer 5 was removed are obtained.

(22) The remainder 1′ comprises, on a main face 10, an annular step 11 corresponding to a non-removed part of the donor substrate 1. This is a peripheral zone where the degree of adhesion between the donor substrate 1 and the support substrate 4 is insufficient to enable the layer to be removed. The width of the step 11 may range from 0.5 to 3 mm and the height thereof may range from 100 nm to 3.5 micrometers or even 4 micrometers.

(23) The presence of the step 11 and the surface properties of the main face 10 do not enable direct reuse and necessitate the preparation of the remainder 1′ before re-use, in particular, in a method of the Smart Cut™ type or a layer transfer method. The present disclosure proposes such a preparation of the remainder 1′.

First Embodiment

(24) According to a first embodiment, depicted in FIGS. 3A and 3B, the method for preparing the remainder 1′ comprises two steps: a deposition of a smoothing oxide 6 on the main face 10 of the remainder 1′, and a heat treatment for densification of the smoothing oxide.

(25) The smoothing oxide 6 is generally selected from the SOG (Spin-On Glass) family, which glasses have the property of being in liquid state at room temperature but may be densified, and made solid, using a suitable heat treatment.

(26) The step of deposition of a smoothing oxide 6 consists in depositing a layer of smoothing oxide 6 on the main face 10 of the remainder 1′ in order to fill the inner space defined by the annular step 11 and to cover at least part of the annular step 11. The deposition of smoothing oxide 6 may also preferably be carried out under conditions leading to the formation of a layer having a thickness at least equal to one and a half times the height of the annular step 11, as illustrated in FIG. 3B. In order to carry out the planarization of the main surface 10 by the smoothing oxide 6, the remainder 1′ is rotated on its support so that it can be distributed by centrifugal force.

(27) The step of densification heat treatment consists in exposing the remainder provided with the layer of smoothing oxide 6 to a temperature of between 225° C. and 850° C., or even 900° C. This heat treatment may last approximately 1 h and be carried out under a nitrogen atmosphere.

(28) At the end of this step, the surface of the smoothing oxide 6 is sufficiently smooth, with a roughness typically of less than 5 Å RMS (AFM measurement 5×5 μm.sup.2), to satisfy the requirements of its subsequent use. The layer of smoothing oxide 6 has an elasticity, viscosity and/or breaking strength, which are sufficient to prevent the possible exfoliation of the bubbles associated with the weakened plane present under the step 11 during the densification annealing or during steps leading to the exposure of the treated substrate to high temperatures.

(29) At the end of these treatments, a substrate 7 is obtained, illustrated by FIG. 3B, comprising a remainder 1′ of a donor substrate 1, the remainder 1′ comprising, on a main face 10, an annular step 11 corresponding to a non-removed part of the donor substrate 1. The remainder 1′ may also comprise a surface oxide layer 2 obtained during the steps for transfer of the thin layer 5 from the donor substrate 1 to the support substrate 4. The donor substrate 1 may consist of silicon.

(30) The substrate 7 also comprises an oxide layer 6 on the main face 10 of the remainder 1′, the oxide layer 6 filling the inner space defined by the annular step 11 and covering at least part of the annular step 11. Preferably, the oxide layer 6 has a thickness at least equal to one and a half times the height of the annular step 11.

Second Embodiment

(31) According to a second embodiment, depicted in FIGS. 4A to 4D, the method for preparing the remainder 1′ comprises an additional step of preparing the main surface 10 of the remainder 1′ before the step of deposition of the smoothing oxide 6.

(32) Indeed, there is a risk of exfoliation of the annular step 11, or of a part thereof, at the residual implantation defects, when the latter remain present in the remainder 1′ as can be seen in FIGS. 3A and 4A. This problem may arise with the first embodiment even if it is advantageously reduced by covering the step 11 with the smoothing oxide 6, by virtue, in particular, of its viscosity, elasticity, and breaking strength properties. However, it remains possible to further reduce this risk.

(33) In order to reduce this risk, this second embodiment provides a step of preparing the main surface 10 of the remainder, with the aim of eliminating the part of the step 11 subject to the exfoliation. This step of preparing the main surface 10 of the remainder 1′ may thus comprise: the preliminary removal of the surface oxide layer 2 (FIG. 4B); elimination of material, for example, by chemical etching, configured to remove a thin layer of the main surface 10 of the remainder 1′ and eliminate the part of the step 11 damaged by ion implantation (FIG. 4C). In other words, the step of preparing the main surface 10 comprises the removal of a peripheral zone of this surface, which has been damaged by ion implantation.

(34) The step of removal of the oxide layer, depicted by FIG. 4B, makes it possible to expose the damaged part of the step 11 to be treated. This may, for example, be a wet chemical etching, under cold conditions, of the oxide with a dilute hydrofluoric acid (HF) solution.

(35) The step of chemical etching of the remainder enables the removal of the part of the step 11 damaged by the ion implantation and therefore subject to the exfoliation. This may, for example, be a wet chemical etching, under hot conditions, of the remainder 1′ by a basic aqueous solution of TMAH or KOH to remove a thickness of the remainder 1′ over a depth at least equivalent to the initial step height.

(36) It is also possible to consider other methods for preparing the surface, such as polishing and/or partial trimming of the plate edge, for example.

(37) This step of preparing the surface implements simple and inexpensive treatments which do not however make it possible to obtain an entirely planar surface. At the end of these treatments, and regardless of the technology used during the surface preparation step, the remainder 1′ still has a peripheral topography that defines a residual annular step 11.

(38) At the end of the surface preparation step, the steps described in relation to the first embodiment are reproduced, that is to say that the smoothing oxide is deposited on the main face 10 of the remainder, in order to fill the inner space defined by the annular step 11 and to cover at least part of the annular step 11; and a heat treatment for densification of the smoothing oxide 6 is applied.

(39) At the end of this method, a substrate 7 is obtained, illustrated by FIG. 4D, comprising a remainder 1′ of the donor substrate 1, comprising, on the main face 10 thereof, a residual annular step 11. The remainder 1′ may also comprise a surface oxide layer 2 (FIG. 3B). The substrate 7 also comprises an oxide layer 6 on the main face 10 of the remainder 1′, the oxide layer 6 filling the inner space defined by the annular step 11 and covering at least part of the annular step 11.

(40) A method in accordance with the present disclosure has the advantage of reducing the loss of material, of not requiring the complete removal of the step 11 of the main face 10 of the remainder 1′, and of providing a perfectly planar face. In particular, it is possible to dispense with a step of “double-sided polishing,” which is generally necessary in the solutions known in the art. It makes it possible to produce a substrate 7 in a small number of steps, reducing the loss of material, and having satisfactory surface properties to be used, for example, as a recipient substrate for the manufacture of substrates for MEMS.

(41) Use

(42) The substrate 7 produced by a method in accordance with the present disclosure can be used as recipient substrate for the manufacture of a substrate on insulator, for example, of SOI type.

(43) The use of this substrate 7 comprises the assembly thereof with a donor substrate, then the thinning of this donor substrate to form a structure on insulator.

(44) The properties of the smoothing oxide layer 6 make it possible to produce the assembly without applying a high-temperature adhesion heat treatment.

(45) The substrate 7 may thus preferably be used as a support in a layer transfer method, the assembling possibly comprising a heat treatment that may be carried out at low temperature, typically between 100° C. and 900° C. Even more preferentially, the heat treatments are carried out at temperatures of between 100° C. and 500° C., and the transferred layer may then be provided with microelectronics devices for an application in the field of 3D integration.

(46) Of course, the invention is not limited to the embodiments described and variant embodiments can be added thereto without departing from the scope of the invention as defined by the claims.