Automotive laminate with embedded wire circuit
11541650 · 2023-01-03
Assignee
Inventors
Cpc classification
B32B17/10871
PERFORMING OPERATIONS; TRANSPORTING
H05B2203/031
ELECTRICITY
H05B3/86
ELECTRICITY
B60J1/002
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10036
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10385
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10376
PERFORMING OPERATIONS; TRANSPORTING
B60J1/02
PERFORMING OPERATIONS; TRANSPORTING
B32B37/142
PERFORMING OPERATIONS; TRANSPORTING
B60R16/0231
PERFORMING OPERATIONS; TRANSPORTING
B29C70/82
PERFORMING OPERATIONS; TRANSPORTING
B32B17/10981
PERFORMING OPERATIONS; TRANSPORTING
B60R16/03
PERFORMING OPERATIONS; TRANSPORTING
International classification
G02F1/1335
PHYSICS
G02F1/17
PHYSICS
C09K11/02
CHEMISTRY; METALLURGY
G02F1/1334
PHYSICS
G02F1/157
PHYSICS
H05B3/86
ELECTRICITY
B60J1/02
PERFORMING OPERATIONS; TRANSPORTING
B32B37/14
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Laminated glazings with embedded wire circuits, have many uses. But, due to the higher cost of manufacture, they are not widely used. This invention provides a process to reduce the cost of production for embedded wire laminated glazing. Rather than embedding the wire one interlayer at a time, several circuits are produced on the same sheet, cut out and then inserted into the interlayer of each separate laminate during assembly, reducing the direct labor and capital investment required.
Claims
1. A process for manufacturing a laminated glazing with embedded circuits, comprising the steps of: embedding multiple circuits on a first sheet of interlayer; cutting and separating said embedded multiple circuits from said first sheet of interlayer; providing a second sheet of interlayer for bonding glass layers of the laminated glazing; splicing a cut portion of the second sheet of interlayer with one separated circuit of said embedded multiple circuits to the first sheet of interlayer; assembling the layers that are to be part of the laminated glazing; and applying heat and pressure to said laminated glazing.
2. The process of claim 1, wherein the circuit is a wire circuit and the wire comprises tungsten wire in the range of about 9 microns to about 125 microns.
3. The process of claim 1, wherein the circuit is a wire circuit and the wire comprises copper wire in the range of about 20 microns to 250 microns.
4. A laminated glazing comprising: a portion of a first sheet of interlayer having a first embedded circuit; and a second sheet of interlayer for bonding glass layers of the laminated glazing; wherein the second sheet of interlayer is spliced to the portion of the first sheet of interlayer having the first embedded circuit; wherein the second sheet of interlayer has different properties than that of the first sheet of interlayer.
5. The laminate glazing of claim 4, wherein the second sheet of interlayer is a PVB interlayer.
6. A vehicle comprising the laminate glazing of claim 4.
7. The laminated glazing of claim 4, wherein: the second sheet of interlayer comprises a first opening; and the portion of the first sheet of interlayer having the first embedded circuit is placed into the first opening of the second sheet of interlayer.
8. The laminated glazing of claim 7, wherein the first embedded circuit and the second embedded circuits are different from each other.
9. The laminated glazing of claim 7, further comprising: a portion of a third sheet of interlayer having a second embedded circuit; and wherein the second sheet of interlayer comprises a second opening; and wherein the portion of the third sheet of interlayer having the second embedded circuit is placed into the second opening of the second sheet of interlayer.
10. The laminated glazing of claim 4, wherein the circuit is a wire circuit and the wire comprises tungsten wire in the range of about 9 microns to about 125 microns.
11. The laminated glazing of claim 4, wherein the circuit is a wire circuit and the wire comprises copper wire in the range of about 20 microns to 250 microns.
12. The laminate glazing of claim 4, wherein the second sheet of interlayer is a performance interlayer selected from the group consisting of wedge interlayer, solar control interlayer, and sound deadening interlayer.
13. The laminate glazing of claim 4, wherein the circuit is a wire circuit and the wire comprises uninsulated copper and/or tungsten wire.
14. The laminated glazing of claim 4, wherein the first embedded circuit is a HWA defroster.
15. The laminated glazing of claim 4, wherein the first embedded circuit is a camera area defroster.
16. The laminated glazing of claim 4, wherein both first embedded circuit and second embedded circuit are wire circuits having different wire sizes.
17. The laminated glazing of claim 9, wherein the first opening and a second opening are made from different sizes.
18. The laminated glazing of claim 4, wherein the circuit is selected from the group consisting of resistive heating circuit, antenna circuit, rain sensing circuit, power supplying circuit, occupant sensing circuit, data transmitting circuit, touch sensitive circuit, lighting circuit and control signal circuit.
19. The process of claim 1, further comprising the steps of: cutting a first opening in the second sheet of interlayer; and placing the separated circuit of said multiple circuits embedded on the first sheet of interlayer into the first opening of said second sheet of interlayer.
20. The process of claim 19, further comprising the steps of: embedding multiple circuits on a third sheet of interlayer; cutting and separating said embedded multiple circuits from said third sheet of interlayer; cutting a second opening in the second sheet of interlayer; and placing the separated circuit of said multiple circuits embedded on the third sheet of interlayer into the second opening of said second sheet of interlayer.
21. The laminated glazing of claim 4, wherein the first embedded circuit of the first sheet interlayer and the second sheet of interlayer have different functionalities and/or comprise wire circuits having different types of wires.
Description
BRIEF DESCRIPTION OF THE FIGURES
(1) These features and advantages of the present invention will become apparent from the detailed description of the following embodiments in conjunction with the accompanying drawings, wherein:
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REFERENCE NUMERALS
(13) 2 Glass 4 Interlayer 5 Wire 8 Heated wiper area defroster 10 Camera defroster 12 Bus bar 14 Cut
DETAILED DESCRIPTION OF THE INVENTION
(14) The cost of the conventional process of embedding wire is driven by the low throughput and resulting high capital, floor space and labor required.
(15) In the case of a heated windshield, where substantially all of the surface area must have wire embedded, consuming several hundreds of meters of wire, the one at a time approach is the only way to make the circuit on an XY type machine. Multiple full windshields circuits can be produced on a CNC machine that operates in a manner similar to that of a lathe. The interlayer is wrapped around a large (1.5 m diameter) drum, bus bars are applied to the interlayer, and the wire is embedded as the drum spins. While this works well for these types of circuits, it is not possible to make the more complex circuits required for the camera and HWA.
(16) On a windshield having both a camera and a HWA, the total heated area is less than 10% of the windshield surface area. The camera area is in the range of 1 to 2 decimeters squared or less than 2% of the typical 1.5 square meter windshield. Only 2-4 meters of wire are needed. The HWA is larger but still only need cover the area from just below the wipers to just about the area heated by the hot air blower system. A large HWA would be in the range of 5-10 square decimeters or 3.5% to 7% of the surface area and uses just 10-20 meters of wire.
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(18) When processing interlayers for parts with camera 10 and/or HWA 8 circuits, one sheet at a time, up to 90% of the cycle time is taken up by placing and locating the sheet of interlayer 4 on the machine and then removing and stacking off after the wire has been embedded. Part to this is due to the large size and the soft, limp composition of the interlayer 4 which makes them difficult to handle.
(19) If both an HWA 8 and a camera 10 defroster are needed a tool change over must be made. Due to the differences between the sizes of the two circuits, they will rarely be able to use the same wire and sometimes not even the same bus bar.
(20) By producing multiple copies of each circuit on separate sheets of interlayer, and then combining the circuits with the larger sheet during assembly of the laminate just prior to the autoclave, these disadvantages are greatly reduced. This method also enables the use of less expensive machines with smaller beds.
(21) It should be noted that the embedded wire circuit could have functionalities as the followings: a resistive heating circuit, an antenna circuit, rain sensing circuit, power supplying circuit, occupant sensing circuit, data transmitting circuit, touch sensitive circuit, lighting circuit, control signal circuit among others.
DESCRIPTION OF EMBODIMENTS
(22) Referring to
(23) Processing one sheet at a time, a machine having an envelope of at least 1.4 m×1.2 m can produce sixteen interlayers per hour as shown in Table 1. Therefore four machines are needed and must have a utilization rate of 96% to meet the demand.
(24) Sixty of the camera 10 defroster circuits cans be embedded on a 1 square meter interlayer in 1,522 seconds and a rate of 142 per hour (see Table 2 and
(25) The circuits are cut 14 and separated from the interlayer 4 sheet and then inserted into the individual laminate interlayer sheet into openings cut to fit the circuits. The assembled laminate is then processed in the same as a standard laminate with heat and pressure applied in an autoclave.
(26) With a larger machine, 1 m×1.2 m, the HWA 8 along with the entire bottom portion of the interlayer 4 can be produced and then spliced to the shorter interlayer sheet at assembly. This is advantageous when a more expensive performance (wedge, solar control, sound deadening, etc.) interlayer 4 required. There is no need for the performance interlayer 4 in the areas of the laminate that are obscured by black paint and the splice is also obscured.
(27) Eight HWA circuits can fit on a 1 m×1.2 m sheet of interlayer 4 as shown in
(28) In both cases, the capital investment is reduced by replacing four larger machines with two smaller machines. Clean room floor space is saved by reducing the foot print by using fewer and smaller machines as is the storage space required for work in process embedded wire interlayers. One additional person is required during assembly to splice the interlayer but this added labor is offset by the reduction in labor in the wire embedding process.
(29) TABLE-US-00001 TABLE 1 Operation Meters Seconds Load 60 Tool Change 20 Camera Bus bars 0.2 10 Tool Change 20 HWA Bus bars 0.2 10 Tool Change 20 Camera Wire 3.0 13 Tool Change 20 HWA Wire 18.0 28 Unload 30 Total 231 #/hour 16
(30) TABLE-US-00002 TABLE 2 Per Sheet 60 Operation Meters Seconds Seconds Load 60 Tool Change 20 20 Camera Bus bars 0.2 10.2 612 Tool Change 20 20 Camera Wire 3 13 780 Unload 30 30 Cycle Time 1,522 Each 25 #/hour 142
(31) TABLE-US-00003 TABLE 3 Per Sheet 10 Operation Meters Seconds Seconds Load 60 Tool Change 20 20 HWA Bus bars 0.2 10.2 102 Tool Change 20 20 HWA Wire 18 28 280 Unload 30 30 Cycle Time 512 Each 51 #/hour 70
(32) TABLE-US-00004 TABLE 4 Per Sheet 8 Operators Meters Seconds Seconds Load 60 Tool Change 20 20 HWA Bus bars 0.2 10.2 82 Tool Change 20 20 HWA Wire 18 28 224 Unload 30 30 Cycle Time 436 Each 54 #/hour 66