Radio frequency transmitter having improved receive band rejection function
10396750 ยท 2019-08-27
Assignee
Inventors
Cpc classification
H04B1/525
ELECTRICITY
H03H9/25
ELECTRICITY
H04B1/0458
ELECTRICITY
H03H7/40
ELECTRICITY
International classification
H03H7/40
ELECTRICITY
H04B1/525
ELECTRICITY
H03H19/00
ELECTRICITY
H03H9/25
ELECTRICITY
Abstract
A radio frequency transmitter includes a transmit circuit configured to generate a transmit signal; a receive band rejection filter comprising a capacitor and an inductor resonating with each other to reject a receive frequency band from the transmit signal, wherein a ratio value of a capacitance value of the capacitor to an inductance value of the inductor is within a predetermined range; and a power amplifying circuit configured to amplify the transmit signal through the receive band rejection filter.
Claims
1. A radio frequency transmitter, comprising: a transmit circuit configured to generate a transmit signal; a receive band rejection filter comprising a capacitor and an inductor resonating with each other to reject a receive frequency band from the transmit signal, wherein a ratio value of a capacitance value of the capacitor to an inductance value of the inductor is within a predetermined range; and a power amplifying circuit configured to amplify the transmit signal through the receive band rejection filter.
2. The radio frequency transmitter of claim 1, wherein the capacitor and the inductor resonate in series with each other, and in a series resonance circuit in which the capacitance value of the capacitor is C picofarads (pF) and the inductance value of the inductor is C*M1 nanohenry (nH), M1, corresponding to a first ratio value, is within a range of 1 to 20.
3. The radio frequency transmitter of claim 2, wherein the inductor comprises an inductance element.
4. The radio frequency transmitter of claim 1, wherein the capacitor and the inductor resonate in parallel with each other, and in a parallel resonance circuit in which the inductance value of the inductor is L nanohenry (nH) and the capacitance value of the capacitor is L*M2 picofarads (pF), M2, corresponding to a second ratio value, is within a range of 1 to 20.
5. The radio frequency transmitter of claim 4, wherein the inductor comprises a bonding wire.
6. The radio frequency transmitter of claim 1, wherein the predetermined range is 1 to 20.
7. A radio frequency transmitter, comprising: a transmit circuit configured to generate a transmit signal; a receive band rejection filter configured to reject a receive frequency band from the transmit signal; and a power amplifying circuit configured to amplify the transmit signal through the receive band rejection filter, wherein one of the transmit circuit and the power amplifying circuit comprises a capacitor for impedance matching, the receive band rejection filter comprises an inductor that resonates with the capacitor to reject the receive band, and a ratio value between a capacitance value of the capacitor and an inductance value of the inductor is within a predetermined range.
8. The radio frequency transmitter of claim 7, wherein the receive band rejection filter comprises the capacitor and the inductor resonating with each other in series to reject the receive band, and in a series resonance circuit in which the capacitance value of the capacitor is C pF and the inductance value of the inductor is C*M1 nH, M1, corresponding to a first ratio value, is within a range of 1 to 20.
9. The radio frequency transmitter of claim 8, wherein the inductor comprises an inductance element.
10. The radio frequency transmitter of claim 7, wherein the receive band rejection filter comprises the capacitor and the inductor resonating with each other in parallel to reject the receive band, and in a parallel resonance circuit in which the inductance value of the inductor is L nH and the capacitance value of the capacitor is L*M2 pF, M2, corresponding to a second ratio value, is within a range of 1 to 20.
11. The radio frequency transmitter of claim 10, wherein the inductor comprises a bonding wire.
12. The radio frequency transmitter of claim 7, wherein the predetermined range is 1 to 20.
13. A radio frequency transmitter, comprising: a transmit circuit configured to generate a transmit signal; a receive band rejection filter receiving the transmit signal and configured to filter a receive frequency band from the transmit signal to create a filtered transmit signal, the receive band rejection filter comprising a capacitor and an inductor resonating with each other; and a power amplifying circuit configured to amplify the filtered transmit signal; wherein a ratio value of a capacitance value of the capacitor to an inductance value of the inductor is within 1 to 20.
14. The radio frequency transmitter of claim 13, wherein the capacitor and the inductor resonate in series with each other.
15. The radio frequency transmitter of claim 14, wherein the inductor is a bonding wire.
16. The radio frequency transmitter of claim 13, wherein the capacitor and the inductor resonate in parallel with each other.
17. The radio frequency transmitter of claim 16, wherein the inductor is a bonding wire.
Description
BRIEF DESCRIPTION OF DRAWINGS
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(19) Throughout the drawings and the detailed description, the same reference numerals refer to the same elements. The drawings may not be to scale, and the relative size, proportions, and depiction of elements in the drawings may be exaggerated for clarity, illustration, and convenience.
DETAILED DESCRIPTION
(20) The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatuses, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the disclosure of this application. For example, the sequences of operations described herein are merely examples, and are not limited to those set forth herein, but may be changed as will be apparent after an understanding of the disclosure of this application, with the exception of operations necessarily occurring in a certain order. Also, descriptions of features that are known in the art may be omitted for increased clarity and conciseness.
(21) The features described herein may be embodied in different forms, and are not to be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many possible ways of implementing the methods, apparatuses, and/or systems described herein that will be apparent after an understanding of the disclosure of this application.
(22)
(23) Referring to
(24) The radio frequency transmitter 200 includes a transmit circuit 210, a receive band rejection filter 220, and a power amplifying circuit 230.
(25) The transmit circuit 210, a circuit generating the transmit signal on the basis of transmit data, may include a modulator, a digital to analog (D/A) converter, a mixer, an amplifier, and the like.
(26) The receive band rejection filter 220 is disposed between the transmit circuit 210 and the power amplifying circuit 230, and rejects a receive band (a frequency band of an RX signal) from the transmit signal input to the power amplifying circuit 230.
(27) In an example, the receive band rejection filter 220 includes a capacitor and an inductor resonating with each other to reject or filter out the receive band, and a ratio value between a capacitance value of the capacitor and an inductance value of the inductor is within a predetermined range.
(28) The power amplifying circuit 230 amplifies the transmit signal through the receive band rejection filter 220. In an example, the power amplifying circuit 230 is implemented by an integrated circuit (IC), and includes a power amplifier (PA).
(29) In an example, in a case in which the power amplifying circuit 230 includes the power amplifier PA, when the receive band rejection filter 220 is included in an input path of the power amplifier PA, a position of the receive band rejection filter 220 is not particularly limited. Here, the input path of the power amplifier PA corresponds to a signal path between the power amplifier PA and the transmit circuit 210.
(30) The communications apparatus may be a frequency division duplexing (FDD) communications apparatus, and the transmit band and the receive band may have different center frequencies.
(31)
(32) An RF signal generated in the radio frequency transmitter may generally have receive band noise of 157 dBm/Hz, and such a receive band noise is coupled into an input terminal of the power amplifying circuit 230, which would be amplified by the power amplifying circuit. The present disclosure suggests a solution for such a receive band noise.
(33) The receive band rejection filter 220 is disposed between the transmit circuit 210 and the power amplifying circuit 230, and includes an LC resonance filter to reject or filter out the receive band (the frequency band of the RX signal) originating from the power amplifying circuit 230.
(34) In addition, a filter having excellent selectivity or quality (Q) factor to pass the transmit band therethrough and reject or filter out the receive band, such as a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter, may be used as the receive band rejection filter 220.
(35) A power amplifying apparatus in the present disclosure includes the receive band rejection filter 220 and the power amplifying circuit 230. The power amplifying circuit 230 may include the power amplifier PA.
(36) As an example, cases in which the receive band rejection filter 220 is formed of an LC resonance filter will be described with reference to
(37)
(38) Referring to
(39) The receive band rejection filter 220-S1 includes the capacitor C21 and the inductor L21, resonating with each other in series, to reject or filter out the receive band.
(40) As an example, a ratio value between a capacitance value of the capacitor C21 and an inductance value of the inductor L21 is within a predetermined range.
(41) For example, in a series resonance circuit in which the capacitance value of the capacitor C21 is C F and the inductance value of the inductor L21 is C*MS H, MS, the ratio value, is within a range of 1*10.sup.3 to 20*10.sup.3.
(42) In addition, when the capacitance value of the capacitor C21 is measured in picofarad (pF) and the inductance value of the inductor L21 is measured in nanohenry (nH), in a series resonance circuit in which the capacitance value of the capacitor C21 is C pF and the inductance value of the inductor L21 is C*M1 nH, M1, the first ratio value will be between 0 and 20. Alternatively, the first ratio value M1 may be within a range of 1 and 20. Such a description may be applied to the series resonance circuit according to each exemplary embodiment in the present disclosure.
(43) In addition, the inductor L21 may include at least one inductance element. Alternatively, the inductor L21 may include a bonding wire.
(44) Referring to
(45) The receive band rejection filter 220-P1 includes the capacitor C22 and the inductor L22 resonating in parallel with each other to reject or filter out the receive band.
(46) In an example, the ratio value between a capacitance value of the capacitor C22 and an inductance value of the inductor L22 is within a predetermined range.
(47) For example, in a parallel resonance circuit in which the inductance value of the inductor L22 is L H and the capacitance value of the capacitor C22 is L*MP F, MP, the ratio value, is within a range of 1*10.sup.3 to 20*10.sup.3. Such a content is applied to a parallel resonance circuit according to each exemplary embodiment in the present disclosure.
(48) In addition, when the capacitance value of the capacitor C22 is measured in picofarad (pF) and the inductance value of the inductor L22 is measured in a nanohenry (nH), in a parallel resonance circuit in which the inductance value of the inductor L22 is L nH and the capacitance value of the capacitor C22 is L*M2 pF, M2, the second ratio value, is within a range of 1 to 20.
(49) As an example, the inductor L22 may include at least one inductance element. Alternatively, the inductor L22 may include a bonding wire.
(50) Examples in which the receive band rejection filters 220-S1 and 220-P1 are implemented by the LC resonance filter are described in each exemplary embodiment in the present disclosure illustrated in
(51) In addition, the receive band rejection filters 220-S1 and 220-P1 are formed of a variable filter. As an example, the receive band rejection filters 220-S1 and 220-P1 are configured so that at least one of the inductor and the capacitor thereof varies. In this case, a variable filter element or a switch type variable circuit is used as the variable filter, and a method of implementing the variable filter is not particularly limited.
(52) As an example, either the transmit circuit 210 or the power amplifying circuit 230 includes a matching circuit including a capacitor for impedance matching. In this case, the receive band rejection filter includes the capacitor of the matching circuit and an inductor to reject or filter out the receive band, and a ratio value between a capacitance value of the capacitor and an inductance value of the inductor is within a predetermined range. This will be described with reference to
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(54) Referring to
(55) In this case, a receive band rejection filter 220-S2 includes the capacitor C23 of the matching circuit 231-M1 and an inductor L23 connected in series between the external terminal T11 and a ground to resonate with the capacitor C23. The capacitor C23 and the inductor L23 constitute a series LC resonance filter.
(56) The receive band rejection filter 220-S2 includes the capacitor C23 and the inductor L23 resonating with each other in series to reject or filter out the receive band.
(57) As an example, a ratio value between a capacitance value of the capacitor C23 and an inductance value of the inductor L23 is within a predetermined range. In addition, the inductor L23 includes at least one inductance element. Alternatively, the inductor L23 may include a bonding wire.
(58) Referring to
(59) In this case, a receive band rejection filter 220-P2 includes the capacitor C24 of the matching circuit 231-M2 and an inductor L24 connected to the capacitor C24 in parallel through external terminals T21 and T22 to resonate with the capacitor C24 in parallel. The capacitor C24 and the inductor L24 constitute a parallel LC resonance filter.
(60) The receive band rejection filter 220-P2 includes the capacitor C24 and the inductor L24 resonating with each other in parallel to reject or filter out the receive band.
(61) As an example, a ratio value between a capacitance value of the capacitor C24 and an inductance value of the inductor L24 is within a predetermined range.
(62) In addition, the inductor L24 may include at least one inductance element. Alternatively, the inductor L24 may include a bonding wire.
(63)
(64) Referring to
(65) In this case, a receive band rejection filter 220-S3 includes the capacitor C25 of the matching circuit 214-M1 and an inductor L25 connected in series between the external terminal 131 and a ground to resonate with the capacitor C25. The capacitor C25 and the inductor L25 constitute a series LC resonance filter.
(66) The receive band rejection filter 220-S3 includes the capacitor C25 and the inductor L25 resonating with each other in series to reject or filter out the receive band.
(67) As an example, a ratio value between a capacitance value of the capacitor C25 and an inductance value of the inductor L25 is within a predetermined range.
(68) In addition, the inductor L25 may include at least one inductance element. Alternatively, the inductor L25 may include a bonding wire.
(69) Referring to
(70) In this case, a receive band rejection filter 220-P3 includes the capacitor C26 of the matching circuit 214-M2 and an inductor L26 connected in parallel to the capacitor C26 through external terminals T41 and T42 to resonate with the capacitor C26. The capacitor C26 and the inductor L26 constitute a parallel LC resonance filter.
(71) The receive band rejection filter 220-P3 includes the capacitor C26 and the inductor L26 resonating with each other in parallel to reject or filter out the receive band.
(72) As an example, a ratio value between a capacitance value of the capacitor C26 and an inductance value of the inductor L26 is within a predetermined range.
(73) In addition, the inductor L26 may include at least one inductance element. Alternatively, the inductor L26 may include a bonding wire.
(74) As described above, when the capacitor of the receive band rejection filter 220-S1, 220-S2, 220-S3, 220-P1, 220-P2, or 220-P3 is implemented in the integrated circuit (a power amplifying IC or a transmit IC), the receive band rejection filter 220-S1, 220-S2, 220-S3, 220-P1, 220-P2, or 220-P3 may not need to have a capacitor externally added for the resonance filter, such that the receive band rejection filter 220-S1, 220-S2, 220-S3, 220-P1, 220-P2, or 220-P3 is further miniaturized.
(75) One of the core technologies of the present disclosure is to significantly reduce transmit insertion loss and suppress receive band noise as much as possible. One of the ways the transmit insertion loss is reduced and the receive band noise is suppressed is by disposing a sharp receive band rejection filter having a resonance filter formed in an input path of a power amplifier and tuning a resonance frequency to a center frequency of a receive band. The receive band rejection filter is implemented by an LC filter in order to perform such a function, which will be described with reference to
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(77) Receive band rejection characteristics of the receive band rejection filter implemented as the series LC filter will be described with reference to
(78) Receive band rejection characteristics of the receive band rejection filter implemented as the parallel LC filter will be described with reference to
(79) Advantages is provided in a case in which the receive band rejection filter is disposed in the input path of the power amplifier as compared to in a case in which the receive band rejection filter is included in an output path of the power amplifier, which will be described with reference to
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(81) It is appreciated from
(82) That is, in
(83) In addition, it is appreciated that in a case in which a receive band space is a small band, transmit insertion loss becomes great, such that it is difficult to use the receive band rejection filter in the output of the power amplifier.
(84) Further, it is appreciated that even though the loss of the receive band rejection filter in the input path of the power amplifier is great, it is small and is recoverable in terms of entire loss.
(85)
(86) In
(87) As an example, a ratio value between a capacitance value of the capacitor C20 and an inductance value of the inductor L20 is within a predetermined range.
(88) In an example, in the case in which the capacitance value of the capacitor C20 is measured in picofarad (pF) and the inductance value of the inductor L20 is measured in nanohenry (nH), in a series resonance circuit in which the capacitance value of the capacitor C20 is C pF and the inductance value of the inductor L20 is C*M1 nH, M1 has a value within a range 1 to 20. The measurement result obtained by measuring insertion loss (S(2,1)) while changing the value of M1 from 1 to 20 is illustrated in
(89) Referring to
(90)
(91) GL1 of
(92) GTX1 of
(93) GL1 of
(94)
(95) Referring to
(96)
(97) In
(98) Referring to
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(100) GC2 of
(101) GTX2 of
(102) GL2 of
(103) Referring to GL2 and GLref of
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(105) Referring to
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(107) Referring to
(108) In an example, the receive band rejection filter is inserted into the input path of the power amplifier to reject noise while being used as a matching component.
(109) A measurement result obtained by measuring the receive band noise in the output of the power amplifier with respect to the transmit signal having the receive band noise and a measurement result according to the related art in which the receive band rejection filter is not used in the input of the power amplifier are represented by Table 1. In Table 1, in LTE B1, a transmission frequency is 1950 MHz, a receiving frequency is 2140 MHz, and transmit and receive spaces are 190 MHz.
(110) TABLE-US-00001 TABLE 1 B1[dBm/Hz] RX band noise RX band noise RX: 2110-2170 at PA input PA Gain at PA output TX RX space: 190 [dBm/Hz] [dB] [dBm/Hz] Related Art 157 28 126 Exemplary 165 28 140 Embodiment in the Present Disclosure
(111) It is appreciated from Table 1 that in a case in which the receive band rejection filter is disposed in the input of the power amplifier as disclosed in the present disclosure, the receive band noise of the transmit signal is reduced.
(112) As set forth above, according to the examples in the present disclosure, receive band noise introduced from the radio frequency transmitter to a radio frequency receiver is efficiently rejected in the radio frequency transmitter, and low power loss is maintained.
(113) In addition, the receive band noise is effectively reduced at a small area and a low complexity to improve sensitivity. When the receive band noise is reduced, a burden of a duplexer for receive isolation is reduced, such that transmit insertion loss of the duplexer is improved and harmonic performance is improved.
(114) Further, a capacitance value of a capacitor of a resonance circuit is set to be greater than an inductance value of an inductor to more efficiently reject the receive band noise.
(115) While this disclosure includes specific examples, it will be apparent after an understanding of the disclosure of this application that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.