Polycrystalline diamond compact with improved thermal stability

Abstract

The present invention relates to a polycrystalline diamond compact. A method for manufacturing a polycrystalline diamond compact includes: preparing primary sintering by mixing and assembling first diamond particles and metal binder particles; sintering the mixed and assembled particles; leaching the upper surface of the sintered polycrystalline diamond compact; preparing secondary sintering by mixing second diamond particles and the metal binder particles and assembling the mixed particles on the upper surface of the primarily sintered polycrystalline diamond compact; sintering the sintered polycrystalline diamond compact and the mixed particles of the upper part; and a grinding step of grinding the reassembled second diamond particles and metal binder particles so as to remove the same. The polycrystalline diamond compact minimizes the content of the residual metal binder in a surface layer and increases the content of the diamond particles with high thermal conductivity, thereby increasing the lifespan of the polycrystalline diamond compact.

Claims

1. A method for manufacturing a polycrystalline diamond compact, comprising: a step of preparing primary sintering by mixing and assembling first diamond particles and metal binder particles; a primary sintering step of sintering the mixed and assembled particles; a step of leaching the upper surface of the sintered polycrystalline diamond compact; a step of preparing secondary sintering by mixing second diamond particles and the metal binder particles and assembling the mixed particles on the upper surface of the primarily sintered polycrystalline diamond compact; a secondary sintering step of sintering the sintered polycrystalline diamond compact and the mixed particles of the upper part; and a grinding step of grinding the reassembled second diamond particles and metal binder particles so as to remove the same.

2. The method for manufacturing the polycrystalline diamond compact of claim 1, wherein a crystalline size of the diamond particles sintered in the primary sintering step is larger than that of the diamond particles added after the primary sintering step.

3. The method for manufacturing the polycrystalline diamond compact of claim 2, wherein a diameter of the first diamond particle is formed in a range of 4 to 40 m.

4. The method for manufacturing the polycrystalline diamond compact of claim 3, wherein a diameter of the second diamond particle is formed within maximum 0.5 m.

5. The method for manufacturing the polycrystalline diamond compact of claim 1, wherein in the leaching step, a leaching depth is formed in a range of 100 to 500 m.

6. The method for manufacturing the polycrystalline diamond compact of claim 1, wherein the metal binder particles include at least one metal component.

7. The method for manufacturing the polycrystalline diamond compact of claim 1, wherein the metal binder particles include at least one metal component of cobalt, nickel, and iron.

Description

DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a schematic view illustrating an appearance a cutting tool using a polycrystalline diamond compact.

(2) FIG. 2 is a perspective view illustrating an appearance of a polycrystalline diamond compact in the related art.

(3) FIG. 3 is a flowchart illustrating a method for manufacturing a polycrystalline diamond compact according to an exemplary embodiment of the present invention.

(4) FIG. 4 is a perspective view illustrating an assembled state of diamond particles and metal binder particles according to the exemplary embodiment.

(5) FIG. 5 is an SEM image illustrating a surface state while the diamond particles and metal the binder particles according to the exemplary embodiment are primarily sintered.

(6) FIGS. 6 and 7 are a perspective view and a cross-sectional view illustrating an appearance in a leaching step according to the exemplary embodiment, respectively.

(7) FIG. 8 is a cross-sectional view illustrating an assembled state for secondary sintering according to the exemplary embodiment.

(8) FIG. 9 is a cross-sectional view schematically illustrating an appearance when sintering the polycrystalline diamond compact according to the exemplary embodiment.

(9) FIG. 10 is a cross-sectional view illustrating an appearance after grinding of the polycrystalline diamond compact according to the exemplary embodiment.

MODES OF THE INVENTION

(10) A method for manufacturing a polycrystalline diamond compact, according to the present invention, comprises: a step of preparing primary sintering by mixing and assembling first diamond particles and metal binder particles; a primary sintering step of sintering the mixed and assembled particles; a step of leaching the upper surface of the sintered polycrystalline diamond compact; a step of preparing secondary sintering by mixing second diamond particles and the metal binder particles and assembling the mixed particles on the upper surface of the primarily sintered polycrystalline diamond compact; a secondary sintering step of sintering the sintered polycrystalline diamond compact and the mixed particles of the upper part; and a grinding step of grinding the reassembled second diamond particles and metal binder particles so as to remove the same.

DESCRIPTION OF EMBODIMENT(S)

(11) Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. If not particularly defined or mentioned, a term indicating a direction used in the present description is based on a state illustrated in the drawings. Further, through each exemplary embodiment, like reference numerals denote like elements. Meanwhile, the thickness or size of each component illustrated in the drawings may be exaggerated for easy description and does not mean that the thickness or size should be configured by a ratio between the corresponding size or component.

(12) FIG. 1 is a schematic view illustrating an appearance a cutting tool using a polycrystalline diamond compact. FIG. 2 is a perspective view illustrating an appearance of a polycrystalline diamond compact in the related art.

(13) Various cutting tools are used in metal/wood cutting and the like. Particularly, in petroleum and gas drilling fields, the ground needs to be cut and excavated, and thus digging and excavating equipment in which abrasion resistance can be ensured as much as possible is used.

(14) A cutting tool 1 is provided at an end of the equipment as illustrated in FIG. 1. In general, the abrasion resistance may be sufficiently ensured at the end of the cutting tool 1 by using a diamond compact 2 in spite of friction with the ground.

(15) In FIG. 2, an appearance of a general diamond compact 2 is illustrated. As illustrated in FIG. 2, in the diamond compact 2, a polycrystalline diamond sintered body 3 which is sintered by using diamond powder is formed on a sintered carbide substrate 4. The sintered carbide substrate 4 serves to support the diamond sintered body 2 to be attached to various tools and the like while the polycrystalline diamond sintered body 3 is attached.

(16) Such a polycrystalline diamond compact 2 is excellent as compared with a tool manufactured by only sintered carbide metal, but there is a problem in processing. That is, a metal matrix (Co, Ni, Fe, etc.) and diamond particles are included in the polycrystalline diamond, a difference in thermal expansion coefficient between the metal and the polycrystalline diamond is large, and the difference affects thermal vibration to generate initial destruction such as cracks and breakage. The present invention is contrived in order to solve the problems.

(17) A method for manufacturing a polycrystalline diamond compact according to an exemplary embodiment of the present invention will be described with reference to FIG. 3. FIG. 3 is a flowchart illustrating a method for manufacturing a polycrystalline diamond compact according to an exemplary embodiment of the present invention.

(18) In order to solve the aforementioned problems, a method for primary and secondary sintering is applied to the present invention. The method for manufacturing the polycrystalline diamond compact according to the exemplary embodiment includes the following processes.

(19) First, primary sintering is prepared by mixing and assembling first diamond particles and metal binder particles (S10), and sintering the mixed and assembled particles are sintered as a second step (S20).

(20) Next, the metal binders distributed on the upper surface part are removed by leaching the upper surface of the sintered polycrystalline diamond compact to form a pore (S30).

(21) Next, secondary sintering is prepared by mixing second diamond particles and the metal binder particles and assembling the mixed particles on the upper surface of the primarily sintered polycrystalline diamond compact (S40), and thereafter, the sintered polycrystalline diamond compact and the mixed particles of the upper part are secondarily sintered (S50).

(22) After the secondary sintering is completed, a layer positioned with the reassembled second diamond particles and metal binder particles is grinded and removed (S60).

(23) Referring to FIGS. 4 to 10, a manufacturing process of the polycrystalline diamond compact will be described in detail for each step. FIG. 4 is a perspective view illustrating an assembled state of diamond particles and metal binder particles according to the exemplary embodiment, and FIG. 5 is an SEM image illustrating a surface state while the diamond particles and metal the binder particles according to the exemplary embodiment are primarily sintered. Further, FIGS. 6 and 7 are a perspective view and a cross-sectional view illustrating an appearance in a leaching step according to the exemplary embodiment, respectively, and FIG. 8 is a cross-sectional view illustrating an assembled state for secondary sintering according to the exemplary embodiment. Further, FIG. 9 is a cross-sectional view schematically illustrating an appearance when sintering the polycrystalline diamond compact according to the exemplary embodiment, and FIG. 10 is a cross-sectional view illustrating an appearance after grinding of the polycrystalline diamond compact according to the exemplary embodiment.

(24) First, as described above, the primary sintering is prepared by mixing and then assembling the first diamond particles and the metal binder particles as illustrated in FIG. 4.

(25) In this case, it is preferred that the diameter of the used first diamond particle is formed in a range of 4 to 40 m. When the size of the diamond particle is increased, impact resistance is increased, but abrasion resistance is decreased, whereas when the size of the particle is decreased, the abrasion resistance is increased, but the impact resistance is decreased. As a result, it is preferred that the diameter of the first diamond particle is determined in the range of 4 to 40 m according to a purpose of the tool. Further, when the diameter of the first diamond particle is larger than 40 m, the second diamond particles to be described below are aggregated between the first diamond particles and thus, it is difficult to obtain the technical effect according to the present invention.

(26) The metal binder particles may include at least one metal component of cobalt, nickel, iron, and the like.

(27) Next, a polycrystalline diamond sintered body 21 is formed by sintering the assembled and mixed particles. In this case, the upper surface of the polycrystalline diamond sintered body 21 may observe a first diamond particle R1 and a binder pool R2 between the first diamond particles R1 as illustrated in FIG. 5.

(28) Referring to FIG. 6, binder metals which are distributed on the surface part of the polycrystalline diamond sintered body 21 are removed by leaching the surface part 211 of the polycrystalline diamond sintered body 21 to form a binder pool as pores. In this case, a leaching depth L1 may be formed in a range of 100 to 500 m. In this case, when the leaching depth is smaller than 100 m, it is difficult to obtain the technical effect according to the present invention, whereas when the leaching depth is larger than 500 m, impact resistance is decreased, and thus performance of the tool is deteriorated and penetration of the second diamond particles to be described below is difficult.

(29) Thereafter, as illustrated in FIG. 8, the secondary sintering is prepared by reassembling the mixed powder of the second diamond particles and the metal binder particles on the leached surface part 211. In this case, a diameter of the second diamond particle may be formed within maximum 0.5 m. When the diameter of the second diamond particle is larger than 0.5 m, it is difficult that the second diamond particles penetrate between the first diamond particles with the size of 4 to 40 m as described above.

(30) Thereafter, as illustrated in FIG. 9, the secondary sintering is performed. In this case, the second diamond particles are broken under high temperature and high pressure to penetrate into the pores generated after leaching and distributed, and carbon (C) is released from the diamond particles by a metal binder (catalyst) added during sintering. The released carbon serves to connect diamond particle grains or perform a growth of the diamond particles to fill the inner pores, thereby increasing the content of the diamond of the leached surface part 211.

(31) Thereafter, when a reassembling layer 213 reassembled for the secondary sintering is grinded and removed, the polycrystalline diamond compact 20 illustrated in FIG. 10 is formed.

(32) In this case, in the surface part 211 of the polycrystalline diamond sintering layer 21, the diamond content after secondary sintering is larger than the diamond content after primary sintering, and thus thermal conductivity is increased, thereby efficiently emitting the heat generated during processing. As a result, the problem caused by the heat is reduced and the performance of the polycrystalline diamond compact is improved.

(33) Although preferable embodiments of the present invention have been exemplarily described as above, the technical spirit of the present invention is limited to the preferable embodiments and the present invention can be variously implemented within the scope without departing from the spirit of the present invention which is specifically described in the appended claims.