FULL COLOR DISPLAY SYSTEMS AND CALIBRATION METHODS THEREOF
20220413289 · 2022-12-29
Inventors
Cpc classification
G02B6/0068
PHYSICS
G02B6/0035
PHYSICS
G09G2310/0297
PHYSICS
G09G3/3233
PHYSICS
G02B6/0076
PHYSICS
International classification
Abstract
A display system includes a first die configured to emit light of a first color, a second die configured to emit light of a second color and a third die configured to emit light of a third color. The display system also includes a lens system and an optical waveguide system. The optical waveguide system includes a first grating portion configured to couple in an incident light to the optical waveguide and a second grating portion configured to couple out a transmitting light from the optical waveguide. The first die, the second die and the third die are contained in one package. The lens system is arranged between the package and the optical waveguide system, and is configured to collimate the light of the first color, the light of the second color and the light of the third color onto the first grating portion of the optical waveguide system.
Claims
1-17. (canceled)
18. A display system comprising: a first display die configured to emit light of a first color; a second display die configured to emit light of a second color; a third display die configured to emit light of a third color; a lens system; and an optical waveguide system comprising a first grating portion configured to couple in an incident light to the optical waveguide system and a second grating portion configured to couple out a transmitting light from the optical waveguide system; and wherein the first display die, the second display die and the third display die are arranged in one package; and wherein the lens system is arranged in between the package and the optical waveguide system, configured to collimate the light of first color, the light of second color and the light of third color onto the first grating portion of the optical waveguide system.
19. The system according to claim 18, wherein the first grating portion is configured to couple in the light of first color, the light of second color and the light of third color to the optical waveguide system and the second grating portion is configured to couple out the light of first color, the light of second color and the light of third color from the optical waveguide system.
20. The system according to claim 18, wherein the optical waveguide system comprises at least three separate waveguides corresponding to the light of first color, the light of second color and the light of third color, whereby each separate waveguide comprises a first grating portion and a second grating portion in order to couple in and couple out the respective light.
21. The system according to claim 18, wherein the first display die, the second display die and the third display die are light emitting dies, comprising arrays of microscopic light emitting diodes forming the individual pixel elements.
22. The system according to claim 18, wherein the first display die, the second display die and the third display die comprise a driver circuit array including a plurality of pixel driver circuits, each being coupled to the individual pixel elements.
23. A display system comprising: a first display die configured to emit light of a first color; a second display die configured to emit light of a second color; a third display die configured to emit light of a third color; a first lens, a second lens and a third lens; and an optical waveguide system comprising a first grating portion configured to couple in an incident light to the optical waveguide system and a second grating portion configured to couple out a transmitting light from the optical waveguide system; and wherein the first display die is arranged on a first package, the second display die is arranged on a second package and the third display die is arranged on a third package, and wherein the first package, the second package and the third package are interconnected via a flex-connector; and wherein the first lens, the second lens and the third lens are arranged between the packages and the optical waveguide system, whereby the first lens is configured to collimate the light of first color, the second lens is configured to collimate the light of second color and the third lens is configured to collimate the light of third color, onto the first grating portion of the optical waveguide system.
24. The system according to claim 23, wherein the first grating portion is configured to couple in the light of first color, the light of second color and the light of third color to the optical waveguide system, and the second grating portion is configured to couple out the light of first color, the light of second color and the light of third color from the optical waveguide system.
25. The system according to claim 23, wherein the optical waveguide system comprises at least three separate waveguides corresponding to the light of first color, the light of second color and the light of third color, whereby each separate waveguide comprises a first grating portion and a second grating portion in order to couple in and couple out the respective light.
26. The system according to claim 23, wherein the first display die, the second display die and the third display die are light emitting dies, comprising arrays of microscopic light emitting diodes forming the individual pixel elements.
27. The system according to claim 23, wherein the first display die, the second display die and the third display die comprise a driver circuit array including a plurality of pixel driver circuits, each being coupled to the individual pixel elements.
28. A method for calibrating a display system, which includes a first display die, a second display die, a third display die and a driver circuit array, the method comprising the steps of: optically measuring offsets along at least two axes between the first display die, the second display die and the third display die by applying calibration images; cropping an actual content to be displayed on the first display die, the second display die and the third display die by a scale based on the measured offsets, thereby generating respective modified contents; and offsetting the modified contents corresponding to the measured offsets.
29. The method according to claim 28, wherein the method further comprises the steps of: optically measuring transversal and rotational offsets between the first display die, the second display die and the third display die; and offsetting the modified contents corresponding to the measured transversal and rotational offsets.
30. A method for calibrating a display system, which includes a first display die, a second display die, a third display die and a driver circuit array, the method comprising the steps of: estimating a misalignment accuracy for assembling the first display die, the second display die and the third display die with respect to an optical waveguide system; adding additional addressable pixels along the two axes on the first display die, the second display die and the third display die based on the estimated misalignment accuracy; optically measuring offsets along at least two axes between the first display die, the second display die and the third display die by applying calibration images; and shifting an actual content to be displayed on the first display die, the second display die and the third display die corresponding to the measured offsets.
31. The method according to claim 30, wherein the method further comprises the steps of: optically measuring transversal and rotational offsets between the first display die, the second display die and the third display die; and offsetting the actual content corresponding to the measured transversal and rotational offsets.
32. The method according to claim 30, wherein the method further comprises the step of: modifying the driver circuit array with respect to the additional addressable pixels along the two axes on the first display die, the second display die and the third display die.
33. The method according to claim 30, wherein the method further comprises the step of: controlling the driver circuit array in order to shift the actual content to be displayed on the first display die, the second display die and the third display die corresponding to the measured offsets.
34. The method according to claim 30, wherein the method further comprises the step of: providing power-gating means to the driver circuit array for deactivating at least a column and/or a row of pixels along the two axes on the first display die, the second display die and the third display die.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Exemplary embodiments of the invention are now further explained with respect to the drawings by way of example only, and not for limitation. In the drawings:
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DETAILED DESCRIPTION
[0045] Display systems and methods for calibrating display systems, are provided. In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the invention. It is apparent, however, that the invention may be practiced without these specific details or with an equivalent arrangement. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the invention.
[0046] In
[0047] As such, at each incident region, the glass plate 4 acts on both transmit mode and reflect mode. The beam 6 within the glass plate 4 traverses in a slander fashion due to total internal reflection and eventually split out from the glass plate 4 via beam splitters 5. A viewer 7 in line with the split out beam therefore can see the virtual image 8 of the actual image that is being emitted by the emitter 2.
[0048] Along
[0049] The system 10 comprises a lens system 17, which can be implemented as a common lens system for the three separate display dies 11,13,15 or as an array of multiple lens respective to each display die 11,13,15. In either case, the lens system 17 collimates the lights onto the optical waveguide system 18. In particular, the optical waveguide system 18 has a first grating portion 19 that acts as an in-coupler and a second grating portion 20 that acts as an out-coupler for the incident and transmitted lights, respectively.
[0050] As can be seen in
[0051] It is also conceivable that the optical waveguide system 18 may comprise only two separate waveguides for two colors and the third color can be split or combined with one of the two. For instance, the two separate waveguide can be implemented for the red color and the blue color. The green color can be either split between both waveguides or combined with one of the two. It is further conceivable that the optical waveguide system 18 may comprise only one waveguide, for instance, by means of volumetric holographic gratings provided by holographic optical elements or via surface microstructures at the coupling portions on the waveguide, thereby forming a single diffractive waveguide for all three colors 12,14,16.
[0052] In
[0053] In addition, each display die 11,13,15 comprises driver circuitry 34,36 including a plurality of pixel driver circuits, preferably distributed along two axes. Particularly, the driver array 34 that is distributed along the horizontal axis with respect to the die position may act as source driver and the driver array 36 that is distributed along the vertical axis with respect to the die position may act as gate driver for the respective pixel elements. The package is preferably realized on a PCB 32 where the separate dies 11,13,15 are arranged in close proximity.
[0054] Preferably, the three display dies 11,13,15 are fabricated with different compound semiconductors. For instance, the display die 11 corresponding to red color 12 may be fabricated with Aluminum Gallium Indium Phosphide (AlGaInP), the display die 13 corresponding to blue color 14 as well as the display die 15 corresponding to green color 16 may be fabricated with Indium Gallium Nitride (InGaN). The package includes a non-volatile memory 38, e.g., a flash memory that can be used to store calibration data and images. Especially, the flash memory 38 stores optical and electrical calibration data for each pixel and may store additional pixel offset data generated by the proposed offset calibration schemes as described later, if required. A connector 37, e.g., a flex-connector is also provided in order to communicate with the display dies 11,13,15 resp. the PCB package 32.
[0055] It is advantageous that the three separate display dies 11,13,15 (in short: RGB dies) are combined in one package and the respective light 12,14,16 (in short: RGB light) is collimated with the lens system 17 and coupled into the optical waveguide system 18. At respective out-coupling portion, the respective light 12,14,16 is coupled out within the field of view of an observer 30. Any misalignment between the RGB dies 11,13,15 to each other typically arises from the packing into one package. Standard flip-chip technology allows a die placement with an accuracy of 60 micrometers bondpad pitch on a printed circuit board (PCB) or within a package. Advanced products using die-to-wafer flip-chip bonding may achieve a bonding accuracy to a bondpad pitch down to 10-20 micrometers in production. If an assumption is made for a target pitch of a micro-LED display of about 3 micrometers, a misplacement of 3-30 pixels of the RGB light can be anticipated as it couples out of the waveguide.
[0056] Along
[0057] As such, the light of first color 12 emitted from the first display die 11 is collimated by the first lens 41 onto the first grating portion 24 of a waveguide 21 of the optical waveguide system 18. Similarly, the light of second color 14 emitted from the second display die 13 is collimated by the second lens 43 onto the first grating portion 26 of a waveguide 22 of the optical waveguide system 18. Further, the light of third color 16 emitted from the third display die 15 is collimated by the third lens 45 onto the first grating portion 28 of a waveguide 23 of the optical waveguide system 18.
[0058] Advantageously, the separate display dies 11,13,15 are arranged in separate packages. Thus, each display die 11,13,15 can be separately placed with an own lens 41,43,45 onto the optical waveguide system 18. Due to the compact size of the lenses 41,43,45 compared to the common lens system 17 of
[0059] Along
[0060] The combined effect of light emission and collimation (whereby every pixel is collimated but not necessarily all pixel emit with the same emission angle) can be achieved by integrating wafer level lens onto the packaging of the separate display dies 51,53,55. It is also conceivable that the first display die 51, the second display die 53 and the third display die 55 can be realized in form of a display that already emits collimated light, i.e., light emission with the same emission angle, in order to achieve the collimation effect. It is further conceivable that the first display die 51, the second display die 53 and the third display die 55 may comprise arrays of microscopic light emitting diodes with resonant cavity in order to achieve the collimation effect.
[0061] In
[0062] In addition, each display die 11,13,15 comprises driver circuitry 34,36 including a plurality of pixel driver circuits, preferably distributed along two axes. Particularly, the driver array 34 that is distributed along the horizontal axis with respect to the die position may act as source driver and the driver array 36 that is distributed along the vertical axis with respect to the die position may act as gate driver for the respective pixel elements.
[0063] As it can be seen in
[0064] As mentioned above, the integration of separate display dies 11,13,15 onto an optical waveguide system 18 would raise misalignments due to process and equipment limitations, especially between 10-100 micrometers in the packaging and placement process of the display dies 11,13,15 with the waveguide system 18. In order to calibrate those misalignments away after the assembly process, the invention proposes two calibration methods based on the depth system design modifications. In both cases, the misalignments or offsets are measured optically after the assembly process and are stored in the memory, e.g., the flash memory 38, as calibration data.
[0065] In
[0066] Thus, in a first step S71, the optical waveguide system 18 with lens system 18 or lenses 41,43,45 and the separate display dies 11,13,15 are assembled. In a second step S72, the high-definition camera is focused in the field of view of the optical waveguide system 18. In a third step S73, a calibration image or pattern is applied for the display die 13, i.e., the second display die 13, which is adapted to emit the image in blue color 14. The image is then centered with respect to the dimension of the second display die 13. The optically measured offset along the horizontal axis X and along the vertical axis Y of the second display die 13 is stored as well as the relative transversal and rotational offsets in the flash memory 38.
[0067] In a subsequence fourth step S74, the calibration image is further applied for the display die 15, i.e., the third display die 15, which is adapted to emit the image in green color 16, and is overlaid onto the second display die 13 of the previous step S73. The green image is shifted along the horizontal axis x and the vertical axis y with respect to the third display die 15 until the green image overlaps with the blue image. Then, the green image is switched off, and the optically measured offset along the horizontal axis X and along the vertical axis Y of the second display die 13 is stored as well as the relative transversal and rotational offsets in the flash memory 38.
[0068] Finally, in a fifth step S75, the calibration image is further applied for the display die 11, i.e., the first display die 11, which is adapted to emit the image in red color 12, and is overlaid onto the second display die 13 of the step S73. The red image is shifted along the horizontal axis x and the vertical axis y with respect to the first display die 11 until the red image overlaps with the blue image. Then, the optically measured offset along the horizontal axis X and along the vertical axis Y of the second display die 13 is stored as well as the relative transversal and rotational offsets in the flash memory 38.
[0069] In
[0070] In
[0071] In
[0072] In order to calibrate the output of three separate display dies 11,13,15 (i.e., RGB dies), which are overlapping pixel by pixel, the calibration method foresees the reduction of frame size (i.e., cut away) of the actual content to be shown and offset in the software the misalignment. For instance,
[0073] For this example, it is considered that the measured misalignment, e.g., obtained from the calibration sequence described along
[0074] In
[0075] In
[0076] For this example, it is considered that the measured misalignment, e.g., obtained from the calibration sequence described along
[0077] In order to modify the source driver 34 and the gate driver 36, respective specific multiplexers 126,126 are implemented. Particularly, the multiplexer 126 implemented to the source driver 34 simply shifts which pixels get which data content. On the gate driver 36 side, the multiplexer 126 is configured to shift the reset signal to the first shift register that gets actually activated and comprises a separate counter to reset after the horizontal pixel lines, e.g., 10 pixels, are addressed.
[0078] Although not shown in the active matrix addressing scheme of
[0079] The calibration method according to the third aspect of the invention is more cost-effective than the method according to the fourth aspect of the invention. However, the calibration method according to the fourth aspect of the invention is more effective with respect to performance and image rendering than the method according to the third aspect of the invention. Nonetheless, both calibration methods relax the requirements for the placement and bonding accuracy of the RGB dies to each other and the waveguide to more realistic values that can be implemented in production.
[0080] The embodiments of the present invention can be implemented by hardware, software, or any combination thereof. Various embodiments of the present invention may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or the like.
[0081] While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. Numerous changes to the disclosed embodiments can be made in accordance with the disclosure herein without departing from the spirit or scope of the invention. For instance, instead of a direct placement of the display dies on the waveguide with or without a lens system in between, the light can be re-directed with a mirror or a prism so to change the path of the lights in order to achieve additional flexibility in design. As such, any change in the light path for reasons of design or form-factor that a skilled person would perceives is covered within the exemplary embodiments. Thus, the breadth and scope of the present invention should not be limited by any of the above described embodiments. Rather, the scope of the invention should be defined in accordance with the following claims and their equivalents.
[0082] Although the invention has been illustrated and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.