METHOD AND DEVICE FOR ELECTROCHEMICALLY TREATING COMPONENTS
20220410297 · 2022-12-29
Assignee
Inventors
- Nicole Feiling (München, DE)
- Markus Zeis (München, DE)
- Roland Huttner (Jesenwang, DE)
- Christian Doll (Markt Indersdorf, DE)
Cpc classification
B23H11/00
PERFORMING OPERATIONS; TRANSPORTING
B23H3/10
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
The invention relates to a device and a method for electrochemically treating a component, comprising at least one electrode which has at least one working surface with an outer contour that is shaped so as complement the surface of the component to be produced, thereby forming a gap, and comprising at least one contour surface which adjoins said working surface and in which at least one cleaning opening is arranged, a cleaning fluid flowing through said cleaning opening. According to the method, at least one component is provided, a voltage is applied between the component and the at least one electrode during the electrochemical treatment, and the electrode is moved relative to the component.
Claims
1. A method for electrochemically treating a component, comprising at least one electrode, which has at least one working surface with an outer contour that is shaped to complement the surface of the component to be produced, thereby forming a gap, and comprising at least one contour surface that adjoins said working surface, and in which at least one cleaning opening PO through which a cleaning fluid can flow is arranged, comprising the method steps of: providing the component; applying a voltage between the component and the at least one electrode during the electrochemical treatment of the component; moving the electrode PO relative to the component; and feeding of a cleaning fluid under pressure through the at least one cleaning opening for the removal of adhesions, in the form of nonconductive process residues, from the treated surface of the component.
2. The method treating a component according to claim 1, further comprising the step of: recording at least one parameter of the treated surface of the component.
3. The method for treating a component according to claim 1, wherein the pressure and/or the flow rate of the cleaning fluid flowing through the at least one cleaning opening can be adjusted.
4. The method for treating a component according to claim 1, wherein, when the cleaning fluid flows through the cleaning opening, it is accelerated.
5. A device for electrochemically treating a component, by the method according to claim 1, comprising at least one electrode, which has at least one working surface with an outer contour that is shaped to complement the surface of the component to be produced, thereby forming a gap, wherein a contour surface that adjoins the outer contour of the working surface, and in which at least one cleaning opening through which a cleaning fluid can flow is arranged.
6. The device for electrochemically treating a component according to claim 5, wherein the contour surface has a plurality of cleaning openings through which a cleaning fluid can flow.
7. The device for electrochemically treating a component according to claim 5, wherein the at least one cleaning opening is configured and arranged so that a cleaning fluid flowing through it is accelerated.
8. The device for electrochemically treating a component according to claim 5, wherein the electrode has at least one flow channel, through which the cleaning fluid can be fed to the at least one cleaning opening.
9. The device for electrochemically treating a component according to claim 5, wherein the cleaning fluid is an electrolyte or another suitable fluid.
10. The device for electrochemically treating a component according to claim 5, wherein the feeding of the cleaning fluid occurs via a separate supply circuit.
11. The device for electrochemically treating a component according to claim 5, wherein the electrode is configured and arranged in at least two parts, wherein the working surface is arranged on at least one first part and at least one section of the contour surface is arranged on at least one second part.
12. The device for electrochemically treating a component according to claim 11, wherein the at least one second part configured and arranged as an electrically nonconductive material.
13. The device for electrochemically treating a component according to claim 5, wherein the electrode is produced at least in part by an additive manufacturing method.
14. The device for electrochemically treating a component according to claim 5, further comprising a control device, which is configured and arranged to adjust the pressure and/or the flow rate of the cleaning fluid through the at least one cleaning opening.
Description
BRIEF DESCRIPTION OF THE DRAWING FIGURES
[0030] Further features, advantages, and possible applications of the invention ensue from the following description in association with the figures. Shown are:
[0031]
[0032]
[0033]
DESCRIPTION OF THE INVENTION
[0034]
[0035] Shown in
[0036] The second part 2 of the exemplary electrode 20 shown in
[0037]
[0038] The cleaning fluid fed through the at least one cleaning opening 26 is usually pressurized and/or the at least one cleaning opening 26 is designed in such a way that the cleaning fluid is accelerated when it flows through the cleaning opening 26. A flow through the cleaning opening 26 results in the creation of a fluid jet 27 that is directed at the treated surface 16 and by which adhesions, such as, in particular, process residues, can be detached from the treated surface 16. For feeding of the cleaning fluid to the at least one cleaning opening 26, at least one flow channel (not illustrated in
[0039] The exemplary electrode illustrated in
[0040]
[0041] The method according to the invention comprises the following steps: In a first step a), the component 12 is provided. In the second step b), during the electrochemical treatment of the component 12, a voltage is applied between the component 12 and the at least one electrode 20. Subsequently, in the third step c), the electrode 20 is moved with respect to the component 12 and in this way, in particular, the intended treatment and/or the cleaning of the produced surface is or are carried out. In the step d), a pressurized cleaning fluid is fed through the at least one cleaning opening 26 in order to remove, by way of the cleaning fluid jet 27 that is thereby formed, adhesions, in particular nonconductive process residues, from the treated surface 16 of the component 12. In an optional further step e), at least one parameter of the treated surface 16 of the component 12 is recorded in order to carry out, for example, a quality control and/or in order to adjust the treatment parameters.