ADHESIVE COMPOSITIONS AND KITS FOR APPLICATION OF SCREEN PROTECTORS
20220411665 · 2022-12-29
Inventors
- Daniel James Beyler (Breesport, NY, US)
- Rui Chang (Corning, NY, US)
- Hossein Eshraghi (Painted Post, NY, US)
- George Karl Kaufman (Painted Post, NY, US)
- Laurence Ralph Morey (Painted Post, NY, US)
- Patrick Ryan Pruden (Corning, NY, US)
- Vitor Marino Schneider (Painted Post, NY, US)
Cpc classification
C03C27/10
CHEMISTRY; METALLURGY
B32B1/00
PERFORMING OPERATIONS; TRANSPORTING
C09J2301/122
CHEMISTRY; METALLURGY
C09J2301/312
CHEMISTRY; METALLURGY
B32B2457/202
PERFORMING OPERATIONS; TRANSPORTING
B32B2457/206
PERFORMING OPERATIONS; TRANSPORTING
C09J2301/408
CHEMISTRY; METALLURGY
C03C27/06
CHEMISTRY; METALLURGY
B32B7/12
PERFORMING OPERATIONS; TRANSPORTING
H04M1/185
ELECTRICITY
B32B3/085
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A screen protector application kit includes a glass-based substrate (110) having an adhesive belt (270) and an adhesive container (478) of an uncured adhesive composition. The adhesive belt (270) includes a first major surface (272) adhered to the glass-based substrate (110), a second major surface (274), a distal edge (276) extending between the first major surface (272) and the second major surface (274), and a proximal edge (278) extending between the first major surface (272) and the second major surface (274). The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The uncured adhesive composition may further include 0.1 wt % to 10 wt % of a co-initiator. The uncured adhesive composition may further include 0.1 wt % to 5 wt % of an oxygen inhibitor.
Claims
1. A screen protector application kit comprising: a glass-based substrate having an adhesive belt, the adhesive belt comprising: a first major surface being adhered to the glass-based substrate; a second major surface opposite the first major surface; a distal edge extending between the first major surface and the second major surface; and a proximal edge extending between the first major surface and the second major surface; and a container of an uncured adhesive composition, the uncured adhesive composition comprising: greater than or equal to 30 wt % and less than or equal to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and greater than or equal to 0.01 wt % and less than or equal to 10 wt % of a visible-light photoinitiator.
2. The screen protector application kit of claim 1, wherein the at least one of: (i) a monomer and (ii) an oligomer comprises cyclic hydrocarbon acrylate, aliphatic acrylate, polysiloxane acrylate, polydimethylsiloxane acrylate, silicone polyetheracrylate, urethane acrylate, monofunctional acrylate, difunctional acrylate, trifunctional acrylate, tetrafunctional acrylate, polyfunctional acrylate, or a combination thereof.
3. The screen protector application kit of claim 1, wherein the visible-light photoinitiator comprises phosphine oxide-based compounds, cyanine compounds, fluorone compounds, thioxanthone compounds, phenyl glyoxylate-based compounds, cyclic ketoester-based compounds, benzoin ether-based compounds, amine compounds, α-hydroxy ketone-based compounds, fluorinated diaryl titanocene compounds, or a combination thereof.
4. The screen protector application kit of claim 1, wherein the visible-light photoinitiator has an absorptivity greater than or equal to 200 L/mol/cm and less than or equal to 5000 L/mol/cm in the wavelength range of 380 nm to 750 nm.
5. The screen protector application kit of claim 1, wherein the visible-light photoinitiator has a thickness-normalized absorbance greater than or equal to 2 cm.sup.−1 and less than or equal to 50 cm.sup.−1 in the wavelength range of 380 nm to 750 nm.
6-10. (canceled)
11. The screen protector application kit of claim 1, wherein the uncured adhesive composition has a viscosity less than or equal to 500 cps as measured at 20° C.
12-19. (canceled)
20. The screen protector application kit of claim 1, wherein the adhesive belt has a thickness greater than or equal to 5 μm and less than or equal to 500 μm.
21. The screen protector application kit of claim 1, wherein the adhesive belt has a width between the distal edge and the proximal edge greater than or equal to 0.1 mm and less than or equal to 30 mm.
22. (canceled)
23. The screen protector application kit of claim 1, wherein the adhesive belt further comprises a plurality of channels extending from the distal edge to the proximal edge.
24. The screen protector application kit of claim 1, wherein the adhesive belt comprises silicone, acrylic, polyurethane, epoxy, cyanoacrylate, polyethylene terephthalate, or a combination thereof.
25. (canceled)
26. The screen protector application kit of claim 1, wherein the glass-based substrate comprises a strengthened glass-based substrate selected from a group consisting of a chemically strengthened glass-based substrate, a thermally strengthened glass-based substrate, and a chemically and thermally strengthened glass-based substrate.
27. The screen protector application kit of claim 1, wherein the glass-based substrate comprises a surface compressive stress greater than or equal to 150 MPa as measured by an FSM-6000 at a wavelength of 596 nm.
28. The screen protector application kit of claim 1, wherein the glass-based substrate comprises a depth of compression greater than or equal to 3 μm as measured by an FSM-6000 at a wavelength of 596 nm.
29. The screen protector application kit of claim 1, wherein the glass-based substrate has a central tension greater than or equal to 1 MPa and less than or equal to 120 MPa as measured by an FSM-6000 at a wavelength of 596 nm.
30. (canceled)
31. The screen protector application kit of claim 1, wherein the glass-based substrate has a thickness of mλ.sub.g/2±mλ.sub.g/10, where m is an integer greater than or equal to 1 and λ.sub.g/2 is the half wavelength of an acoustic wave emitted through the glass-based substrate.
32. The screen protector application kit of claim 1, wherein the glass-based substrate has a thickness of mV.sub.S/2f±mV.sub.S/10f where m is an integer greater than or equal to 1, V.sub.S is a velocity of propagation of an acoustic wave emitted through the glass-based substrate at f, and f is a frequency greater than or equal to 1 MHz and less than or equal to 100 MHz.
33-101. (canceled)
102. The screen protector application kit of claim 1, wherein the uncured adhesive composition further comprises greater than or equal to 0.1 wt % and less than or equal to 10 wt % of a co-initiator, the co-initiator being a silane, carbazole, iodonium salt, sulfonium salt, borate salt, amine, amine acrylate, acrylamide, or a combination thereof.
103. The screen protector application kit of claim 1, wherein the uncured adhesive composition further comprises greater than or equal to 0.1 wt % and less than or equal to 5 wt % of an oxygen inhibitor, the oxygen inhibitor being a phosphine, phosphite, amine, thiol, silane, hydrogen phosphite, stannane, aldehyde, vinyl amide, vinyl lactam, vinylcarbazole, diphenyl furan, dibutyl anthracene, or a combination thereof.
104. The screen protector application kit of claim 1, wherein the uncured adhesive composition is cured by irradiation with a visible light source to form a cured adhesive composition, the cured adhesive composition being a cured liquid optically clear adhesive such that the cured adhesive composition has a visible light transmission greater than 70%, a transmission haze less than 20%, and a clarity greater than 80% as measured by a technique set forth in ASTM D1003 with a standard CIE-C illuminant with a wavelength range of 380 nm to 720 nm at a thickness of 0.2 mm.
105. The screen protector application kit of claim 1, wherein the second major surface of the adhesive belt has a peel force on glass greater than or equal to 20 gf/inch and less than or equal to 5000 gf/inch as measured by a technique set forth in ASTM D3330.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
[0302] Reference will now be made in detail to various adhesive compositions and kits for applying a screen protector to a cover glass of an electronic device. According to embodiments, a screen protector application kit includes a glass-based substrate having an adhesive belt and a container of an uncured adhesive composition. The adhesive belt includes a first major surface adhered to the glass-based substrate, a second major surface, a distal edge extending between the first major surface and the second major surface, and a proximal edge extending between the first major surface and the second major surface. The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The uncured adhesive composition may further include 0.1 wt % to 10 wt % of a co-initiator. The uncured adhesive composition may further include 0.1 wt % to 5 wt % of an oxygen inhibitor. In embodiments, a screen protector application kit includes a glass-based substrate, a container of an uncured adhesive composition, and an application fixture. The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The application fixture includes a rectangular frame having a pair of length sides and a pair of width sides. In embodiments, the application fixture further includes a plurality of tabs extending from one of the pair of width sides in a direction perpendicular to the pair of width sides, a plurality of protrusions extending from each of the pair of length sides in a direction perpendicular to the pair of length sides, and at least one level positioned in one of at least one of the pair of length sides and the pair of width sides. In embodiments, the application fixture further includes a plurality of tabs extending from one of the pair of width sides in a direction perpendicular to the pair of width sides, at least one groove in the other of the pair of width sides, and a wedge slider insertable into the at least one groove.
[0303] Ranges may be expressed herein as from “about” one particular value, and/or to “about” another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent “about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
[0304] Directional terms as used herein—for example up, down, right, left, front, back, top, bottom—are made only with reference to the figures as drawn and are not intended to imply absolute orientation.
[0305] Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order, nor that with any apparatus specific orientations be required. Accordingly, where a method claim does not actually recite an order to be followed by its steps, or that any apparatus claim does not actually recite an order or orientation to individual components, or it is not otherwise specifically stated in the claims or description that the steps are to be limited to a specific order, or that a specific order or orientation to components of an apparatus is not recited, it is in no way intended that an order or orientation be inferred, in any respect. This holds for any possible non-express basis for interpretation, including: matters of logic with respect to arrangement of steps, operational flow, order of components, or orientation of components; plain meaning derived from grammatical organization or punctuation; and the number or type of embodiments described in the specification.
[0306] As used herein, the singular forms “a,” “an” and “the” include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to “a” component includes aspects having two or more such components, unless the context clearly indicates otherwise.
[0307] When a definition used herein conflicts with a definition incorporated by reference, the definition used herein controls.
[0308] The phrase “percent of polymerization,” as used herein, is defined via the initial area (A.sub.0) and the area at a given time (A.sub.t) of a peak centered at 809 cm.sup.−1 (799-818 cm.sup.−1), which corresponds to the C═C bond, as measured by Fourier-transform infrared spectroscopy (FTIR) by:
[0309] The baseline of the peak is taken to be the straight line that connects the intensity of the FTIR spectrum at 799 cm.sup.−1 and 819 cm.sup.−1 (or the isosbestic points near 799 cm.sup.−1 and 819 cm.sup.−1) because this range has minimal interference from other neighboring peaks and to minimize the effect of gradual shifts in the baseline of the spectrum.
[0310] The phrase “second derivative of degree of polymerization,” as used herein, is defined by the area (A) of a peak centered at 809 cm.sup.−1 as measured by Fourier-transform infrared spectroscopy (FTIR) by:
[0311] The phrase “uncured adhesive composition,” as used herein, refers to an adhesive composition that has not been exposed to a light source having an emission spectrum less than 700 nm or to an adhesive composition having a degree of polymerization less than 10% as measured by FTIR after being exposed to 6500 K fluorescent light with an illuminance of at least 300 lux for 60-120 minutes at a thickness of 0.1 mm.
[0312] The phrase “cured adhesive composition,” as used herein, refers to an adhesive composition having a degree of polymerization greater than or equal to 10% as measured by FTIR after being exposed to 6500 K fluorescent light with an illuminance of at least 300 lux for 60-120 minutes at a thickness of 0.1 mm and having a second derivative degree of polymerization that has not reached a minimum as measured by FTIR after being exposed to 6500 K fluorescent light with an illuminance of at least 300 lux for 30-60 minutes at a thickness of 0.1 mm.
[0313] The phrase “fixed adhesive composition,” as used herein, refers to an adhesive composition having a second derivative degree of polymerization that has reached a minimum as measured by FTIR after being exposed to 6500 K fluorescent light with an illuminance of at least 300 lux for 30-60 minutes at a thickness of 0.1 mm.
[0314] The phrase “visible light source,” as used herein, refers to a light source that has an integrated emission intensity wherein the area attributable to wavelengths less than 410 nm is less than 15% of the total integrated emission intensity in the wavelength range of 10 nm to 900 nm. The visible light source may include any appropriate light-producing element. In embodiments, the visible light source includes at least one of a fluorescent lamp, a light-emitting diode, a laser, a tungsten lamp, a halogen lamp, a mercury lamp, an incandescent lamp, and sunlight.
[0315] The phrase “UV light source,” as used herein, refers to a light source that has integrated emission intensity wherein the area attributable to wavelengths less than 410 nm is greater than 15% of the total integrated emission intensity in the wavelength range of 10 nm to 900 nm.
[0316] Transmission, as described herein, is measured in accordance with ASTM D1003 with a standard CIE-C illuminant with a wavelength range of 380 nm to 720 nm at a thickness of 0.2 mm, unless otherwise indicated.
[0317] The phrase “transmission haze,” as used herein, refers to the ratio of transmitted light scattered at an angle greater than 2.5° from normal to all transmitted light over the total transmission. Transmission haze, as described herein, is measured in accordance with ASTM D1003 with a standard CIE-C illuminant with a wavelength range of 380 nm to 720 nm at a thickness of 0.2 mm, unless otherwise indicated.
[0318] The term “clarity,” as used herein refers to the ratio of transmitted light scattered at an angle less than 2.5° from normal to all transmitted light over the total transmission. Clarity, as described herein, is measured in accordance with ASTM D1003 with a standard CIE-C illuminant with a wavelength range of 380 nm to 720 nm at a thickness of 0.2 mm, unless otherwise indicated.
[0319] The term “absorbance (A),” as used herein, is defined via the incident intensity (Jo) and transmitted intensity (I) by:
[0320] The term “absorptivity,” as used herein, refers to the property of a chemical that determined the ability of the chemical to absorb incident light in a given wavelength range. The absorptivity was measured when the photoinitiator was dissolved in the liquid adhesive composition and immediately after curing with minimal photobleaching effect. “Absorptivity” may also be referred to as “extinction coefficient.”
[0321] According to the Beer-Lambert Law, the absorbance is proportional to the concentration of the visible-light photoinitiator (c) and the thickness of the film (l) by the absorptivity or extinction coefficient (e):
A=εcl
[0322] An absorption peak, as described herein, is determined by Gaussian curve fitting with a coefficient of determination R.sup.2>0.95. The peak location is the wavelength of the local maximum of the spectrum identified by Gaussian curve fitting with the coefficient of determination R.sup.2>0.95.
[0323] The tensile properties storage modulus (E′) and loss modulus (E″), as described herein, are measured by dynamic mechanical analysis (DMA). Specifically, E′ and E″ are measured by an RSA-G2 instrument (TA instruments) using rectangular film geometry fixtures. The samples are cut to the dimension of 10-12 mm in length, 5-8 mm in width, and about 0.2 mm in thickness. Firstly, temperature ramp tests are performed dynamically in tension using FRT normal force transducer mode. Axial force is set to active in tension mode with a level of 1 N±0.1 N. Force tracking mode is used with a setting of axial force>dynamic force equal to 20% and a minimum force of 0.005 N. Auto strain adjustment mode is enabled to optimize the signal to noise ratio using a strain adjust setting of 80%, minimum strain of 0.02%, maximum strain of 2%, minimum force of 0.01 N, and maximum force of 2 N. Once the specimen is loaded, it is cooled to −50° C. by liquid nitrogen. Once equilibrated, the test is started by oscillating the specimen at a frequency of 1 Hz, 0.2% initial strain, and heated from −50 to 120° C. at a rate of 2° C./min. Results of the temperature ramp are shown at
[0324] Emission intensity spectra of light sources, as described herein, are measured by Ocean Optics Spectrophotometer. Spectra collected are the average of 3 spectra, with a boxcar smoothing of 3. The integration time is adjusted from 50 ms to 3 s to avoid saturating the detector. The illuminance (luminous intensity of the light source that reaches the detector) is measured by a lux meter.
[0325] The phrase “glass-based,” as described herein, includes both glasses and glass-ceramics, wherein glass-ceramics have one or more crystalline phases and an amorphous, residual glass phase. The glass-based substrate may comprise an amorphous material (e.g., glass) and optionally one or more crystalline materials (e.g., ceramic). Amorphous materials and glass-based materials comprising the glass-based substrate may be thermally or chemically strengthened, as described below. Exemplary glass-based materials, which may be free of lithia or not, comprise soda lime glass, alkali aluminosilicate glass, alkali borosilicate glass, alkali aluminophosphosilicate glass, and alkali aluminoborosilicate glass.
[0326] Young's modulus values, as described herein, refer to a value as measured by a resonant ultrasonic spectroscopy technique of the general type set forth in ASTM E2001-13, titled “Standard Guide for Resonant Ultrasound Spectroscopy for Defect Detection in Both Metallic and Non-metallic Parts,” unless otherwise indicated.
[0327] Poisson's ratio values, as described herein, refer to a value as measured by a resonant ultrasonic spectroscopy technique of the general type set forth in ASTM E2001-13, titled “Standard Guide for Resonant Ultrasound Spectroscopy for Defect Detection in Both Metallic and Non-metallic Parts,” unless otherwise indicated.
[0328] Peel force measurements, as described herein, refer to a value as measured by the technique set forth in ASTM D3330, unless otherwise indicated.
[0329] Surface compressive stress (CS), as described herein, is measured by surface stress meter (FSM) using commercially available instruments such as the FSM-6000, manufactured by Orihara Industrial Co., Ltd. (Japan). Surface stress measurements rely upon the accurate measurement of the stress optical coefficient (SOC), which is related to the birefringence of the glass under stress. SOC in turn is measured according to Procedure C (Glass Disc Method) described in ASTM standard C770-16, entitled “Standard Test Method for Measurement of Glass Stress-Optical Coefficient,” the contents of which are incorporated herein by reference in their entirety.
[0330] A liquid optically clear adhesive (LOCA) is an attractive choice for screen protector applications, especially for screen protectors that are applied to devices with complex, non-flat surfaces and include ultrasonic sensors (e.g., fingerprint sensors). A LOCA is compatible with ultrasonic sensors and provides good wetting and spreading properties to allow it to fill the gap produced by the shape mismatch of a screen protector and the surface to which it is being applied. Previously, screen protector applications have employed uncured adhesive compositions that must be cured by exposure to ultraviolet (UV) irradiation. The curing process for these types of uncured adhesive compositions requires a UV light source, which increases the cost of the product and complexity of the application of the screen protector. Additionally, a potential danger of UV exposure is created for the users applying the screen protectors.
[0331] The LOCA compositions described herein may be cured by exposure to a visible light source because of the presence of visible-light-sensitive photoinitiators in the uncured adhesive compositions. With the addition of co-initiators, oxygen inhibitors, and polymerizable crosslinkers and surfactants, the LOCA compositions described herein fix in a relatively short period of time after application, have minimal shrinkage after curing, and have a low enough peel force so that the screen protector may be removed if the screen protector is damaged. The composition and thickness of the LOCA are optimized to be compatible with ultrasonic sensors and to maximize optical clarity of the LOCA. Application kits described herein provide for quick, easy, and successful application of the screen protector by consumers who may have no experience with installing screen protectors.
[0332] The uncured adhesive compositions described herein may be generally described as uncured LOCA. The uncured adhesive compositions described herein comprise at least one of: (i) a monomer; and (ii) an oligomer; and a visible-light photoinitiator having sufficient absorption in the visible light wavelength range to achieve curing of the uncured adhesive composition by exposure to a visible light source. In addition, the uncured adhesive compositions described herein may further contain at least one of a co-initiator and an oxygen inhibitor, which may assist in shortening the curing time of the uncured adhesive compositions and reducing areal shrinkage of the cured adhesive compositions. The cured adhesive compositions described herein may have a reduced peel strength such that no residue is left on the cover glass when the screen protector is removed.
[0333] The uncured adhesive compositions described herein may comprise a monomer, an oligomer, or a combination thereof that is polymerized during the curing process. The monomers and oligomers of the uncured adhesive composition may be selected such that they are capable of polymerizing to form a desired polymer, such as a polyacrylate. In embodiments, the monomers and oligomers may be capable of radical polymerization. In embodiments, the at least one of a monomer and an oligomer may comprise silicone, polyacrylic, polyurethane, epoxy, cyanoacrylate, polyethylene, polyterephthalate, poly(vinyl alcohol), polystyrene, methacrylate (e.g., poly(methyl methacrylate)), polydimethylsiloxane, or a combination thereof. In embodiments, the at least one of a monomer and an oligomer may comprise cyclic hydrocarbon polyacrylate, aliphatic polyacrylate, polysiloxane acrylate, polydimethylsiloxane acrylate, silicone polyetheracrylate, urethane acrylate, monofunctional acrylate, difunctional acrylate, trifunctional acrylate, tetrafunctional acrylate, polyfunctional acrylate, or a combination thereof. In embodiments, the uncured adhesive composition may comprise greater than or equal to 30 wt % and less than 99.9 wt % of the at least one of: (i) a monomer; and (ii) an oligomer. In embodiments, the uncured adhesive composition may comprise greater than or equal to 80 wt % and less than or equal to 99.9 wt % of the at least one of: (i) a monomer; and (ii) an oligomer. In embodiments, the uncured adhesive composition may comprise greater than or equal to 95 and less than or equal to 99.9 wt % of the at least one of: (i) a monomer; and (ii) an oligomer. In embodiments, the concentration of the at least one of: (i) a monomer; and (ii) an oligomer in the uncured adhesive composition may be greater than or equal to 30 wt %, greater than or equal to 40 wt %, greater than or equal to 50 wt %, greater than or equal to 60 wt %, greater than or equal to 70 wt %, greater than or equal to 80 wt %, greater than or equal to 85 wt %, greater than or equal to 90 wt %, or even greater than or equal to 95 wt %. In embodiments, the concentration of the at least one of: (i) a monomer; and (ii) an oligomer in the uncured adhesive composition may be greater than or equal to 30 wt % and less than or equal to 99.9 wt %, greater than or equal to 40 wt % and less than or equal to 99.9 wt %, greater than or equal to 50 wt % and less than or equal to 99.9 wt %, greater than or equal to 60 wt % and less than or equal to 99.9 wt %, greater than or equal to 70 wt % and less than or equal to 99.9 wt %, greater than or equal to 80 wt % and less than or equal to 99.9 wt %, greater than or equal to 85 wt % and less than or equal to 99.9 wt %, greater than or equal to 90 wt % and less than or equal to 99.9 wt %, greater than or equal to 93 wt % and less than or equal to 99.9 wt %, greater than or equal to 95 wt % and less than or equal to 99.9 wt %, greater than or equal to 97 wt % and less than or equal to 99.9 wt %, greater than or equal to 98 wt % and less than or equal to 99.9 wt %, greater than or equal to 50 wt % and less than or equal to 95 wt %, greater than or equal to 60 wt % and less than or equal to 95 wt %, greater than or equal to 80 wt % and less than or equal to 95 wt %, greater than or equal to 85 wt % and less than or equal to 95 wt %, greater than or equal to 70 wt % and less than or equal to 90 wt %, greater than or equal to 80 wt % and less than or equal to 90 wt %, greater than or equal to 83 wt % and less than or equal to 90 wt %, greater than or equal to 85 wt % and less than or equal to 90 wt %, greater than or equal to 86 wt % and less than or equal to 90 wt %, greater than or equal to 87 wt % and less than or equal to 90 wt %, greater than or equal to 88 wt % and less than or equal to 90 wt %, greater than or equal to 80 wt % and less than or equal to 89 wt %, greater than or equal to 83 wt % and less than or equal to 89 wt %, greater than or equal to 85 wt % and less than or equal to 89 wt %, or even greater than or equal to 87 wt % and less than or equal to 89 wt %, or any and all sub-ranges formed from any of these endpoints.
[0334] The visible-light photoinitiators included in the uncured adhesive compositions described herein are selected to match the spectra of the lighting source intended for curing of the uncured adhesive composition. The uncured adhesive compositions described herein may be cured by exposure to a visible light source. The curing of the uncured adhesive composition by exposure to a visible light source is achieved by inclusion of a visible-light photoinitiator that has sufficient absorption in the visible light wavelength range. The absorption of the visible-light photoinitiator may be weighted to relatively short wavelengths in the visible wavelength range, such as less than about 500 nm, because this wavelength range has a relatively high energy, which facilitates the initiation of polymerization. The absorption of the photoinitiator may be weighted to relatively long wavelengths in the visible wavelength range, such as more than about 500 nm, because many household light sources emit more light in this wavelength range, which facilitates the initiation of polymerization. Absorption of wavelengths of less than about 500 nm corresponds to the absorption of purple/blue light, which may produce a yellow/orange appearance of the uncured adhesive composition and the cured adhesive composition produced from the uncured adhesive composition. Absorption of wavelength greater than 500 nm corresponds to the absorption of yellow to red light, which may produce a blue appearance of the LOCA and the cured adhesive film produced from the LOCA. The absorption by the visible-light photoinitiator, the spectra of the curing light sources, and the color appearance of the cured adhesive composition are important considerations when determining the appropriate uncured adhesive composition for use in screen protector applications. Similarly, it may be desirable to select a visible-light photoinitiator that photobleaches, meaning that the reaction of the visible-light photoinitiator under the light results in loss of color. Additionally, to reduce the curing time of the uncured adhesive composition, it may be desirable to include a visible-light photoinitiator that, by itself or with a co-initiator, assists with radical polymerization.
[0335] In embodiments, the visible-light photoinitiator may comprise phosphine oxide-based compounds, cyanine compounds, indocyanine compounds, xanthene compounds, fluorone compounds, thioxanthone compounds, phenyl glyoxylate-based compounds, cyclic ketoester-based compounds, benzoin ether-based compounds, amine compounds, α-hydroxy ketone-based compounds, fluorinated diaryl titanocene compounds, or a combination thereof. In embodiments, the photinitiator may comprise, phenylbis(2,4,6-trimethyl benzoyl)phosphine oxide (e.g., Irgacure 819), bis(eta-5-2,4-cyclopentadien-1-yl)bis[2,6-difluoro-3-(1H-pyrrol-1-yl phenyl]titanium (e.g., Irgacure 784), 1-butyl-2-[5-(1-butyl-1,3-dihydro-3,3-dimethyl-2H-indol-2-ylidene)-1,3-pentadien-1-yl]-3,3-dimethyl-3H-indolium salt (e.g., H-Nu 640 MP), or combinations thereof.
[0336] In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.01 wt % and less than or equal to 10 wt % of the visible-light photoinitiator. In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.05 wt % and less than or equal to 5 wt % of the visible-light photoinitiator. In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.1 wt % and less than or equal to 2 wt % of the visible-light photoinitiator. In embodiments, the concentration of the visible-light photoinitiator in the uncured adhesive composition may be greater than or equal to greater than or equal to 0.01 wt %, greater than or equal to 0.05 wt %, greater than or equal 0.1 wt %, greater than or equal to 0.5 wt %, greater than or equal to 0.7 wt %, or even greater than or equal to 0.8 wt %. In embodiments, the concentration of the visible-light photoinitiator in the uncured adhesive composition may be less than or equal to 10 wt %, less than or equal to 7 wt %, less than or equal to 5 wt %, less than or equal to 3 wt %, less than or equal to 2 wt %, less than or equal to 1.5 wt %, less than or equal to 1.3 wt %, less than or equal to 1.1 wt %, or even less than or equal to 1.0 wt %. In embodiments, the concentration of the visible-light photoinitiator in the uncured adhesive composition may be greater than or equal to 0.01 wt % and less than or equal to 10 wt %, greater than or equal to 0.01 wt % and less than or equal to 7 wt %, greater than or equal to 0.01 wt % and less than or equal to 5 wt %, greater than or equal to 0.01 wt % and less than or equal to 3 wt %, greater than or equal to 0.01 wt % and less than or equal to 2 wt %, greater than or equal to 0.01 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.01 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.01 wt % and less than or equal to 1.1 wt %, greater than or equal to 0.01 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.05 wt % and less than or equal to 10 wt %, greater than or equal to 0.05 wt % and less than or equal to 7 wt %, greater than or equal to 0.05 wt % and less than or equal to 5 wt %, greater than or equal to 0.05 wt % and less than or equal to 3 wt %, greater than or equal to 0.05 wt % and less than or equal to 2 wt %, greater than or equal to 0.05 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.05 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.05 wt % and less than or equal to 1.1 wt %, greater than or equal to 0.05 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.1 wt % and less than or equal to 10 wt %, greater than or equal to 0.1 wt % and less than or equal to 7 wt %, greater than or equal to 0.1 wt % and less than or equal to 5 wt %, greater than or equal to 0.1 wt % and less than or equal to 3 wt %, greater than or equal to 0.1 wt % and less than or equal to 2 wt %, greater than or equal to 0.1 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.1 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.1 wt % and less than or equal to 1.1 wt %, greater than or equal to 0.1 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.5 wt % and less than or equal to 10 wt %, greater than or equal to 0.5 wt % and less than or equal to 7 wt %, greater than or equal to 0.5 wt % and less than or equal to 5 wt %, greater than or equal to 0.5 wt % and less than or equal to 3 wt %, greater than or equal to 0.5 wt % and less than or equal to 2 wt %, greater than or equal to 0.5 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.5 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.5 wt % and less than or equal to 1.1 wt %, greater than or equal to 0.5 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.7 wt % and less than or equal to 10 wt %, greater than or equal to 0.7 wt % and less than or equal to 7 wt %, greater than or equal to 0.7 wt % and less than or equal to 5 wt %, greater than or equal to 0.7 wt % and less than or equal to 3 wt %, greater than or equal to 0.7 wt % and less than or equal to 2 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.1 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.9 wt % and less than or equal to 10 wt %, greater than or equal to 0.9 wt % and less than or equal to 7 wt %, greater than or equal to 0.9 wt % and less than or equal to 5 wt %, greater than or equal to 0.9 wt % and less than or equal to 3 wt %, greater than or equal to 0.9 wt % and less than or equal to 2 wt %, greater than or equal to 0.9 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.9 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.9 wt % and less than or equal to 1.1 wt %, or even greater than or equal to 0.9 wt % and less than or equal to 1.0 wt %, or any and all sub-ranges formed between any of these endpoints.
[0337] The absorptivity of the visible-light photoinitiator included in the uncured adhesive composition in the visible light spectrum, prior to photobleaching, may be sufficient to allow for initiation of the polymerization of the uncured adhesive composition upon exposure to visible light. In embodiments, the visible-light photoinitiator may have an absorptivity in the wavelength range of 380 nm to 750 nm greater than or equal to 200 L/mol/cm and less than or equal to 5000 L/mol/cm, greater than or equal to 250 L/mol/cm and less than or equal to 4000 L/mol/cm, greater than or equal to 300 L/mol/cm and less than or equal to 3000 L/mol/cm, greater than or equal to 350 L/mol/cm and less than or equal to 2000 L/mol/cm, greater than or equal to 400 L/mol/cm and less than or equal to 1000 L/mol/cm, or even greater than or equal to 450 L/mol/cm and less than or equal to 850 L/mol/cm, or any and all sub-ranges formed between any of these endpoints. “Photobleaching” of the photoinitiator, means that the uncured adhesive composition with the photoinitiator, when irradiated by light sources in the wavelength range of 380 nm to 750 nm, loses color because of chemical changes to the photoinitiator. Where the absorptivity of the visible-light photoinitiator in the wavelength range of 380 nm to 750 nm is too low, the uncured adhesive composition may not be able to be cured by exposure to visible light. In cases where the absorbance (the product of absorptivity and concentration) of the visible-light photoinitiator in the wavelength range of 380 nm to 750 nm is too high, undesirable optical effects may be produced.
[0338] The visible-light photoinitiators included in the uncured adhesive composition may also be characterized by their absorbance. In embodiments, the visible-light photoinitiator has a thickness-normalized absorbance in the wavelength range of 380 nm to 750 nm greater than or equal to 2 cm.sup.−1 and less than or equal to 50 cm.sup.−1, greater than or equal to 3 cm.sup.−1 and less than or equal to 45 cm.sup.−1, greater than or equal to 4 cm.sup.−1 and less than or equal to 40 cm.sup.−1, greater than or equal to 5 cm.sup.−1 and less than or equal to 35 cm.sup.−1, greater than or equal to 10 cm.sup.−1 and less than or equal to 30 cm.sup.−1, or even greater than or equal to 15 cm.sup.−1 and less than or equal to 25 cm.sup.−1, or any and all sub-ranges formed from any of these endpoints. The ranges of the normalized absorbance are without the photobleaching of the photoinitiator, which means that the uncured adhesive composition with the photoinitiator is not irradiated by any type of light source that has a wavelength range that overlaps with the absorption spectrum of the photoinitiator. Where the thickness-normalized absorbance of the visible-light photoinitiator in the wavelength range of 380 nm to 750 nm is too low, the uncured adhesive composition may not be able to be cured by exposure to visible light. In cases where the thickness-normalized absorbance of the visible-light photoinitiator in the wavelength range of 380 nm to 750 nm is too high, undesirable optical effects may be produced.
[0339] The performance of the visible-light photoinitiator may also be characterized by the location of absorption peaks. In embodiments, the visible-light photoinitiator may have an absorption peak in a wavelength range greater than or equal to 350 nm and less than or equal to 750 nm, greater than or equal to 350 nm and less than or equal to 600 nm, greater than or equal to 350 nm and less than or equal to 500 nm, greater than or equal to 350 nm and less than or equal to 450 nm, greater than or equal to 350 nm and less than or equal to 400 nm, greater than or equal to 350 nm and less than or equal to 390 nm, greater than or equal to 360 nm and less than or equal to 750 nm, greater than or equal to 360 nm and less than or equal to 600 nm, greater than or equal to 360 nm and less than or equal to 500 nm, greater than or equal to 360 nm and less than or equal to 450 nm, greater than or equal to 360 nm and less than or equal to 400 nm, greater than or equal to 360 nm and less than or equal to 390 nm, greater than or equal to 370 nm and less than or equal to 750 nm, greater than or equal to 370 nm and less than or equal to 600 nm, greater than or equal to 370 nm and less than or equal to 500 nm, greater than or equal to 370 nm and less than or equal to 450 nm, greater than or equal to 370 nm and less than or equal to 400 nm, or even greater than or equal to 370 nm and less than or equal to 390 nm, or any and all sub-ranges formed between these endpoints. In embodiments, the visible-light photoinitiator has an absorption peak outside the visible light range, but may cure in the visible light range because it has an absorptivity or a thickness-normalized absorbance falling within the ranges described hereinabove.
[0340] The co-initiators included in the uncured adhesive compositions described herein are selected to decrease the fixing and curing times of the uncured adhesive composition. While the presence of visible-light photoinitiators in the uncured adhesive compositions described herein allows for curing in the visible light range, such uncured adhesive compositions may have relatively slow fixing and curing times. The co-initiators described herein promote polymerization, particularly radical polymerization. Increasing the rate of polymerization reduces the fixing and curing times of the uncured adhesive composition, which may help to reduce shrinkage of the cured adhesive composition.
[0341] In embodiments, the co-initiator may comprise a silane, carbazole, iodonium salt, sulfonium salt, borate salt, amine, amine acrylate, acrylamide, or a combination thereof. In embodiments, the iodonium or sulfonium salt may have an anion counter-ion such as hexafluorophosphate, hexafluoroarsenate, hexafluoroantimonate, tetrafluoroborate, bifluoride, perchlorate, chloride, bromide, iodide, nitrate, silicate (e.g., difluorotrimethylsilicate and/or hexafluorosilicate), sulfonate (e.g., triflate, p-toluenesulfonate, and/or perfluoro-1-butanesufonate), or a combination thereof. In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.1 wt % and less than or equal to 10 wt % of the co-initiator. In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.1 wt % and less than or equal to 5 wt % of the co-initiator. In embodiments, the concentration of the co-initiator in the uncured adhesive composition may be less than or equal to 10 wt %, less than or equal to 7 wt %, less than or equal to 5 wt %, less than or equal to 3 wt %, less than or equal to 2 wt %, less than or equal to 1.5 wt %, less than or equal to 1.3 wt %, less than or equal to 1.1 wt %, or even less than or equal to 1.0 wt %. In embodiments, the concentration of the co-initiator in the uncured adhesive composition may be greater than or equal to 0.1 wt % and less than or equal to 10 wt %, greater than or equal to 0.1 wt % and less than or equal to 7 wt %, greater than or equal to 0.1 wt % and less than or equal to 5 wt %, greater than or equal to 0.1 wt % and less than or equal to 3 wt %, greater than or equal to 0.1 wt % and less than or equal to 2 wt %, greater than or equal to 0.1 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.1 wt % and less than or equal to 1 wt %, greater than or equal to 0.5 wt % and less than or equal to 10 wt %, greater than or equal to 0.5 wt % and less than or equal to 7 wt %, greater than or equal to 0.5 wt % and less than or equal to 5 wt %, greater than or equal to 0.5 wt % and less than or equal to 3 wt %, greater than or equal to 0.5 wt % and less than or equal to 2 wt %, greater than or equal to 0.5 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.1 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.7 wt % and less than or equal to 10 wt %, greater than or equal to 0.7 wt % and less than or equal to 7 wt %, greater than or equal to 0.7 wt % and less than or equal to 5 wt %, greater than or equal to 0.7 wt % and less than or equal to 3 wt %, greater than or equal to 0.7 wt % and less than or equal to 2 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.1 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.9 wt % and less than or equal to 1.1 wt %, or even greater than or equal to 0.9 wt % and less than or equal to 1.0 wt %, or any and all sub-ranges formed from any of these endpoints.
[0342] Similar to the co-initiators, the oxygen inhibitors, otherwise known as antioxidants or anti-oxygen inhibitor, included in the uncured adhesive compositions described herein are selected to promote polymerization, particularly radical polymerization, by decreasing the fixing and curing times of the uncured adhesive composition and may help to reduce shrinkage of the cured adhesive composition. While not wishing to be bound by theory, it is believed that oxygen dissolved in the uncured adhesive composition reacts with highly reactive radicals and transforms them into less reactive peroxyl radicals, thereby inhibiting and decreasing the rate of radical driven polymerization of monomers. An oxygen inhibitor not only reacts with oxygen in the uncured adhesive composition, but also reacts with the peroxyl radicals to increase their reactivity.
[0343] In embodiments, the oxygen inhibitor may comprise a reducing agent (e.g., phosphine and/or phosphite), a hydrogen donor (e.g., amine, thiol, silane, hydrogen phosphite, stannane, and/or aldehyde), vinyl amide, vinyl lactam (e.g., N-vinylpyrrolidone and N-vinyl-s-caprolactam), vinylcarbazole, a singlet oxygen scavenger (e.g., diphenyl furan and/or dibutyl anthracene), or a combination thereof. In embodiments, the oxygen inhibitor may comprise 4-(dimethylamino)phenyl diphenylphosphene, triphenylphosphine, triphenyl phosphite, or a combination thereof. In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.1 wt % and less than or equal to 5 wt % of the oxygen inhibitor. In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.1 wt % and less than or equal to 2 wt % of the oxygen inhibitor. In embodiments, the concentration of the oxygen inhibitor in the uncured adhesive composition may be less than or equal to 5 wt %, less than or equal to 4 wt %, less than or equal to 3 wt %, less than or equal to 2 wt %, less than or equal to 1.5 wt %, less than or equal to 1.3 wt %, less than or equal to 1.1 wt %, or even less than or equal to 1.0 wt %. In embodiments, the concentration of the oxygen inhibitor in the uncured adhesive composition may be greater than or equal to 0.1 wt % and less than or equal to 5 wt %, greater than or equal to 0.1 wt % and less than or equal to 4 wt %, greater than or equal to 0.1 wt % and less than or equal to 3 wt %, greater than or equal to 0.1 wt % and less than or equal to 2 wt %, greater than or equal to 0.1 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.1 wt % and less than or equal to 1 wt %, greater than or equal to 0.5 wt % and less than or equal to 5 wt %, greater than or equal to 0.5 wt % and less than or equal to 4 wt %, greater than or equal to 0.5 wt % and less than or equal to 3 wt %, greater than or equal to 0.5 wt % and less than or equal to 2 wt %, greater than or equal to 0.5 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.5 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.7 wt % and less than or equal to 5 wt %, greater than or equal to 0.7 wt % and less than or equal to 4 wt %, greater than or equal to 0.7 wt % and less than or equal to 3 wt %, greater than or equal to 0.7 wt % and less than or equal to 2 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.5 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.3 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.1 wt %, greater than or equal to 0.7 wt % and less than or equal to 1.0 wt %, greater than or equal to 0.9 wt % and less than or equal to 1.1 wt %, or even greater than or equal to 0.9 wt % and less than or equal to 1.0 wt %, or any and all sub-ranges formed from any of these endpoints.
[0344] In embodiments, the uncured adhesive composition may include a surfactant. The surfactant may comprise polysiloxane acrylate, polydimethylsiloxane acrylate, silicone polyether acrylate, perfluoropolyether, perfluorocarbon, or a combination thereof. In embodiments, the uncured adhesive composition may comprise greater than or equal to 0.01 wt % and less than or equal to 1 wt % surfactant. In embodiments, the concentration of the surfactant in the uncured adhesive composition may be less than or equal to 1 wt %, less than or equal to 0.7 wt %, or even less than or equal to 0.5 wt %. In embodiments, the concentration of surfactant in the uncured adhesive composition may be greater than or equal to 0.01 wt % and less than or equal to 1 wt %, greater than or equal to 0.01 wt % and less than or equal to 0.7 wt %, greater than or equal to 0.01 wt % and less than or equal to 0.5 wt %, greater than or equal to 0.01 wt % and less than or equal to 0.3 wt %, greater than or equal to 0.01 wt % and less than or equal to 0.1 wt %, greater than or equal to 0.1 wt % and less than or equal to 1 wt %, greater than or equal to 0.1 wt % and less than or equal to 0.7 wt %, greater than or equal to 0.1 wt % and less than or equal to 0.5 wt %, greater than or equal to 0.1 wt % and less than or equal to 0.3 wt %, greater than or equal to 0.3 wt % and less than or equal to 1 wt %, greater than or equal to 0.3 wt % and less than or equal to 0.7 wt %, greater than or equal to 0.3 wt % and less than or equal to 0.5 wt %, greater than or equal to 0.5 wt % and less than or equal to 1 wt %, greater than or equal to 0.5 wt % and less than or equal to 0.7 wt %, or even greater than or equal to 0.7 wt % and less than or equal to 1 wt %, or any and all sub-ranges formed from any of these endpoints.
[0345] The viscosity of the uncured adhesive composition described herein ensures fast wetting and spreading between a glass-based substrate and a mounting surface of a device to which the screen protector will be adhered. If the viscosity is too high, insufficient spreading or wetting of the uncured adhesive composition may result. Additionally, if the viscosity of the uncured adhesive composition is not low enough, bubbles may be trapped within the cured adhesive composition. In embodiments, the uncured adhesive compositions described herein may have a viscosity less than or equal to 500 cps, less than or equal to 450 cps, less than or equal to 400 cps, less than or equal to 350 cps, less than or equal to 300 cps, less than or equal to 250 cps, less than or equal to 200 cps, less than or equal to 150 cps, less than or equal to 100 cps, less than or equal to 50 cps, less than or equal to 20 cps, or even less than or equal to 10 cps. The viscosities reported herein were obtained from the data sheet of the materials and are measured at 20° C., unless otherwise indicated.
[0346] The uncured adhesive compositions may be cured in a time period that allows for the convenient application of a screen protector. A fixed adhesive composition does not allow a screen protector to which it is adhered to be moved relative to the mounting surface by a user and does not seep or leak from the edges of the screen protector. The cured adhesive composition allows any sensors positioned such that they operate through the cured adhesive composition, such as a fingerprint sensor located within or below a display, to operate normally.
[0347] Light sources with different spectra and intensities may result in different fix and cure times even when the same visible-light photoinitiator is employed. In embodiments, immediately after irradiation with the visible light source, the adhesive composition may be fixed. In embodiments, immediately after irradiation with the visible light source, the adhesive composition may be cured. In embodiments, irradiation of the uncured adhesive composition with a visible light source extends for a period greater than or equal to 10 seconds and less than or equal to 10 minutes, greater than or equal to 30 seconds and less than or equal to 10 minutes, greater than or equal to 1 minute and less than or equal to 10 minutes, greater than or equal to 2 minutes and less than or equal to 10 minutes, greater than or equal to 10 seconds and less than or equal to 7 minutes, greater than or equal to 30 seconds and less than or equal to 7 minutes, greater than or equal to 1 minute and less than or equal to 7 minutes, greater than or equal to 2 minutes and less than or equal to 7 minutes, greater than or equal to 10 seconds and less than or equal to 5 minutes, greater than or equal to 30 s and less than or equal to 5 minutes, greater than or equal to 1 minute and less than or equal to 5 minutes, or even greater than or equal to 2 minutes and less than or equal to 5 minutes, or any and all sub-ranges formed between any these endpoints.
[0348] The uncured adhesive composition may form a polymer upon curing. In embodiments, the polymer formed when the uncured adhesive composition is cured may be a polymer generated by radical polymerization. In embodiments, the polymer formed when the uncured adhesive composition is cured may be a polyacrylate, such as poly(isobornyl acrylate).
[0349] Referring now to
[0350] The glass-based substrate 110 may have a shape that reflects the shape of the cover glass 140 of the electronic device to which it will be applied. Stated differently, the shape of the glass-based substrate 110 may reflect the shape of the mounting surface 130 of the cover glass 140. In embodiments, the glass-based substrate 110 may have a 2-dimensional (2D), a 2.5-dimensional (2.5D), or a 3-dimensional (3D) shape. As utilized herein, a 2D shape refers to a glass-based substrate where both major surfaces are flat (planar). As utilized herein, a 2.5D shape refers to a glass-based substrate where one major surface is flat (planar) and one major surface is curved. As utilized herein, a 3D shape refers to a glass-based substrate where both major surfaces are curved. By way of example, a 3D glass-based substrate may be appropriately employed when the mounting surface to which it will be adhered and which it will protect is curved.
[0351] The glass-based substrate 110 may comprise a length and a width. In embodiments, the length of the glass-based substrate 110 may be greater than or equal to 10 millimeters (mm), greater than or equal to 30 mm, greater than or equal to 50 mm, greater than or equal to 100 mm, greater than or equal to 130 mm, greater than or equal to 150 mm, greater than or equal to 160 mm, greater than or equal to 200 mm. In embodiments, the length of the glass-based substrate 110 may be less than or equal to 500 mm, less than or equal to 300 mm, or less than or equal to 200 mm. In embodiments, the length of the glass-based substrate 110 may be greater than or equal to 10 mm and less than or equal to 500 mm, greater than or equal to 10 mm and less than or equal to 300 mm, greater than or equal to 10 mm and less than or equal to 200 mm, greater than or equal to 10 mm and less than or equal to 200 mm, greater than or equal to 30 mm and less than or equal to 500 mm, greater than or equal to 30 mm and less than or equal to 300 mm, greater than or equal to 30 mm and less than or equal to 200 mm, greater than or equal to 50 mm and less than or equal to 500 mm, greater than or equal to 50 mm and less than or equal to 300 mm, greater than or equal to 50 mm and less than or equal to 200 mm, greater than or equal to 100 mm and less than or equal to 500 mm, greater than or equal to 100 mm and less than or equal to 300 mm, greater than or equal to 100 mm and less than or equal to 200 mm, greater than or equal to 120 mm and less than or equal to 200 mm, greater than or equal to 130 mm and less than or equal to 200 mm, greater than or equal to 50 mm and less than or equal to 160 mm, or even greater than or equal to 50 mm and less than or equal to 150 mm, or any and all subranges formed between these endpoints. In embodiments, the width of the glass-based substrate 110 may be about the same, greater than, or less than the length of the glass-based substrate 110. In embodiments, the width of the glass-based substrate 110 may comprise the ranges presented above for the length of the glass-based substrate 110. In embodiments, the length and width of the glass-based substrate 110 may be the same as the corresponding dimensions of a device or portion of the device (e.g., screen of the device) that the glass-based substrate 110 has been designed to protect. In embodiments, the length and width of the glass-based substrate 110 may be proportional to the corresponding dimensions of the device or portion of the device (e.g., screen of the device) that the glass-based substrate 110 has been designed to protect. In embodiments, the length and/or width of the glass-based substrate 110 may be less than or greater than the corresponding dimensions of the device or portion of the device (e.g., screen of the device) that the glass-based substrate 110 has been designed to protect.
[0352] In embodiments, the glass-based substrate 110 may include an anti-splinter layer 150. The anti-splinter layer 150 prevents shattering of the glass-based substrate 110 once the glass-based substrate is broken. The anti-splinter layer 150 may cover all or a portion of the glass-based substrate 110. In embodiments, the anti-splinter layer 150 is provided at the periphery of the glass-based substrate 110 and serves to provide a pleasing aesthetic appearance or decoration to the screen protector system 100, and holds the shattered glass if the screen protector is broken. The anti-splinter layer 150 may be opaque or translucent. Decoration may be added to the anti-splinter layer 150 by any appropriate process, such as screen printing or other printing method.
[0353] The consumer electronic device may include an ultrasonic sensor 160 located below the cover glass 140 that is configured to operate through the cover glass 140. In
[0354] The ultrasonic sensor 160 may be a fingerprint sensor (FPS). The FPS may recognize a fingerprint pattern of a user's finger by the difference in ultrasonic power returning to the sensor detector due to the difference in the ultrasonic impedances of finger ridges and valleys (the impedances of skin and air). For the FPS to be compatible with the screen protector, the sensor must have enough power to transmit an acoustic wave through the screen protector and have a reflected acoustic wave return to the sensor detector within a specific time of flight. The acoustic wave produced by the ultrasonic sensor 160 may be a matrix of longitudinal plane waves. It should be understood that where the performance of a FPS is described herein, the principles allowing for the FPS compatibility are also applicable to compatibility with other ultrasonic sensors.
[0355] The ultrasonic sensor 160 of the electronic device may be characterized by its operating frequency. In embodiments, the ultrasonic sensor 160 may have an operating frequency greater than or equal to 1 MHz and less than or equal to 50 MHz, greater than or equal to 1 MHz and less than or equal to 40 MHz, greater than or equal to 1 MHz and less than or equal to 30 MHz, greater than or equal to 1 MHz and less than or equal to 20 MHz, greater than or equal to 1 MHz and less than or equal to 15 MHz, greater than or equal to 5 MHz and less than or equal to 50 MHz, greater than or equal to 5 MHz and less than or equal to 40 MHz, greater than or equal to 5 MHz and less than or equal to 30 MHz, greater than or equal to 5 MHz and less than or equal to 20 MHz, greater than or equal to 5 MHz and less than or equal to 15 MHz, greater than or equal to 10 MHz and less than or equal to 50 MHz, greater than or equal to 10 MHz and less than or equal to 40 MHz, greater than or equal to 10 MHz and less than or equal to 30 MHz, greater than or equal to 10 MHz and less than or equal to 20 MHz, or even greater than or equal to 10 MHz and less than or equal to 15 MHz, or any and all sub-ranges formed from any of these endpoints. In embodiments, the ultrasonic sensor 160 may have an operating frequency of 12 MHz. In embodiments, the ultrasonic sensor 160 may have an operating frequency of 10 MHz.
[0356] The design parameters of the screen protector system 100 including the glass-based substrate 110 and cured adhesive composition 120 may be selected such that the cured adhesive composition 120 is compatible with the functionality of an ultrasonic sensor 160 of the electronic device to which the screen protector system 100 is adhered. For example, the thickness of the glass-based substrate 110 and cured adhesive composition 120 may be selected to maximize the response of the ultrasonic sensor 160 while also providing a tolerance for a large variety of cured adhesive composition 120 thicknesses. The cured adhesive composition 120 thickness may be as thin as possible to provide the desired ultrasonic sensor 160 performance. The ability of the screen protector to provide adequate adhesion and a bubble-free appearance requires at least a minimum thickness of the cured adhesive composition 120. Thin adhesive layers may allow the ultrasonic sensor 160 to operate properly even when the glass-based substrate 110 thickness is outside of the preferred range. The rheology of the adhesive composition 120 is also important to the functionality of the ultrasonic FPS.
[0357] In embodiments, the glass-based substrate 110 may have a thickness greater than or equal to 200 μm and less than or equal to 250 μm±30 μm. This glass-based substrate thickness is in coincidence with the half wavelength of a 12 MHz ultrasonic wave in the glass-based substrate, resulting in resonance and enhancing the transmitted power of the wave. In general, the velocity of a longitudinal ultrasonic wave in glass (v.sub.g) can be expressed as a function of Young's modulus (E), density (ρ), and Poisson's ratio (v), as shown by the below equation.
[0358] The wavelength of the ultrasonic wave (λ.sub.g) in glass can be calculated by the below equation, where f is the operation frequency of the ultrasonic sensor.
[0359] The half wavelength (λ.sub.g/2) of a 12 MHz ultrasonic wave in commercially available alkali aluminosilicate glasses may be about 200-270 μm, indicating that a glass-based substrate thickness in this range may provide desirable resonance and performance. Similarly, thicknesses of the glass-based substrate in accordance with multiples of the half wavelength (λ.sub.g/2) will also provide resonance and improved performance. The glass-based substrate thicknesses that provide resonance, and are thus preferred, are described by mλ.sub.g/2±mλ.sub.g/10, where m is an integer greater than or equal to 1, such as 1, 2, 3, 4, or more. It is expected that thicker glass-based substrates may cause a lag (delay) in the ultrasonic wave reflected back to the sensor's detector that is longer than the designed time of flight of the projected detector circuit. The time of flight may be compensated by electronic adjustment of the ultrasonic sensor, but it may be desirable for that reason to keep the thickness of the glass small. Additionally, a thick glass may increase the noise when the emission direction of the ultrasonic wave has small deviation from normal (90°) to the display cover. Therefore the order m of the glass resonance is as small a number as possible, with m=1 being a preferred condition.
[0360] In embodiments, the glass-based substrate 110 may have a thickness greater than or equal to 100 μm and less than or equal to 500 μm, greater than or equal to 150 μm and less than or equal to 400 μm, greater than or equal to 175 μm and less than or equal to 300 μm, greater than or equal to 200 μm and less than or equal to 275 μm, greater than or equal to 210 μm and less than or equal to 260 μm, or even greater than or equal to 225 μm and less than or equal to 250 μm, or any and all sub-ranges formed from any of these endpoints.
[0361] The thickness of the glass-based substrate may also be characterized as a function of the operating frequency f of the ultrasonic sensor and the velocity of propagation of the ultrasonic wave V.sub.S in the glass-based substrate at the operating frequency. In embodiments, the thickness of the glass-based substrate may be defined as mV.sub.S/2f±mV.sub.S/10f, where m is an integer greater than or equal to 1, such as 1 or 2.
[0362] For a given glass-based substrate thickness, a thinner cured adhesive composition will provide improved ultrasonic sensor functionality, as influence of the cured adhesive composition on the performance of the ultrasonic sensor may be primarily damping controlled. Consequently, the selection of the damping properties of the cured adhesive composition is important to ensure the desired functionality of the ultrasonic sensor.
[0363] Damping of a cured adhesive composition may be characterized by dynamic mechanical analysis (DMA) in either tensile and shear modes. There is a correlation between tensile (E) and shear (G) moduli by Poisson's ratio (v), as shown by the below equation:
[0364] Both the tensile and shear moduli are complex parameters, with a real part (storage modulus, E′ and G′) and an imaginary part (loss modulus, E″ and G″). Assuming the Poisson's ratio is a constant, the damping, as characterized by the loss tangent (tan(δ)) of the cured adhesive composition, may be calculated by either shear or tensile mode, as expressed in the equation below:
[0365] In the case of weakly compressible polymers, such as acrylic rubbers, the Poisson's ratio is about 0.5, leading to G=E/3. Since the ultrasonic waves described herein are assumed to be longitudinal, the tensile moduli play more important roles than shear moduli in the damping behavior of the cured adhesive compositions. As a result, the tensile moduli of the cured adhesive compositions are generally discussed herein.
[0366] The storage modulus (F′), loss modulus (E″), and loss tangent (tan(δ)) recited herein are reported at a reference temperature of 20° C. (room temperature), unless otherwise indicated. Cured adhesive compositions that provide improved ultrasonic sensor performance typically have a higher E′, a higher E″, and a lower tan(δ). The rheology of the cured adhesive composition is also a function of the frequency, and for that reason the rheology is generally considered at the operating frequency of the ultrasonic sensor with which it will be utilized.
[0367] The reflection coefficient (R) of an ultrasonic wave at the interface of the cured adhesive composition and glass-based substrate is a function of the acoustic impedance difference (Z.sub.g−Z.sub.p) between the acoustic impedance of the glass-based substrate Z.sub.g and the acoustic impedance of the cured adhesive composition Z.sub.p, as expressed by the equation below.
[0368] The ultrasonic transmission of the screen protectors described herein may be calculated. The computational calculation of the transmission is based on the theoretical equations of acoustic wave transmission in a stack of layered materials, which is equivalent to an electrical circuit using electrical waves. The equivalency of acoustic waves and electrical circuits may be rationalized by the fact that both originate from sinusoidal waves interacting with each other and have similar boundary conditions. Once the equation is derived, it may be used to solve either electrical or acoustic problems. The only modification required is the substitution by their equivalent components either in the electrical or acoustic domain.
[0369] In performing the ultrasonic transmission calculations, it is assumed that the ultrasonic sensor is located under the cover glass and display of the consumer electronic device, with an equivalent acoustic impedance matching with the acoustic impedance of a finger skin (finger ridges and valleys) on the surface of the cover of the device to maximize the transmission of ultrasonic waves without the use of any screen protectors. Therefore, in the optimal scenario with a glass-based screen protector, the equivalent acoustic impedance at the interface of the glass-based substrate and cured adhesive composition should also match with, or be as close as possible to, the acoustic impedance of the human finger. The equivalent acoustic impedance Z(L) at the interface of glass-based substrate and cured adhesive composition can be computed by the equation below, where Z.sub.o is the characteristic acoustic impedance of the glass-based substrate. Z.sub.L is the acoustic impedance of finger skin or air, corresponding to locations of fingerprint ridges and valleys.
[0370] L is the thickness of the glass-based substrate,
and γ is a complex propagation constant given by
In this case, α is the attenuation factor correlated with damping, and i is the imaginary unit. Similarly, the equivalent acoustic impedance at the interface of the cured adhesive composition and the cover glass may also be computed by successively applying the same equation above. Here, Z.sub.o is the characteristic acoustic impedance polymer adhesive, and Z.sub.L is equivalent acoustic impedance at the interface of glass-based substrate and polymer adhesive. In the ideal case the equivalent impedance Z(L) at the interface of display cover and polymer adhesive should match with the acoustic impedance of the finger skin.
[0371] In liquid and solid materials that are isotropic, the acoustic longitudinal waves have a velocity as described above, and an acoustic impedance Z given by the below equation:
Z=√{square root over (Eρ)}
where ρ is the density of the material in the absence of acoustic waves (as the wave affects the local density of the material). E is the Young's modulus of the material.
[0372] Typical values of these parameters of the finger and glass can be found in the literature. The attenuation coefficient α (db/m) can be converted to α (Neper/m) by dividing it by 8.686 to be used in the computation of the complex propagation constant γ. The attenuation of the polymer (α.sub.p) is correlated with the loss tangent tan(δ), frequency (f, in kHz), and the speed of an ultrasonic wave in the medium (v.sub.p):
[0373] In addition to the equivalent acoustic impedance at the interface, the power of the ultrasonic wave transmitting through the screen protector and reflecting back to the detector was also calculated. With the calculated equivalent acoustic impedance on the cover glass/cured adhesive composition interface, the power (P) returning back to the detector can simplified to only one reflection on the cover glass/cured adhesive composition interface, which is expressed as the equation below with the assumption that the initial power (P.sub.0) under the cover glass/cured adhesive composition interface is 1.
[0374] Z.sub.cg is the acoustic impedance of the cover glass. Z.sub.eq is the computed complex equivalent acoustic impedance on the cover glass/cured adhesive composition interface.
[0375] To identify a fingerprint, the ultrasonic FPS detects the power difference of the ultrasonic wave reflected from the interface in contact with skin (fingerprint ridges) and air (fingerprint valleys). Therefore, the signal of the ultrasonic FPS, ΔP, is expressed in the equation below as the difference in the ultrasonic power received by the sensor detector.
[0376] Z.sub.eg,f is the calculated complex equivalent acoustic impedance on the cover glass/cured adhesive composition interface with skin as the semi-infinite exterior medium (fingerprint ridges). Z.sub.eg,a is the calculated complex equivalent acoustic impedance on the cover glass/cured adhesive composition interface with air as the semi-infinite exterior medium (fingerprint valleys).
[0377] In embodiments, the difference in power ΔP received by the sensor detector is greater than or equal to 0.4 times the initial power P.sub.0. A difference in power in this range indicates the compatibility of the ultrasonic sensor with the screen protector.
[0378] In embodiments, the glass-based substrate 110 may be strengthened, creating a strengthened glass-based substrate. Methods of creating a strengthened glass-based substrate comprise chemical strengthening, thermal strengthening, or a combination of chemical strengthening and thermal strengthening. In embodiments, the glass-based substrate may not be strengthened (unstrengthened).
[0379] The strengthened glass-based substrate may be characterized by a surface compressive stress (CS), which may be defined as the maximum surface compressive stress inside the strengthened glass-based substrate as measured using a scattered light polarizing scope (SCALP) technique or a film stress measurement (FSM) technique known in the art. In embodiments, the strengthened glass-based substrate may have a CS greater than or equal to 150 MegaPascals (MPa), greater than or equal to 300 MPa, greater than or equal to 400 MPa, greater than or equal to 500 MPa, or even greater than or equal to 600 MPa. In embodiments, the strengthened glass-based substrate may have a CS less than or equal to 1000 MPa, less than or equal to 900 MPa, or even less than or equal to 800 MPa. In embodiments, the strengthened glass-based substrate may have a CS greater than or equal to 150 MPa and less than or equal to 1000 MPa, greater than or equal to 150 MPa and less than or equal to 900 MPa, greater than or equal to 150 MPa and less than or equal to 800 MPa, greater than or equal to 300 MPa and less than or equal to 1000 MPa, greater than or equal to 300 MPa and less than or equal to 900 MPa, greater than or equal to 300 MPa and less than or equal to 800 MPa, greater than or equal to 400 MPa and less than or equal to 1000 MPa, greater than or equal to 400 MPa and less than or equal to 900 MPa, greater than or equal to 400 MPa and less than or equal to 800 MPa, greater than or equal to 500 MPa and less than or equal to 1000 MPa, greater than or equal to 500 MPa and less than or equal to 900 MPa, greater than or equal to 500 MPa and less than or equal to 800 MPa, greater than or equal to 600 MPa and less than or equal to 1000 MPa, greater than or equal to 600 MPa and less than or equal to 900 MPa, or even greater than or equal to 600 MPa and less than or equal to 800 MPa, or any and all subranges formed from any of these endpoints.
[0380] The strengthened glass-based substrate may be characterized by a central tension (CT), which may be defined as the tension at the half thickness of the glass-based substrate as measured using a scattered light polarizing scope (SCALP) technique or a film stress measurement (FSM) technique known in the art. In embodiments, the strengthened glass-based substrate may have a CT greater than or equal to 1 MPa, greater than or equal to 5 MPa, greater than or equal to 10 MPa, greater than or equal to 15 MPa, greater than or equal to 20 MPa, or even greater than or equal to 25 MPa. In embodiments, the strengthened glass-based substrate may have a CT less than or equal to 120 MPa, less than or equal to 100 MPa, less than or equal to 90 MPa, or even less than or equal to 80 MPa. In embodiments, the strengthened glass-based substrate may have a CT greater than or equal to 1 MPa and less than or equal to 120 MPa, greater than or equal to 1 MPa and less than or equal to 100 MPa, greater than or equal to 1 MPa and less than or equal to 90 MPa, greater than or equal to 1 MPa and less than or equal to 80 MPa, greater than or equal to 5 MPa and less than or equal to 120 MPa, greater than or equal to 5 MPa and less than or equal to 100 MPa, greater than or equal to 5 MPa and less than or equal to 90 MPa, greater than or equal to 5 MPa and less than or equal to 80 MPa, greater than or equal to 10 MPa and less than or equal to 120 MPa, greater than or equal to 10 MPa and less than or equal to 100 MPa, greater than or equal to 10 MPa and less than or equal to 90 MPa, greater than or equal to 10 MPa and less than or equal to 80 MPa, greater than or equal to 15 MPa and less than or equal to 120 MPa, greater than or equal to 15 MPa and less than or equal to 100 MPa, greater than or equal to 15 MPa and less than or equal to 90 MPa, greater than or equal to 15 MPa and less than or equal to 80 MPa, greater than or equal to 20 MPa and less than or equal to 120 MPa, greater than or equal to 20 MPa and less than or equal to 100 MPa, greater than or equal to 20 MPa and less than or equal to 90 MPa, greater than or equal to 20 MPa and less than or equal to 80 MPa, greater than or equal to 25 MPa and less than or equal to 120 MPa, greater than or equal to 25 MPa and less than or equal to 100 MPa, greater than or equal to 25 MPa and less than or equal to 90 MPa, or even greater than or equal to 25 MPa and less than or equal to 80 MPa, or any and all subranges formed from any of these endpoints.
[0381] The strengthened glass-based substrate may be characterized by a depth of compression (DOC), which may be defined as the depth from the surface to which a surface compressive stress region extends. Stated differently the DOC is the depth where the stress transitions from compressive to tensile. The DOC of the glass-based substrate is measured using a scattered light polariscope (SCALP) technique or a film stress measurement (FSM) technique known in the art. In embodiments, the strengthened glass-based substrate has a DOC greater than or equal to 3 μm, greater than or equal to 5 μm, or even greater than or equal to 10 μm. In embodiments, the strengthened glass-based substrate has a DOC less than or equal to 50 μm, less than or equal to 25 μm, or even less than or equal to 15 μm. In embodiments, the strengthened glass-based substrate has a DOC greater than or equal to 3 μm and less than or equal to 50 μm, greater than or equal to 3 μm and less than or equal to 25 μm, greater than or equal to 3 μm and less than or equal to 15 μm, greater than or equal to 5 μm and less than or equal to 50 μm, greater than or equal to 5 μm and less than or equal to 25 μm, greater than or equal to 5 μm and less than or equal to 15 μm, greater than or equal to 10 μm and less than or equal to 50 μm, greater than or equal to 10 μm and less than or equal to 25 μm, or even greater than or equal to 10 μm and less than or equal to 15 μm, or any and all sub-ranges formed from any of these endpoints.
[0382] Chemical strengthening comprises contacting a glass-based substrate, which may or may not already be thermally strengthened, with an ion exchange medium to exchange ions in the glass-based substrate with those in the ion exchange medium. This process may be referred to as “ion exchange” because ions at or near the surface of the glass-based substrate are replaced by (i.e., exchanged with) ions of the ion exchange medium. In embodiments, the ions exchanged out of the glass-based substrate may be monovalent alkali metal cations, for example Li.sup.+, Na.sup.+, K.sup.+, Rb.sup.+, and Cs.sup.+. In embodiments, the ions exchanged into the glass-based substrate may be alkali metal cations or other metal cations, for example Ag.sup.+ and Cu.sup.2+. In embodiments, the ion exchange medium may include any one or more of KNO.sub.3, NaNO.sub.3, LiNO.sub.3, and AgNO.sub.3. The ion exchange medium may be sprayed onto the surface of the glass-based substrate or the glass-based substrate may be submerged in an ion exchange bath, such as a molten salt bath. The molten salt bath or ionic salt solution may be at a temperature greater than or equal to 300° C., greater than or equal to 350° C., or even greater than or equal to 400° C. The molten salt bath may be at a temperature greater than or equal to 300° C. and less than or equal to 500° C., greater than or equal to 350° C. and less than or equal to 450° C., greater than or equal to 380° C. and less than or equal to 430° C., or even greater than or equal to 400° C. and less than or equal to 420° C., or any and all subranges formed from any of these endpoints. In embodiments, the ion exchange may extend for a period greater than or equal to 10 minutes, greater than or equal to 30 minutes, or greater than or equal to 1 hour. In embodiments, the ion exchange may extend for a period greater than or equal to 10 minutes and less than or equal to 48 hours, greater than or equal to 30 minutes and less than or equal to 24 hours, greater than or equal to 1 hour and less than or equal to 16 hours, greater than or equal to 2 hours and less than or equal to 12 hours, or even greater than or equal to 3 hours and less than or equal to 8 hours, or any and all subranges formed from any of these endpoints.
[0383] In embodiments, the Young's modulus (E) of the glass-based substrate may be greater than or equal to 40 GPa and less than or equal to 120 GPa, greater than or equal to 40 GPa and less than or equal to 100 GPa, greater than or equal to 40 GPa and less than or equal to 80 GPa, greater than or equal to 50 GPa and less than or equal to 120 GPa, greater than or equal to 50 GPa and less than or equal to 100 GPa, greater than or equal to 50 GPa and less than or equal to 80 GPa, greater than or equal to 60 GPa and less than or equal to 120 GPa, greater than or equal to 60 GPa and less than or equal to 100 GPa, or even greater than or equal to 60 GPa and less than or equal to 80 GPa, or any and all sub-ranges between these endpoints.
[0384] In embodiments, the glass-based substrates may have a Poisson's ratio (v) greater than or equal to 0.15 and less than or equal to 0.30, greater than or equal to 0.16 and less than or equal to 0.29, greater than or equal to 0.17 and less than or equal to 0.28, greater than or equal to 0.18 and less than or equal to 0.27, greater than or equal to 0.19 and less than or equal to 0.26, greater than or equal to 0.20 and less than or equal to 0.25, greater than or equal to 0.21 and less than or equal to 0.25, or even greater than or equal to 0.22 and less than or equal to 0.24, or any and all sub-ranges between these endpoints.
[0385] For the sake of simplicity, the cured adhesive composition 120 is generally referred to herein as a single layer. In embodiments, the cured adhesive composition 120 may include a plurality of layers, such as greater than or equal to 2 and less than or equal to 5 layers. The layers of the cured adhesive composition 120 may have different compositions and properties.
[0386] In embodiments, the cured adhesive composition 120 may have a thickness less than or equal to 500 μm, less than or equal to 450 μm, less than or equal to 400 μm, less than or equal to 350 μm, less than or equal to 300 μm, less than or equal to 250 μm, less than or equal to 200 μm, less than or equal to 150 μm, or even less than or equal to 125 μm. The cured adhesive composition 120 may have a higher thickness while still enabling the desired ultrasonic performance if the glass-based substrate 110 has a thickness that is approximately a multiple of the half wavelength of a wave in the glass-based substrate 110 at the operating frequency of the ultrasonic sensor 160, as described above.
[0387] The damping of the cured adhesive composition 120 may be characterized by the loss tangent tan(δ). In embodiments, the cured adhesive composition 120 may have a tan(δ) less than 1.0, less than or equal to 0.9, less than or equal to 0.8, less than or equal to 0.7, less than or equal to 0.6, less than or equal to 0.5, less than or equal to 0.4, less than or equal to 0.3, less than or equal to 0.2, or even less than or equal to 0.1 as measured at room temperature (20° C.) and the operating frequency of the ultrasonic sensor 160. In general, a lower tan(δ) value indicates improved compatibility with an ultrasonic sensor 160.
[0388] The cured adhesive composition 120 may be characterized by an acoustic attenuation coefficient. In embodiments, the cured adhesive composition 120 may have an acoustic attenuation coefficient α less than 100000 db/m, less than 90000 db/m, less than 80000 db/m, less than 70000 db/m, less than 60000 db/m, less than 50000 db/m, less than 40000 db/m, less than 30000 db/m, or even less than 26000 db/m as measured at 20° C. and the operating frequency of the ultrasonic sensor 160.
[0389] The cured adhesive composition 120 may be characterized by the tensile storage modulus. In embodiments, the cured adhesive composition 120 may have a tensile storage modulus E′ greater than or equal to 10 MPa, greater than or equal to 50 MPa, greater than or equal to 100 MPa, greater than or equal to 150 MPa, greater than or equal to 200 MPa, greater than or equal to 250 MPa, greater than or equal to 300 Pa, greater than or equal to 350 Pa, greater than or equal to 400 MPa, greater than or equal to 450 MPa, greater than or equal to 500 MPa, greater than or equal to 550 MPa, greater than or equal to 600 MPa, greater than or equal to 650 MPa, greater than or equal to 700 MPa, greater than or equal to 750 MPa, greater than or equal to 800 MPa, greater than or equal to 850 MPa, greater than or equal to 900 MPa, greater than or equal to 950 MPa, or even greater than or equal to 1000 MPa as measured at room temperature (20° C.) and at the operating frequency of the ultrasonic sensor 160. In general, a cured adhesive composition with a higher E′ value at the operating frequency of the ultrasonic sensor 160 has a higher degree of compatibility with the ultrasonic sensor 160.
[0390] The cured adhesive composition 120 may be characterized by the tensile loss modulus. In embodiments, the cured adhesive composition 120 may have a tensile loss modulus E″ less than or equal to 10.sup.9 MPa, less than or equal to 10.sup.8.5 MPa, less than or equal to 10.sup.8 MPa, or even less than or equal to 10.sup.7.5 MPa at room temperature (20° C.) and the operating frequency of the ultrasonic sensor 160.
[0391] The cured adhesive composition may have optical properties that do not degrade the optical performance of the device to which the screen protector is applied. In embodiments, the cured adhesive composition may have a transmission greater than or equal to 70%, greater than or equal to 75%, greater than or equal to 80%, greater than or equal to 85%, or even greater than or equal to 90% as measured at a thickness of 0.2 mm. In embodiments, the cured adhesive composition has a transmission haze less than or equal to 20%, less than or equal to 15%, less than or equal to 10%, less than or equal to 5%, or even less than or equal to 2% as measured at a thickness of 0.2 mm. In embodiments, the cured adhesive composition has a clarity greater than or equal to 80%, such as greater than or equal to 85%, greater than or equal to 90%, or even greater than or equal to 95% as measured at a thickness of 0.2 mm. In embodiments, the cured adhesive composition is optically clear such that the cured adhesive composition has a visible light transmission greater than 70%, a transmission haze less than 20%, and a clarity greater than 80% as measured at a thickness of 0.2 mm.
[0392] The cured adhesive composition after photobleaching may have optical properties that do not degrade the optical performance of the device to which the screen protector is applied. The cured adhesive composition in its as-applied state may not have these optical properties. The cured adhesive composition state after photobleaching may be defined by irradiating with a visible light source (e.g. 5000 K LED light) of illumination >1000 lux for more than 10 min, more than 30 min, more than 4 h, more than 24 h, or more. In its cured state after photobleaching, the cured adhesive composition has a transmission of greater than or equal to 85%, greater than or equal to 90%, greater than or equal to 95%, or more; the cured adhesive composition has a haze of less than or equal to 10%, less than or equal to 5%, less than or equal to 2%, or less; the cured adhesive composition has a clarity of greater than or equal to 90%, greater than or equal to 95%, greater than or equal to 98%, or more.
[0393] The optical properties of the cured adhesive composition may be characterized with reference to a specific curing treatment. In embodiments, the cured adhesive composition obtained after irradiating an uncured adhesive composition with a visible light source for a period of 24 hours may have a transmission greater than or equal to 70%, greater than or equal to 75%, greater than or equal to 80%, greater than or equal to 85%, or even greater than or equal to 90%.
[0394] Referring now to
[0395] The adhesive belt 270 allows the glass-based substrate 210 to be adhered to a mounting surface 230 of the cover glass 240 of the electronic device before the cured adhesive composition 220 is cured. The adhesive belt 270 contains the uncured adhesive composition in the desired area of the screen protector 200, preventing leakage and/or the contamination of unintended portions of the electronic device with the uncured adhesive composition. The adhesive belt 270 also controls the thickness of the cured adhesive composition 220, as the thickness of the adhesive belt 270 is selected to produce a desired separation between the lower surface of the glass-based substrate 210 and the mounting surface 230 of the electronic device. The separation produced by the thickness of the adhesive belt 270 defines the thickness of the cured adhesive composition 220.
[0396] The adhesive belt 270 is located at and adhered to the periphery of the glass-based substrate 210 or, alternatively to an anti-splinter layer 271 of the glass-based substrate 210. The adhesive belt 270 includes a first major surface 272, a second major surface 274, a distal edge 276 extending between the first major surface 272 and the second major surface 274, and a proximal edge 278 extending between the first major surface 272 and the second major surface 274. An edge portion of the cured adhesive composition 220 is in contact with the proximal edge 278 of the adhesive belt 270. The first major surface 272 of the adhesive belt 270 is adhered to the glass-based substrate 210 and the second major surface 274 is adhered to the mounting surface 230. The cured adhesive composition 220 is contained between the glass-based substrate 210 and the mounting surface 230 by the adhesive belt 270.
[0397] The adhesive belt 270 may comprise one or more materials, such as synthetic polymers and natural materials. Embodiments of natural materials may comprise animal glue, casein glue, blood albumen glue, starch, dextrin agar, mastic, or combinations thereof. Embodiments of suitable polymers may comprise, without limitation, copolymers such as di-block copolymers, co-block copolymers, etc. and blends thereof: thermoplastics comprising polystyrene (PS), polycarbonate (PC), polyesters comprising poly(ethylene terephthalate) (PET), polyolefins comprising polyethylene (PE), polyvinylchloride (PVC), acrylic polymers comprising poly(methyl methacrylate) (PMMA), thermoplastic urethanes (TPU), polyetherimide (PEI), epoxies, silicones comprising polydimethylsiloxane (PDMS), or combinations thereof. In embodiments, the adhesive belt 270 may include at least one of silicone, acrylic, polyurethane, epoxy, cyanoacrylate, and poly(ethylene terephthalate). The adhesive belt 270 may be different than the cured adhesive composition 220, for example the adhesive belt 270 may have a different composition than the cured adhesive composition 220. In embodiments, the adhesive belt 270 may include a plurality of layers, where the layers may have the same or different compositions. In other embodiments, the adhesive belt 270 may be a single layer.
[0398] In embodiments, the thickness of the adhesive belt 270 may be greater than or equal to 5 μm, greater than or equal to 10 μm, greater than or equal to 20 μm, greater than or equal to 30 μm, greater than or equal to 40 μm, greater than or equal to 50 μm, greater than or equal to 60 μm, greater than or equal to 70 μm, greater than or equal to 80 μm, greater than or equal to 90 μm, or even greater than or equal to 100 μm. In embodiments, the thickness of the adhesive belt 270 may be less than or equal to 500 μm, less than or equal to 450 μm, less than or equal to 400 μm, less than or equal to 350 μm, less than or equal to 300 μm, less than or equal to 250 μm, less than or equal to 200 μm, or even less than or equal to 150 μm. In embodiments, the thickness of the adhesive belt 270 may be greater than or equal to 5 μm and less than or equal to 500 μm, greater than or equal to 20 μm and less than or equal to 450 μm, greater than or equal to 30 μm and less than or equal to 400 μm, greater than or equal to 50 μm and less than or equal to 350 μm, greater than or equal to 60 μm and less than or equal to 300 μm, greater than or equal to 70 μm and less than or equal to 250 μm, greater than or equal to 80 μm and less than or equal to 200 μm, or even greater than or equal to 90 μm and less than or equal to 150 μm, or any and all subranges formed between these endpoints.
[0399] In embodiments, the width of the adhesive belt 270 may greater than or equal to 0.1 mm, greater than or equal to 0.2 mm, greater than or equal to 0.5 mm, greater than or equal to 1 mm, or even greater than or equal to 2 mm. In embodiments, the width of the adhesive belt 270 is less than or equal to 30 mm, less than or equal to 20 mm, less than or equal to 10 mm, or even less than or equal to 5 mm. In embodiments, the width of the adhesive belt 270 may be greater than or equal to 0.1 mm and less than or equal to 30 mm, greater than or equal to 0.1 mm and less than 20 mm, greater than or equal to 0.1 mm and less than or equal to 10 mm, greater than or equal to 0.1 mm and less than or equal to 5 mm, greater than or equal to 0.2 mm and less than or equal to 30 mm, greater than or equal to 0.2 mm and less than 20 mm, greater than or equal to 0.2 mm and less than or equal to 10 mm, greater than or equal to 0.2 mm and less than or equal to 5 mm, greater than or equal to 0.5 mm and less than or equal to 30 mm, greater than or equal to 0.5 mm and less than 20 mm, greater than or equal to 0.5 mm and less than or equal to 10 mm, greater than or equal to 0.5 mm and less than or equal to 5 mm, greater than or equal to 1 mm and less than or equal to 30 mm, greater than or equal to 1 mm and less than 20 mm, greater than or equal to 1 mm and less than or equal to 10 mm, greater than or equal to 1 mm and less than or equal to 5 mm, greater than or equal to 2 mm and less than or equal to 30 mm, greater than or equal to 2 mm and less than 20 mm, greater than or equal to 2 mm and less than or equal to 10 mm, or even greater than or equal to 2 mm and less than or equal to 5 mm, or any and all sub-ranges formed from any of these endpoints.
[0400] The distal edge 276 of the adhesive belt 270 may be located a distance from the edge of the glass-based substrate 210 in a direction perpendicular to the thickness direction of the glass-based substrate 210. In embodiments, the distance between the distal edge 276 of the adhesive belt 270 and the edge of the glass-based substrate 210 may be greater than or equal to 100 nm and less than or equal to 1 mm, greater than or equal to 1 μm and less than or equal to 900 μm, greater than or equal to 50 μm and less than or equal to 800 μm, greater than or equal to 100 μm and less than or equal to 700 μm, greater than or equal to 200 μm and less than or equal to 600 μm, or even greater than or equal to 300 μm and less than or equal to 500 μm, or any and all sub-ranges formed between these endpoints.
[0401] Referring now to
[0402] In embodiments, the channel may have a width extending parallel to an edge of the adhesive belt 270. The width of the channel may be greater than or equal to 0.005 mm and less than or equal to 5 cm, greater than or equal to 0.01 mm and less than or equal to 4 cm, greater than or equal to 0.1 mm and less than or equal to 3 cm, greater than or equal to 0.5 mm and less than or equal to 2 cm, greater than or equal to 1 mm and less than or equal to 1 cm, greater than or equal to 2 mm and less than or equal to 9 mm, greater than or equal to 3 mm and less than or equal to 8 mm, greater than or equal to 4 mm and less than or equal to 7 mm, or even greater than or equal to 5 mm and less than or equal to 6 mm, or any and all sub-ranges formed between these endpoints.
[0403] The arrangement of channels in the adhesive belt 270 may be according to any of the embodiments illustrated in
[0404] The channels 280 in the adhesive belt 270 may be formed by any appropriate method. In embodiments, the channels 280 may be formed by die cutting, laser cutting, digital knife cutting, or water cutting. The channels 280 may also be formed by laminating pieces of the adhesive belt 270 to the glass-based substrate 210 separately, such that gaps are formed between the pieces to form the channels 280. The channels 280 may also be formed by printing a liquid adhesive ink on the desired location with the target thickness followed by a curing process, such that the channels 280 are formed by controlling the location of printing.
[0405] The strength of adhesion of the adhesive belt 270 to the glass-based substrate 210 and the mounting surface 230 may be selected to ensure that the screen protector 200 remains adhered to the mounting surface 230 in normal use and may be removed without excessive difficulty when desired. If the peel force is too low, the adhesive belt 270 may be dislodged from the mounting surface 230 during normal usage and the uncured adhesive composition may leak before it is cured. When the peel force is too high, it may not be possible to remove the adhesive belt 270 from the mounting surface 230 without damaging the mounting surface 230. The strength of adhesion of the adhesive belt 270 may be characterized by the peel force. In embodiments, the peel force on the surface of the adhesive belt 270 adhered to the glass-based substrate 210 may be different than the peel force on the surface of the adhesive belt 270 adhered to the mounting surface 230. In embodiments, the surface of the adhesive belt 270 adhered to the glass-based substrate 210 may have a peel force on glass greater than or equal to 500 gf/inch and less than or equal to 5000 gf/inch, greater than or equal to 500 gf/inch and less than or equal to 2500 gf/inch, greater than or equal to 1000 gf/inch and less than or equal to 2000 gf/inch, greater than or equal to 100 gf/inch and less than or equal to 4000 gf/inch, greater than or equal to 1000 gf/inch and less than or equal to 4000 gf/inch, or even greater than or equal to 2000 gf/inch and less than or equal to 4000 gf/inch, or any and all sub-ranges formed between these endpoints. In embodiments, the surface of the adhesive belt 270 adhered to the mounting surface 230 may have a peel force on glass greater than or equal to 20 gf/inch and less than or equal to 5000 gf/inch, greater than or equal to 30 gf/inch and less than or equal to 4500 gf/inch, greater than or equal to 40 gf/inch and less than or equal to 4000 gf/inch, greater than or equal to 50 gf/inch and less than or equal to 3500 gf/inch, greater than or equal to 100 gf/inch and less than or equal to 3000 gf/inch, greater than or equal to 500 gf/inch and less than or equal to 2500 gf/inch, greater than or equal to 1000 gf/inch and less than or equal to 2000 gf/inch, greater than or equal to 100 gf/inch and less than or equal to 4000 gf/inch, greater than or equal to 1000 gf/inch and less than or equal to 4000 gf/inch, or even greater than or equal to 2000 gf/inch and less than or equal to 4000 gf/inch, or any and all sub-ranges formed between these endpoints.
[0406] An exemplary device to which the screen protectors described herein may be applied is shown in
[0407] Use of application fixtures described herein allow for screen protectors to be applied quickly, easily, and successfully by consumers who may have no experience with installing screen protectors. Correct installation of screen protectors onto handheld electronic devices is a critical component of the success of the screen protector functionality.
[0408] Referring now to
[0409] Referring now to
[0410] The application fixture 450 includes a rectangular frame 452 having a pair of length sides 454 and a pair of width sides 456. The pair of length sides 454 are generally perpendicular to the pair of width sides 456. A plurality of tabs 458 extend from one of the pair of width sides 456. At least one groove 460 is included in the other of the pair of width sides 456. A wedge slider 462 is insertable into the at least one groove 460. As shown, the at least one groove 460 may comprise two grooves and the wedge slider 462 may comprise a double wedge slider insertable into the two grooves. The application fixture 450 may further include at least one level 464 positioned in one of one at least one of the pair of length sides 454 and pair of width sides 456. The application fixture 450 may further include an applicator arm 470. The applicator arm 470 extends between and is connectable to the pair of width sides 456. The applicator arm 470 includes an opening 476 configured to hold an adhesive container 478 therein. The application fixture 450 may further include a leveling mat 480.
[0411] During application of a screen protector to an electronic device, an electronic device is placed on the leveling mat 480 and the levelness of the electronic device is determined and adjusted as necessary. Referring now to
[0412] In embodiments, the uncured adhesive composition described herein may be applied without the use of an application kit such as those described herein. In embodiments, the uncured adhesive composition described herein may be applied using a different application kit than the application kits described herein.
[0413] In embodiments, a screen protector application kit includes a glass-based substrate 110 (
[0414] In embodiments, a screen protector application kit includes a glass-based substrate 110 (
EXAMPLES
[0415] Embodiments will be further clarified by the following examples. It should be understood that these examples are not limiting to the embodiments described above.
Example 1—The Effects of Thickness and Properties of Cured Adhesive Compositions on Ultrasonic Sensor Functionality
[0416] The effect of the thickness and properties of a cured LOCA on the performance of ultrasonic sensors was tested. Samples were prepared by laminating optically clear adhesives of different thicknesses on glass substrates. The adhesive composition materials are reported in Table I. The adhesive compositions were deliberately chosen due to their differences in rheological properties
TABLE-US-00001 TABLE I Adhesive Composition Description 1 1,6-Hexanediol diacrylate (HDDA) Irgacure 819 1 wt % photoinitiator photoinitiator 2 Isobornyl acrylate (IBOA) Irgacure 819 1 wt % photoinitiator photoinitiator 3 1,6-Hexanediol diacrylate (HDDA) NOA89 Mercapto-ester photoinitiator 4 IBOA 36 wt % Commercially HDDA 13 wt % available acrylate Bisoflex 23 wt% Hydrocarbon acrylate 11 wt % photoinitiator 2 wt % 5 IBOA + additives TP2500 6 Acrylate based 821x
[0417] Adhesives 1 and 2 in Table I were acrylate monomers with commercially available photoinitiators. Adhesives 3-6 are commercially available materials.
[0418] The adhesive compositions were tested on commercially available Samsung S10 and S10+ devices, which include an under-display ultrasonic fingerprint sensor. Adhesives 1-5 were applied to the devices in a liquid state. Then, the screen protector glass was applied onto the Adhesives 1-5. The thickness of the liquid adhesive layers was controlled by four pieces of double-sided tape placed between the screen protector glass and the device cover glass to act as spacers. The liquid adhesive layers were then cured by irradiation with an ultraviolet (UV) lamp. Adhesive 6 was purchased as a solid film and laminated on the glass by a laminator. The glasses used in the tests were alkali aluminosilicate glasses, and the properties of the glasses are reported in Table II. The glasses were tested in both chemically strengthened (with a stress profile) and in non-strengthened form. The different properties of the glasses and the presence of a stress profile did not produce a significant difference in the performance of the FPS response. The thicknesses of the glasses ranged from 100 μm to 500 μm, beyond which the aesthetics and touch sensitivity of the screen protector were degraded. The glass was cleaned by acetone and the film application/lamination was free of air bubbles.
TABLE-US-00002 TABLE II Young's Ultrasonic Ultrasonic Half Density modulus Poisson's velocity wavelength wavelength Glass (g/cm.sup.3) (GPa) ratio (m/s) (μm) (μm) A 2.39 69.3 0.22 5753.6 479.5 239.8 B 2.43 76.7 0.21 5960.8 496.7 248.4 C 2.4 77 0.21 6009.6 500.8 250.4
[0419] The results of FPS performance tests of screen protectors having various glass and polymer adhesive thickness combinations are presented in
[0420]
[0421] As shown in
[0422] The calculated results for the ultrasonic velocity, ultrasonic wavelength, and half wavelength for the 12 MHz operating frequency of the tested FPS in the glass compositions are presented in Table II. As discussed above, a resonance at multiples of the half wavelength of the ultrasonic wave in the glass substrate increases the performance of the FPS. Accordingly, as shown in
[0423] Different adhesive materials exhibit significantly different responses to the ultrasonic FPS. As shown in
[0424] The rheological properties of the cured adhesive compositions were measured, as shown in
[0425] Since the polymer rheology is a function of frequency, the temperature sweep tests were also conducted for each cured adhesive composition to acquire E′, E″, and tan(δ) at ultrasonic frequencies. The frequency sweeps were performed from 0.1-100 Hz and a temperature range of 0-60° C. Rheology curves were then produced by using the principle of time-temperature superposition. A reference temperature close to T.sub.g was assigned to each cured adhesive composition. The frequency sweep data at each temperature was then shifted horizontally along the x-axis by applying a multiplication factor to the measured frequency to produce a master curve based on a reduced frequency in Hz. After the master curve was constructed, the entirety of the master curve was shifted to a new reference temperature of 20° C. (room temperature) using the WLF (William, Landel, and Ferry) equation. The reduced frequencies of the original master curve were then transferred to a new set of frequencies at the new reference temperature of 20° C. by shifting factors. These new master curves of the adhesive materials are shown in
TABLE-US-00003 TABLE III E′ E″ E′ E″ Max T.sub.g 1 Hz 1 Hz Tan(δ) 12 MHz 12 MHz Tan(δ) Thickness Adhesive (° C.) (MPa) (MPa) 1 Hz (MPa) (MPa) 12 MHz (μm) 1 90 1270 68.46 0.053 2120 83.5 0.039 350 2 70 1750 61.3 0.031 2000 39.2 0.025 300 3 12 7.6 3.12 0.408 603.7 21.5 0.037 200 4 −22 0.17 0.065 0.371 355.6 123.1 0.348 150 5 −51 0.59 0.27 0.457 30.3 11.0 0.386 100 6 4 0.88 0.89 1.015 788.3 179.8 0.229 125
[0426] The cured adhesive compositions tend to behave as stiff materials at high frequencies, as indicated by large E′ values (30-2200 MPa). The FPS performance is dependent on both E′ and tan(δ) at 20° C. at the operating frequency of 12 MHz. Remarkably, Adhesives 1 and 3 have the same (within the tolerance of rheology measurement) tan(δ) at 20° C. and 12 MHz. The better FPS performance of Adhesive 1 in comparison to Adhesive 3 can be attributed to the larger E′ of Adhesive 1. The acoustic impedance of Adhesive 1 is larger with a larger E′, leading to a smaller difference in acoustic impedance between the adhesive and glass substrate.
[0427] The larger acoustic impedance of Adhesive 1 produces less reflection at the adhesive-glass substrate interface and more ultrasonic transmission. Moreover, Adhesive 2 has even an smaller tan(δ) than Adhesives 1 and 3. E′ of Adhesive 2 is slightly smaller than Adhesive 1 and much larger than Adhesive 3. Therefore, the FPS performance of Adhesive 2 is slightly worse than Adhesive 1, but still much better than Adhesive 3. In comparison, Adhesive 4, 5, and 6 have large tan(δ) (>0.2) at 20° C. and the operating frequency of 12 MHz, indicating large damping of ultrasonic wave. Hence, the FPS functionalities of Adhesive 4, 5, 6 are not desirable compared to Adhesive 1, 2, 3, even though Adhesive 6 has similar E′ value as Adhesive 3. Therefore, for robust FPS performance, a glass screen protector should have an adhesive film having a thickness of 300 μm or less, with E′ greater than 300 MPa and tan(δ) less than 0.2 at room temperature and the operation frequency (20° C., 12 MHz), or even with E′ greater than 600 MPa and tan(δ) less than 0.05 (Adhesive 3 in Table III) at room temperature and operating frequency (20° C., 12 MHz). Based on the discussion above, generally, an adhesive material with a large E′ and a small tan(δ) at 20° C. and the operating frequency is preferred for FPS performance.
[0428] The material properties used in computational calculations are listed in Table IV.
TABLE-US-00004 TABLE IV ρ α υ.sub.p Z Material (g/ca.sup.me) (dB/m) (m/s) (Pa.s/m.sup.3) Skin 1.15 920 1730 1.99 × 10.sup.6 Glass A 2.39 16 5754 13.7 × 10.sup.6 Glass C 2.4 16 6010 14.4 × 10.sup.6 Adhesive 3 1.2 8600 2700 3.0 × 10.sup.6 High Damping 1.2 25000 2700 3.0 × 10.sup.6 Adhesive
[0429] Utilizing the material properties in Table IV, the calculated equivalent real acoustic impedance at the interface of the adhesive and the device cover are shown in
[0430] As shown in
[0431]
[0432]
Example 2—Addition of Visible-Light Photoinitiator
[0433] Table V lists visible-light photoinitiators used in experimental tests and their properties. The visible-light photoinitiators in Table V are commercially available as Irgacure 819, Irgacure 784, and H-Nu 740 MP and the absorption peaks reported in Table V were reported by the vendor. The experimental tests were performed with these visible-light photoinitiators dissolved in multiple acrylate monomers and commercially available liquid optically clear adhesives (LOCA) that cannot be cured by visible light, as reported in Table VI. The cure mechanism reported in Table VI is for the compositions prior to the addition of visible-light photoinitiators described herein. For the sake of simplicity, the performance of isobornyl acrylate (IBOA) monomer will primarily be described.
TABLE-US-00005 TABLE V Absorption Peaks in Photo- methanol initiator Chemical Identity Appearance (nm) Irgacure Phosphine oxide, phenyl bis (2,4,6- Light 295, 370 819 trimethyl benzoyl) Yellow Irgacure Bis (eta 5-2,4-cyclopentadien-1-yl) Orange 398, 470 784 Bis [2,6-difluoro-3-(1H-pyrrol-1-yl) phenyl]titanium H-Nu 1-butyl-2-[5-(1-butyl-1,3-dihydro-3, Blue 646 640MP 3-dimethyl-2H-indol-2-ylidene)-1, 3-pentadien-1-yl]-3,3-dimethyl-3H- indolium salt
TABLE-US-00006 TABLE VI Viscosity Cure Chemical composition (cps) mechanism IBOA (Isobornyl acrylate) monomer 6-10 Not curable HDDA (1,6-Hexanediol diacrylate) monomer 9 Not curable HDDA; Mercapto-ester; UV photoinitiator 20 UV cure IBOA (36%) + HDDA (13%) + Bisoflex 10-20 UV cure (23%) + hydrocarbon acrylate (11%) + UV photoinitiator (2%) Urethane related resin based. Mercapto ester 1 250 UV cure/ (30-50%); Mercapto ester 2 (35-60%); heat cure Benzophenone (0.1-3%) IBOA + UV photoinitiators + silica particles + 2500 UV cure other additives
[0434] To demonstrate the polymerization by visible light, IBOA was mixed with 0.01-1.0 wt % and 0.5 wt % of one or more photoinitiators listed in Table V and applied onto a glass-based cover by pipette. The glass-based covers utilized in the tests were part of commercially available Samsung S8 and/or Samsung S8+ devices. The screen protector was applied onto the IBOA mixture and exposed to light from the display, a cold fluorescent light at 380-500 lux, a warm fluorescent light at 800-900 lux, a 5000 K LED light, and sunlight. The volume of the IBOA mixture was optimized as 1000 μL for the S8 and S8+ devices. A 100 μm thick adhesive film was laminated on the periphery of the screen protector glass to control the thickness of the IBOA layer for the purposes of the test. The IBOA was demonstrated to be curable by all visible light sources. The power intensity of the light sources and the fix times are listed in Table VII. Each of the mixtures in Table VII were formed with IBOA.
TABLE-US-00007 TABLE VII Fix Time Cold Warm 5000K Samsung S8 fluorescent fluorescent LED light Sunlight Display light light (4000-5000 UV lamp (8400-130000 Mixture (600 lux) (380 lux) (800-900 lux) lux) (13000 lux) lux) 1 wt % Not fixed in 30 min 15 min 22-25 min 5-7 s 5 s Irgacure 819 60 min 1 wt % 3.5 min 10-15 min 5-6 min 7 min Not fixed in Irgacure 784 4 min 0.5 wt % 6 min 20-25 min 10 min Irgacure784 0.1 wt % Not fixed in 18-20 min 5-6 min 16-17 min 5-7 s H-Nu640MP + 60 min 1 wt % Irgacure 819
[0435] As observed by the naked eye, immediately after the application of the mixtures, a screen protector with 1 wt % Irgacure 819 does not show noticeable color deviation or reduction of transmission; a screen protector with 0.5 wt % Irgacure 784 is slightly yellow; a screen protector with 1 wt % Irgacure 784 is obviously yellow; a screen protector with 0.1 wt % H-Nu640MP and 1 wt % Irgacure 819 is obviously blue. The yellow color of the screen protector with both 0.5 wt % and 1 wt % Irgacure 784 and the blue color of the screen protector with 0.1 wt % H-Nu640MP+1 wt % Irgacure 819 are not uniform, with a more yellow/blue appearance on the sides and a less yellow/blue appearance in the center. The photobleaching of Irgacure 784 reduces the yellow color over time. Under cold fluorescent light of 380-500 lux, the color of the screen protector with 0.5 wt % Irgacure 784 was unnoticeable after 6 hours. The color of the screen protector with 1 wt % Irgacure 784 was also more uniform and lighter after 6 hours, which is acceptable for the application of a screen protector. H-Nu640MP photoinitiator photobleaches much faster than Irgacure 784. The fading of the blue color is significant within 5 min of exposure under 200 lux of Samsung S8+ display light. The polymerization reaction of IBOA monomer does not have enough time to occur before the photobleaching of H-Nu640MP. Therefore, we added both 0.1 wt % H-Nu640MP and 1 wt % Irgacure 819 to cure IBOA monomer. As shown in Table VII, the addition of 0.1 wt % H-Nu640MP to IBOA with 1 wt % Irgacure 819 significantly accelerated the polymerization reaction and decreased the fix time of IBOA under visible light sources of cold and warm fluorescent light and 5000 K LED light, even though IBOA with only 0.1 wt % H-Nu640MP but without 1 wt % Irgacure 819 cannot be fixed due to the fast photobleaching of H-Nu640MP.
[0436] To quantify the optical effects of the visible-light photoinitiators, the spectra of a Samsung S8 and S8+ display without a screen protector and with a screen protector were measured. All the measurements were taken under the maximum brightness of the display, without auto brightness adjustment, without blue light filter, and with an integration time of 3 seconds. Each reported result was the average of 3 measured spectra. As shown in
[0437] In
[0438]
[0439]
[0440]
[0441] The spectra and the power of lighting sources used in testing were quantified.
[0442] The absorption spectra of Irgacure 784 and Irgacure 819 visible-light photoinitiators were measured with the cured IBOA films having different visible-light photoinitiator concentrations (0.05, 0.25, 0.50, 0.75, 1.00, and 1.25 wt %). To minimize photobleaching effects, the IBOA+Irgacure 784 solutions were cured under the warm fluorescent light (800-900 lux) and exposed for a fixed time of 30 min. IBOA+0.05 wt % Irgacure 784 cannot be cured by either fluorescent light or UV lamp within a reasonable time, and therefore is not reported in the results. The IBOA+Irgacure 819 solutions were cured under a UV lamp (1300 lux) for 4 min due to the long time required for curing under fluorescent light with Irgacure 819 concentrations lower than 1.00 wt %. The cured films were stored in a plastic bag covered by black tape to block ambient light until spectroscopic measurements could be performed.
[0443] Both transmission and reflection spectra were collected for each cured film. The transmission spectra and reflection spectra of Irgacure 784 and Irgacure 819 were characterized after minimal photobleaching. Then absorbance normalized by film thicknesses (A/l) and absorptivity were calculated from the transmission and reflection spectra.
[0444] In
[0445] In
[0446] The absorptivity of Irgacure 784 was calculated as described above and is shown in
[0447] Generally, the absorption spectra show that 0.25-1.25 wt % Irgacure 784 has a considerable absorption of the visible wavelengths of 380-530 nm. This absorption range may utilizes the 447 nm peak of an LED flashlight, the 437 nm peak of fluorescent light, and the 455 nm peak of the Samsung S8+ display light. Irgacure 784 thus enables curing under different visible light sources. However, IBOA+1 wt % Irgacure 784 cannot be fixed by the UV lamp as shown in Table III. Even though Irgacure 784 has a strong absorption in the peak wavelengths of 404 and 437 nm of the UV lamp (
[0448] In
[0449] In
[0450] The calculated absorptivity of Irgacure 819 is shown in
[0451] Based on the absorption spectra, the concentrations of Irgacure 819<1 wt % are not recommended for curing under visible light due to the lack of absorption in the wavelengths >380 nm. But, they can be cured by sunlight or a UV lamp with enough UV range. The concentrations of Irgacure 819≥1 wt % are recommended for screen protector applications cured under visible light because they have enough absorption of light with wavelengths <440 nm. Based on the light source spectra shown in
[0452] Due to the fast photobleaching of H-Nu640MP photoinitiator, the absorbance and absorptivity of H-Nu640MP cannot be measured by cured IBOA films with different H-Nu640MP concentrations. Instead, we filled solutions of H-Nu640MP dissolved in IBOA in cuvettes with a path length of 1 cm and measured the transmission spectra using a 5000 K LED light as the light source. The concentration of H-Nu640MP is diluted to 0.0005-0.005 wt %. The solutions do not contain Irgacure 819. A blank sample is pure IBOA filled in the cuvette with path length of 1 cm. In
[0453] The absorptivity of H-Nu640MIP was calculated at an exposure time of 0 min (within 10 s of exposure to 5000 K LED light, presented in
Example 3—Addition of Co-Initiators and Oxygen Inhibitors
[0454] Table VIII lists visible-light photoinitiators, co-initiators, and oxygen inhibitors used in experimental tests and their properties. Visible-light photoinitiators in Table VIII are commercially available as Irgacure 819 and Irgacure 784, and the absorption peaks reported in Table VIII were reported by the vendors. Two of the co-initiators in Table VIII are commercially available as DPI-PF.sub.6 and SpeedCure 938, and the absorption peaks reported in Table VIII were reported by the vendors. Table IX lists acrylate monomers and oligomers used in experimental tests and their properties. Table X lists LOCA formulations comprising IBOA and 1 wt % Irgacure 819, different co-initiators, oxygen inhibitors, co-monomers, and cross-linkers.
TABLE-US-00008 TABLE VIII UV/vis absorption peaks given by vendors Materials Chemical identity Appearance (nm) Irgacure 819 Phosphine oxide, phenyl bis (2,4,6- Light yellow 295, 370 in trimethyl benzoyl) powder methanol Irgacure 784 Bis (eta 5-2,4-cyclopentadien-1-yl) Bis Orange powder 398, 470 in [2,6-difluoro-3-(1H-pyrrol-1-yl) methanol phenyl]titanium DPS Diphenylsilane Transparent liquid TTMSS Tris(trimethylsilyl)silane Transparent liquid DPI-PF.sub.6 Diphenyliodonium hexafluorophosphate White powder 225 in CH.sub.2Cl.sub.2 SpeedCure Bis(4-t-butylphenyl)iodonium White powder 241 938 hexafluorophosphate DMAPDP 4-(dimethylamino)phenyl White powder diphenylphosphene TPn Triphenylphosphine White powder
TABLE-US-00009 TABLE IX Cure mechanism Viscosity (with visible light Materials Chemical composition (cps) photoinitiator) IBOA (monomer) IBOA (isobornyl acrylate) monomer 6-10 Radical Miramer M120 LA-C.sub.12,13 (lauryl acrylate) monomer 5-15 Radical Miramer M4004 PEOTA (pentaerythritol (EO).sub.n tetraacrylate) 120-200 Radical crosslinker TEGO Rad TR2200N (siliconepolyether acrylate) 700-2500 Radical 2200N monomer TEGO Rad 2500 TR2500 (polydimethylsiloxane acrylate) 150 Radical monomer TEGO Rad 2650 TR2650 (polysiloxane acrylate) monomer 300-600 Radical ParB66 PARALOID ™ B-66 100% resin, acrylic solid Radical copolymer resin
TABLE-US-00010 TABLE X DPS TTMSS DPI-PF.sub.6 DMAPDP TPn LA-C.sub.12,13 Sample (wt %) (wt %) (wt %) (wt %) (wt %) (wt %) 1 2 3 2 3 1 0.5 4 1 0.5 1 5 0.5-1 6 10 7 8 9 1 10 10 1 11 1 12 13 1 14 1 0.5 0.5 15 1 0.5 0.5 16 1 Observed PEOTA TR2200N ParB66 Fix time Shrinkage Sample (wt %) (wt %) (wt %) (min) (wt %) 1 17-23 6-8 2 9 0.5-2.1 3 14 2.8-4.0 4 2.7 0.7-2.2 5 4-6 1.6-1.9 6 16-17 5.1 7 10 9-15 2.9 8 1 15 4.3 9 6 1.6-1.8 10 10 4 1.8-2.1 11 1 6 1.1-1.3 12 1 17 2.6-3.3 13 1 6.5 1.9 14 2.5 3.0-3.2 1.1-1.8 15 4.5 2.9-3.1 0.7-1.8 16 10 3-4
[0455] To demonstrate polymerization by visible light, the LOCA formulations of Table X were placed by pipette onto an attenuated total reflection (ATR) window of a Fourier transform infrared (FTIR) spectrophotometer and covered with screen protector glass in the dark. As shown in
[0456] Further spectra were recorded at regular intervals while Samples 1 and 2 were exposed to visible light at 510-675 lux above the screen protector glass to initiate polymerization (shown as IBOA+819 cured and IBOA+819+TTMSS+DPI cured, respectively, in
[0457] As illustrated in Table X, Sample 1 (only IBOA and 1 wt % of Irgacure 819) had the longest fix time of 17-23 minutes. Sample 2 (addition of 2 wt % DPI PF.sub.6 and 3 wt % TTMSS) resulted in a decrease in fixing time of about 50% as compared to Sample 1. Sample 3 (addition of 0.5 wt % DPI PF.sub.6 and 1 wt % DPS) resulted in a decrease in fixing time of about 25% as compared to Sample 1. While not wishing to be bound by theory, it is believed that the accepted mechanism of action for this co-initiator system is as follows:
where D is the dye molecule (i.e., Irgacure 819), D* is the excited state of D when activated by light, DPI.sup.+ is the cation of the iodonium salt, PhI is phenyl iodide, Ph is a phenyl radical, PhH is phenyl hydride, R.sub.3SiH is the silane, R.sub.3Si is the silyl radical after donating a hydrogen atom, and R′OO. is the oxidized silyl radical. Analysis by FTIR showed that TTMSS acted as a hydrogen-atom-donor co-initiator during the LOCA polymerization, as indicated by the disappearance of its Si—H bond, which has a stretching vibration mode at 2052 cm.sup.−1 (
[0458] The addition of 1 wt % DMAPDP as exemplified in Samples 4, 5, 9-11, and 13 or 1 wt % TPn as exemplified in Sample 16 decreased the fixing time by approximately 75% as compared to Sample 1 (i.e., the fixing speed increased by a factor of about 4).
[0459] As exemplified, the addition of a co-initiator and an oxygen inhibitor decreased the fixing time of the uncured adhesive composition.
[0460] Note that the fixing times in Table X and
[0461]
where a.sub.0 is the area of the cover glass occupied by LOCA at time zero, which is generally the area of the screen protector glass when enough LOCA has been applied to the cover glass to spread all the way to the edges, and a.sub.t is the area of the cover glass occupied by LOCA at time t, typically measured in hours or days. Areal shrinkage is a good representation of the volume shrinkage of cured LOCA because the thickness of the LOCA layer between the screen protector glass and the cover glass is well controlled by controlling the volume of uncured LOCA applied and the area that the uncured LOCA spreads, which is the area of the screen protector glass.
[0462] Table X shows the final percentage areal shrinkage for samples that had cured at room temperature and 50% relative humidity for more than 14 days, at which point the shrinkage of cured IBOA appeared to plateau. To accelerate the shrinkage for easier measure, sister samples were exposed to 80° C. and 50% relative humidity in an environmental chamber.
[0463] As shown in Table X, the addition of a co-initiator system decreased the shrinkage of the cured LOCA. The addition of 2 wt % DPI PF.sub.6 and 3 wt % TTMSS of Sample 2 resulted in a decrease in shrinkage of about 80% as compared to Sample 1. The addition of 0.5 wt % DPI PF.sub.6+1 wt % DPS of Sample 3 resulted in a decrease in shrinkage of about 50% as compared to Sample 1. As shown in
[0464] As shown in Table X, the addition of 1 wt % DMAPDP (i.e., an oxygen inhibitor) of Sample 5 resulted in a decrease in shrinkage of about 75% as compared to Sample 1. Addition of 1 wt % DMAPDP to a formulation that also contained 0.5 wt % DPI PF.sub.6 and 1 wt % DPS as in Sample 4 results in a further decrease in shrinkage of 50-60% beyond that of a formulation with 0.5 wt % DPI PF.sub.6 and 1 wt % DPS alone as in Sample 3.
[0465] The addition of 1 wt % ParB66, a pre-cured acrylic co-oligomer, as in Sample 12 did not change the fixing time significantly, but the shrinkage decreased by about 60% compared to that of IBOA and 1 wt % Irgacure 819 alone as in Sample 1. Addition of ParB66 had no significant additional effect on fixing time or shrinkage, however, when added to formulations that contained co-initiators or oxygen inhibitors (see Table X).
[0466] To determine if cured LOCA formulations described herein left residue upon removal of the screen protector from the cover glass, samples were aged for 4 days in an environmental chamber at 80° C. and 50% relative humidity. Specifically, as shown in
TABLE-US-00011 TABLE XI Cover Glass Top Middle Bottom FIG. 70 Sample 1 Sample 7 Sample 10 FIG. 71 Sample 1 Sample 7 Sample 10 FIG. 72 Sample 1 Sample 8 Sample 11 FIG. 73 Sample 1 Sample 8 Sample 11
[0467] To quantify the degradation of the cover glass ETC layer after removal of the screen protector, the contact angles of both water (CA.sub.H.sub.
[0468] The top sections of
[0469] Various additives may prevent this visible residue for all but the most heavily degraded ETC layers, which had a CA.sub.HD<10° (
Example 4—Adhesive Belt
[0470] To demonstrate the effectiveness of the screen protector system, experimental tests were performed on commercially available mobile phones. The glass-substrates utilized in the examples have a thickness of 0.33 mm and included a two-layer anti-splinter film with a total thickness of 0.075 mm. The adhesive belt had a thickness of 0.10 mm and was in the form of a three-layer film applied as a belt near the periphery of the glass-based substrate. In examples containing channels in the adhesive belt, the channels were cut through the entire thickness of the adhesive belt and had a width of 10 mm. The liquid optically clear adhesive utilized to form the cured adhesive composition was isobornyl acrylate containing 1 wt % of commercially available visible-light photoinitiator Irgacure 819, and had a viscosity in the range of 7 to 10 cps.
[0471]
[0472]
[0473]
[0474]
[0475]
[0476] The volume of liquid adhesive applied, measured leakage (mass loss) of liquid adhesive, leakage perception, and thickness of the liquid adhesive for examples are reported in Table XII below. Examples 4B.sub.1 and 4B.sub.2 utilized the screen protector design of Example 4B. Leakage (mass loss) of liquid adhesive was determined by: measuring the gross mass (m.sub.1) of the screen protector glass, liquid adhesive, and device before application of the screen protector; measuring the gross mass (m.sub.2) of the device with the applied screen protector and liquid adhesive; and subtracting m.sub.1 from m.sub.2.
TABLE-US-00012 TABLE XII Adhesive Applied Leakage Leakage Thickness Example Volume (μL) (g) Perception (mm) 4A 0 — — — 4B.sub.1 500 −0.112 Minor 0.03 ± 0.03 4B.sub.2 1000 −0.491 Medium 0.05 ± 0.04 4C 1100 −0.031 Negligible 0.11 ± 0.02 4D 1100 −0.069 Minor 0.10 ± 0.01 4E 1100 −0.034 Minor 0.14 ± 0.04
[0477] As shown in Table XII, the leakage of adhesive composition is noticeable and possibly messy for users of a screen protector without an adhesive belt (Examples 4B1 and 4B2), especially when the amount of adhesive composition is more than required. In the case of these examples, the ideal volume of adhesive composition is calculated as about 500 μL, which is just enough to wet and spread the full area of the display (Example 4B.sub.1). Adding more adhesive composition (1000 μL) resulted in more leakage during the application (Example 4B.sub.2). Moreover, since there is no thickness control due to the lack of an adhesive belt, the thickness variation of the adhesive composition applied is +0.03-0.04 mm (Examples 4B.sub.1 and 4B.sub.2).
[0478] The leakage of the adhesive composition was effectively reduced by the use of an adhesive belt on the edges of the screen protector (Examples 4C and 4D). However, without air channels in the belt, air bubbles were confined by the belt and accumulated at the corners (Example 4C). The bubbles were effectively released by adding four air channels at the corners of the adhesive belt (Example 4D), which also provided better thickness control (±0.01 mm) with just minor leakage through the channels. The leakage of the adhesive composition is also well controlled when the central area gap is filled by capillary force with an opening on the adhesive belt (Example 4E). The thickness of the adhesive composition of Example 4E had a large variation due to the slow flow of the adhesive composition. The adhesive composition was filled from the top edge to the bottom edge of the screen protector, resulting in a second adhesive layer that was thicker at the top (˜0.18 mm) and thinner at the bottom (˜0.10 mm) after curing. Moreover, the adhesive composition around the opening could flow and cure under the belt due to the low adhesion of belt caused by the opening.
[0479] The above embodiments, and the features of those embodiments, are exemplary and can be provided alone or in any combination with any one or more features of other embodiments provided herein without departing from the scope of the disclosure.
[0480] It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the spirit and scope of the disclosure. Thus, it is intended that the present disclosure cover the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.