SYSTEM AND METHOD OF PRODUCING MONOCRYSTALLINE LAYERS ON A SUBSTRATE
20240150930 ยท 2024-05-09
Assignee
Inventors
Cpc classification
C30B23/06
CHEMISTRY; METALLURGY
International classification
Abstract
A system (100) for producing an epitaxial monocrystalline layer on a substrate (20) comprising: an inner container (30) defining a cavity (5) for accommodating a source material (10) and the substrate (20); an insulation container (50) arranged to accommodate the inner container (30) therein; an outer container (60) arranged to accommodate the insulation container (50) and the inner container (30) therein; and heating means (70) arranged outside the outer container (60) and configured to heat the cavity (5), wherein the inner container (30) comprises a support structure for supporting a solid monolithic source material (10) at a predetermined distance above the substrate (20) in the cavity (5) such that a growth surface of the substrate (20) is entirely exposed to the source material (10). A corresponding method is also disclosed.
Claims
1-14. (canceled)
15. A system for producing an epitaxial monocrystalline layer on a substrate comprising: an inner container defining a cavity for accommodating a source material and a substrate; an insulation container arranged to accommodate the inner container therein; an outer container arranged to accommodate the insulation container and the inner container therein; and heating means arranged outside the outer container and configured to heat the cavity, wherein the inner container comprises a support structure for supporting a solid monolithic source material at a predetermined distance above the substrate in the cavity such that a growth surface of the substrate is entirely exposed to the source material, wherein the support structure comprises one or more first leg members having a first height (H1) and arranged to support the source material along a peripheral edge thereof, and one or more second leg members having a second height (H2) and arranged to support the substrate, wherein the first height (H1) is greater than the second height (H2).
16. The system according to claim 15, further comprising at least one container support having a third height (H3) and being arranged to support the inner container within the insulation container.
17. The system according to claim 15, wherein the inner container, the insulation container and the outer container are cylindrical in shape, and the source material and/or the substrate are disk-shaped.
18. The system according to claim 17, wherein an inner diameter of the inner container is in the range 100-500 mm, preferably 150-300 mm.
19. The system according to claim 15, further comprising a heating body made of high-density graphite arranged on top of the inner container in the cavity.
20. The system according to claim 15, wherein the surface area of the source material is greater than or equal to the surface area of the substrate.
21. The system according to claim 15, wherein the inner container comprises an upper part with a lower wall section and a lower part with an upper wall section which are arranged to be joined together to form a sealing, leakproof connection.
22. The system according to claim 21, wherein a top portion of the upper part has a first thickness (T1), and a base portion of the lower part has a second thickness (T2), wherein the first thickness (T1) is greater than or equal to the second thickness (T2).
23. The system according to claim 21, wherein an inner diameter of the lower part is smaller than an inner diameter of the upper part, forming a ledge, wherein a ring-shaped member (1; 1) is arranged on the ledge.
24. The system according to claim 23, wherein the ring-shaped member (1; 1) comprises a plurality of inwardly extending radial protrusions for supporting the source material along a peripheral edge thereof.
25. The system according to claim 23, wherein the ring-shaped member (1; 1) is made of tantalum, niobium, tungsten, hafnium and/or rhenium.
26. The system according to claim 15, wherein the insulation container comprises a top part (50a), a middle part (50b) and a bottom part (50c), wherein the insulation container is made of an insulating rigid porous graphite and wherein a fiber direction of the top part (50a) and the bottom part (50c) is orthogonal to a center axis of the insulation container, and a fiber direction of the middle part (50b) is parallel to the center axis of the insulation container.
27. The system according to claim 15, wherein the heating means comprises radiofrequency coils which are movable along the outer container.
28. A method of producing an epitaxial monocrystalline layer on a substrate comprising: providing an inner container defining a cavity for accommodating a source material and a substrate; arranging the substrate in the cavity of the inner container; arranging a solid monolithic source material in the cavity of the inner container at a predetermined distance above the substrate such that a growth surface of the substrate is entirely exposed to the source material; arranging the inner container within an insulation container; arranging the insulation container and the inner container in an outer container; providing heating means outside the outer container to heat the cavity; evacuating (S101) the cavity to a predetermined low pressure; introducing (S102) an inert gas into the cavity; raising (S103) the temperature in the cavity to a predetermined growth temperature by the heating means; maintaining (S104) the predetermined growth temperature in the cavity until a predetermined thickness of the epitaxial monocrystalline layer on the substrate has been achieved; and cooling (S105) the substrate.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0032] The invention is now described, by way of example, with reference to the accompanying drawings, in which:
[0033]
[0034]
[0035]
[0036]
[0037]
[0038]
[0039]
[0040]
[0041]
[0042]
[0043]
DESCRIPTION OF EMBODIMENTS
[0044] In the following, a detailed description of a system for producing an epitaxial monocrystalline layer on a substrate according to the present disclosure is presented. In the drawing figures, like reference numerals designate identical or corresponding elements throughout the several figures. It will be appreciated that these figures are for illustration only and are not in any way restricting the scope of the invention.
[0045]
[0046] According to one embodiment the heating means 70 comprises an induction coil for radiofrequency heating. Said outer container 60 is in this example a quartz tube and said insulation container 50 and said inner container 30 are cylindrical and made of an insulating graphite foam and high-density graphite, respectively. The insulation container 50 and the inner container 30 may also be made of another suitable material which has the ability to withstand high temperatures and, when a radiofrequency induction coil is used as heating means 70, also facilitates coupling to said radiofrequency induction coil. The heating means 70 is used to heat the container and by this sublime the source material 10. The heating means 70 is movable in a vertical direction in order to adjust the temperature and thermal gradient in the inner container 30. The temperature gradient between the source material 10 and substrate 20 can also be altered by varying the properties of the inner container 30, such as the thicknesses of the upper part 31 and the lower part 32 as is known in the art. Additionally, there are pumps for evacuating the inner container (not shown), i.e. to provide a pressure between about 10-4 and 10-6 mbar.
[0047] The heating body 40 is made of high-density graphite. Furthermore, the heating body 40 may be coated. Together with the inner container 30, the heating body 40 couples with the electromagnetic field generated by the RF coils 70 to generate sufficient heat in the system. The shape of the heating body 40 is preferably a cylinder bulk shape; the thickness or height T3 of the heating body 40 is preferably adjusted in conjunction with the height of the inner container 30 to obtain a desired temperature distribution, as will be explained further below. The diameter of the heating body 40 is preferably 50-150% of the diameter of the inner container 30, more preferably 70-110%.
[0048]
[0049] With reference to the heating body 40 described above, the total height of the top portion 34 and the heating body 40, i.e. the sum of the first thickness T1 and third thickness T3, is larger than the height of the base portion 33, i.e. the second thickness T2. This is in order to facilitate a suitable vertical temperature gradient within the inner container 30, and also in order to improve temperature uniformity in a horizontal direction or a direction substantially orthogonal to the cylinder axis of said inner container 30 or a direction orthogonal to an epitaxial layer growth direction. In one example, T2=15 mm and the sum T1+T3=50 mm.
[0050] The vertical temperature gradient between the source material 10 and the substrate 20 is preferably 1-5? C./mm and the horizontal temperature gradient of the substrate 20 is preferably lower than 0.3? C./mm. It should be noted that the positive value of the vertical temperature gradient means that the temperature on the upper part 31 (the source material 10) side is higher than that of the lower part 32 (the substrate 20) side, while the positive value of the horizontal temperature gradient means that the center temperature of the substrate 20 is lower than that of the edge of substrate 20. Such uniform temperature distribution is important for the thickness and doping uniformity of the epitaxially grown monocrystalline layer.
[0051] Moreover, the inner container 30 preferably is provided with fastening means 35, such as a catch or threads, providing a sealing connection in order to make the container sufficiently leakproof and avoid losses of vapor species, particularly silicon, to such amounts that the stability of growth is disturbed. The lower part 32 of
[0052] The container supports 32a are made of a material able to withstand high temperatures, preferably high-density graphite or a metal with high melting point, like tantalum (Ta). The configuration of the container supports 32a is given in
[0053] In one embodiment, the inner diameter of the lower part 32 is smaller than the inner diameter of the upper part 31, thus forming a ledge 38 in the upper wall 37. As may be seen in
[0054]
[0055] The above-mentioned system design has a number of advantages. In particular, the system is designed such that a higher and more even heat distribution at the substrate and the source material is achieved. This is favorable as a higher temperature increases the growth rate, and a more even heat distribution improves the quality of the epitaxial layer. The geometry of the insulation container 50 and the inner container 30 contributes to establishing the desired temperature profiles which are necessary for obtaining growth conditions at which high-quality material can be attained. Although particular measures have been given as examples in relation to
[0056]
[0057]
[0058] As mentioned above, the source material 10 is to be arranged above the substrate 20 on the source support structure 4. To achieve this, the source material 10 is a solid monolithic plate, sufficiently rigid to enable the source material 10 to be supported along a peripheral edge thereof. In one embodiment, the source material 10 is a monolithic SiC plate to produce an epitaxial monocrystalline SiC layer on the substrate 20 through SSM. However, other source materials may also be used in conjunction with the system 100 and method of the present disclosure depending on the desired epitaxial layer to be produced, such as e.g., aluminum nitride (AlN).
[0059] Referring now to
[0060]
[0061] The positions of the source material 10 and the substate 20 in the inner container 30 as well as the relative distance between the source material 10 and the substate 20 are determined by the first height H1 of the source support 4 and the second height H2 of the substrate support 3. For example, if the total height of the cavity 5 of the inner container 30 is 20 mm, H1 is preferably 17 mm. The relative distance between the source material 10 and the substrate 20 in SSM is preferably set to be 1 mm, H2 is equivalent to the value of using H1 to subtract 1 mm and the thickness of the substrate 20. In other words, if the substrate 20 has thickness of 1 mm, H2 equals 15 mm.
[0062] The method will now be described with reference to a system design as described above, but the man skilled in the art knows that the design is only an example and that other designs can also be used as long as the desired growth conditions are achieved.
[0063]
[0064] When a desirably thick monocrystalline layer has been produced the heating is ramped down and the substrate is allowed to cool, this is referred to as the cooling phase S105. The pre-heating and the cooling phase can be optimized in order to decrease the production time.
[0065]
[0066]
[0067] Although the present disclosure has been described in detail in connection with the discussed embodiments, various modifications may be made by one of ordinary skill in the art within the scope of the appended claims without departing from the inventive idea of the present disclosure. Further, the method can be used to produce more than one layer in the same cavity as is readily realized by the man skilled in the art.
[0068] All the described alternative embodiments above or parts of an embodiment can be freely combined without departing from the inventive idea as long as the combination is not contradictory.