Method for manufacturing a substrate for a radiofrequency filter

Abstract

A method for manufacturing a substrate for a radiofrequency filter by joining a piezoelectric layer to a carrier substrate via an electrically insulating layer, wherein the method comprises depositing the electrically insulating layer by spin coating an oxide belonging to the family of SOGs (spin-on glasses) on the surface of the piezoelectric layer to be joined to the carrier substrate, followed by an anneal for densifying the electrically insulating layer before joining the piezoelectric layer to the carrier substrate via the electrically insulating layer.

Claims

1. A method for fabricating a substrate for a radiofrequency filter, comprising: depositing an electrically insulating layer by spin coating an oxide belonging to the family of spin-on glasses (SOGs) on a surface of a piezoelectric layer to be joined to a carrier substrate; annealing and densifying the electrically insulating layer after depositing the electrically insulating layer by spin coating on the surface of a piezoelectric layer; and after annealing and densifying the electrically insulating layer, joining the piezoelectric layer to the carrier substrate via the electrically insulating layer, wherein a thickness of the piezoelectric layer is greater than 10 ?m, the surface of the piezoelectric layer to be joined to the carrier substrate has a rough surface suitable for reflecting a radiofrequency wave, and the rough surface of the piezoelectric layer has a roughness of greater than 1 ?m.

2. The method of claim 1, wherein the rough surface of the piezoelectric layer has a roughness of greater than 3 ?m.

3. The method of claim 2, wherein the carrier substrate comprises silicon.

4. The method of claim 3, wherein the carrier substrate further comprises a trapping layer toward an interface to be joined with the piezoelectric layer.

5. The method of claim 4, wherein the piezoelectric layer comprises lithium niobate or lithium tantalate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Other features and advantages of the present disclosure will be better understood from reading the following detailed description with reference to the appended drawings in which:

(2) FIG. 1 illustrates a process for producing a substrate for a radiofrequency filter according to one embodiment of the disclosure; and

(3) FIG. 2 illustrates a process for producing a substrate for a radiofrequency filter according to another embodiment of the disclosure.

(4) To improve the readability of the figures, the various layers are not necessarily shown to scale.

DETAILED DESCRIPTION

(5) FIG. 1 schematically illustrates the process for producing a substrate for a radiofrequency filter according to one embodiment of the present disclosure. FIG. 1 illustrates a carrier substrate 100 to which a piezoelectric layer 200 is joined via an electrically insulating layer 300.

(6) The electrically insulating layer is generally chosen from the family of SOGs (spin-on glasses), which exhibit the property of being in the liquid state at ambient temperature but may be densified, and solidified, by means of a suitable heat treatment.

(7) This technique consists in rotating the substrate on which the electrically insulating layer 300 is to be deposited at a substantially constant and relatively high speed in order to spread the layer in the liquid state uniformly over the entire surface of the substrate by centrifugal force. To this end, the substrate is typically placed and held by vacuum chuck on a turntable.

(8) A person skilled in the art is capable of determining the operating conditions, such as the volume deposited on the surface of the substrate, the speed of rotation of the substrate, and the minimum deposition time according to the desired thickness for the adhesive layer.

(9) The thickness of the electrically insulating layer 300 is typically between 2 ?m and 8 ?m. Additionally, the spin coating technique used is advantageous in that the deposition of the insulating layer 300 is carried out at ambient temperature, and is followed by a densifying anneal at a temperature of around 250? C., which, therefore, does not cause the substrate on which the dielectric layer is formed to deform.

(10) An electrically insulating layer 300 of oxide of SOG type makes it possible to maintain the acoustic performance of a radiofrequency device obtained later from a piezoelectric substrate at an optimal level.

(11) According to one non-limiting example, the electrically insulating layer 300 may be chosen from families of SOGs of silicate or methylsilsesquioxane type, sold, for example, under the references 20B or 400F by FILMTRONICS or FOX16 by DOW CORNING.

(12) The piezoelectric layer 200 on which the electrically insulating layer 300 has been deposited and densified is preferably joined to the carrier substrate 100 via direct bonding by molecular adhesion, as illustrated in Step 1 in FIG. 1. The bonding is preferably carried out at ambient temperature, namely about 20? C. It is however possible to carry out the bonding with a heat treatment at a temperature of between 20? C. and 50? C., and more preferably between 20? C. and 30? C.

(13) Additionally, the bonding step is advantageously carried out at low pressure, i.e., at a pressure lower than or equal to 5 mTorr, which makes it possible to desorb the water from the surfaces forming the bonding interface, i.e., the surface of the electrically insulating layer 300 and the surface of the carrier substrate 100. Carrying out the bonding step under vacuum makes it possible to improve the desorption of water at the bonding interface further still.

(14) A heat treatment in order to strengthen the bonding interface may be carried out at low temperatures of up to 300? C. without the entire assembly undergoing overly substantial deformations leading to the materials breaking or detachment at the bonding interface.

(15) The bonding energy obtained by the direct bonding between the surface of the carrier substrate 100 and the electrically insulating layer 300 of the present disclosure is high and allows not only the Step 2 of thinning the piezoelectric layer by chemical-mechanical polishing (CMP) (as shown in FIG. 1) but also the final dicing of the assembled wafer in order to obtain radiofrequency devices, despite a substantial difference in thermal expansion coefficient of the piezoelectric materials of the piezoelectric layer 200 used and of the material of the carrier substrate 100 used.

(16) According to one non-limiting example of the disclosure, the carrier substrate 100 may be made of silicon material.

(17) According to another non-limiting embodiment, illustrated schematically in FIG. 2, the carrier substrate 100 may be silicon material further comprising a trapping layer 400 towards the interface to be joined, in Step 1 of FIG. 2, with the electrically insulating layer 300, making it possible to trap electric-charge carriers caused by the frequency operation of the radiofrequency device. This layer thus makes it possible to decrease insertion losses and improve the performance of the devices.

(18) According to one non-limiting example of the disclosure, the piezoelectric material may be chosen from lithium niobate and lithium tantalate.

(19) The predetermined thickness of the piezoelectric layer 200 is preferably greater than 5 ?m, or more preferably greater than 10 ?m.

(20) Given the substantial difference in thermal expansion coefficient, such a high thickness leads to stresses that are difficult to withstand experienced by the assembly of the piezoelectric layer 200 on the carrier substrate 100. The assembly according to the present disclosure allows bonding energies to be obtained that make it possible to keep the substrate mechanically intact, which substrate could thus undergo process steps such as thinning Steps 2 as shown in FIG. 2, electrode-depositing steps involving temperatures of up to 300? C., or dicing steps in order to separate the radiofrequency devices obtained on this joined substrate.

(21) According to one non-limiting example of the disclosure, the surface of the piezoelectric layer 200 to be joined to the carrier substrate has a rough surface suitable for reflecting a radiofrequency wave. This makes it possible to decrease the impact of parasitic waves reflected at any interfaces present within a hybrid substrate of a piezoelectric layer joined to a carrier. In advantageous embodiments, the rough surface of the piezoelectric layer has a roughness of greater than 1 ?m, preferably greater than 3 ?m, corresponding substantially to the length of the parasitic waves. Additionally, these parasitic waves appear in particular for piezoelectric structures with a thickness of greater than 5 ?m, or 10 ?m, for which the assembly of the present disclosure affords advantages. It should be noted that the spin coating technique has a smoothing effect and envisaged thicknesses of the electrically insulating layer 300 of between 2 ?m and 8 ?m make it possible not only to obtain an assembly having a good bonding energy but also to avoid additional steps of planarization and smoothing if this spin coating deposition is applied to a rough surface such as described above.