PRINTED CIRCUIT BOARD

Abstract

A printed circuit board is provided with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers. At least one electrically conductive outer layer and multiple electrically conductive intermediate layers are provided. At least one electrically conductive through-connection is provided between an electrically conductive outer layer and an electrically conductive intermediate layer. The printed circuit board consists of at least one first multi layer PCB and one second multilayer PCB. The first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers, and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer. The multilayer PCBs are connected to each other. The electrically conductive through-connection between a first electrically conductive outer layer and a second electrically conductive outer layer is formed from multilayer PCBs.

Claims

1. A printed circuit board comprising: multiple electrically conductive layers separated from each other by electrically non-conductive layers, said multiple electrically conductive layers including at least one electrically conductive outer layer and multiple electrically conductive intermediate layers; where at least one electrically conductive through-connection between a said electrically conductive outer layer and a said electrically conductive intermediate layer; wherein the printed circuit board includes at least a first multilayer PCB and a second multilayer PCB, where the first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer, where the multilayer PCBs are connected to each other, where the electrically conductive through-connection between a first electrically conductive outer layer and a second electrically conductive outer layer is formed by one of the multilayer PCBs.

2. The printed circuit board in accordance with claim 1, wherein the second multilayer PCB is formed from multiple electrically conductive layers and from multiple electrically non-conductive layers.

3. The printed circuit in accordance with claim 1, wherein the printed circuit board is composed of the multilayer PCBs.

4. The printed circuit board in accordance with claim 1, wherein at least two multilayer PCBs, at least one first multilayer PCB, and one second multilayer PCB, are connected.

5. The printed circuit board in accordance with claim 1, wherein the electrically conductive through-connection is arranged in the first multilayer PCB, where the second multilayer PCB in connection with the electrically conductive through-connection of the first multilayer PCB has no through-connection or likewise has at least one electrically conductive through-connection.

6. The printed circuit board in accordance with claim 1 one of the preceding claims, wherein the electrically conductive through-connection of the first multilayer PCB is sealed on one side by the second multilayer PCB.

7. The printed Printed circuit board in accordance with claim 1, wherein the electrically conductive through-connection is covered on the outer side of the first multilayer PCB by an electrically conductive layer as a cover.

8. The printed circuit board in accordance with claim 1, wherein the electrically conductive layer for the cover is a copper layer with a solder mask, or is a copper layer with a surface coating with a surface coating and with a solder mask.

9. The printed circuit board in accordance with claim 1, wherein the electrically conductive through-connection is formed by drilling through the first multilayer PCB, into which an electrically conductive sleeve is inserted or formed through electroplating.

10. The printed circuit board in accordance with claim 9, wherein the electrically conductive sleeve is filled with a filler material.

11. The printed circuit board in accordance with claim 10, wherein an electrically conductive cover, which is essentially flat, is put on the electrically conductive sleeve sealed with filler material.

12. The printed circuit board in accordance with claim 11, wherein the electrically conductive cover is put on the filler material such that electronic components to be are directly mounted or soldered on the electrically conductive cover.

13. The printed circuit boardin accordance with claim 10, wherein the filler material is a filler material enriched with an adhesive.

14. The printed circuit board in accordance with claim 10, wherein the minimum of one first multilayer PCB and the second multilayer PCB are glued together by a non-conductive layer enriched with adhesive.

15. (canceled)

16. A method for manufacturing a printed circuit board with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers, comprising the steps of: providing at least one electrically conductive outer layer and multiple electrically conductive intermediate layers, providing at least one electrically conductive through-connection between an electrically conductive outer layer and an electrically conductive intermediate layer, providing at least a first multilayer PCB and at least a second multilayer PCB, where the first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer, where the electrically conductive through-connection between a first electrically conductive outer layer and a second electrically conductive outer layer is formed from one of the multilayer PCBs, and where the multilayer PCBs are connected to each other.

17. The method in accordance with claim 16, wherein the at least one of one first multilayer PCB and the at least one of one second multilayer PCB are connected to each other, specifically by gluing them together.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Reference is now made more particularly to the drawings, which illustrate the best presently known mode of carrying out the invention and wherein similar reference characters indicate the same parts throughout the views.

[0027] FIG. 1 shows a schematic diagram of a cut-out of an embodiment of a printed circuit board as defined by the invention.

[0028] FIG. 2 shows a schematic diagram of a cut-out of an embodiment of a printed circuit board as defined by the invention.

DETAILED DESCRIPTION OF THE DRAWINGS

[0029] FIG. 1 shows a schematic diagram with a cut-out of a printed circuit board 1 as defined by the invention with multiple electrically conductive layers 2, which are separated from each other by non-conductive layers 3.

[0030] At least one electrically conductive outer layer 4 and multiple electrically conductive intermediate layers 5 are included. The illustrated embodiment includes eight electrically conductive layers 2, i.e. two electrically conductive outer layers 4 and six electrically conductive intermediate layers 5.

[0031] An electrically conductive through-connection 6 can be seen. This illustrated through-connection 6 represents an example for at least one electrically conductive through-connection 6 formed between an electrically conductive outer layer 4 and an electrically conductive first intermediate layer 5. It is preferable to provide for multiple such through-connections 6. The through-connection 6 is formed by a drilled hole 7 with an electroplated electrically conductive sleeve 8.

[0032] The printed circuit board 1 as defined by the invention is composed of a first multilayer PCB 9 and a second multilayer PCB 10, each of which is formed from multiple electrically conductive layers 2 and multiple non-conductive layers 3, where the minimum of two multilayer PCBs 9, 10 are connected to each other. This is accomplished by the non-conductive layer 11, which is particularly enriched with adhesive. At least one first multilayer PCB 9 and one second multilayer PCB 10 are advantageously glued together or connected in some other way.

[0033] The through-connection 6 is formed as defined by the invention between a first electrically conductive outer layer 12 and a second electrically conductive outer layer 13 of one of the multilayer PCBs 9. As a result, this multilayer PCB 9 can be drilled through and the electrically conductive sleeve 8 can be formed. This is accomplished by an electroplating process,

[0034] In FIG. 1, for example, the through-connection 6 is arranged in the first multilayer PCB 9, where the second multilayer PCB 10 in connection with the through-connection 6 of the first multilayer PCB 9 has no electrically conductive through-connection. As shown in FIG. 2, however, the second multilayer PCB 10 can also have an electrically conductive through-connection 50 or even multiple electrically conductive through-connections, even of various types, depending on the requirement.

[0035] In FIG. 1, the second multilayer PCB 10 closes the through-connection 6 in a middle area of the printed circuit board 1. Thus the through-connection 6 of the first multilayer PCB 9 is closed on one side by the non-conductive layer 11, which is enriched with adhesive, and the second multilayer PCB 10.

[0036] It can also be seen that the through-connection 6, which is filled or closed with a filler material 18, is reliably covered by a conductive layer 15 on the outer side 14 of the first multilayer PCB 9. Such a layer is also found on the other side of the first multilayer PCB 9 and on the opposite side of the second multilayer PCB 10. For a cover, therefore, the electrically conductive layer 2 as an outer layer 4 has a copper layer as a cover or layer 15, in particular a copper layer as layer 15 with a solder mask 16, or a copper layer as layer 15 with a surface coating 17, in particular a copper layer 15 with surface coating 17 and with a solder mask 16.

[0037] The through-connection 6 is formed in accordance with the embodiment by through-drilling the first multilayer PCB 9, in which an electrically conductive sleeve 8 is formed. The sleeve 8 is filled with a filler material 18, specifically one that has been enriched with an adhesive. The adhesive-enriched layer 11 is used for gluing at least one first multilayer PCB 9 and the second multilayer PCB 10. The adhesive-enriched filler material can also be used partially as a filler material 18 for the through-connection 6.

[0038] The printed circuit board 1 is preferably provided for use in control devices or as sensors, particularly for automotive applications, particularly as radar sensors or control units for radar sensors.

[0039] The through-connection has a metallic, electrically conductive cover 19, as a cap, which also enables electronic components to be placed directly over the through-connection.

[0040] If the through-connection is created by drilling through the first multilayer PCB, the drilling diameter can be the same and small. It is advantageous for the drilling diameter or hole diameter also to be independent of the drilling depth.

[0041] It is extremely advantageous that the respective first multilayer PCBs can be stacked and drilled through and no longer need to be drilled individually using special tools with high precision and depth-control. This reduces the manufacturing costs.

[0042] FIG. 2 shows another embodiment of a printed circuit board 1, which essentially corresponds to the embodiment in FIG. 1, where a through-connection 50 is additionally provided in the area of the second multilayer PCB 10. Otherwise, reference is made to the description for FIG. 1.

[0043] In accordance with the definition of the invention, it is particularly advantageous when the electrically conductive through-connection 6 is filled or closed with a filler material 18, which is particularly enriched with an adhesive, and is particularly provided with an electrically conductive cover 19.

[0044] The printed circuit board is manufactured, for example, using a method as defined by the invention, in which at least a first multilayer PCB is provided and in which the through-connection from an electrical outer layer of the first multilayer PCB to the other electrical outer layer of the first multilayer PCB is either already inserted or is manufactured. This involves drilling through at least a first multilayer PCB to create a hole that, for example, is metallically coated on the edge side by metalizing or electroplating. Alternatively, it is also possible to insert a solid sleeve or the like.

[0045] Following this, it is preferable for the through-connection to be filled with a filler material and closed on either one or both sides.

[0046] Then at least a second multilayer PCB can be provided that is connected to the minimum of one first multilayer PCB so that the minimum of two multilayer PCBs are connected to each other and form a stack of electrically conductive layers and electrically non-conductive layers. The connection is preferably made by gluing.

[0047] The arrangement is to be designed so that the through-connection of the first multilayer PCB is arranged so that it ends in a more middle area of the interconnected. multilayer PCBs and thus forms a through-connection from an outer layer of the first multilayer PCB and into a middle area of the printed circuit board.

[0048] The method for manufacturing a printed circuit board with multiple electrically conductive layers, which are separated from each other by electrically non-conductive layers, where at least one electrically conductive outer layer and multiple electrically conductive intermediate layers are provided, where at least one electrically conductive through-connection is provided between an electrically conductive outer layer and an electrically conductive intermediate layer, involves the provision of at least one first multilayer PCB and at least one second multilayer PCB, where the first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer, where the electrically conductive through-connection between one first electrically conductive outer layer and one second electrically conductive outer layer is formed from one of the multilayer PCBs and where the multilayer PCBs are connected to each other.

[0049] It is also provided for that the minimum of one first multilayer PCB and the minimum of one second multilayer PCB are connected to each other, specifically by gluing them together.

[0050] The printed circuit board created in this way from multiple multilayer PCBs can have at least one more through-connection 20 inserted from an outer layer of the printed circuit board to an opposite outer layer of the printed circuit board by drilling through the printed circuit board to create a hole that is then metalized or electroplated. Alternatively, it is also possible to insert a sleeve. It is preferable for this through-connection 20 to be formed without a filler.

REFERENCE NUMERAL LIST

[0051] 1 Printed circuit board

[0052] 2 Electrically conductive layer

[0053] 3 Electrically non-conductive layer enriched with adhesive (prepreg)

[0054] 4 Outer layer

[0055] 5 intermediate layer

[0056] 6 Through-connection

[0057] 7 Drilled hole

[0058] 8 Electrically conductive sleeve

[0059] 9 Multilayer PCB

[0060] 10 Multilayer PCB

[0061] 11 Electrically non-conductive layer enriched with adhesive (prepreg)

[0062] 12 Outer layer

[0063] 13 Outer layer

[0064] 14 Outer side

[0065] 15 Electrically conductive layer

[0066] 15a Electrically conductive layer

[0067] 16 Solder mask

[0068] 17 Surface coating

[0069] 18 Adhesive-enriched filler material

[0070] 19 Electrically conductive cover

[0071] 20 Through-connection

[0072] 50 Through-connection